CN104874911B - A kind of microprobe tip forming laser system of processing - Google Patents
A kind of microprobe tip forming laser system of processing Download PDFInfo
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- CN104874911B CN104874911B CN201510275772.0A CN201510275772A CN104874911B CN 104874911 B CN104874911 B CN 104874911B CN 201510275772 A CN201510275772 A CN 201510275772A CN 104874911 B CN104874911 B CN 104874911B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The invention discloses a kind of microprobe tip forming laser system of processing, relate to processing and manufacturing field, microprobe tip.This system specifically includes that laser generation module, optical path adjusting module, probe location adjusting module, on-line monitoring module, signal analysis and processing module, lasing safety module etc.；The laser that described laser generation module sends, after optical path adjusting module regulates, converges in probe tip, probe tip can be carried out local fast heating shaping；The course of processing can be monitored by described on-line monitoring module in real time, and described signal analysis and processing module, by regulating connected power controller, controls the whole course of processing.Native system can be adjusted flexibly the size and location in Source region, it is not easily caused microprobe damage in other regions in addition to tip, it is suitable for small regional area is quickly heated, the most accurately control heating power and heat time heating time simultaneously, preferable probe tip spherical form can be obtained at short notice.
Description
Technical field
The present invention relates to processing and manufacturing field, microprobe tip, particularly to a kind of microprobe tip forming laser processing system
System.
Background technology
Microprobe is the core composition of the measuring instruments such as measuring surface form instrument, profile measurer, contact pin type displacement transducer
Parts, at field of industrial productions such as accurate measurement processing, high-end product manufactures, have and apply widely.
For microprobe, a good microspheroidal tip is requisite.How probe is processed so that it is have
Good microspheroidal tip is a technical barrier urgently to be resolved hurrily.
Traditional microprobe tip hot forming processing method has following several: flame thermoforming method, Resistant heating shape
Method, arc discharge thermoforming method etc..These processing methods have the shortcomings and deficiencies of himself.
Flame method for cooking is one microprobe tip forming and machining method earlier.This forming system specifically includes that
Flame generating means, stationary fixture, clamping adjusts platform etc..Its Flame is produced by hydrogen or the fuel combustion such as ethanol or propane,
Sprayed by the nozzle of flame generating means, heat to processed probe tip.The subject matter that this processing method exists is:
1, flame space distribution is relatively big, is not suitable for small local and accurately processes.2, burning produce flame temperature field easily by air-flow,
The ectocines such as humidity, and can not accurately control heat time heating time, cause the concordance of most advanced and sophisticated molding and repeatability poor.3, combustion
The burning of material can introduce other oxides and be attached to probe ball point, impacts probe tip.
Resistant heating firing process produces on the basis of flame heating means, and this forming system specifically includes that
Heating resistance wire or resistor disc and the circuit being attached thereto, stationary fixture, clamping adjustment platform etc..Compared with flame method for cooking
The heating region of the method is by resistor disc size constraint.But for itself feature, still there is following defect: 1, the thermal treatment zone
Territory is relatively big, is not suitable for small local and accurately processes.2, in heating process, the easy powdered of exothermic material and rhegma, release has
Poisonous substance matter；3, exothermic material programming rate is relatively slow and needs to be passed through larger current, requires the highest to hardware circuit.
Arc discharge heating means are a kind of most advanced and sophisticated forming and machining methods for materials with high melting point probe more typically, the party
Method is based primarily upon the basic principles such as arc discharge, energy absorption and surface tension and forms probe tip.Its system of processing
Composition includes: high-frequency and high-voltage power supply, two symmetrical electrode assemblies and the circuit being attached thereto, stationary fixture, clamping adjust flat
Platform etc..The defect that electrode discharge processing mode is primarily present is: although but 1, heating region relatively above several its sizes less
Can not adjust according to processing request, motility and poor universality.There is electric arc hole, gas in the ball point surface 2, processed
The defects such as bubble.3, add man-hour for preventing machined material and sparking electrode and oxygen reaction, need to be passed through protective gas, therefore
Structure is complicated, is difficult to operation.
Summary of the invention
For solving defect present in above microprobe tip forming technique, improve the spherical quality that microprobe is most advanced and sophisticated,
The invention provides a kind of microprobe tip forming laser system of processing.The concrete technical scheme of this system employing is as detailed below retouches
State.
