CN110076455A - A kind of electronic component laser soldering device and method - Google Patents
A kind of electronic component laser soldering device and method Download PDFInfo
- Publication number
- CN110076455A CN110076455A CN201910445934.9A CN201910445934A CN110076455A CN 110076455 A CN110076455 A CN 110076455A CN 201910445934 A CN201910445934 A CN 201910445934A CN 110076455 A CN110076455 A CN 110076455A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- laser
- camera lens
- welding
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to fuse production technical fields, more particularly to a kind of electronic component laser soldering device, including electronic component fixing mechanism, laser fiber camera lens, the first fixed bracket and the second fixed bracket, the electronic component fixing mechanism is used to fix the main part and lead of electronic component, the electronic component fixing mechanism is fixed on the described first fixed bracket, the laser fiber camera lens is installed on the described second fixed bracket, and laser beam emitted by the laser fiber camera lens is directed at the junction of the main part Yu the lead.Compared with the prior art, the present invention realizes accurate welding, reduces the damage to electronic component, improves welding quality.In addition, easy to operate, welding accuracy and welding quality are high the present invention also provides a kind of electronic component method for laser welding.
Description
Technical field
The invention belongs to production of electronic components technical field more particularly to a kind of electronic component laser soldering device and sides
Method.
Background technique
Electronic component (electronic component), is the basic element in electronic circuit, usually individual encapsulation,
And there is two or more lead or metallic contact.Electronic component can be individual encapsulation, for example, resistor, capacitor,
Inductor, transistor, diode, fuse etc..Electronic component listed above is all by main part and to be connected to main part two
The lead at end is constituted.In the prior art, the mode of butt-joint or high-frequency welding is mostly used to be connected to one between main part and lead
It rises.However, butt-joint has the risk for causing electronical elements surface to damage because of directly impact；High-frequency welding adds because of entire electronic component
Heat, heat-affected zone have damage greatly the risk of electronic component.
In view of this, it is necessory to provide it is a kind of can reduce to the mode of electronic component damage risk come to electronic component into
Row installation.
Summary of the invention
One of it is an object of the invention to: in view of the deficiencies of the prior art, and provide a kind of electronic component Laser Welding tipping
It sets, realizes precisely welding, reduce the damage to electronic component, improve welding quality.
To achieve the goals above, the invention adopts the following technical scheme:
A kind of electronic component laser soldering device, including electronic component fixing mechanism, laser fiber camera lens, the first fixed branch
Frame and the second fixed bracket, the electronic component fixing mechanism are used to fix the main part and lead of electronic component, the electronics
Element fixed mechanism is fixed on the described first fixed bracket, and the laser fiber camera lens is installed on the described second fixed bracket
On, laser beam emitted by the laser fiber camera lens is directed at the junction of the main part Yu the lead.
As a kind of improvement of electronic component laser soldering device of the present invention, the laser fiber camera lens with it is described
The distance between electronic component fixing mechanism is d, and the focal length of the laser fiber camera lens is f, d=f ± 2mm.
As a kind of improvement of electronic component laser soldering device of the present invention, the focal length of the laser fiber camera lens
F is 30~100mm.Focal length should not be too large or too small, and when focal length is excessive, correspondingly, laser fiber camera lens and electronic component are solid
It is also bigger to determine the distance between mechanism, welding accuracy can be reduced；When focal length is too small, correspondingly, laser fiber camera lens with
The distance between electronic component fixing mechanism is just smaller, will affect the reasonability of the mounting structure of whole device.More preferably,
The focal length f of the laser fiber camera lens is 50mm.
It further include mobile mechanism as a kind of improvement of electronic component laser soldering device of the present invention, the shifting
Motivation structure is set on the described second fixed bracket, and the laser fiber camera lens is installed in the mobile mechanism.Pass through movement
Mechanism moves laser fiber camera lens, realizes the welding at electronic component both ends and lead, and without artificial mobile, precision is higher, effect
Rate is faster.
