CN104923914A - Method for welding component pin and apparatus thereof - Google Patents
Method for welding component pin and apparatus thereof Download PDFInfo
- Publication number
- CN104923914A CN104923914A CN201410104927.XA CN201410104927A CN104923914A CN 104923914 A CN104923914 A CN 104923914A CN 201410104927 A CN201410104927 A CN 201410104927A CN 104923914 A CN104923914 A CN 104923914A
- Authority
- CN
- China
- Prior art keywords
- laser
- component
- components
- wire feeder
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention relates to the field of welding technology, and discloses a method for welding a pin of a component and an apparatus thereof. The method herein comprises welding the component pin to a PCB board by using laser and a wire feeder, wherein the laser refers to a single beam laser. During welding, the laser supplies heat to the tip end of the component pin, and the wire feeder delivers the wire to the tip end of the component pin. According to the invention, the laser supplies heat to the tip end of the component pin instead of a coated copper layer on the PCB board, and the wire feeder delivers the wire to the tip end of the component pin instead of the coated copper layer on the PCB board. Thus, the method herein is applicable to welding pins of all plug-in types of components with no concerns of the morphology of the cross section or the size of the cross section area, or factors like heat radiation property of the coated copper layer. The method herein has the advantages of short pre-heating time, simple modulation, and a wide range of application.
Description
Technical field
The present invention relates to welding technology field, in particular, particularly a kind of welding method of component's feet and device thereof.
Background technology
Along with the promotion of the fast development of electronic manufacturing technology, the increasingly extensive and micro-processing technology of IT industry application, especially, under the situation increased substantially is consumed in the various personal communications such as mobile phone, notebook computer, MP3/MP4, digital camera and amusement equipment, the product of electronic enterprises is more and more towards highly integrated, intelligent, miniaturized and portable future development.On the other hand, have higher requirement to manufacturing technology in production development direction, less for realizing small product size, the requirement that quality is lighter, various electronic product internal structure need reach more highdensity integrated, to proposing higher challenge manufacturing vital welding procedure in process, how to realize the welding of solid matter pin and special construction element and ensureing higher production efficiency and qualification rate, having become conventional soldering techniques problems faced.And along with laser weld application constantly extensive, make laser soldering become one of this welding occasion solution.
In prior art, the LASER HEATING position of Laser Overlaying welding is that on copper clad layers on pcb board and plug-in unit, wire feed position is in the copper clad layers on pcb board, and because laser major part is radiated on plug-in unit pin, temperature rise is very fast; The copper clad layers of fraction on pcb board, the copper clad layers temperature on pcb board is lower, and such plug-in unit pin is easily oxidized, and makes failure welding; The pad surface reflection that laser is formed in welding, pcb board of burning; And the clearance requirement of the size of pad and circular hole and plug-in unit is very high.Existing solution uses light path shaping, realize homogeneous heating, but cost is very high by ring-shaped light spot.
When existing pcb board welds with plug-in unit simultaneously, when having outstanding electronic devices and components around, can not use Wave crest Welding, existing mode is the mode using automatic tin welding machine or manual welding, the limitations of existing automatic tin welding machine contact type welding; In manual welding all there is unstable hidden danger in human factor and labour intensity etc.
Laser Overlaying solder used in the prior art weld time pcb board in heat accumulation less, in brazing filler metal melts wetting and spreading, energy aspect is wayward, easily burns out pcb board.
Summary of the invention
The object of the invention is to the technical problem for existing in prior art, provide a kind of regulate simple, adapt to workpiece type wide, adapt to that workpiece size is wide, repetitive positioning accuracy is high and the welding method of the component's feet of low cost of manufacture.
In order to solve problem set forth above, the technical solution used in the present invention is:
A kind of welding method of component's feet, laser and wire feeder is adopted to be welded on pcb board by component's feet, described laser is single beam laser, in welding process, the heating location of laser is positioned at the pin tip of components and parts, and the pin that the wire feed position of wire feeder is positioned at components and parts is most advanced and sophisticated.
