CN203062088U - Laser welding system - Google Patents
Laser welding system Download PDFInfo
- Publication number
- CN203062088U CN203062088U CN2012207245222U CN201220724522U CN203062088U CN 203062088 U CN203062088 U CN 203062088U CN 2012207245222 U CN2012207245222 U CN 2012207245222U CN 201220724522 U CN201220724522 U CN 201220724522U CN 203062088 U CN203062088 U CN 203062088U
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- Prior art keywords
- laser
- mentioned
- wedge
- shaped substrate
- workpiece
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
Abstract
The utility model provides a laser welding system. A wedge-shaped substrate is used for dividing laser rays so that the manufacturing cost of the laser welding system can be prevented from being too high, and the improvement of jointing quality can be realized through management of the intensity ratio of the divided laser rays. The laser welding system is used for welding a workpiece (W) through irradiation of the laser rays (LB) which are oscillated out of a laser oscillator (14). The laser welding system comprises the wedge-shaped substrate (42), a wedge-shaped substrate driving control part (82) and a laser intensity determination part (50). The wedge-shaped substrate (42) is used for dividing the laser rays (LB) into multiple divided laser rays (LB1 and LB2). The wedge-shaped substrate driving control part (82) moves forwards and backwards relative to the laser rays (LB) so as to drive the wedge-shaped substrate (42) to control the incidence amount of the laser rays (LB) in the wedge-shaped substrate (42). The laser intensity determination part (50) obtains the intensity of each of the divided laser rays (LB1 and LB2). The wedge-shaped substrate driving control part (82) moves forwards and backwards to drive the wedge-shaped substrate (42) according to the intensity, obtained by the laser intensity determination part (50), of each of the divided laser rays (LB1 and LB2).
Description
Technical field
The utility model relates to the laser welding system that laser that workpiece irradiation is vibrated from laser oscillator welds.
Background technology
At present, as the method for electronic unit being installed at printing distributing board, using the welding of (flow) mode of flowing and backflow (reflow) mode widely.But, when printing distributing board is installed the electronic unit be difficult to weld in this way (for example electronic unit that hear resistance is low, electronic unit that the terminal ratio of heat capacities is bigger etc.), when perhaps assembling the substrate that has installed, need in the operation of back, partly carry out weld job.
The weld job of part in the operation of back is so many times welded by artificial use flatiron, and engage that quality produces fluctuation, engages that fraction defective improves, the production time is elongated, production cost rising etc. becomes problem.Therefore, constantly advance the exploitation of the device that can automatically weld at a high speed in recent years.
As automatic soldering device, known to the robot welding device of the robot that uses flatiron and the laser soldering device of use laser.
Above-mentioned robot welding device is pressed each workpiece that will engage with flatiron, simultaneously it is heated, and comes a pair of workpiece is engaged by the position of this heating being supplied with thread scolder.At this moment, because use flatiron, so be not easy the little electronic unit of installation dimension etc.In addition, the part of Rong Hua scolder is attached on the flatiron sometimes, can't provide needed amount of solder to soldered portion.And when lead-free solder is used in the consideration of environment, the fusing point of this lead-free solder is higher than the existing fusing point that contains plumbous scolder, so make the flatiron oxidation easily, makes the lifetime of this flatiron.
On the other hand, laser soldering device be because can easily adjust the degree of concentration of laser, so also can tackle the installation of the little electronic unit of size etc.
In such laser soldering device, for example when a side of a pair of workpiece that laser is only shone will engage, in each workpiece, produce big temperature difference, the scolder of fusing flows to the high workpiece of temperature, thus be easy to generate engage bad.In addition, thermal capacity is not difficult to obtain good joint quality simultaneously more in each workpiece.
Laser soldering device as the such problem of reply, knownly by beam splitter laser is divided into reverberation and sees through light, to shine soldered part by the laser of this beam splitter reflection, and will be through the laser soldering device of the high workpiece (for example with reference to patent documentation 1) of the laser irradiation thermal capacity of this beam splitter.But the strength ratio of each laser (respectively cutting apart laser) after can't easily change and cut apart by beam splitter this moment is so purposes is restricted.
As the laser soldering device that can change the strength ratio of cutting apart laser, the laser soldering device (for example with reference to patent documentation 2) that has proposed to use two prisms that engage to change the strength ratio of cutting apart laser and use with reflectivity (transmitance) according to the incoming position of laser and the partition member that different modes constitutes changes the laser soldering device (for example with reference to patent documentation 3) of the strength ratio of cutting apart laser.
But, in above-mentioned prior art, as the cutting unit of cutting apart laser, two prisms that use to engage or with reflectivity (transmitance) according to the incoming position of laser and the partition member that different modes constitutes, so the structure complicated of above-mentioned cutting unit and be specialized apparatus.Therefore, the manufacturing cost of laser soldering device might raise.
In addition, above-mentioned prior art moves partition member (prism) becomes predefined strength ratio so that cut apart the strength ratio of laser, so can't manage the actual strength ratio of cutting apart laser.
[patent documentation 1] Japanese kokai publication hei 07-211424 communique
[patent documentation 2] TOHKEMY 2007-289980 communique
[patent documentation 3] TOHKEMY 2011-56520 communique
The utility model content
The utility model proposes in view of above-mentioned problem, its purpose is to provide a kind of laser welding system, it cuts apart the rising that laser can suppress the manufacturing cost of laser welding system by using wedge-shaped substrate, and can realize engaging the raising of quality by the strength ratio that laser is cut apart in management.
Laser welding system of the present utility model, the laser that irradiation is vibrated from laser oscillator to workpiece welds, and wherein possesses: above-mentioned laser is divided into the wedge-shaped substrate that multi beam is cut apart laser; Drive the wedge-shaped substrate drive control part that above-mentioned wedge-shaped substrate is controlled the amount of incident of this laser in this wedge-shaped substrate with respect to above-mentioned laser advance and retreat; And obtain the above-mentioned intensity of respectively cutting apart the intensity of laser and obtain the unit, above-mentioned wedge-shaped substrate drive control part is obtained the above-mentioned intensity of respectively cutting apart laser that the unit is obtained according to above-mentioned intensity, and advance and retreat drive above-mentioned wedge-shaped substrate.
According to laser welding system of the present utility model, because the control amount of incident of laser in wedge-shaped substrate, so can easily control the strength ratio that multi beam after cutting apart by this wedge-shaped substrate is cut apart laser.Thus, do not need as prior art, to use complicated special-purpose cutting unit, so can suppress the rising of the manufacturing cost of laser welding system.In addition, because obtaining the intensity advance and retreat driving wedge-shaped substrate of respectively cutting apart laser that obtains the unit according to intensity, the wedge-shaped substrate drive control part controls the amount of incident of laser in this wedge-shaped substrate, so can manage the actual strength ratio of cutting apart laser effectively.Thus, the laser of cutting apart that will be managed shines workpiece and welds, so can realize engaging the raising of quality.
