CN110444487A - A kind of repair method of Mini LED module - Google Patents
A kind of repair method of Mini LED module Download PDFInfo
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- CN110444487A CN110444487A CN201910575193.6A CN201910575193A CN110444487A CN 110444487 A CN110444487 A CN 110444487A CN 201910575193 A CN201910575193 A CN 201910575193A CN 110444487 A CN110444487 A CN 110444487A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000008439 repair process Effects 0.000 title claims abstract description 31
- 238000012423 maintenance Methods 0.000 claims abstract description 11
- 230000004888 barrier function Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000007547 defect Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910020658 PbSn Inorganic materials 0.000 description 2
- 101150071746 Pbsn gene Proteins 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of repair methods of Mini LED module, this method comprises: a barrier sheet is arranged in the first end of bad point Mini LED chip when detecting any Mini LED chip in Mini LED module is bad point Mini LED chip；It drives the second end pushed pin in bad point Mini LED chip to apply towards first end the power of horizontal direction by translation motor, bad point Mini LED chip is separated with pcb board；Second end and first end face；Bad point Mini LED chip is picked up by inhaling brilliant device, so as to the Mini LED chip more renewed on the pad of installation bad point Mini LED chip originally, realizes the maintenance of Mini LED module.Using repair method of the invention, maintenance precision and efficiency can be effectively promoted.
Description
Technical field
The present invention relates to LED technology field more particularly to a kind of repair methods of Mini LED module.
Background technique
Currently, Mini LED module is usually made of pcb board and the Min LED chip being arranged on, due to Mini
The size of LED chip is micron order, then thousands of Mini LED chips can be arranged in usual one piece of Mini LED module, and
These Mini LED chip dense arrangements, spacing are very small.
The repair method of existing LED module include: when detect any LED chip in LED module be bad point when,
Then the scolding tin for connecting the LED chip and pcb board is heated, and is divided the LED chip and pcb board in melts soldering tin
From, and then peel off the LED chip；Then, then on the pad of pcb board weld upper new LED chip.
However, since the gap in Mini LED module between Mini LED chip is only micron order, then when using existing
When some repair methods separate the bad point chip in Mini LED module with pcb board, near bad point chip
Mini LED chip is easy and then Mini LED module to be easy to cause to be formed more with pcb board bad connection due to being heated
Bad point reduces the maintenance precision and efficiency of Mini LED module.
Summary of the invention
In view of the above-mentioned problems, a kind of repair method of Mini LED module of the invention can be accurately by bad point Mini LED
Chip is separated with pcb board, when avoiding separation bad point Mini LED chip, is damaged to normal Mini LED chip, energy
Enough maintenance precision and efficiency for effectively promoting Mini LED module.
In order to solve the above technical problems, a kind of repair method of Mini LED module of the invention, comprising:
When detecting any Mini LED chip in Mini LED module is bad point Mini LED chip, described bad
A barrier sheet is arranged in the first end of point Mini LED chip；
The second end pushed pin in the bad point Mini LED chip is driven to apply towards the first end by translation motor
The power of horizontal direction separates the bad point Mini LED chip with the pcb board of the Mini LED module；Described
Two ends and the first end face；
The bad point Mini LED chip is picked up by inhaling brilliant device, to install the bad point Mini LED core originally
The Mini LED chip more renewed on the pad of piece realizes the maintenance of Mini LED module.
As an improvement of the above scheme, the Mini more renewed on the pad for installing the bad point Mini LED chip originally
LED chip includes the following steps:
Articulamentum is coated on the pad for installing the bad point Mini LED chip originally；
New Mini LED chip is moved on the pad by the brilliant device of the suction, so that the new Mini
LED chip is connect with the pad.
As an improvement of the above scheme, on the pad for installing the bad point Mini LED chip originally coat articulamentum it
Afterwards, further include following steps:
The articulamentum is detected by AOI detection device；
When the AOI detection device detects the articulamentum existing defects, then new articulamentum is coated again.
As an improvement of the above scheme, metal salient point is provided on the electrode of the new Mini LED chip；It is described new
Mini LED chip connect in the following way with the pad:
When new Mini LED chip is transferred to the pad by the brilliant device of the suction, heated using solder reflow process
The articulamentum, so that the metal salient point of the new Mini LED chip is connect by the articulamentum with the pad.
As an improvement of the above scheme, the material of the articulamentum includes one of Sn, Ag, Sb, Pb and Cu or at least
The combination of two kinds of materials, the material of the metal salient point are identical as the material of the articulamentum.As an improvement of the above scheme, institute
State articulamentum with a thickness of 5~30 μm.
