CN104874911A - Laser machining system for forming of pointed end of microprobe - Google Patents
Laser machining system for forming of pointed end of microprobe Download PDFInfo
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- CN104874911A CN104874911A CN201510275772.0A CN201510275772A CN104874911A CN 104874911 A CN104874911 A CN 104874911A CN 201510275772 A CN201510275772 A CN 201510275772A CN 104874911 A CN104874911 A CN 104874911A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The invention discloses a laser machining system for forming of the pointed end of a microprobe, and relates to the field of machining and manufacturing of the pointed ends of microprobes. The system mainly comprises a laser generation module, an optical path adjustment module, a probe position adjustment module, an on-line monitoring module, a signal analysis and processing module and a laser protection module. Lasers emitted by the laser generation module are gathered at the pointed end of the probe after being adjusted by the optical path adjustment module, and then local rapid heating forming can be performed on the pointed end of the probe; the on-line monitoring module can perform real-time monitoring on the machining process; the signal analysis and processing module controls the whole machining process by adjusting a power controller connected with the signal analysis and processing module. According to the system, the size and position of a heat source acting area can be flexibly adjusted, damage to other areas except for the pointed end of the microprobe is not likely to occur, the system is suitable for performing rapid heating on a micro local area, meanwhile, heating power and heating time can be easily and accurately controlled, and an ideal spherical shape of the pointed end of the microprobe can be obtained within a short time.
Description
Technical field
The present invention relates to the most advanced and sophisticated processing and manufacturing field of microprobe, particularly the most advanced and sophisticated forming laser system of processing of a kind of microprobe.
Background technology
Microprobe is the core building block of the measuring instruments such as measuring surface form instrument, profile measurer, contact pin type displacement transducer, at field of industrial productions such as accurate measurement processing, high-end product manufactures, has and applies widely.
For microprobe, a good microspheroidal tip is absolutely necessary.How processing probe, making it have good microspheroidal tip is a technical barrier urgently to be resolved hurrily.
The most advanced and sophisticated hot forming processing method of traditional microprobe has following several: flame heating forming process, Resistant heating forming process, arc discharge heating forming process etc.These processing methods have himself shortcomings and deficiencies.
Flame method for cooking is the most advanced and sophisticated forming and machining method of a kind of microprobe comparatively early.This formed machining system mainly comprises: flame generating means, stationary fixture, clamping adjustment platform etc.Its Flame is produced by hydrogen or the fuel combustion such as ethanol or propane, is sprayed, heat to processed probe tip by the nozzle of flame generating means.The subject matter that this processing method exists is: 1, flame space distribution is comparatively large, is not suitable for small local and accurately processes.2, the flame temperature field that burning produces is subject to the ectocine such as air-flow, humidity, and the heat time can not accurately control, cause most advanced and sophisticated shaping uniformity and repeatability poor.3, the burning of fuel can be introduced other oxides and be attached to probe ball point, impacts probe tip.
Resistant heating firing process produces on the basis of flame heating means, and this formed machining system mainly comprises: heating resistance wire or resistor disc and the circuit be attached thereto, stationary fixture, clamping adjustment platform etc.The heating region of the method is by resistor disc size constraint compared with flame method for cooking.But still there is following defect with regard to itself feature: 1, heating region is comparatively large, is not suitable for small local and accurately processes.2, in heating process, the easy powdered of exothermic material and rhegma, release noxious material; 3, exothermic material programming rate is comparatively slow and need to pass into larger current, requires very high to hardware circuit.
Arc discharge heating means are a kind of more common most advanced and sophisticated forming and machining methods for materials with high melting point probe, the method mainly based on basic principles such as arc discharge, energy absorption and surface tension to probe tip formed machining.The composition of its system of processing comprises: high-frequency and high-voltage power supply, two symmetrical electrode assemblies and the circuit be attached thereto, stationary fixture, clamping adjustment platform etc.The defect that electrode discharge processing mode mainly exists is: although 1, heating region comparatively above several its size less can not adjust according to processing request, flexibility and poor universality.There is the defects such as electric arc hole, bubble in the ball point surface 2, processed.3, adding man-hour for preventing machined material and sparking electrode and oxygen reaction, needing to pass into protective gas, therefore complex structure, not easy to operate.