It further include PLC control system as a kind of improvement of electronic component laser soldering device of the present invention, it is described
PLC control system works for coordinated control mobile mechanism.
The beneficial effect of one of the object of the invention is: the present invention provides a kind of electronic component laser soldering device, utilizes
Laser beam emitted by laser fiber camera lens welds main part and lead, right and wrong between laser beam and electronic component
Contact type welding, and be the fusing connection realized by temperature caused by laser beam between the two, avoid touching formula
Directly heat the risk that damage is caused to electronic component；In addition, laser beam hot spot is small, it can be achieved that pinpoint welds.Therefore,
Compared with the prior art, electronic component laser soldering device of the invention realizes accurate welding, reduces to electronic component
Damage, improves welding quality.
The second object of the present invention is: providing a kind of electronic component method for laser welding, comprising the following steps:
Main part and lead are fixed on electronic component fixing mechanism, the position of laser fiber camera lens is adjusted, makes its institute
The junction of laser beam alignment main part one end and lead of injection, completes the laser welding of main part one end and lead；
Laser fiber camera lens is adjusted again, and the laser beam emitted by it is made to be directed at the connection of the main part other end and lead
Place completes the laser welding of the main part other end and lead；
The main part for completing welding and lead are removed, main part and lead is replaced, repeats above operation.
As a kind of improvement of electronic component method for laser welding of the present invention, the laser fiber lens location is logical
It crosses and moves mobile mechanism and be adjusted, the work of the mobile mechanism passes through PLC control system and controls.Pass through PLC control system
Control, precision is high, and efficiency is fast.
As a kind of improvement of electronic component method for laser welding of the present invention, the welding temperature of the laser welding
It is adjusted by way of changing the irradiation time of the laser beam and the output power of the laser beam；Work as welding temperature
One timing, irradiation time increase, and output power then becomes smaller, and irradiation time shortens, and output power then becomes larger.
As a kind of improvement of electronic component method for laser welding of the present invention, the irradiation time of the laser beam
For 0.4 ± 0.1s, the output power of the laser beam is 50 ± 5W.The irradiation time and output power that the present invention limits only are made
For preferred value, specific irradiation time and output power can make the appropriate adjustments according to practical operation, be not limited only to limit in the present invention
Fixed numberical range.
Two beneficial effect of the object of the invention is: electronic component method for laser welding of the invention, in welding process
In, electronic component do not carried out with welding equipment it is any directly contact, be to realize that heating is completed to weld by the heat of laser beam
, compared to contact and direct-fired welding method, this method will not cause to damage to electronic component.In addition, this method
Welding temperature is adjusted by control irradiation time and output power, welding temperature can be precisely controlled.Therefore, of the invention
Welding method precision is higher, and welding quality is more preferably.
Detailed description of the invention
Fig. 1 is one of structural schematic diagram of the invention.
Fig. 2 is second structural representation of the invention.
Fig. 3 is the enlarged drawing of part-structure in the present invention.
Wherein: 1- electronic component fixing mechanism, 2- laser fiber camera lens, the fixed bracket of 3- first, the fixed bracket of 4- second,
5- mobile mechanism, 6- laser beam, 7- main part, 8- lead.
Specific embodiment
With reference to embodiment and Figure of description, the present invention is described in further detail, but the present invention
Embodiment be not limited to this.
Embodiment 1
As shown in Figures 1 to 3, a kind of electronic component laser soldering device, including electronic component fixing mechanism 1, laser fiber
The fixed bracket 3 of camera lens 2, first and the second fixed bracket 4, electronic component fixing mechanism 1 are used to fix the main part 7 of electronic component
With lead 8, electronic component fixing mechanism 1 is fixed on the first fixed bracket 3, and laser fiber camera lens 2 is installed on the second fixed branch
On frame 4, laser beam 6 emitted by laser fiber camera lens 2 is directed at the junction of main part 7 and lead 8.