As an improvement of the above scheme, on the pad for installing the bad point Mini LED chip originally coat articulamentum it
After further comprise the steps of: and coat scaling powder on the articulamentum.
As an improvement of the above scheme, the articulamentum includes the mixture of Ag and epoxy resin；In the new Mini
Further include following steps after LED chip is connect with the pad: the Mini LED module is heating and curing.
As an improvement of the above scheme, it detects to obtain any in the Mini LED module by AOI detection device
Mini LED chip is bad point Mini LED chip.
As an improvement of the above scheme, the Mini LED chip in the Mini LED module has substrate, the substrate
Material includes GaN, Si and SiC.
Compared with prior art, implement repair method of the invention, have the following beneficial effects: and detecting Mini LED
When any Mini LED chip in mould group is bad point Mini LED chip, by elder generation the first of bad point Mini LED chip
One barrier sheet of end setting, then the second end in bad point Mini LED chip is pushed pin towards its first end by translation motor drive
Apply horizontal force to separate bad point Mini LED chip with the pcb board of Mini LED module, in this way, can accurately will be bad
Point Mini LED chip is separated with pcb board, thus when avoiding separation bad point Mini LED chip, to normal Mini LED core
Piece damages, and can effectively promote the maintenance precision and efficiency of Mini LED module.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the repair method of Mini LED module provided in an embodiment of the present invention.
Fig. 2 is a kind of schematic diagram of the repair method of Mini LED module provided in an embodiment of the present invention.
Fig. 3 is a kind of flow diagram that Mini LED chip is replaced in repair method provided in an embodiment of the present invention.
Specific embodiment
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention.But the present invention can be with
It is different from the other modes of this description much to implement, those skilled in the art can be without violating the connotation of the present invention
Similar popularization is done, therefore the present invention is not limited by the specific embodiments disclosed below.
Clear, complete description is carried out to technical solution of the present invention with attached drawing combined with specific embodiments below.
Referring to Figure 1, be a kind of Mini LED module provided in an embodiment of the present invention repair method flow diagram.
As depicted in figs. 1 and 2, which includes the following steps:
S1, when detect any Mini LED chip in Mini LED module be bad point Mini LED chip 1 when, in institute
A barrier sheet 101 is arranged in the first end for stating bad point Mini LED chip 1；
In step sl, detect to obtain any Mini LED core in the Mini LED module by AOI detection device
Piece is bad point Mini LED chip 1.
Wherein, AOI (Automated Optical Inspection, automatic optics inspection) detection device is being detected
When, acquire pcb board image by camera automatically scanning pcb board, and by collected pcb board image and preset standard
Pcb board image is compared, and thus identifies whether the Mini LED chip on pcb board image is bad point Mini LED core
Piece, and then when identifying in Mini LED module there are when bad point Mini LED chip, it will be bad in pcb board image by display
Point Mini LED chip is shown, or is marked by way of identifying automatically to the bad point Mini LED chip of pcb board
Know, is achieved in the detection of bad point Mini LED chip.
S2, by translation motor 102 drive push pin 103 the bad point Mini LED chip 1 second end towards described in
First end applies the power of horizontal direction, by the pcb board 2 of the bad point Mini LED chip 1 and the Mini LED module into
Row separation；The second end and the first end face；
In step s 2,103 be arranged perpendicular to pcb board 2 by that will push pin so that push pin 103 side and bad point Mini
Second end in contact of LED chip 1 can increase the contact area of the two, avoid damaging bad point Mini because contact area is too small
LED chip 1.
S3, the bad point Mini LED chip 1 is picked up by inhaling brilliant device, to install the bad point Mini originally
The Mini LED chip more renewed on the pad 21 of LED chip 1 realizes the maintenance of Mini LED module.
Compared with prior art, the repair method of Mini LED module of the invention is on detecting Mini LED module
When any Mini LED chip is bad point Mini LED chip 1, it is arranged by elder generation in the first end of bad point Mini LED chip 1
One barrier sheet 101, then driven by translation motor 102 push pin 103 bad point Mini LED chip 1 second end towards its
One end applies horizontal force and separates bad point Mini LED chip 1 with the pcb board 2 of Mini LED module, in this way, can be quasi-
Really bad point Mini LED chip 1 is separated with pcb board 2, thus when avoiding separation bad point Mini LED chip 1, to normal
Mini LED chip damages, and can effectively promote the maintenance precision and efficiency of Mini LED module.