According to a preferred embodiment of the invention: described welding method specifically comprises the following steps,
S1. the components and parts of required welding are positioned on pcb board;
S2. the pin tip of single beam laser to components and parts is adopted to carry out preheating;
S3. soft solder silk to be delivered to the pin of components and parts most advanced and sophisticated for wire feeder, melts after pin tip accepts LASER HEATING, and under gravity, under flow to pad locations on pcb board, heat conduction completes welding to pad locations simultaneously.
According to a preferred embodiment of the invention: in step s 2, the time of single beam laser to the most advanced and sophisticated preheating of the pin of components and parts is 100 ~ 500ms.
According to a preferred embodiment of the invention: in step s3, the wire guiding nipple of wire feeder and horizontal plane have an angle α, and have a distance d with the pin tip of components and parts bottom the wire guiding nipple of wire feeder.
According to a preferred embodiment of the invention: described angle α is 30 ~ 60 °, described distance d is 5 ~ 15mm.
The present invention also provides a kind of device realizing the welding method of above-mentioned component's feet, comprise semiconductor laser and wire feeder, described semiconductor laser is vertically installed in directly over the component's feet on pcb board, and described wire feeder is arranged at the side of semiconductor laser.
According to a preferred embodiment of the invention: the wire guiding nipple of described wire feeder and horizontal plane have an angle α, and with the pin tip of components and parts, there is a distance d bottom the wire guiding nipple of wire feeder.
According to a preferred embodiment of the invention: described angle α is 30 ~ 60 °, described distance d is 5 ~ 15mm
Compared with prior art, beneficial effect of the present invention is:
1, the single beam laser heating location that the present invention adopts is on the pin tip of components and parts instead of the copper clad layers on pcb board, wire feed position is on the pin tip of components and parts instead of the copper clad layers on pcb board, be applicable to the pin welding of various plug-in unit class components and parts, the no matter Cross Section Morphology of pin and sectional area size, and the impact of the factor such as copper clad layers heat radiation, have that preheating time is short, debugging is simple, adapt to the features such as wide;
2, the present invention is owing to have employed single beam laser as thermal source, and namely contactless heating makes to increase the spacing of components and parts and the size adaptability of pad, and relatively existing Laser Overlaying solder, avoids the high cost of light path shaping;
What 3, the present invention adopted is that high energy laser beam carries out Fast Heating to tip, decreases the interference to other components and parts and injury;
4, the heating location of single beam laser is the plug-in unit needing heat larger, and making it be heated can be even;
5, single beam laser can not be irradiated to pcb board, avoids laser burn pcb board.
Accompanying drawing explanation
Fig. 1 is the flow chart of the welding method of component's feet of the present invention.
Fig. 2 is the schematic diagram of the welding method of component's feet of the present invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.
Consult shown in Fig. 1 ~ Fig. 2, the welding method of a kind of component's feet provided by the invention, laser and wire feeder is adopted to be welded on pcb board 2 by component's feet 1, described laser is single beam laser 3, in welding process, the heating location of laser is positioned at pin 1 tip of components and parts, and the pin 1 that the wire feed position of wire feeder is positioned at components and parts is most advanced and sophisticated.
The present invention is on pin 1 tip of components and parts instead of the copper clad layers on pcb board 2 due to single beam laser 3 heating location adopted, and can avoid like this to other components and parts on pcb board 2 or copper clad layers, interference occurring or damaging; Meanwhile, pin 1 tip due to components and parts is the position needing to carry out heating, and pin 1 tip of components and parts can be made to be heated evenly; Wire feed position is on the pin tip of components and parts instead of the copper clad layers on pcb board; The present invention can be enable to be applicable to the pin welding of various plug-in unit class components and parts, no matter the Cross Section Morphology of pin and sectional area size, and the factor impact such as copper clad layers heat radiation, have that preheating time is short, debugging is simple, adapt to the features such as wide.