Summary of the invention
For solving the defect existed in the most advanced and sophisticated forming technique of above microprobe, improve the spherical quality at microprobe tip.Based on the application idea of laser processing in optical fiber coupling device preparation, we have invented the most advanced and sophisticated forming laser system of processing of a kind of microprobe.The concrete technical scheme that this system adopts is described below:
Originally system is shaped, primarily of compositions such as laser generation module, optical path adjusting module, probe location adjusting module, on-line monitoring module, signal analysis and processing module, lasing safety modules.Described laser generation module comprises: CO
2laser instrument (1), dc source (2), power controller (3) etc., be used for producing CO
2laser; It is characterized in that: described CO
2the rear end of laser instrument connects dc source (2) and power controller (3) respectively, and front is provided with described optical path adjusting module.
Described optical path adjusting module comprises: laser designator (4), light combination mirror (5), condenser lens (6), laser absorption device (10) etc., be used for regulating laser optical path, it is characterized in that: the center of described laser designator, light combination mirror, condenser lens, laser absorption device is in the same level parallel with X-Y plane, wherein laser designator is positioned at the right side of light combination mirror (5), lower and visible second laser of energy can be launched, described light combination mirror, condenser lens and laser absorption device, along the CO of level
2laser beam axis is arranged in order from left to right.
Described adjustment of displacement module is two dimension or multidimensional precision displacement platform (9), be used for adjusting the relative position of microprobe blank, it is characterized in that: described displacement platform is a kind of precision actuation platform, is arranged on the right side of condenser lens (6); On described displacement platform, rigid connecting is connected to fixture, described fixture is used for fixing described microprobe blank, by the position regulating displacement platform can change microprobe blank (8), its tip is made to be in the right side near focal point of described condenser lens.
Described on-line monitoring module is a kind of micro-imaging equipment (7), be used for observing the forming process of probe tip, it is characterized in that: described micro-imaging equipment mainly comprises micro-imaging camera lens and image sensor array, described image sensor array is generally the one in CCD device or cmos device, the tip of the microprobe blank (8) that the alignment lens of described micro-imaging equipment is processed, in equipment output end access signal analysis and processing module (11), the real-time image information of most advanced and sophisticated for microprobe blank forming process can be transferred to signal analysis and processing module (11), achieve the operation of visual on-line machining.
Described signal analysis and processing module (11) is computer, and the signal being used for controlling power controller (3) exports and receives the image information of micro-imaging equipment (7).It is characterized in that: described signal analysis and processing module is connected with power controller (3) and micro-imaging equipment (7) respectively, described micro-imaging equipment, by the processing on real-time information of shooting, is transferred to signal analysis and processing module (11) and carries out analyzing and processing.According to analysis result, signal analysis and processing module (11) is again by the parameter control CO of Modulating Power controller (3)
2the working power of laser instrument (1).
Described lasing safety module is cover glass (12), it is characterized in that: described cover glass is by four pieces of CO
2laser special protection glass plate is formed, and covers on the region of whole laser optical path process, can prevent CO
2the skew scattering of laser damages user of service.
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrate further into, the central plane of described light combination mirror is vertical with X-Y plane and become miter angle to place with Y-Z plane, described CO
2the first laser (13) along Y direction that laser instrument sends, incide the center of light combination mirror (5), the center inciding light combination mirror (5) along visible second laser (14) of X-axis negative direction that laser designator (4) sends, two bundle laser, after light combination mirror (5), are merged into and a branch ofly have the 3rd laser (15) with the second laser same color along Y direction; After the 3rd described laser incides condenser lens (6), converge in the tip of described microprobe blank (8), can be shaped to the heating of microprobe tip.Other remaining laser is radiated on laser absorption device (10), is intercepted absorb by laser absorption device (10).
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrates further as, described CO
2the power supply of laser is provided by dc source (2), and laser power is regulated by the power controller (3) be connected with signal analysis and processing module (11).Why native system adopts CO
2laser instrument be because processed microprobe majority is made up of nonmetallic materials, and nonmetallic materials is to CO
2laser induced plasma flow field is higher than other laser.
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrate further into, described power controller is exported by regulating impulse width for a kind of, realizes the equipment that laser output power regulates, respectively with CO
2laser instrument (1) is connected with signal analysis and processing module (11).Described signal analysis and processing module is used for providing control signal to described power controller, controls startup and the stopping of power controller (3).After power controller (3) starts, the pwm signal of user preset can be acted on CO
2laser instrument (1), realizes CO
2the triggering of laser.User regulates the pwm signal parameter preset by signal analysis and processing module (11), adjust CO flexibly
2the output time of laser and power output, thus accurately can control the probe tip heat time and add heat, enhance controllability and the operability of process.