Further, as shown in Fig. 2, in order to which effectively bad point Mini LED chip 1 is separated with pcb board 2, above-mentioned
In the step S1 of embodiment, carried out due to passing through articulamentum 3 between the Mini LED chip 1 in Mini LED module and pcb board 2
The bottom of barrier sheet 101, then can be flushed setting by connection with the bottom of articulamentum 3, and by push pin 103 bottom and connection
The bottom of layer 3 flushes setting, push pin in this way 103 in the first end from bad point Mini LED chip 1 to second end application level side
To power when, articulamentum 3 can be promoted to fall off with bad point Mini LED chip, so as in the Mini LED chip more renewed
When articulamentum can be directly coated on pad, enhance the fastness that new Mini LED chip is connect with pcb board.
In addition, barrier sheet is arranged by the first end in bad point Mini LED chip in repair method of the invention
101, it can avoid bad point Mini LED chip 1 and fallen to when being separated with pcb board 2 between the gap of Mini LED module.Due to resistance
The blocking of baffle 101 can make the light-emitting surface of bad point Mini LED chip 1 keep parallel with the horizontal plane of pcb board 2, then inhale brilliant dress
The suction nozzle 104 set can be accurately aimed at the light-emitting surface of bad point Mini LED chip 1, can promote overhaul efficiency.
Specifically, as shown in figure 3, the Mini more renewed on the pad for installing the bad point Mini LED chip originally
LED chip includes the following steps:
S31, articulamentum is coated on the pad for installing the bad point Mini LED chip originally；
S32, new Mini LED chip is moved on the pad by the brilliant device of the suction, so that described new
Mini LED chip is connect with the pad.
Preferably, in order to avoid repair when there is the bad connection of new Mini LED chip and pcb board, the repair method
In on the pad for installing the bad point Mini LED chip originally coat articulamentum after, further include following steps:
S311, the articulamentum is detected by AOI detection device；
S312, when the AOI detection device detects the articulamentum existing defects, then coat new connection again
Layer.
In step S311~step S312, AOI (Automated Optical Inspection, automatic optics inspection)
Detection device when being detected, acquires pcb board image by camera automatically scanning pcb board, and by collected pcb board
Image is compared with preset standard pcb board image, thus whether there is invalid articulamentum on pcb board image to identify,
And then the invalid articulamentum of pcb board image is shown by display, or to pcb board by way of identifying automatically
Invalid articulamentum is identified.
Preferably, in the above-described embodiment, metal salient point is provided on the electrode of the new Mini LED chip；Institute
It states new Mini LED chip to connect with the pad in the following way: when the brilliant device of the suction is by new Mini LED chip
When being transferred to the pad, the articulamentum is heated using solder reflow process, so that the gold of the new Mini LED chip
Belong to salient point to connect by the articulamentum with the pad.In traditional repair method, by normal welding mode by new LED
Chip, which is soldered to, is also easy to make the LED chip of surrounding is heated to fall off on pcb board, generate bad point.And the present invention passes through first original
The pad for installing bad point Mini LED chip coats articulamentum, then new Mini LED chip is transferred to pad, then uses
Solder reflow process heats articulamentum, it is possible thereby to which easily controllable heating temperature and heated perimeter, avoid in replacement Mini LED
The Mini LED chip being located at around pad is damaged when chip, the precision of maintenance can be promoted.
Preferably, in the above-described embodiments, the material of the articulamentum includes one of Sn, Ag, Sb, Pb and Cu or extremely
The combination of few two kinds of materials.For example, articulamentum can be SnAgCu alloy, PbSn alloy, SnAg alloy, SnSb alloy, PbSb
Alloy, PbSnAg alloy etc..
Preferably, the metal salient point material can be identical as the material of articulamentum, thus adds using reflow soldering process
When thermal connection layer, the metal salient point of new Mini LED chip also melts therewith, can promote new Mini LED chip and pcb board
Bonding strength and fastness between pad.
Preferably, in the above-described embodiments, the articulamentum with a thickness of 5~30 μm, in this way, being pushed away when articulamentum
When the power for the horizontal direction that needle generates, articulamentum can be with receiving portion component, convenient for articulamentum with bad point Mini LED chip
It is separated with pcb board.On the other hand, due to the thickness of articulamentum be not it is blocked up, not will increase the thermal resistance of new Mini LED chip,
So that the Mini LED module after maintenance has good reliability.
Preferably, it in order to promote the welding process of reflow soldering process, prevents that oxidation reaction, the connection occurs when Reflow Soldering
Layer material include PbSn, on the pad for installing the bad point Mini LED chip originally coat articulamentum after further include step
It is rapid: to coat scaling powder on the articulamentum.
Preferably, in the above-described embodiments, the articulamentum includes the mixture of Ag and epoxy resin；Described new
Further include following steps after Mini LED chip is connect with the pad: the Mini LED module is heating and curing.