In above-mentioned laser welding system, above-mentioned wedge-shaped substrate drive control part can be to the driving of advancing and retreat of above-mentioned wedge-shaped substrate, cuts apart the strength ratio of laser and becomes the predetermined strength ratio so that above-mentioned intensity obtains the above-mentioned multi beam of obtaining the unit.
According to such system, can make the strength ratio of cutting apart laser become the predetermined strength ratio, so can realize engaging the further raising of quality.
In above-mentioned laser welding system, above-mentioned workpiece comprises first workpiece and second workpiece that welds, and can also possess the illuminating optical system to above-mentioned each laser of each workpiece irradiation of above-mentioned first workpiece and above-mentioned second workpiece.
According to said system, can shine the laser of being managed of cutting apart respectively to first workpiece and second workpiece by illuminating optical system, even so for example under the situation of thermal capacity greater than the thermal capacity of second workpiece of first workpiece, also can reduce the temperature difference of this first workpiece and this second workpiece with doing one's utmost.In other words, can make the temperature of the temperature of this first workpiece and this second workpiece roughly the same.Thus, can prevent suitably that unwanted scolder from flowing to the zone in addition, bonding part of first workpiece or second workpiece, so first workpiece and second workpiece can be engaged reliably.
In above-mentioned laser welding system, first temperature of temperature that possesses also that to obtain illuminated above-mentioned and cut apart above-mentioned first workpiece of laser obtains the unit; And second temperature of temperature that to obtain illuminated above-mentioned cuts apart above-mentioned second workpiece of laser obtains the unit, and above-mentioned wedge-shaped substrate drive control part can be obtained the temperature that obtains the unit and above-mentioned second temperature according to above-mentioned first temperature and obtain the temperature that obtains the unit to the driving of advancing and retreat of described wedge-shaped substrate.
According to such system, obtain to cut apart the temperature of first workpiece and second workpiece of laser illuminated, and according to these temperature to the wedge-shaped substrate driving of advancing and retreat, so can carry out the temperature treatment of first workpiece and second workpiece.Can carry out the good joint of repeatability managed thus.
In above-mentioned laser welding system, also have the shooting unit that the state of the scolder in the welding process is taken, above-mentioned wedge-shaped substrate drive control part can be according to the information of above-mentioned shooting unit photographs to the driving of advancing and retreat of above-mentioned wedge-shaped substrate.
According to such system, by taking the unit state of the scolder in the welding process is taken, according to the information that photographs to the wedge-shaped substrate driving of advancing and retreat, so can manage the state of the scolder in the welding process.Can carry out the good joint of repeatability managed thus.
In above-mentioned laser welding system, above-mentioned first workpiece be configured in above-mentioned second workpiece around, a plurality of above-mentioned wedge-shaped substrate are set, and above-mentioned illuminating optical system shines the above-mentioned laser of cutting apart of multi beam by the mode at a distance of equal intervals around the optical axis of cutting apart laser that shines above-mentioned second workpiece to above-mentioned first workpiece.
According to such system, around second workpiece, dispose first workpiece, shine above-mentioned first workpiece around the optical axis of cutting apart laser of above-mentioned second workpiece of irradiation, to make multi beam cut apart laser at a distance of the mode of equal intervals, so first workpiece is heated up substantially equably.Thus, even for example when the whole periphery of second workpiece is welded, also can supply with scolder equably to the whole periphery of this second workpiece.Thus, first workpiece and second workpiece can be engaged reliably.
In above-mentioned laser welding system, around the optical axis of above-mentioned laser at a distance of the above-mentioned a plurality of wedge-shaped substrate of equal intervals ground configuration.
According to such system, because around the optical axis of laser at a distance of a plurality of wedge-shaped substrate of equal intervals ground configuration, so can with around the optical axis of cutting apart laser of irradiation second workpiece at a distance of the mode of equal intervals, easily make multi beam cut apart laser and shine first workpiece.
In above-mentioned laser welding system, above-mentioned workpiece has a plurality of joints, can also possess the above-mentioned illuminating optical system of respectively cutting apart laser of each joint irradiation in above-mentioned a plurality of joints.
According to such system, because laser is respectively cut apart in each joint irradiation in a plurality of joints, so heated up simultaneously in a plurality of joints.Thus, can weld a plurality of joints efficiently, so can significantly reduce the man-hour of welding sequence.
In above-mentioned laser welding system, can also have the light spot form that makes above-mentioned laser becomes substantially elliptical or square light spot form deformation unit.
According to such system, because it is substantially oval or square that the light spot form of laser is become, so cutting apart laser needle and also can become oval or square substantially to the light spot form of workpiece after cutting apart by wedge-shaped substrate.Thus, when for example in vertical view, the soldered part of workpiece being formed rectangle, also can make this soldered intensification suitably.
In above-mentioned laser welding system, above-mentioned light spot form deformation unit can be to have the square shaped core optical fiber that the cross section is square core.
When generally the laser of intensity distributions that has a Gaussian distribution shape in use is at printing distributing board welding electronic unit, because the peak strength height of the core of this laser (optical axis part), so the hot input quantity of the core of laser spot becomes excessive sometimes.So, might cause damage to above-mentioned printing distributing board, this electronic unit comes off from this printing distributing board.
According to above-mentioned laser welding system, by user's core optical fiber, can easily make the light spot form of laser become square.In addition, can make the intensity distributions of laser become the intensity distributions of flat-top (tophat) shape.Thus, even for example when using this laser at the printing distributing board welding electronic unit that resin is made, because can not cause damage to this printing distributing board, so can prevent suitably that this electronic unit from coming off from this printing distributing board.
As mentioned above, cut apart laser because by wedge-shaped substrate laser is divided into multi beam, so can suppress the rising of the manufacturing cost of laser welding system.In addition, the wedge-shaped substrate drive control part is advanced and retreat to drive to wedge-shaped substrate according to the intensity of respectively cutting apart laser and is controlled the amount of incident of laser in this wedge-shaped substrate, so can weld to the laser of cutting apart that the workpiece irradiation is managed, the result can realize the raising of welding quality.
Description of drawings
Fig. 1 is the schematic diagram of the laser welding system of expression first embodiment of the present utility model.
Fig. 2 is the structure of the expression outgoing unit that constitutes above-mentioned laser welding system and the schematic diagram of control part main body structure.
Fig. 3 is the flow chart of order that has used the welding of above-mentioned laser welding system for explanation.
Fig. 4 A makes the part of laser LB incide the key diagram of the state of wedge-shaped substrate for explanation, and Fig. 4 B has increased above-mentioned laser LB at the key diagram of the state of the amount of incident of wedge-shaped substrate for the state from Fig. 4 A that illustrates.