A kind of microprobe tip forming laser system of processing, mainly by laser generation module, optical path adjusting module, probe position
Put adjusting module, on-line monitoring module, signal analysis and processing module, lasing safety module composition.Described laser generation module
Including: CO2Laser instrument (1), DC source (2), power controller (3), be used for producing CO2Laser；It is characterized in that:
Described CO2The rear end of laser instrument connects DC source (2) and power controller (3) respectively, and front is provided with described light path
Adjustment module.
Described optical path adjusting module includes: laser designator (4), light combination mirror (5), condenser lens (6), laser are inhaled
Receive device (10)；Described laser designator, light combination mirror, condenser lens, the center of laser absorption device are being put down with X-Y plane
In the same level of row, wherein laser designator is positioned at the right side of light combination mirror (5), can launch energy relatively low and visible
Second laser, described light combination mirror, condenser lens and laser absorption device, along the CO of level2Laser beam axis is the most successively
Arrangement.
Described adjustment of displacement module is two dimension or multidimensional precision displacement platform (9), is used for adjusting the phase para-position of microprobe blank
Put；Described displacement platform is a kind of precision actuation platform, is arranged on the right side of condenser lens (6)；Put down in described displacement
Be rigidly connected on platform fixture, and described fixture is used for fixing described microprobe blank, can change micro-by regulation displacement platform
The position of probe blank (8) so that it is tip is in the right side near focal point of described condenser lens.
Described on-line monitoring module is a kind of micro-imaging equipment (7), is used for observing the forming process of probe tip；Institute
The micro-imaging equipment stated mainly includes micro-imaging camera lens and image sensor array, and described image sensor array is usually
One in CCD device or cmos device, the microprobe blank that the alignment lens of described micro-imaging equipment is processed
(8) tip, equipment output end accesses in signal analysis and processing module (11), can be formed at microprobe blank tip
The real-time image information of process is transferred to signal analysis and processing module (11), it is achieved that visual on-line machining operates.
Described signal analysis and processing module (11) is computer, be used for control power controller (3) signal output and
Receive the image information of micro-imaging equipment (7)；Described signal analysis and processing module respectively with power controller (3) and aobvious
Micro-imaging device (7) connects, and described micro-imaging equipment, by the processing on real-time information of shooting, is transferred to signal analysis and processing
Module (11) is analyzed processing.According to analysis result, signal analysis and processing module (11) is again by adjusting power controller
(3) parameter controls CO2The working power of laser instrument (1).
Described lasing safety module is cover glass (12)；Described cover glass is by four pieces of CO2Laser is special anti-
Protect glass plate to constitute, cover on the region of whole laser optical path process, CO can be prevented2User of service is caused by the skew scattering of laser
Injury.
Microprobe tip as above a kind of forming laser system of processing, illustrate further into, described light combination mirror
Central plane is vertical with X-Y plane and becomes 45 degree of angles to place with Y-Z plane, described CO2Laser instrument send along Y-axis side
To the first laser (13), incide the center of light combination mirror (5), what laser designator (4) sent can along X-axis negative direction
The second laser (14) seen incides the center of light combination mirror (5), and two bundle laser, after light combination mirror (5), are merged into a branch of
Along Y direction, there is the 3rd laser (15) with the second laser same color；The 3rd described laser light incident is to condenser lens
(6), after, the tip of described microprobe blank (8) is converged in, can be to microprobe tip thermoforming.Other remnants swash
Light is radiated on laser absorption device (10), is intercepted by laser absorption device (10) and absorbs.
Microprobe tip as above a kind of forming laser system of processing, illustrates further as, described CO2Laser
Power supply by DC source (2) provide, laser power is by the power controller being connected with signal analysis and processing module (11)
(3) regulation.Why native system uses CO2Laser instrument, is because processed microprobe most by nonmetallic materials system
Become, and nonmetallic materials are to CO2Laser induced plasma flow field is higher than other laser.
Microprobe tip as above a kind of forming laser system of processing, illustrate further into, described power controls
Device is a kind of by regulation pulse width output, it is achieved the equipment of laser output power regulation, respectively with CO2Laser instrument (1)
Connect with signal analysis and processing module (11).Described signal analysis and processing module is used for providing control to described power controller
Signal processed, controls startup and the stopping of power controller (3).After power controller (3) starts, can be user preset
Pwm signal acts on CO2Laser instrument (1), it is achieved CO2The triggering of laser.User can pass through signal analysis and processing module
(11) the pwm signal parameter that regulation is preset, is adjusted flexibly CO2The output time of laser and output, thus can be accurate
Control probe tip heat time heating time and add heat, enhancing controllability and the operability of the course of processing.