The mode of the principle similar Wave crest Welding pcb board plug-in unit pin at single beam laser heating pin tip of the present invention, heats wetting and spreading by the solder of high temperature and finally forms weld seam, and then complete welding process.
Concrete, welding method of the present invention comprises the following steps,
The components and parts of required welding are positioned on pcb board 2 by step S1.;
Step S2. adopts pin 1 tip of single beam laser 3 pairs of components and parts to carry out preheating, and the time of preheating can determine according to the size of components and parts, and general setting-up time is between 100 ~ 500ms.
The pin that components and parts delivered to by soft solder silk 5 by step S3. wire feeder is most advanced and sophisticated, melts after pin tip accepts LASER HEATING, and under gravity, under flow to pad locations on pcb board, heat conduction completes welding to pad locations simultaneously.
In above-mentioned step S3, in order to improve precision and the degree of accuracy of wire feed further, the wire guiding nipple 4 that the present invention sets wire feeder has an angle α with horizontal plane, and has a distance d with the pin tip of components and parts bottom the wire guiding nipple 4 of wire feeder.
As preference data, in the present embodiment, select angle α to be 30 ~ 60 °, select distance d to be 5 ~ 15mm.
In order to realize the welding method of above-mentioned component's feet, the present invention also provides a kind of welder of component's feet, this device comprises semiconductor laser and wire feeder, described semiconductor laser is vertically installed in directly over the component's feet on pcb board, and described wire feeder is arranged at the side of semiconductor laser; Concrete, wire guiding nipple 4 and the horizontal plane of wire feeder have an angle α, and have a distance d with the pin tip of components and parts bottom the wire guiding nipple 4 of wire feeder, and preferred angle α is 30 ~ 60 °, and preferred distance d is 5 ~ 15mm.
In the present invention, what adopt is semiconductor laser laser, by Optical devices such as optical fiber, collimating mirror, focus lamps, laser aiming is focused on workpiece position to be welded, for the contact pin of different size, the adjustment such as optical arrangement of changing collimation, focusing laser facula size can be adopted.The technical scheme of this part semiconductor laser instrument and Optical devices, in belonging to prior art, no longer repeats its concrete structure herein.
In the present invention, the wire feeder adopted is primarily of tin wire tray, motor, wire feed rolls, wire feeding guiding tube, wire feeding mouth, mechanical adjustment and the composition such as fixture, programmable device, the process of whole wire feed controls electric machine rotation by programmable device, driven by motor wire feed rolls, the tin silk be clamped between two wire feed rolls is passed to wire feeding guiding tube from tin wire tray, and guides to welding position by wire feeding mouth.And the technical scheme of wire feeder part is open in the automatic wire feeder patent of 200920134297.5 in the patent No. of applicant's earlier application, also adopts the wire feeder of other types, no longer its concrete structure is repeated herein.
The present invention is after have employed above technical scheme, its advantage is: 1, owing to have employed single beam laser as thermal source, namely contactless heating makes to increase the spacing of components and parts and the size adaptability of pad, relatively existing Laser Overlaying solder, avoids the high cost of light path shaping; 2, due to employing is that high energy laser beam carries out Fast Heating to tip, decreases the interference to other components and parts and injury; 3, the heating location of single beam laser is the plug-in unit needing heat larger, and making it be heated can be even; 4, single beam laser can not be irradiated on pcb board, and then avoids the generation of laser burn pcb board phenomenon.
Above-described embodiment is the present invention's preferably embodiment; but embodiments of the present invention are not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (8)
1. the welding method of a component's feet, laser and wire feeder is adopted to be welded on pcb board by component's feet, it is characterized in that: described laser is single beam laser, in welding process, the heating location of laser is positioned at the pin tip of components and parts, and the pin that the wire feed position of wire feeder is positioned at components and parts is most advanced and sophisticated.