Fig. 5 makes the key diagram of cutting apart laser LB1 irradiation cable terminal and making the state of cutting apart laser LB2 irradiation conductive component for explanation.
Fig. 6 is the flow chart of first variation that has used the welding sequence of above-mentioned laser welding system for explanation.
Fig. 7 is the flow chart of second variation that has used the welding sequence of above-mentioned laser welding system for explanation.
Fig. 8 is the flow chart of the 3rd variation that has used the welding sequence of above-mentioned laser welding system for explanation.
Fig. 9 is the flow chart of the 4th variation that has used the welding sequence of above-mentioned laser welding system for explanation.
Figure 10 is the flow chart of the 5th variation that has used the welding sequence of above-mentioned laser welding system for explanation.
Figure 11 is the schematic diagram of the laser welding system of expression second embodiment of the present utility model.
Figure 12 is the key diagram for explanation workpiece shown in Figure 11.
Figure 13 is the schematic diagram of the laser welding system of expression the 3rd embodiment of the present utility model.
Figure 14 is the key diagram for the configuration relation of three wedge-shaped substrate of explanation formation laser welding system shown in Figure 13.
Figure 15 is the key diagram for explanation workpiece shown in Figure 13.
Figure 16 is the schematic diagram of the laser welding system of expression the 4th embodiment of the present utility model.
Figure 17 A is the key diagram for explanation workpiece shown in Figure 16, and Figure 17 B represents to cut apart the state of the workpiece shown in laser irradiation Figure 17 A.
Symbol description
10A ~ 10D laser welding system; 14 laser oscillators;
42,100a～100c, 110 wedge-shaped substrate;
46 illuminating optical systems; 50 laser intensity determination parts (intensity obtains the unit);
52 camera units (shooting unit); 58 first temperature measuring portions;
60 second temperature measuring portions; 82 wedge-shaped substrate drive control parts;
90 lens (light spot form deformation unit); LB laser;
LB1 ~ LB4 is cut apart laser; The W workpiece.
The specific embodiment
Below represented the preferred embodiment of laser welding system of the present utility model for example, described with reference to accompanying drawing.
(first embodiment)
The laser welding system 10A of first embodiment uses laser LB to make workpiece W heat up to weld, possess LD power supply 12, according to the drive current of supplying with from LD power supply 12 vibrate laser LB laser oscillator 14, transmission from laser oscillator 14 vibrate the laser LB that transmission unit 16, be used for making by the laser LB of transmission unit 16 transmission shine outgoing unit 18, the place work piece W of workpiece W workbench (stage) 20, supply with scolder supply unit 22, the control part 24 of scolder (thread scolder) S.
Workpiece W has: the conductive connection part of electric wiring 302 (first workpiece) 300, form terminal (second workpiece) 305(of tabular or film shape with reference to Fig. 5 at the wiring substrate 304 that is connected with this electric wiring 302 conductions).In the present embodiment, engage with the terminal 305 of wiring substrate 304 by the conductive connection part 300 of welding with electric wiring 302.
Transmission can have length arbitrarily with optical fiber 32, is the transmission optical fiber that has passed the optical fibre core that is made of SI type optical fiber in the protection tube that is formed by the SUS solenoid.The optical fiber core is for example by constituting with the lower part: the core that is formed by pure quartz glass, cover the covering that is for example formed by the quartz glass of the fluorine that mixed of this core and the clad that is for example formed by polyamide that covers this covering coaxially coaxially.Transmission terminates in outgoing unit 18 with optical fiber 32.
As shown in Figure 2, outgoing unit 18 has: the constant transmissions fixed part 38 of the exiting side end of optical fiber 32; The collimation lens 40 that is calibrated to directional light from transmission with optical fiber 32 with predetermined wide angle emitting laser LB; Laser LB by collimation lens 40 parallelizations is divided into the wedge-shaped substrate 42 that two bundles are cut apart laser LB1, LB2; Drive the actuator (drive division) 44 of wedge-shaped substrate 42; This is cut apart the illuminating optical system 46 of laser LB1, LB2 guiding workpiece W; Be arranged on the photochopper 48 on this light path of cutting apart laser LB1, LB2; Measure the laser intensity determination part (intensity obtains the unit) 50 of the intensity of respectively cutting apart laser LB1, LB2; And be used for camera unit (image unit) 52 that the state of the scolder S of welding process is taken.
Wedge-shaped substrate 42 can change its light path that sees through light.That is, the part by making laser LB sees through wedge-shaped substrate 42, this laser LB can be divided into seen through this wedge-shaped substrate 42 see through light (cutting apart laser LB1) and not through the light (cutting apart laser LB2) of this wedge-shaped substrate 42.
In addition, wedge-shaped substrate 42 has the predetermined angle of wedge, and this angle of wedge is more big, the optical axis of cutting apart laser LB1 of irradiation workpiece W and cut apart distance between the optical axis of laser LB2 (between optical axis apart from L) more big (with reference to Fig. 5).In the present embodiment, determine between predetermined optical axis apart from L according to the size of conductive connection part 300 and terminal 305 or shape etc., select and use the wedge-shaped substrate 42 that has between the optical axis that becomes this decision apart from the angle of wedge of L.
Illuminating optical system 46 has: reflect the speculum 54 of respectively cutting apart laser LB1, LB2 and this part of respectively cutting apart laser LB1, LB2 being seen through to workpiece W; And respectively cut apart laser LB1, the LB2 by speculum 54 reflection converged to collector lens 56 on the workpiece W.Thus, can shine conductive connection part 300 with cutting apart laser LB1, and will cut apart the end face that laser LB2 shines terminal 305.
The laser welding system 10A of present embodiment also has: measure the first soldered portion of the conductive connection part 300(conductive connection part 300 that heats up owing to the irradiation of cutting apart laser LB1, the irradiated site of cutting apart laser LB1 in the conductive connection part 300) the first temperature measuring portion 58 of temperature; With the second soldered portion of the terminal 305(terminal 305 that heats up owing to the irradiation of cutting apart laser LB2, the irradiated site of cutting apart laser LB2 in the terminal 305) the second temperature measuring portion 60 of temperature.The first temperature measuring portion 58 and the second temperature measuring portion 60 for example constitute non-contact thermometers such as radiation thermometer.
Laser intensity determination part 50 comprises: assemble the collector lens 62 that sees through light of above-mentioned speculum 54, the beam quality analyzer 64 that sees through light intensity that mensuration is assembled by this collector lens 62.The detection signal of beam quality analyzer 64 is exported to control part 24.
Design temperature for example is set at the temperature ratio of the welding that is suitable for conductive connection part 300 and terminal 305 than the ratio of temperature and the temperature of the second soldered portion of terminal 305 that is the first soldered portion of conductive connection part 300.Specifically, be the ratio of same temperature with above-mentioned design temperature than the temperature of the temperature of the first soldered portion that is set at conductive connection part 300 and the second soldered portion of terminal 305 for example.