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrate further into, described light combination mirror is a kind of eyeglass different to the light action of different wave length.Due to the CO that native system uses
2laser is the sightless infrared laser of human eye, if not treated, will affect subsequent machining operations and bring potential safety hazard.Native system adds laser designator (4) and light combination mirror (5) for this reason, is used for CO
2laser carries out mark instruction.Described laser designator can launch lower and visible second laser of a kind of energy, and described light combination mirror has the transmissivity of superelevation to the first laser (13), has very strong albedo to the second laser (14).The first laser (13) transmiting light combination mirror (5) will be merged into the 3rd laser (15) with the second described laser with same color with the second laser (14) reflected through light combination mirror (5), thus completes CO
2the mark instruction of laser, achieves the visual of CO2 laser optical path in following process process.
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrate further into, described condenser lens is the condenser lens that a kind of wave-length coverage according to laser instrument Output of laser is selected, and its eyeglass multiplex ZnSe, Ge etc. are to CO
2the material that laser has superelevation transmissivity is made.The center of condenser lens (6), on the optical axis of the 3rd laser (15), is used for CO
2laser converges, and laser facula is diminished, the CO after convergence
2laser dimensional energy distribution is more concentrated, can carry out local fast heating shaping to probe tip.
The most advanced and sophisticated forming laser system of processing of a kind of microprobe as above, illustrate further into, described laser absorption device is placed in the end of whole light path system, is used for stopping and laser more than absorption of residual, the personal safety of guarantee user of service.
Beneficial effect of the present invention
Compared with the most advanced and sophisticated thermo shaping method of traditional microprobe, the beneficial effect that the present invention brings is:
Size and the position in Source region can be adjusted flexibly, not easily cause microprobe other area damage except tip, be applicable to small regional area Fast Heating very much, obtain desirable probe tip shape.
Process time is shorter, and better, working power and action time easily accurately control, can according to the demand flexible modulation of oneself for probe tip shaping uniformity and repeatability.
Accompanying drawing explanation
Fig. 1 is the most advanced and sophisticated forming laser system of processing of a kind of microprobe of the present invention, overall structure figure.
Fig. 2 is the most advanced and sophisticated forming laser system of processing of a kind of microprobe of the present invention, the most advanced and sophisticated spherical chart of a kind of standard microprobe shaped.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention will be further described.
As shown in Figure 1: the present invention relates to the most advanced and sophisticated forming laser system of processing of a kind of microprobe, comprising: CO
2laser instrument (1), dc source (2), power controller (3), laser designator (4), light combination mirror (5), condenser lens (6), micro-imaging equipment (7), microprobe blank (8), probe location adjusting module (9), laser absorption device (10), signal analysis and processing module (11), cover glass (12) etc.Described micro-imaging equipment (7) with CCD microscopic imaging apparatus as an example, described microprobe blank (8) with glass probe as an example, described probe location adjusting module (9) is with precision three-dimensional displacement platform for example, and described signal analysis and processing module (11) is that example is described with computer.Specific process of the present invention can be divided into the following steps:
In the system of processing shown in Fig. 1, the first step is the system call interception preparatory stage.First, the power supply of the electrical equipments such as the dc source (2) in system, power controller (3), CCD microscopic imaging apparatus (7), computer (11) is connected, simultaneously by dc source (2) and CO
2laser instrument (1) connects, power controller (3) and CO
2laser instrument (1) is connected with computer (11), then is connected with computer (11) by micro-imaging equipment (7).Secondly, the position of part each in system is tentatively adjusted, by CO
2the center of laser instrument (1), laser designator (4), light combination mirror (5), condenser lens (6), laser absorption device (10) is adjusted in the same level parallel with X-Y plane, and by described CO
2laser instrument, light combination mirror, condenser lens, laser absorption device are along the CO of level
2laser beam axis is arranged in order from left to right, described laser designator is arranged on the right side of light combination mirror (5).Finally, adjustment CCD microscopic imaging apparatus (7), makes the right side focus of its condenser lens described in camera lens rough alignment.
In the system of processing shown in Fig. 1, second step be the conjunction bundle of the first described laser and the second laser adjust and glass probe (8) clamp location.On first step operation basis, open dc source (2) and power controller (3), first give the power parameter that power controller (3) input one is lower, make described CO
2laser instrument sends the first moderate laser of a branch of energy comparison.The first described laser, respectively through after the transmission of light combination mirror (5) and the focusing of condenser lens (6), is radiated on laser absorption device (10), and stays next calcination point on laser absorption device (10).