2. the welding method of component's feet according to claim 1, is characterized in that: described welding method specifically comprises the following steps,
S1. the components and parts of required welding are positioned on pcb board;
S2. the pin tip of single beam laser to components and parts is adopted to carry out preheating;
S3. soft solder silk to be delivered to the pin of components and parts most advanced and sophisticated for wire feeder, melts after pin tip accepts LASER HEATING, and under gravity, under flow to pad locations on pcb board, heat conduction completes welding to pad locations simultaneously.
3. the welding method of component's feet according to claim 2, is characterized in that: in step s 2, and the time of single beam laser to the most advanced and sophisticated preheating of the pin of components and parts is 100 ~ 500ms.
4. the welding method of component's feet according to claim 2, is characterized in that: in step s3, and the wire guiding nipple of wire feeder and horizontal plane have an angle α, and has a distance d with the pin tip of components and parts bottom the wire guiding nipple of wire feeder.
5. the welding method of component's feet according to claim 4, is characterized in that: described angle α is 30 ~ 60 °, and described distance d is 5 ~ 15mm.
6. realize the device of the welding method of the component's feet described in any one of Claims 1 to 5, it is characterized in that: this device comprises semiconductor laser and wire feeder, described semiconductor laser is vertically installed in directly over the component's feet on pcb board, and described wire feeder is arranged at the side of semiconductor laser.
7. the welder of component's feet according to claim 6, is characterized in that: the wire guiding nipple of described wire feeder and horizontal plane have an angle α, and has a distance d with the pin tip of components and parts bottom the wire guiding nipple of wire feeder.
8. the welder of component's feet according to claim 7, is characterized in that: described angle α is 30 ~ 60 °, and described distance d is 5 ~ 15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410104927.XA CN104923914B (en) | 2014-03-20 | 2014-03-20 | A kind of welding method of component's feet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410104927.XA CN104923914B (en) | 2014-03-20 | 2014-03-20 | A kind of welding method of component's feet |
Publications (2)
| Publication Number | Publication Date |
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| CN104923914A true CN104923914A (en) | 2015-09-23 |
| CN104923914B CN104923914B (en) | 2017-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410104927.XA Active CN104923914B (en) | 2014-03-20 | 2014-03-20 | A kind of welding method of component's feet |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
| CN106392228A (en) * | 2016-10-25 | 2017-02-15 | 贸联电子(昆山)有限公司 | Welding method of element pins |
| CN106425103A (en) * | 2016-10-31 | 2017-02-22 | 武汉凌云光电科技有限责任公司 | Infrared laser welding method for nonferrous metals |
| CN110238474A (en) * | 2019-07-05 | 2019-09-17 | 俞烽 | A kind of semiconductor devices erecting and welding system and method |
| CN113369690A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
| CN116551176A (en) * | 2023-07-12 | 2023-08-08 | 长春理工大学 | Infrared detection window laser welding device and welding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
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| CN106425103A (en) * | 2016-10-31 | 2017-02-22 | 武汉凌云光电科技有限责任公司 | Infrared laser welding method for nonferrous metals |
| CN106425103B (en) * | 2016-10-31 | 2018-02-13 | 武汉凌云光电科技有限责任公司 | A kind of welding method of infrared laser to non-ferrous metal |
| CN110238474A (en) * | 2019-07-05 | 2019-09-17 | 俞烽 | A kind of semiconductor devices erecting and welding system and method |
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| CN113369690A (en) * | 2021-06-30 | 2021-09-10 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
| CN113369690B (en) * | 2021-06-30 | 2023-03-14 | 哈尔滨工业大学（威海） | Connection method and clamp for laser brazing of vibrating mirror of temperature receiver resistor component |
| CN116551176A (en) * | 2023-07-12 | 2023-08-08 | 长春理工大学 | Infrared detection window laser welding device and welding method |
| CN116551176B (en) * | 2023-07-12 | 2023-09-15 | 长春理工大学 | Infrared detection window laser welding device and welding method |
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