The design temperature scope for example is set at the suitable temperature range of the degree that scolder S can melt.Benchmark image for example uses the image of the state (shape of scolder) of the scolder S in the welding process be illustrated in when welding under the best welding condition.
Strength ratio calculating part 72 calculates the strength ratio that 2 bundles that shine workpiece W are cut apart laser LB1, LB2 according to the detection signal of beam quality analyzer 64.Strength ratio detection unit 74 judges whether calculating strength is than consistent with the setting strength ratio.
Temperature is than the ratio of calculating part 76 calculating by temperature with the temperature of the second soldered portion of the terminal of measuring by the second temperature measuring portion 60 305 of the first soldered portion of the conductive connection part 300 of the first temperature measuring portion, 58 mensuration.Temperature detection unit 78 judges that accounting temperature is than more consistent than whether with design temperature.In addition, temperature detection unit 78 judges whether conductive connection part 300 and the temperature of terminal 305 are in the design temperature scope.
Wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, drives control wedge-shaped substrate 42.Photochopper control part 84 opens and closes photochopper 48.Camera unit control part 86 drives control camera unit 52.Scolder supply control part 88 drives control scolder supply unit 22 to be come preposition is supplied with scolder S.
With reference to Fig. 3 ~ Fig. 5 the order that the conductive connection part 300 of the laser welding system 10A that constitutes like that more than the use and terminal 305 weld is described.
At first, on workbench 20 conductive connection part 300 of electric wiring 302 and the terminal 305 of wiring substrate 304 are positioned, photochopper control part 84 makes photochopper 48 become closing state.
Then, power control part 66 driving LD power supplys 12 are 26 supply drive currents to the LD unit, the step S1 of the laser LB(Fig. 3 that vibrates thus).Vibrate the laser LB that from LD unit 26 from taking out with optical fiber 28 outgoing, by collimation lens 34 by parallelization after, incide transmission with in the optical fiber 32 by collector lens 36, be transferred to outgoing unit 18.From transmission with optical fiber 32 emitting laser LB by collimation lens 40 by parallelization after, by speculum 54 reflection back irradiation photochoppers 48.
Then, wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, makes wedge-shaped substrate 42 with respect to the laser LB scheduled volume (step S2) that advances.So the part of laser LB shines wedge-shaped substrate 42(with reference to Fig. 4 A).Thus, laser LB be divided into wedge-shaped substrate 42 see through light (cutting apart laser LB1) and not through the light (cutting apart laser LB2) of wedge-shaped substrate 42.
Then, computed segmentation laser LB1 and the strength ratio (step S3) of cutting apart laser LB2.Specifically, respectively see through light by what beam quality analyzer 64 was measured speculum 54 will respectively cut apart laser LB1, LB2 irradiation speculum 54 time, strength ratio calculating part 72 respectively sees through light intensity according to what this was measured to, computed segmentation laser LB1 and cut apart the strength ratio of laser LB2.
Then, strength ratio detection unit 74 judge calculating strength than with set strength ratio whether consistent (step S4).Obtain the setting strength ratio with reference to storage part 70.
When calculating strength ratio and setting strength ratio are inconsistent (step S4: not), wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, drives wedge-shaped substrate 42(step S5 with respect to laser LB advance and retreat).Thus, for example when wedge-shaped substrate 42 is advanced, can increase laser LB for the amount of incident (with reference to Fig. 4 B) of this wedge-shaped substrate 42, when wedge-shaped substrate 42 is retreated, can reduce laser LB for the amount of incident of this wedge-shaped substrate 42.Afterwards, carry out the later processing of step S3.
When the calculating strength ratio is consistent with the setting strength ratio (step S4: be), photochopper control part 84 is opened photochopper 48(step S6).When photochopper 48 is opened, cut apart laser LB1 and under the state that passes through collector lens 56 convergences, shine the first soldered portion of conductive connection part 300, and cut apart laser LB2 shines terminal 305 under the state of assembling by collector lens 56 second soldered (step S7).
Then, the temperature of the first soldered portion that temperature is measured according to the first temperature measuring portion 58 than calculating part 76 and the temperature of the second soldered portion that the second temperature measuring portion 60 measures are calculated the temperature of first soldered and the second soldered portion than (step S8).
Then, temperature detection unit 78 judge accounting temperatures than and design temperature than whether consistent (step S9).Obtain the design temperature ratio with reference to storage part 70.
Accounting temperature than with design temperature (step S9: not), wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, drives wedge-shaped substrate 42(step S10 with respect to laser LB advance and retreat) when inconsistent.Thus, can change first soldered with the temperature of the second soldered portion than (near design temperature than).Then, carry out the later processing of step S8.
Accounting temperature than with design temperature (step S9: be) when consistent, whether the temperature of the temperature detection unit 78 judgements first soldered portion and the temperature of the second soldered portion in setting range (step S11).Obtain the design temperature scope with reference to storage part 70.
(step S11: not), carry out the later processing of step S8 when the temperature of the temperature of the first soldered portion and the second soldered portion is not in the design temperature scope.This is because the temperature of first soldered and the second soldered portion also is not able to make the temperature of the degree that scolder S melts.
When the temperature of the temperature of the first soldered portion and the second soldered portion is in the design temperature scope (step S11: be), scolder supply control part 88 control scolder supply units 22 are supplied with scolder S(step S12 to first soldered and second soldered).
Then, camera unit control part 86 control camera units 52, the state (step S13) of the scolder S in the shooting welding process.Then, spectral discrimination portion 80 judges that the consistent degree of photographic images and benchmark image is whether in preset range (step S14).Obtain benchmark image with reference to storage part 70.
When the consistent degree of photographic images and benchmark image is not in preset range (step S14: not), wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, and advance and retreat drive wedge-shaped substrate 42(step S15).Thus, in welding process, can adjust the temperature of the second soldered portion of the temperature of the first soldered portion of conductive connection part 300 and terminal 305, so can change the state of scolder S.Thus, can make the consistent degree of the photographic images corresponding with the state that welds the scolder S when finishing and benchmark image in preset range.Afterwards, carry out the later processing of step S13.
When the consistent degree of photographic images and benchmark image is in preset range (step S14: be), scolder supply control part 88 control scolder supply units 22 stop the supply of scolder S, power control part 66 stops the vibration (S16) from the laser LB of LD unit 26 by stopping the driving of LD power supply 12.Then, welding finishes (step S17).In this stage, the order of the welding of the laser welding system 10A of use present embodiment finishes.
According to present embodiment, because control laser LB is at the amount of incident of wedge-shaped substrate 42, so can easily change the strength ratio that two bundles after cutting apart by this wedge-shaped substrate 42 are cut apart laser LB1, LB2.Thus, do not need the cutting unit of the special use of the such complexity of prior art, so can suppress the rising of the manufacturing cost of laser welding system 10A.