Microprobe tip as above a kind of forming laser system of processing, illustrate further into, described light combination mirror is
A kind of eyeglass different to the light action of different wave length.The CO used due to native system2Laser is that human eye is sightless infrared sharp
Light, if the most treated, it will affect subsequent machining operations and bring potential safety hazard.Laser designator is added for this native system
(4) with light combination mirror (5), it is used for CO2Laser is labeled instruction.Described laser designator can launch a kind of energy
Relatively low and visible second laser, described light combination mirror has the absorbance of superelevation to the first laser (13), to the second laser
(14) there is the strongest reflectance.Transmit first laser (13) of light combination mirror (5) and the reflected through light combination mirror (5)
Dual-laser (14) has the 3rd laser (15) of same color by being merged into the second described laser, thus completes CO2
The mark instruction of laser, it is achieved that CO during following process2The visualization of laser optical path.
Microprobe tip as above a kind of forming laser system of processing, illustrates further as, described condenser lens
The condenser lens selected for a kind of wave-length coverage according to laser instrument Output of laser, the eyeglass of condenser lens uses CO2 laser
ZnSe or the Ge material with superelevation absorbance is made.The center of condenser lens (6) is at the optical axis of the 3rd laser (15)
On, it is used for CO2Laser converges, and makes laser facula diminish, the CO after convergence2Laser dimensional energy distribution more collects
In, probe tip can be carried out local fast heating molding.
Microprobe tip as above a kind of forming laser system of processing, illustrates further as, described laser absorption
Device is placed in the end of whole light path system, is used for stopping and absorb remaining laser, it is ensured that the personal safety of user of service.
Compared with traditional microprobe tip thermo shaping method, the present invention brings and provides the benefit that.
The size and location in Source region can be adjusted flexibly, be not easily caused microprobe other regions in addition to tip and damage
Bad, it is especially suitable for small regional area is quickly heated, obtains preferable probe tip shape.
Process time is shorter, and probe tip shapes concordance and repeatability is preferable, and working power and action time are the most accurate
Control, can be according to the demand flexible of oneself.
Accompanying drawing explanation
Fig. 1 is one microprobe tip of the present invention forming laser system of processing, overall structure figure.
Fig. 2 is one microprobe tip of the present invention forming laser system of processing, and a kind of standard microprobe shaped is most advanced and sophisticated
Spherical chart.
Detailed description of the invention
The present invention will be further described with embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1: the present invention relates to a kind of microprobe tip forming laser system of processing, including CO2Laser instrument 1,
DC source 2, power controller 3, laser designator 4, light combination mirror 5, condenser lens 6, micro-imaging equipment 7, micro-spy
Pin blank 8, probe location adjusting module 9, laser absorption device 10, signal analysis and processing module 11, cover glass 12.
Described micro-imaging equipment 7 with CCD microscopic imaging apparatus as an example, described microprobe blank 8 using glass probe as
Example, described probe location adjusting module 9 with precision three-dimensional displacement platform as example, described signal analysis and processing module
11 are described with computer for example.The specific process of the present invention can be divided into the following steps.
In the system of processing shown in Fig. 1, the first step is the system call interception preparatory stage.First, by the unidirectional current in system
The power supply of the electrical equipments such as source 2, power controller 3, CCD microscopic imaging apparatus 7, computer 11 connects, simultaneously by unidirectional current
Source (2) and CO2Laser instrument 1 connects, power controller 3 and CO2Laser instrument 1 and computer 11 connect, then by micro-
Imaging device 7 is connected with computer 11.Secondly, the position of ingredient each in system is carried out just successive step, by CO2Swash
Light device 1, laser designator 4, light combination mirror 5, condenser lens 6, the center of laser absorption device 10 are adjusted to put down with X-Y plane
In the same level of row, and by described CO2Laser instrument, light combination mirror, condenser lens, laser absorption device are along level
CO2Laser beam axis is arranged in order from left to right, and described laser designator is arranged on the right side of light combination mirror 5.Finally, adjust
CCD microscopic imaging apparatus 7 so that it is the right side focus of the condenser lens described in camera lens rough alignment.
In the system of processing shown in Fig. 1, second step is that the conjunction bundle of the first described laser and the second laser adjusts and glass
Probe 8 clamp location.On the basis of the first step operates, open DC source 2 and power controller 3, first to power control
Device 3 processed inputs a relatively low power parameter, makes described CO2Laser instrument sends the first laser that a branch of energy comparison is moderate.