Further, the distance between laser fiber camera lens 2 and electronic component fixing mechanism 1 are d, laser fiber camera lens 2
Focal length be f, d=f ± 5mm.The focal length f of laser fiber camera lens 2 is 30mm.
Further, the invention also includes mobile mechanism 5, mobile mechanism 5 is set on the second fixed bracket 4, laser light
Fine camera lens 2 is installed in mobile mechanism 5.
Further, the invention also includes PLC control system, PLC control system is used for 5 work of coordinated control mobile mechanism
Make.
Embodiment 2
Unlike the first embodiment: the focal length f of laser fiber camera lens 2 is 50mm.
Remaining is with embodiment 1, and which is not described herein again.
Embodiment 3
Unlike the first embodiment: the focal length f of laser fiber camera lens 2 is 100mm.
Remaining is with embodiment 1, and which is not described herein again.
Embodiment 4
A kind of electronic component method for laser welding of the electronic component laser soldering device using embodiment 1, including it is following
Step:
Main part 7 and lead 8 are fixed on electronic component fixing mechanism 1, the position of laser fiber camera lens 2 is adjusted, makes
Laser beam 6 emitted by it is directed at the junction of main part 7 one end and lead 8, and completion 7 one end of main part is swashed with lead 8
Photocoagulation；
Laser fiber camera lens 2 is adjusted again, and the laser beam 6 emitted by it is made to be directed at 7 other end of main part and lead 8
The laser welding of main part 7 other end and lead 8 is completed in junction；
The main part 7 for completing welding and lead 8 are removed, main part 7 and lead 8 is replaced, repeats above operation.
Further, 2 position of laser fiber camera lens passes through mobile mobile mechanism 5 and is adjusted, and the work of mobile mechanism 5 is logical
Cross PLC control system control.
Further, irradiation time and the laser beam 6 that the welding temperature of laser welding passes through change laser beam 6
The mode of output power adjust；When one timing of welding temperature, irradiation time increases, and output power then becomes smaller, irradiation time
Shorten, output power then becomes larger.
Further, the irradiation time of laser beam 6 is 0.4 ± 0.1s, and the output power of laser beam 6 is 50 ± 5W.
Embodiment 5
As different from Example 4: the present embodiment using embodiment 2 electronic component laser soldering device.
Remaining is with embodiment 4, and which is not described herein again.
Embodiment 6
As different from Example 4: the present embodiment using embodiment 3 electronic component laser soldering device.
Remaining is with embodiment 4, and which is not described herein again.
Fuse made from electronic component method for laser welding using embodiment 4~6 is tested, acquired results are such as
Shown in table 1.
1 test result of table
As can be seen from Table 1, using the electronic component laser soldering device of above-described embodiment 1~3 and embodiment 4~6
Fuse welding quality made from electronic component method for laser welding is good, and electronic component does not damage, and welding position is accurate.This be because
For present invention employs laser weldings, avoid soldering appliance and directly contact with electronic component, to avoid making electronic component
At damage, and the hot spot of laser beam is small, it can be achieved that pinpoint welds.
According to the disclosure and teachings of the above specification, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and is modified.Therefore, the invention is not limited to above-mentioned specific embodiment, all those skilled in the art exist
Made any conspicuous improvement, replacement or modification all belong to the scope of protection of the present invention on the basis of the present invention.This
Outside, although using some specific terms in this specification, these terms are merely for convenience of description, not to the present invention
Constitute any restrictions.
Claims (10)
1. a kind of electronic component laser soldering device, it is characterised in that: including electronic component fixing mechanism, laser fiber camera lens,
First fixed bracket and the second fixed bracket, the electronic component fixing mechanism are used to fix the main part of electronic component and draw
Line, the electronic component fixing mechanism are fixed on the described first fixed bracket, and the laser fiber camera lens is installed on described the
On two fixed brackets, laser beam emitted by the laser fiber camera lens is directed at the connection of the main part Yu the lead
Place.