In addition, in the present embodiment, in order to make calculating strength than with to set strength ratio consistent, advance and retreat drive wedge-shaped substrate 42 and carry out FEEDBACK CONTROL, so can manage actual laser LB1 and the strength ratio of cutting apart laser LB2 cut apart effectively.Thus, can conductive connection part 300 and terminal 305 be heated up (preheating) by cut apart laser LB1, the LB2 that is managed, therefore can improve the joint quality.
In the present embodiment, will cut apart laser LB1 by illuminating optical system 46 and shine conductive connection part 300, will cut apart laser LB2 by illuminating optical system 46 and shine terminal 305.Therefore, even for example under the situation of thermal capacity greater than the thermal capacity of conductive connection part 300 of terminal 305, also can reduce the temperature difference of this terminal 305 and this conductive connection part 300 with doing one's utmost.
In other words, can make the temperature of temperature and the second soldered portion of terminal 305 of the first soldered portion of conductive connection part 300 identical substantially.Thus, can prevent suitably that the scolder S that melts from flowing to conductive connection part 300 too much, so this conductive connection part 300 can be engaged reliably with terminal 305.
According to present embodiment, the temperature of the temperature of the first soldered portion that measures according to the first temperature measuring portion 58 and the second soldered portion of the second temperature measuring portion 60 mensuration, calculate first soldered temperature ratio with the second soldered portion, for make this accounting temperature ratio become design temperature than and advance and retreat drive wedge-shaped substrate 42 and carry out FEEDBACK CONTROL, so can carry out first soldered temperature treatment with the second soldered portion effectively.Thus, can carry out the good joint of repeatability managed.
In addition, take the state of the scolder S in the welding process by camera unit 52, for the consistent degree that makes this photographic images and benchmark image in preset range, advance and retreat drive wedge-shaped substrate 42 and carry out FEEDBACK CONTROL, so can manage the state of the scolder S in the welding process.Thus, can carry out the good joint of repeatability managed.
(first variation)
First variation of the welding sequence of the laser welding system 10A that uses first embodiment is described with reference to Fig. 6 then.In this variation, for the step with contents processing identical with the contents processing of flow chart shown in Figure 3, omit its detailed explanation.Also identical in second ~ the 5th variation described later.
In the laser weld order of this variation, the processing of step S21 ~ step S26 is identical with the processing of the step S1 of Fig. 3 ~ step S6.That is, power control part 66 drives LD power supplys 12, the laser LB(step of vibrating from LD unit 26 S21), wedge-shaped substrate drive control part 82 transmits control signal to actuator 44, makes wedge-shaped substrate 42 advance (step S22).So, by wedge-shaped substrate 42 laser LB is divided into and cuts apart laser LB1 and cut apart laser LB2, respectively cut apart laser LB1, LB2 irradiation photochopper 48.
Then, calculate the strength ratio (step S23) respectively cut apart laser LB1, LB2, judge calculating strength than with set strength ratio whether consistent (step S24), advance and retreat driving wedge-shaped substrate 42(step S25 when inconsistent), carry out the later processing of step S23.
On the other hand, when the calculating strength ratio was consistent with the setting strength ratio, photochopper control part 84 was opened photochopper 48(step S26), scolder supply control part 88 control scolder supply units 22 carry out the supply (step S27) of scolder S.When photochopper 48 is opened, cut apart laser LB1 and shine the first soldered portion, and cut apart laser LB2 and shine second soldered (step S28).Then, to by respectively cutting apart first soldered and second soldered supply scolder S that laser LB1, LB2 heat up, weld thus.
Then, scolder supply control part 88 control scolder supply units 22 stop the supply of scolder S, and power control part 66 stops the driving of LD power supply 12, stops the vibration (step S29) from the laser LB of LD unit 26 thus.Afterwards, welding finishes (step S30).In this stage, the order of the laser weld of this variation finishes.
According to this variation, compare with the order of Fig. 3, can correspondingly simplify the control of laser weld with the amount that all number of steps are cut down.In addition, even if under situation about so simplifying, because in order to make calculating strength than driving wedge-shaped substrate 42 and carry out FEEDBACK CONTROL with setting the consistent and advance and retreat of strength ratio, so can manage the actual strength ratio of cutting apart laser LB1 and cutting apart laser LB2 effectively.Thus, can conductive connection part 300 and terminal 305 be heated up by respectively cut apart laser LB1, the LB2 that is managed, can improve the quality of joint thus.
(second variation)
Second variation of the welding sequence of the laser welding system 10A that uses first embodiment is described with reference to Fig. 7 then.In this variation, under original state, wedge-shaped substrate 42 is configured in the position that the part of laser LB can incident.
As shown in Figure 7, in the laser weld of this variation order, power control part 66 drives the LD power supplys 12 laser LB(step S41 that vibrates from LD unit 26).So, by wedge-shaped substrate 42 laser LB is divided into and cuts apart laser LB1 and cut apart laser LB2, respectively cut apart laser LB1, LB2 and shine photochopper 48.
Then, photochopper control part 84 is opened photochopper 48(step S42), scolder supply control part 88 control scolder supply units 22 carry out the supply (step S43) of scolder S.When photochopper 48 is opened, cut apart laser LB1 and shine the first soldered portion, and cut apart laser LB2 and shine second soldered (step S44).So first soldered heats up owing to cutting apart laser LB1, and second soldered heat up scolder S fusing owing to cutting apart laser LB2.
Then, the temperature of the temperature of the first soldered portion that temperature is measured according to the first temperature measuring portion 58 than calculating part 76 and the second soldered portion of the second temperature measuring portion 60 mensuration is calculated first soldered temperature with the second soldered portion than (step S45).
Then, temperature detection unit 78 judge accounting temperatures than with design temperature than whether consistent (step S46), advance and retreat driving wedge-shaped substrate 42(step S47 when inconsistent), carry out the later processing of step S45 then.
On the other hand, accounting temperature than with design temperature when consistent, scolder supply control part 88 stops the supply (step S48) of scolder S.
Then, power control part 66 stops the driving of LD power supply 12, stops the vibration (step S49) from the laser LB of LD unit 26 thus.Afterwards, welding finishes (step S50).In this stage, the order of the laser weld of this variation finishes.
According to this variation, compare with the order of Fig. 3, can correspondingly simplify the control of laser weld with the amount that all number of steps are cut down.In addition, even if under situation about so simplifying, because calculate first soldered temperature ratio with the second soldered portion, in order to make this accounting temperature ratio become the design temperature ratio, advance and retreat drive wedge-shaped substrate 42 and carry out FEEDBACK CONTROL, so can carry out this first soldered the temperature treatment with the second soldered portion effectively.Thus, can carry out the good joint of repeatability managed.