Then power controller (3) is closed, opening visible second laser that laser designator (4) makes it launch is radiated on light combination mirror (5), the second described laser is by being radiated on described laser absorption device equally after the reflection of light combination mirror (5) and the focusing of condenser lens (6), and on laser absorption device, form a visible light spot, the relative position of the visible light spot described in observation and described calcination point.By the position of adjustment laser designator (4), make the center superposition of the center of described visible light spot and described calcination point, thus realize indicating the mark of sightless first laser.
After determining two bundle laser coaxials, laser designator (4) is kept to be in opening.Then, by processed glass tube along the vertical fixed clamp of Z-direction on described precision three-dimensional displacement platform.Open the tip location of CCD microscopic imaging apparatus (7) sight glass pipe, by adjustment precision three-D displacement platform (9), make glass probe tip with the second described laser when the right side near focal point of condenser lens (6) is orthogonal, stopping regulates.
In the system of processing shown in Fig. 1, the 3rd step is that the heating of glass probe tip is shaped.On second step operation basis, the power parameter set and time parameter are input in power controller (3) by computer (11).Open power controller (3), described CO
2the CO that laser instrument sends
2laser heats to the tip of glass probe (8).Due to described CO
2laser has very high energy, and therefore after heating very short time, flowing can be softened in glass probe tip, and under surface tension and internal stress effect, described glass probe tip will form hemispherical as shown in Figure 2.
The softening forming process at described glass probe tip, is in the real-time monitored of CCD microscopic imaging apparatus (7).The forming information of described CCD microscopic imaging apparatus observation, after computer (11) analyzing and processing, forms new power parameter and time parameter, then by power controller (3), control CO
2laser instrument (1), can form new probe tip processing scheme.Such structural design, can improve the success rate that glass-tube probe tip shapes effectively.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all within thought of the present invention and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. the most advanced and sophisticated forming laser system of processing of microprobe, primarily of compositions such as laser generation module, optical path adjusting module, probe location adjusting module, on-line monitoring module, signal analysis and processing module, lasing safety modules; Described laser generation module comprises: CO
2laser instrument (1), dc source (2), power controller (3) etc., described CO
2the rear end of laser instrument connects dc source (2) and power controller (3), CO respectively
2the front of laser instrument (1) is provided with described optical path adjusting module; Described optical path adjusting module comprises: laser designator (4), light combination mirror (5), condenser lens (6), laser absorption device (10) etc., the center of described laser designator, light combination mirror, condenser lens, laser absorption device is in the same level parallel with X-Y plane, wherein laser designator is positioned at the right side of light combination mirror (5), lower and visible second laser (14) of energy can be launched, described light combination mirror, condenser lens and laser absorption device, along the CO of level
2laser beam axis is arranged in order from left to right; Described probe location adjusting module (9) is fixed with microprobe blank (8) to be processed, and the position of microprobe blank (8) to be processed adjusts by probe location adjusting module (9); Described on-line monitoring module is a kind of micro-imaging equipment (7), the camera lens of this equipment is just to the tip of microprobe blank (8), and in output access signal analysis and processing module (11), output signal can be transferred to signal analysis and processing module (11); Described signal analysis and processing module is connected with power controller (3) and micro-imaging equipment (7) respectively, and the signal being used for controlling power controller (3) exports and receives the image information of micro-imaging equipment (7); Described lasing safety module is cuboid cover glass (12), and described cover glass is by four pieces of CO
2laser special protection glass plate is formed, and covers on the region of whole laser optical path process.
2. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, is characterized in that: described CO
2laser instrument, light combination mirror, condenser lens, microprobe blank, laser absorption device are at the CO of level
2laser beam axis is arranged in order from left to right, CO
2the first laser (13) along Y direction that laser instrument (1) sends, with laser designator (4) send along visible second laser (14) of X-axis negative direction, be merged at the center of light combination mirror (5) and a branch ofly have the 3rd laser (15) with the second laser (14) same color along Y direction, the 3rd described laser is radiated on condenser lens (6), the tip of microprobe blank (8) and laser absorption device (10) successively.
3. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, is characterized in that: described power controller is the adjustable function signal generation equipment of a kind of conventional square-wave pulse width, is used for the laser intensity controlling to produce.
4. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, is characterized in that: the central plane of described light combination mirror is perpendicular to X-Y plane and becomes miter angle to place with Y-Z face, at close CO
2one side surface of laser instrument (1) is coated with the low anti-antireflecting coating for the first laser (13), is coated with the highly-reflective coating for the second laser (14) at the side surface near laser designator (4).
5. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, it is characterized in that: described condenser lens is centrally located on the 3rd laser (15) optical axis, and on the right side of it, focal position overlaps with the tip of described microprobe blank (8); Eyeglass multiplex ZnSe, Ge etc. of described condenser lens are to CO
2the material that laser has superelevation transmissivity is made.
6. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, is characterized in that: described micro-imaging equipment (7) for a kind of based on the microscopic imaging apparatus of CCD device or cmos device.
7. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, it is characterized in that: described probe location adjusting module is two dimension or multidimensional precision displacement platform, on described displacement platform, rigid connecting is connected to stationary fixture, described stationary fixture is clamped with described microprobe blank.
8. the most advanced and sophisticated forming laser system of processing of a kind of microprobe as claimed in claim 1, is characterized in that: described signal analysis and processing module is computer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510275772.0A CN104874911B (en) | 2015-05-27 | 2015-05-27 | A kind of microprobe tip forming laser system of processing |
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|---|---|---|---|
| CN201510275772.0A CN104874911B (en) | 2015-05-27 | 2015-05-27 | A kind of microprobe tip forming laser system of processing |
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| CN104874911B CN104874911B (en) | 2016-10-12 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105537757A (en) * | 2016-01-20 | 2016-05-04 | 四川大学 | Microprobe tip thermal forming system based on polysymmetrical laser beam |
| CN105598578A (en) * | 2016-03-29 | 2016-05-25 | 四川大学 | Microprobe tip thermal processing device based on laser beams converged in annular reflection cavity |
| CN105665935A (en) * | 2015-12-29 | 2016-06-15 | 四川大学 | Microprobe tip forming system based on CO2 laser bilateral heating mode |
| CN105806284A (en) * | 2016-05-12 | 2016-07-27 | 四川大学 | Microprobe machining and forming system and method |
| CN105817764A (en) * | 2016-04-19 | 2016-08-03 | 常熟安通林汽车饰件有限公司 | Laser weakening equipment for automobile instrument |
| CN105855695A (en) * | 2016-05-11 | 2016-08-17 | 四川大学 | Rotary uniformly heated microprobe tip hot forming device |
| CN105965155A (en) * | 2016-07-21 | 2016-09-28 | 成都福誉科技有限公司 | Method and system for uniformly controlling laser power |
| CN106404236A (en) * | 2016-08-23 | 2017-02-15 | 上海交通大学 | PVDF-based microneedle-type piezoelectric micro-force sensor and preparation method thereof |
| CN106563881A (en) * | 2016-08-29 | 2017-04-19 | 武汉凌云光电科技有限责任公司 | Device and method for cutting optical fiber through laser |
| CN109310853A (en) * | 2016-05-09 | 2019-02-05 | 新信心股份有限公司 | The manufacturing method of laser processing and micropin |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665935A (en) * | 2015-12-29 | 2016-06-15 | 四川大学 | Microprobe tip forming system based on CO2 laser bilateral heating mode |
| CN105537757A (en) * | 2016-01-20 | 2016-05-04 | 四川大学 | Microprobe tip thermal forming system based on polysymmetrical laser beam |
| CN105598578A (en) * | 2016-03-29 | 2016-05-25 | 四川大学 | Microprobe tip thermal processing device based on laser beams converged in annular reflection cavity |
| CN105817764A (en) * | 2016-04-19 | 2016-08-03 | 常熟安通林汽车饰件有限公司 | Laser weakening equipment for automobile instrument |
| CN109310853A (en) * | 2016-05-09 | 2019-02-05 | 新信心股份有限公司 | The manufacturing method of laser processing and micropin |
| CN105855695A (en) * | 2016-05-11 | 2016-08-17 | 四川大学 | Rotary uniformly heated microprobe tip hot forming device |
| CN105806284A (en) * | 2016-05-12 | 2016-07-27 | 四川大学 | Microprobe machining and forming system and method |
| CN105965155A (en) * | 2016-07-21 | 2016-09-28 | 成都福誉科技有限公司 | Method and system for uniformly controlling laser power |
| CN106404236A (en) * | 2016-08-23 | 2017-02-15 | 上海交通大学 | PVDF-based microneedle-type piezoelectric micro-force sensor and preparation method thereof |
| CN106563881A (en) * | 2016-08-29 | 2017-04-19 | 武汉凌云光电科技有限责任公司 | Device and method for cutting optical fiber through laser |
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