Preferably, in the above-described embodiments, the Mini LED chip in the Mini LED module has substrate, the lining
Bottom material includes GaN, Si and SiC.In this way, when bad point Mini LED chip occurs in Mini LED module, bad point Mini
LED chip afford translation motor drive push pin application horizontal direction power when, can effectively be separated with pcb board.If
Mini LED chip do not have substrate, then its bear mechanical force ability it is weaker, be easy afford translation motor drive push pin
The fragmentation when power of the horizontal direction of application, and then can not be kept completely separate with pcb board.
It should be noted that Mini LED module, which can be, is provided with Mini LED chip in repair method of the invention
The LED modules such as backlight module, display, plant illumination mould group, automobile lighting mould group, the present invention is for Mini LED module
Type is with no restriction.
The above described is only a preferred embodiment of the present invention, limitation in any form not is done to the present invention, therefore
All contents without departing from technical solution of the present invention, it is made to the above embodiment according to the technical essence of the invention any simply to repair
Change, equivalent variations and modification, all of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of repair method of Mini LED module characterized by comprising
When detecting any Mini LED chip in Mini LED module is bad point Mini LED chip, in the bad point
A barrier sheet is arranged in the first end of Mini LED chip；
Drive the second end pushed pin in the bad point Mini LED chip horizontal towards the first end application by translation motor
The power in direction separates the bad point Mini LED chip with the pcb board of the Mini LED module；The second end
With the first end face；
The bad point Mini LED chip is picked up by inhaling brilliant device, to install the bad point Mini LED chip originally
The Mini LED chip more renewed on pad realizes the maintenance of Mini LED module.
2. repair method as described in claim 1, which is characterized in that in the weldering for installing the bad point Mini LED chip originally
The Mini LED chip more renewed on disk, includes the following steps:
Articulamentum is coated on the pad for installing the bad point Mini LED chip originally；
New Mini LED chip is moved on the pad by the brilliant device of the suction, so that the new Mini LED core
Piece is connect with the pad.
3. repair method as claimed in claim 2, which is characterized in that in the weldering for installing the bad point Mini LED chip originally
Further include following steps after coating articulamentum on disk:
The articulamentum is detected by AOI detection device；
When the AOI detection device detects the articulamentum existing defects, then new articulamentum is coated again.
4. repair method as claimed in claim 2, which is characterized in that be provided on the electrode of the new Mini LED chip
Metal salient point；The new Mini LED chip is connect with the pad in the following way:
When new Mini LED chip is transferred to the pad by the brilliant device of the suction, heated using solder reflow process described in
Articulamentum, so that the metal salient point of the new Mini LED chip is connect by the articulamentum with the pad.
5. repair method as claimed in claim 4, which is characterized in that the material of the articulamentum include Sn, Ag, Sb, Pb and
The combination of one of Cu or at least two materials, the material of the metal salient point are identical as the material of the articulamentum.
6. repair method as claimed in claim 4, which is characterized in that the articulamentum with a thickness of 5~30 μm.
7. repair method as claimed in claim 4, which is characterized in that in the weldering for installing the bad point Mini LED chip originally
It is further comprised the steps of: after coating articulamentum on disk and coats scaling powder on the articulamentum.
8. repair method as claimed in claim 4, which is characterized in that the articulamentum includes the mixing of Ag and epoxy resin
Object；Further include following steps after the new Mini LED chip is connect with the pad:
The Mini LED module is heating and curing.
9. repair method as described in claim 1, which is characterized in that detect to obtain the Mini by AOI detection device
Any Mini LED chip in LED module is bad point Mini LED chip.
10. such as repair method according to any one of claims 1 to 9, which is characterized in that in the Mini LED module
Mini LED chip has substrate, and the substrate material includes GaN, Si and SiC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910575193.6A CN110444487A (en) | 2019-06-28 | 2019-06-28 | A kind of repair method of Mini LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910575193.6A CN110444487A (en) | 2019-06-28 | 2019-06-28 | A kind of repair method of Mini LED module |
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| CN110444487A true CN110444487A (en) | 2019-11-12 |
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| CN201910575193.6A Pending CN110444487A (en) | 2019-06-28 | 2019-06-28 | A kind of repair method of Mini LED module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113362729A (en) * | 2021-06-25 | 2021-09-07 | 利晶微电子技术(江苏)有限公司 | LED display screen overhauling method and device and LED display screen overhauling system |
| CN113409699A (en) * | 2020-03-16 | 2021-09-17 | 重庆康佳光电技术研究院有限公司 | LED display convenient to repair and repair method thereof |
| CN113744653A (en) * | 2020-05-29 | 2021-12-03 | 中国科学院长春光学精密机械与物理研究所 | Display device based on miniature LED |
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Application publication date: 20191112 |