When the first temperature measuring portion 58 and the second temperature measuring portion 60 for example are made of non-contact thermometers such as radiation thermometers, in step S45 according to the temperature computation temperature ratio on the surface of the temperature on the surface of the first soldered portion and the second soldered portion.So, might exist to the in fact not enough situation of the hot input quantity of first soldered and the second soldered portion.
Therefore, in this variation, be not the vibration that stops laser LB after the supply that stopping scolder S (accounting temperature than with design temperature than consistent) immediately in step S49, and preferred mode with the power (output) that gently or interimly reduces laser LB stop this laser LB.So, can be to first soldered and second soldered the heat that input is enough.In other words, there is not the not enough situation of heat input to first soldered and the second soldered portion.
In addition, in step S49, can preestablish than the high slightly temperature threshold of above-mentioned design temperature scope, under the temperature of first soldered and the second soldered portion situation consistent with described temperature threshold, stop the vibration of laser LB.In this case, also can carry out enough heat inputs to first soldered and the second soldered portion.
In addition, the said temperature threshold value can be set to the hot input quantity of first soldered and the second soldered portion can be inexcessive the value of degree.
(the 3rd variation)
The 3rd variation of the welding sequence of the laser welding system 10A that uses first embodiment is described with reference to Fig. 8 then.In this variation, under original state, wedge-shaped substrate 42 is configured in the part of laser LB can the position of incident on.
As shown in Figure 8, in the laser weld order of this variation, the processing of the step S41 ~ step S44 of the processing of step S61 ~ step S64 and second variation is identical, therefore omits its explanation.
Then, behind step S64, camera unit control part 86 control camera units 52, the state (step S65) of the scolder S in the shooting welding process.Then, spectral discrimination portion 80 judges that the consistent degree of photographic images and benchmark image is whether in preset range (step S66), advance and retreat drive wedge-shaped substrate 42(step S67 when above-mentioned consistent degree is not in preset range), carry out the later processing of step S65 then.
On the other hand, when above-mentioned consistent degree is in preset range, scolder supply control part 88 control scolder supply units 22 stop the supply of scolder S, and power control part 66 stops the driving of LD power supply 12, stops the vibration (step S68) from the laser LB of LD unit 26 thus.Afterwards, welding finishes (step S69).In this stage, the order of the welding of the use laser welding system 10A of this variation finishes.
According to this variation, compare with the order of Fig. 3, can correspondingly simplify the control of laser weld with the amount that all number of steps are cut down.In addition, even if under situation about so simplifying, also can take the state of the scolder S in the welding processes by camera unit 52, for the consistent degree that makes this photographic images and benchmark image in preset range, manage the state of the scolder S in the welding process.Thus, can carry out the good joint of repeatability managed.
(the 4th variation)
The 4th variation of the welding sequence of the laser welding system 10A that uses first embodiment is described with reference to Fig. 9 then.
As shown in Figure 9, the laser weld of this variation is to have made up the order of the order gained of the order of first variation shown in Figure 6 and second variation shown in Figure 7 in proper order.
Specifically, after the processing of the step S21 that has carried out Fig. 6 ~ step S28, carry out the processing of step S45 ~ step S50 of Fig. 7.Each particular content of handling is illustrated in first and second variation, so omit its explanation.
According to this variation, can manage the strength ratio of cutting apart laser LB1 and cutting apart laser LB2 effectively, and can carry out first soldered temperature treatment with the second soldered portion effectively, so can when improving welding quality, carry out the good joint of repeatability managed.
(the 5th variation)
The 5th variation of the welding sequence of the laser welding system 10A that uses first embodiment is described with reference to Figure 10 then.
As shown in figure 10, the laser weld of this variation is to have made up the order of the order gained of the order of first variation shown in Figure 6 and the 3rd variation shown in Figure 8 in proper order.
Specifically, after the processing of the step S21 that has carried out Fig. 6 ~ step S28, carry out the processing of step S65 ~ step S69 of Fig. 8.Each particular content of handling is illustrated in the first and the 3rd variation, so omit its explanation.
According to this variation, can manage the strength ratio of cutting apart laser LB1 and cutting apart laser LB2 effectively, and can manage the state of the scolder S in the welding process, so can when improving welding quality, carry out the good joint of repeatability managed.
The laser welding system 10A of first embodiment is restricted to said structure and order.For example, can carry out concurrently simultaneously by accounting temperature than the control of carrying out (the step S45 of Fig. 9 ~ S47) control (the step S65 of Figure 10 ~ step S67) with image.At this moment, can be according to the consistent management of carrying out state of a certain side in temperature ratio or the image.
In addition, power control part 66 can according to the intensity of cutting apart laser LB1 with cut apart the intensity of laser LB2 or cut apart the strength ratio of laser LB1, LB2, the driving current value of increase and decrease LD power supply 12 changes the laser LB(that vibrates from LD unit 26 thus and respectively cuts apart laser LB1, LB2) output.
So, the strength ratio of cutting apart laser LB1 and cutting apart laser LB2 not only can be easily changed, the energy (cutting apart laser LB1 and the gross energy of cutting apart laser LB2) of laser LB can also be easily changed.Thus, can easily the intensity of respectively cutting apart laser LB1, LB2 be adjusted into the setting intensity level.Thus, can realize engaging the further lifting of quality.
At this moment, power control part 66 for example can or according to first soldered output of recently changing above-mentioned laser LB with the temperature of the second soldered portion, can also change the output of above-mentioned laser LB according to the photographic images of camera unit 52 according to the temperature of the temperature of the first soldered portion (temperature that is measured to by the first temperature measuring portion 58) and the second soldered portion (temperature that is measured to by the second temperature measuring portion 60).
(second embodiment)
The laser welding system 10B of second embodiment of the present utility model is described with reference to Figure 11 and Figure 12 then.In the laser welding system 10B of second embodiment, give identical symbol to key element identical with the laser welding system 10A of first embodiment or that play identical function and effect, and omit detailed explanation.Also identical in the described later the 3rd and the 4th embodiment.
As Figure 11 and shown in Figure 12, the workpiece W of present embodiment has the copper figure (first workpiece) 308 that prints at printing distributing board 306 and the electronic unit of installing at this copper figure 308 (second workpiece) 310.Electronic unit 310 for example constitutes rectangular-shaped wafer capacitor, comprises the capacitor body 312 that constitutes its middle body, the terminal electrode 314 that constitutes each end.In the present embodiment, by welding copper figure 308 is engaged with terminal electrode 314.
In the laser welding system 10B of present embodiment, on the light path of the laser LB between collimation lens 40 and the wedge-shaped substrate 42, being provided be used to the light spot form that makes this laser LB becomes the elliptoid lens of cardinal principle (light spot form deformation unit) 90 and makes the parallel collimation lens 92 through the laser LB of these lens 90.