2. electronic component laser soldering device according to claim 1, it is characterised in that: the laser fiber camera lens and institute
Stating the distance between electronic component fixing mechanism is d, and the focal length of the laser fiber camera lens is f, d=f ± 2mm.
3. electronic component laser soldering device according to claim 2, it is characterised in that: the coke of the laser fiber camera lens
It is 30~100mm away from f.
4. electronic component laser soldering device according to claim 3, it is characterised in that: the coke of the laser fiber camera lens
It is 50mm away from f.
5. electronic component laser soldering device according to claim 1, it is characterised in that: it further include mobile mechanism, it is described
Mobile mechanism is set on the described second fixed bracket, and the laser fiber camera lens is installed in the mobile mechanism.
6. electronic component laser soldering device according to claim 5, it is characterised in that: it further include PLC control system, institute
PLC control system is stated to work for coordinated control mobile mechanism.
7. a kind of electronic component method for laser welding, which comprises the following steps:
Main part and lead are fixed on electronic component fixing mechanism, the position of laser fiber camera lens is adjusted, makes emitted by it
Laser beam alignment main part one end and lead junction, complete main part one end and lead laser welding；
Laser fiber camera lens is adjusted again, and the laser beam emitted by it is made to be directed at the junction of the main part other end and lead,
Complete the laser welding of the main part other end and lead；
The main part for completing welding and lead are removed, main part and lead is replaced, repeats above operation.
8. electronic component method for laser welding according to claim 7, it is characterised in that: the laser fiber lens location
It is adjusted by mobile mobile mechanism, the work of the mobile mechanism is controlled by PLC control system.
9. electronic component method for laser welding according to claim 7, it is characterised in that: the welding temperature of the laser welding
It spends by way of the output power of the irradiation time and the laser beam that change the laser beam and adjusts；When welding temperature
One timing of degree, irradiation time increase, and output power then becomes smaller, and irradiation time shortens, and output power then becomes larger.
10. electronic component method for laser welding according to claim 7, it is characterised in that: the irradiation of the laser beam
Time is 0.4 ± 0.1s, and the output power of the laser beam is 50 ± 5W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910445934.9A CN110076455A (en) | 2019-05-27 | 2019-05-27 | A kind of electronic component laser soldering device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910445934.9A CN110076455A (en) | 2019-05-27 | 2019-05-27 | A kind of electronic component laser soldering device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110076455A true CN110076455A (en) | 2019-08-02 |
Family
ID=67422037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910445934.9A Pending CN110076455A (en) | 2019-05-27 | 2019-05-27 | A kind of electronic component laser soldering device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110076455A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885653A (en) * | 2021-01-13 | 2021-06-01 | 东莞市贝特电子科技股份有限公司 | Fuse and manufacturing method thereof |
| CN113369690A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011238659A (en) * | 2010-05-06 | 2011-11-24 | Sumitomo Wiring Syst Ltd | Electronic component holder |
| CN202384285U (en) * | 2011-12-27 | 2012-08-15 | 东莞市贝特电子科技有限公司 | Anti-explosion fuse |
| CN103280320A (en) * | 2013-05-08 | 2013-09-04 | 佛山市三水日明电子有限公司 | Polymer solid aluminum electrolytic capacitor and manufacturing method thereof |
| CN203984371U (en) * | 2014-06-25 | 2014-12-03 | 唐志强 | A kind of metallic packaging electronical elements surface mounts makeup distribution structure |