After the first described laser is respectively through the transmission of light combination mirror 5 and the focusing of condenser lens 6, it is radiated at laser absorption device 10
On, and on laser absorption device 10, stay next calcination point.
It is then shut off power controller 3, opens visible second laser that laser designator 4 makes it launch and be radiated at conjunction bundle
On mirror 5, the second described laser is by being radiated at described laser equally after the reflection of light combination mirror 5 and the focusing of condenser lens 6
On absorber, and on laser absorption device, form a visible light spot, the phase of the visible light spot described in observation and described calcination point
To position.By adjusting the position of laser designator 4, make the center of described visible light spot and the center weight of described calcination point
Close, thus realize the mark to sightless first laser and indicate.
After determining two bundle laser coaxials, laser designator 4 is kept to be in opening.Then, by processed glass tubing
Along the vertical fixed clamp of Z-direction on described precision three-dimensional displacement platform.Open CCD microscopic imaging apparatus 7 sight glass
The tip location of pipe, by adjustment precision three-D displacement platform 9, the second laser making glass probe most advanced and sophisticated Yu described is focusing on thoroughly
When the right side near focal point of mirror 6 is orthogonal, stop regulation.
In the system of processing shown in Fig. 1, the 3rd step is glass probe tip thermoforming.On second step operation basis
On, the power parameter set is input in power controller 3 by computer 11 with time parameter.Open power control
Device 3, described CO2The CO that laser instrument sends2Laser will carry out heat treated to the tip of glass probe 8.Due to described
CO2Laser has the highest energy, and therefore after heating very short time, glass probe tip can soften flowing, opens on surface
Under power and internal stress effect, described glass probe tip will form hemispherical as shown in Figure 2.
The softening forming process that described glass probe is most advanced and sophisticated, is in the real-time monitored of CCD microscopic imaging apparatus 7.Described
CCD microscopic imaging apparatus observation forming information through computer 11 analyze and process after, formed new power parameter and the time ginseng
Number, then by power controller 3, control CO2Laser instrument 1, can form new probe tip processing scheme.Such structure
Design, can be effectively improved the success rate that glass probe tip shapes.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all thought in the present invention and former
Within then, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (8)
1. a microprobe tip forming laser system of processing, is mainly adjusted by laser generation module, optical path adjusting module, probe location
Mould preparation block, on-line monitoring module, signal analysis and processing module, lasing safety module form；Described laser generation module bag
Include: CO2Laser instrument (1), DC source (2), power controller (3), described CO2The rear end of laser instrument connects respectively
DC source (2) and power controller (3), CO2The front of laser instrument (1) is provided with described optical path adjusting module；Described
Optical path adjusting module include: laser designator (4), light combination mirror (5), condenser lens (6), laser absorption device (10),
Described laser designator, light combination mirror, condenser lens, laser absorption device center at the same water parallel with X-Y plane
In plane, wherein laser designator is positioned at the right side of light combination mirror (5), can launch that energy is relatively low and visible second laser
(14), described light combination mirror, condenser lens and laser absorption device, along the CO of level2Laser beam axis is arranged the most successively
Row；Microprobe blank (8) to be processed, microprobe blank to be processed it is fixed with on described probe location adjusting module (9)
(8) position can be adjusted by probe location adjusting module (9)；Described on-line monitoring module is a kind of micro-imaging
Equipment (7), the camera lens of this equipment just tip to microprobe blank (8), and outfan access signal analysis and processing module
(11), in, output signal can be transferred to signal analysis and processing module (11)；Described signal analysis and processing module respectively with
Power controller (3) and micro-imaging equipment (7) connect, and are used for controlling the signal output of power controller (3) and receiving
The image information of micro-imaging equipment (7)；Described lasing safety module is cuboid cover glass (12), and described is anti-
Protect bell glass by four pieces of CO2Laser special protection glass plate is constituted, and covers on the region of whole laser optical path process.
2. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: described CO2Laser
Device, light combination mirror, condenser lens, microprobe blank, laser absorption device are at the CO of level2Arrange the most successively on laser beam axis
Row, CO2The first laser (13) along Y direction that laser instrument (1) sends, with laser designator (4) send along X
Visible second laser of axle negative direction (14), be merged at the center of light combination mirror (5) a branch of along Y direction have with second swash
3rd laser (15) of light (14) same color, the 3rd described laser is radiated at condenser lens (6), microprobe hair successively
On the tip of base (8) and laser absorption device (10).
3. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: described power controller
For a kind of conventional square-wave pulse width adjustable function signal generation equipment, it is used for controlling produced laser intensity.
4. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: in described light combination mirror
Heart plane is perpendicular to X-Y plane and becomes with Y-Z face 45 degree of angles to place, near CO2The side surface-coated of laser instrument (1)
There is the low anti-antireflecting coating for the first laser (13), having for the near the side surface-coated of laser designator (4)
The highly-reflective coating of dual-laser (14).
5. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: in described condenser lens
The heart is positioned on the 3rd laser (15) optical axis, and on the right side of it, focal position overlaps with the most advanced and sophisticated of described microprobe blank (8)；Institute
The eyeglass of the condenser lens stated uses ZnSe or the Ge material to CO2 laser with superelevation absorbance to make.
6. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: described micro-imaging sets
Standby (7) are a kind of based on CCD device or the microscopic imaging apparatus of cmos device.
7. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: described probe location is adjusted
Mould preparation block is two dimension or multidimensional precision displacement platform, and be rigidly connected on described displacement platform stationary fixture, and described is fixing
Described microprobe blank it is clamped with on fixture.
8. a kind of microprobe tip as claimed in claim 1 forming laser system of processing, is characterized in that: at described signal analysis
Reason module is computer.
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| CN201510275772.0A CN104874911B (en) | 2015-05-27 | 2015-05-27 | A kind of microprobe tip forming laser system of processing |
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| CN201510275772.0A CN104874911B (en) | 2015-05-27 | 2015-05-27 | A kind of microprobe tip forming laser system of processing |
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| CN104874911B true CN104874911B (en) | 2016-10-12 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665935A (en) * | 2015-12-29 | 2016-06-15 | 四川大学 | Microprobe tip forming system based on CO2 laser bilateral heating mode |
| CN105537757B (en) * | 2016-01-20 | 2017-10-10 | 四川大学 | A kind of sophisticated thermoforming system of the microprobe based on many axial symmetry laser beams |
| CN105598578A (en) * | 2016-03-29 | 2016-05-25 | 四川大学 | Microprobe tip thermal processing device based on laser beams converged in annular reflection cavity |
| CN105817764A (en) * | 2016-04-19 | 2016-08-03 | 常熟安通林汽车饰件有限公司 | Laser weakening equipment for automobile instrument |
| US20190209821A1 (en) * | 2016-05-09 | 2019-07-11 | Think-Lands Co., Ltd. | Laser beam machining method and microneedle fabrication method |
| CN105855695A (en) * | 2016-05-11 | 2016-08-17 | 四川大学 | Rotary uniformly heated microprobe tip hot forming device |
| CN105806284A (en) * | 2016-05-12 | 2016-07-27 | 四川大学 | Microprobe machining and forming system and method |
| CN105965155B (en) * | 2016-07-21 | 2018-01-02 | 成都福誉科技有限公司 | A kind of method and system of equal control laser power |
| CN106404236A (en) * | 2016-08-23 | 2017-02-15 | 上海交通大学 | PVDF-based microneedle-type piezoelectric micro-force sensor and preparation method thereof |
| CN106563881A (en) * | 2016-08-29 | 2017-04-19 | 武汉凌云光电科技有限责任公司 | Device and method for cutting optical fiber through laser |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4700043A (en) * | 1986-12-09 | 1987-10-13 | Matsutani Seisakusho Co., Ltd. | Method of forming bore in eyeless operating needle |
| US4935029A (en) * | 1987-06-22 | 1990-06-19 | Matsutani Seisakusho Co., Ltd. | Surgical needle |
| EP0503012B1 (en) * | 1990-09-28 | 1996-06-26 | Sulzer Innotec Ag | Hollow needle for medical use, and process for the manufacture of such needles |
| DE4234884A1 (en) * | 1992-10-16 | 1994-04-21 | Lutz Kothe | Mfg. two-part surgical instrument, with blank cut into two parts - form required contours in blank during dividing by cutter |
| EP1504829B1 (en) * | 2003-08-05 | 2006-06-07 | Lasag Ag | Process of manufacturing a medical needle |
| CN101776573B (en) * | 2010-03-09 | 2011-09-07 | 华中科技大学 | Silver-plated nano-fiber probe and manufacturing method thereof |
| CN103257254B (en) * | 2012-02-15 | 2015-11-25 | 西安电子科技大学 | A kind of probe tip and preparation method thereof |
| CN104345178A (en) * | 2013-07-24 | 2015-02-11 | 国家纳米科学中心 | Preparation method of metal probe |
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