According to the laser welding system 10B of formation like this, because scioptics 90 make the light spot form of laser LB become ellipticity substantially, also can become ellipticity (with reference to Figure 12) substantially so respectively cut apart the light spot form of laser LB1, LB2.Thus, be welded under the situation on the copper figure 308 as the wafer capacitor, will overlooking terminal electrode 314 for general rectangular, this terminal electrode 314 and copper figure 308 are heated up.
(the 3rd embodiment)
The laser welding system 10C of the 3rd embodiment of the present utility model is described with reference to Figure 13 ~ Figure 15 then.
As Figure 13 and shown in Figure 15, the workpiece W of present embodiment has at the copper figure (first workpiece) 308 of printing distributing board 306 printing with at this copper figure 308 electronic unit (second workpiece) 316 of (through hole installation) is installed.Form through hole 318 at printing distributing board 306, around this through hole 318, disposed circular copper figure 308.
As Figure 13 and shown in Figure 14, in the laser welding system 10C of present embodiment, the wedge-shaped substrate 42 that a plurality of (three) wedge-shaped substrate 100a ~ 100c replaces first embodiment is set.Under the state of direction with aligned in position of the optical axis of laser LB, dispose these wedge-shaped substrate 100a ~ 100c in the mode at a distance of equal intervals around this optical axis.That is, these wedge-shaped substrate 100a ~ 100c is offset 120 ° phase place mutually around the optical axis of laser LB.Described wedge-shaped substrate 100a ~ 100c also can be offset mutually along the optical axis of laser LB.
In the laser welding system 10C that so constitutes, the light that sees through that laser LB is divided into each wedge-shaped substrate 100a ~ 100c (is cut apart laser LB1 ~ LB3) and is not seen through the light (cutting apart laser LB4) of these wedge-shaped substrate 100a ~ 100c.That is, laser LB is divided into four bundles and cuts apart laser LB1 ~ LB4.
Then, cut apart the end face of laser LB4 irradiation terminal 322, cut apart laser LB1 ~ LB3 and around the optical axis of cutting apart laser LB4, under the state of equal intervals, shining copper figure 308.
Thus, can make circular copper figure 308 be warmed up to impartial substantially temperature.Thus, even for example when the whole periphery of terminal 322 is welded, also can supply with scolder S equably to the whole periphery of this terminal 322.Thus, terminal 322 and copper figure 308 can be engaged reliably.
According to present embodiment, because around the optical axis of laser LB at a distance of equal intervals ground configuration wedge-shaped substrate 100a ~ 100c, so can easily around the optical axis of cutting apart laser LB4 of irradiation terminal 322, make a plurality of laser LB1 ~ LB3 of cutting apart shine copper figures 308 at a distance of equal intervals ground.
(the 4th embodiment)
The laser welding system 10D of the 4th embodiment of the present utility model is described with reference to Figure 16 and Figure 17 then.
As Figure 16 and shown in Figure 17, the workpiece W of present embodiment has at a plurality of (for example three) copper figure 308a ~ 308c of printing distributing board 306 printings and the electronic unit 324 of (through hole installation) is installed at this copper figure 308a ~ 308c.Form three through hole 318a ~ 318c at printing distributing board 306, around each through hole 318a ~ 318c, disposed circular described copper figure 308a ~ 308c.
That is, the workpiece W of present embodiment has: the joint 330a that is made of terminal 328a and copper figure 308a; The joint 330b that is constituted by terminal 328b and copper figure 308b; The joint 330c that is constituted by terminal 328c and copper figure 308c
The laser welding system 10D of present embodiment also possesses: wedge-shaped substrate 110, the actuator 112 that drives this wedge-shaped substrate 110, two scolder supply units 114,116.
Between collimation lens 40 and wedge-shaped substrate 42, around the optical axis of laser LB, the phase place that is offset 180 ° with respect to wedge-shaped substrate 42 disposes wedge-shaped substrate 110.In addition, also have no relations even the position along the direction of the optical axis of laser LB of wedge-shaped substrate 110 alignd with wedge-shaped substrate 42.
Wedge-shaped substrate drive control part 82 transmits control signal to actuator 112, drives wedge-shaped substrate 110 with respect to laser LB advance and retreat.
In the laser welding system 10D that so constitutes, laser LB be divided into each wedge-shaped substrate 42,110 see through light (cutting apart laser LB1, LB2) and through these wedge-shaped substrate 42,110 light (cutting apart laser LB3).That is, laser LB is divided into three beams and cuts apart laser LB1 ~ LB3.
Then, respectively cut apart laser LB1 ~ LB3 and shine each joint 330a ~ 330c.Therefore, can efficiently make three joint 330a ~ 330c heat up to weld (simultaneously).Thus, can reduce the man-hour of welding sequence significantly.
The utility model is not limited to above-mentioned embodiment, in the scope that does not exceed purport of the present utility model, can adopt various structures certainly.For example, workpiece W is not limited to said structure, can at random change.
In addition, transmission can be formed square (rectangle or square) with the cross sectional shape of the core of optical fiber 32.That is, transmission can be constituted square shaped core optical fiber (light spot form deformation unit) with optical fiber 32.
So, can obtain the laser LB that peak strength is low and have flat intensity distributions (intensity distributions of flat-top shape).That is, can make the intensity distributions of respectively cutting apart laser LB1 ~ LB4 become the intensity distributions of flat-top shape.
Generally has printing distributing board that the laser of the intensity distributions of Gaussian distribution shape makes at resin when welding electronic unit (terminal) in use, because the peak strength height of the core of this laser (optical axis part), so the hot input quantity of the core of laser spot becomes excessive sometimes.So, sometimes above-mentioned printing distributing board being caused damage, this electronic unit comes off from this printing distributing board.
But, when using square shaped core optical fiber as described above to use optical fiber as transmission, because respectively cut apart the intensity distributions that the intensity distributions of laser LB1, LB2 becomes the flat-top shape, so can not cause damage to described printing distributing board, so can prevent suitably that electronic unit from coming off from this printing distributing board.
In addition, when the cross section of the core that will constitute square shaped core optical fiber forms rectangle, even about the shape of laser spot, also can make its cross section become rectangle.Thus, for example as shown in Figure 12, even when the terminal electrode 314 with copper figure 308 and electronic unit (wafer capacitor) 310 welds, the light spot form of cutting apart laser LB1 is conformed to the shape of this copper figure 308, and the light spot form of cutting apart laser LB2 is conformed to the shape of this terminal electrode 314, this copper figure 308 and this terminal electrode 314 are heated up suitably.
At this moment, about the long limit of laser spot and the ratio of minor face, long limit: be boundary about minor face=2:1.When the ratio on the long limit of wanting further to increase this laser spot when (wanting to obtain the laser spot shape of elongated shape), for example have outgoing unit 18 and the above-mentioned square shaped core optical fiber of oval optical system (lens 90) by combination, can easily realize.