| CN204122932U (en) * | 2014-08-18 | 2015-01-28 | 武汉洛芙科技股份有限公司 | A kind of Thermal Cutoffs and nickel plating pin weld jig |
| CN205428697U (en) * | 2016-02-18 | 2016-08-03 | 德州信平电子有限公司 | Power transformer lead welding structure |
| CN207668707U (en) * | 2017-12-13 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of laser soldering device |
| CN208600868U (en) * | 2018-07-27 | 2019-03-15 | 兰州石化职业技术学院 | A kind of electronic field welder |
| CN208644383U (en) * | 2018-07-06 | 2019-03-26 | 新际电子元件（杭州）有限公司 | A kind of transformer lead pin lead bonding device |
-
2019
- 2019-05-27 CN CN201910445934.9A patent/CN110076455A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011238659A (en) * | 2010-05-06 | 2011-11-24 | Sumitomo Wiring Syst Ltd | Electronic component holder |
| CN202384285U (en) * | 2011-12-27 | 2012-08-15 | 东莞市贝特电子科技有限公司 | Anti-explosion fuse |
| CN103280320A (en) * | 2013-05-08 | 2013-09-04 | 佛山市三水日明电子有限公司 | Polymer solid aluminum electrolytic capacitor and manufacturing method thereof |
| CN203984371U (en) * | 2014-06-25 | 2014-12-03 | 唐志强 | A kind of metallic packaging electronical elements surface mounts makeup distribution structure |
| CN204122932U (en) * | 2014-08-18 | 2015-01-28 | 武汉洛芙科技股份有限公司 | A kind of Thermal Cutoffs and nickel plating pin weld jig |
| CN205428697U (en) * | 2016-02-18 | 2016-08-03 | 德州信平电子有限公司 | Power transformer lead welding structure |
| CN207668707U (en) * | 2017-12-13 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of laser soldering device |
| CN208644383U (en) * | 2018-07-06 | 2019-03-26 | 新际电子元件（杭州）有限公司 | A kind of transformer lead pin lead bonding device |
| CN208600868U (en) * | 2018-07-27 | 2019-03-15 | 兰州石化职业技术学院 | A kind of electronic field welder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885653A (en) * | 2021-01-13 | 2021-06-01 | 东莞市贝特电子科技股份有限公司 | Fuse and manufacturing method thereof |
| CN113369690A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
| CN113369690B (en) * | 2021-06-30 | 2023-03-14 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110076455A (en) | A kind of electronic component laser soldering device and method | |
| CN102023614B (en) | Laser welding device | |
| CN101774090A (en) | High-power semiconductor laser constant-temperature welding device | |
| CN104625405B (en) | Method for laser welding and laser welding system | |
| CN105537768A (en) | Magnetic field-assisted laser welding device and method | |
| CN103901924A (en) | Non-magnetic temperature control device based on light heating | |
| CN104842070A (en) | Laser eutectic soldering device and method | |
| JP2013132655A (en) | Laser soldering system | |
| CN106475649A (en) | A kind of laser tin soldering machine | |
| CN110280862A (en) | A kind of welding system and its method of device pin | |
| CN112091413B (en) | Marking focal length correction method of laser marking system | |
| CN216541290U (en) | Laser soft soldering device for integrated circuit development board | |
| CN203265821U (en) | Compact type selective welding system | |
| CN104923914A (en) | Method for welding component pin and apparatus thereof | |
| CN109358398B (en) | Optical module, optical module light emitting device and preparation method thereof | |
| CN204975701U (en) | Laser eutectic welding set | |
| CN208680769U (en) | Multistation lamp pumping laser welding apparatus | |
| CN108176922A (en) | A kind of laser output system and welding method welded simultaneously for intensive multiple spot | |
| JP7198583B2 (en) | LASER SOLDERING METHOD AND LASER SOLDERING APPARATUS | |
| CN208322421U (en) | Laser corrective system and welder | |
| JPS62224476A (en) | Packaging device for electron device | |
| CN205218290U (en) | Qualities of YAG laser welding are improved control system | |
| CN204122931U (en) | Double light path Output of laser welder | |
| Anguiano et al. | Heating capacity analysis of a focused infrared light soldering system | |
| CN101414727B (en) | Self-adaptive equalization thermal lens laser resonant cavity for crystal lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190802 |