In laser welding system 10A of the present utility model ~ 10D, a plurality of LD unit 26 can be set, and the taking-up that will extend from each LD unit 26 constitutes fibre bundle (bundle fiber) with optical fiber 28.
So, can compile the laser LB that vibrates and from each LD unit 26 by above-mentioned fibre bundle.Thus, can be used for processing (welding) to the higher laser LB of output.Specifically, for example by the LD unit 26 that 7 maximums are output as 25W is set, can reach the laser LB of the height output of 175W.
In addition, in laser welding system 10A of the present utility model ~ 10D, can directly be connected with outgoing unit 18 taking out with optical fiber 28.So, can omit incident section 30 and transmission with the structure of optical fiber 32, so can simplify the structure of laser welding system 10A ~ 10D.
Claims (10)
1. a laser welding system is shone the laser that vibrates from laser oscillator to workpiece and is welded, and it is characterized in that possessing:
Above-mentioned laser is divided into the wedge-shaped substrate that multi beam is cut apart laser;
Drive the wedge-shaped substrate drive control part that above-mentioned wedge-shaped substrate is controlled the amount of incident of this laser in this wedge-shaped substrate with respect to above-mentioned laser advance and retreat; And
Obtain the above-mentioned intensity of respectively cutting apart the intensity of laser and obtain the unit,
Above-mentioned wedge-shaped substrate drive control part is obtained the above-mentioned intensity of respectively cutting apart laser that the unit is obtained according to above-mentioned intensity, and advance and retreat drive above-mentioned wedge-shaped substrate.
2. laser welding system according to claim 1 is characterized in that,
Above-mentioned wedge-shaped substrate drive control part is to the driving of advancing and retreat of above-mentioned wedge-shaped substrate, cuts apart the strength ratio of laser and becomes the predetermined strength ratio so that above-mentioned intensity obtains the above-mentioned multi beam of obtaining the unit.
3. laser welding system according to claim 1 is characterized in that,
Above-mentioned workpiece comprises first workpiece and second workpiece that welds,
Described laser welding system also possesses the illuminating optical system to above-mentioned each laser of each workpiece irradiation of above-mentioned first workpiece and above-mentioned second workpiece.
4. laser welding system according to claim 3 is characterized in that,
Also possess:
First temperature of temperature that to obtain illuminated above-mentioned cuts apart above-mentioned first workpiece of laser obtains the unit; And
Second temperature of temperature that to obtain illuminated above-mentioned cuts apart above-mentioned second workpiece of laser obtains the unit,
Above-mentioned wedge-shaped substrate drive control part is obtained the temperature that obtains the unit and above-mentioned second temperature according to above-mentioned first temperature and is obtained the temperature that obtains the unit to the driving of advancing and retreat of above-mentioned wedge-shaped substrate.
5. laser welding system according to claim 3 is characterized in that,
Also have the shooting unit that the state of the scolder in the welding process is taken,
Above-mentioned wedge-shaped substrate drive control part according to the information of above-mentioned shooting unit photographs to the driving of advancing and retreat of above-mentioned wedge-shaped substrate.
6. laser welding system according to claim 3 is characterized in that,
Above-mentioned first workpiece be configured in above-mentioned second workpiece around,
A plurality of above-mentioned wedge-shaped substrate are set,
Above-mentioned illuminating optical system shines the above-mentioned laser of cutting apart of multi beam by the mode at a distance of equal intervals around the optical axis of cutting apart laser that shines above-mentioned second workpiece to above-mentioned first workpiece.
7. laser welding system according to claim 6 is characterized in that,
Around the optical axis of above-mentioned laser at a distance of the above-mentioned a plurality of wedge-shaped substrate of equal intervals ground configuration.
8. laser welding system according to claim 1 is characterized in that,
Above-mentioned workpiece has a plurality of joints,
Described laser welding system also possesses the above-mentioned illuminating optical system of respectively cutting apart laser of each joint irradiation in above-mentioned a plurality of joints.
9. according to any described laser welding system of claim 1 ~ 8, it is characterized in that,
Also have the light spot form that makes above-mentioned laser and become substantially elliptical or square light spot form deformation unit.
10. laser welding system according to claim 9 is characterized in that,
Above-mentioned light spot form deformation unit is to have the square shaped core optical fiber that the cross section is square core.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-283763 | 2011-12-26 | ||
| JP2011283763A JP2013132655A (en) | 2011-12-26 | 2011-12-26 | Laser soldering system |
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| Publication Number | Publication Date |
|---|---|
| CN203062088U true CN203062088U (en) | 2013-07-17 |
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| CN2012207245222U Expired - Fee Related CN203062088U (en) | 2011-12-26 | 2012-12-25 | Laser welding system |
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| JP (1) | JP2013132655A (en) |
| KR (1) | KR20130079148A (en) |
| CN (1) | CN203062088U (en) |
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| CN104625405A (en) * | 2013-11-14 | 2015-05-20 | 株式会社天田米亚基 | Laser welding method and laser welding system |
| CN104842070A (en) * | 2015-05-13 | 2015-08-19 | 北京万恒镭特机电设备有限公司 | Laser eutectic soldering device and method |
| CN105813791A (en) * | 2013-12-19 | 2016-07-27 | 派克泰克封装技术有限公司 | Apparatus for the isolated application of solder material deposits |
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| JP6420994B2 (en) * | 2014-08-28 | 2018-11-07 | プライムアースＥｖエナジー株式会社 | Laser welding method |
| CN105458435B (en) * | 2015-12-04 | 2018-06-01 | 王伟 | A kind of lead bonding device and technique for semiconductor power device encapsulation |
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2011
- 2011-12-26 JP JP2011283763A patent/JP2013132655A/en active Pending
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2012
- 2012-11-19 KR KR1020120131168A patent/KR20130079148A/en not_active Application Discontinuation
- 2012-12-25 CN CN2012207245222U patent/CN203062088U/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104625405A (en) * | 2013-11-14 | 2015-05-20 | 株式会社天田米亚基 | Laser welding method and laser welding system |
| CN104625405B (en) * | 2013-11-14 | 2018-04-17 | 株式会社天田米亚基 | Method for laser welding and laser welding system |
| CN105813791A (en) * | 2013-12-19 | 2016-07-27 | 派克泰克封装技术有限公司 | Apparatus for the isolated application of solder material deposits |
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| CN104842070A (en) * | 2015-05-13 | 2015-08-19 | 北京万恒镭特机电设备有限公司 | Laser eutectic soldering device and method |
| CN110860751A (en) * | 2018-08-16 | 2020-03-06 | 台达电子工业股份有限公司 | Multi-beam soldering system and multi-beam soldering method |
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| Publication number | Publication date |
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| KR20130079148A (en) | 2013-07-10 |
| JP2013132655A (en) | 2013-07-08 |
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