JPH11112131A - Method and device for repairing semiconductor device and removing method of device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability of a repaired semiconductor device and mounted substrate and especially to simplify the repair of the semiconductor device, wherein connecting terminals are arranged in the array pattern. SOLUTION: When this device is constituted of a solution part 1 for forming vapor atmosphere, of a repair part 2 wherein the semiconductor device of a repair part is set, and of a driving part 3 which supports the semiconductor device of the repiar part, solution 4 in the solution part 1 is heated and boiled by a heater 5 when the semiconductor device 9 of the repair part mounted on the surface is removed from a mounting substrate 8 by a solder 11, and the repair part 2 is made to be vapor atmosphere 6. By this vapor heat, the connecting part of the mounting substrate 8 and the semiconductor device 9 is heated, and the solder 11 is fused. The semiconductor device 9 of the repair part is separated and removed from the mounting substrate 8. Furthermore, the remounting is also performed by fusing the solder 11 with the vapor atmosphere 6 by the same way.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device repair technology, and particularly to a semiconductor device or the like surface-mounted by solder connection on a mounting board such as a motherboard, and when each component is replaced. The present invention relates to a repair method and an apparatus from removal of a replacement part to remounting, and a technique effective when applied to a method of removing a part.

[0002]

2. Description of the Related Art For example, as a technique studied by the present inventor, as a method of repairing a component such as a semiconductor device (BGA, QFP, etc.) mounted on a mounting board by soldering, a method of repairing a mounting board and a component is known. It is indispensable to melt the solder connecting the components, and a method of removing a component by heating the connection portion of the solder by hot air and melting the solder is generally known.

[0003]

In the technique for repairing components such as a semiconductor device as described above, when removing the semiconductor device 16 of the QFP mounted on the mounting board 8 as shown in FIG. 6, for example. The semiconductor device 16 is detached by heating the connection portion connected by the solder 11 by the hot air 15 from the injection unit 14 to melt the solder 11. In this case, for the peripheral components 10 other than the semiconductor device 16 to be removed, the solder 11 must be prevented from being melted in order to prevent deterioration of connection reliability.

However, for a component whose connection terminal is on the back surface of the package (on the side of the mounting board 8), for example, as in a BGA semiconductor device 9 shown in FIG. Is very difficult to melt. In particular, the package in which the connection terminals are arranged in an array will heat the periphery including the package body more than necessary to heat the inside,
This can lead to product damage and reduced reliability.

Therefore, an object of the present invention is to improve the reliability of a repaired semiconductor device and a mounted substrate by using a heating method based on a vapor atmosphere instead of a heating method mainly using hot air. It is an object of the present invention to provide a method and an apparatus for repairing a semiconductor device which can simplify the repair of semiconductor devices arranged in a shape, and a method for removing the semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0007]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the method of repairing a semiconductor device according to the present invention, the connection portion of the semiconductor device mounted on the mounting substrate is heated in a vapor atmosphere to melt the solder, and the semiconductor device is removed from the mounting substrate. The semiconductor device to be remounted is positioned on the mounting board from which it has been removed, and the connection between the mounted mounting board and the semiconductor device to be remounted is heated in a vapor atmosphere to melt the solder and to be mounted on the mounting board. Attach the semiconductor device to be remounted.

The semiconductor device repair apparatus according to the present invention is applied to a semiconductor device which is surface-mounted by solder connection on a mounting board, and is filled with a solution for creating a vapor atmosphere. Heat to a predetermined temperature
A solution section to be boiled, a solder section is melted by heating in a vapor atmosphere created by the solution section, and a repair section for removing and re-mounting the semiconductor device with respect to the mounting board, and an inside of the repair section and the repair section And a drive unit for positioning a semiconductor device to be detached and remounted, which is driven between the device and the outside of the device, on a mounting substrate.

[0010] In this configuration, the repair section is formed in a structure surrounding only the semiconductor device to be removed and remounted, and heating means for heating the connection portion of the semiconductor device to be removed and remounted by hot air. In addition, the heating temperature in the vapor atmosphere and the heating temperature in the hot air having a temperature different from the heating temperature in the vapor atmosphere are used in combination.

Further, in the method of removing a semiconductor device according to the present invention, the connecting portion of the semiconductor device mounted on the mounting substrate is heated in a vapor atmosphere to melt the solder, and the semiconductor device is removed from the mounting substrate where the solder is melted. And removing the step.

Therefore, according to the semiconductor device repairing method, the semiconductor device repairing method, and the removing method described above, the mounting substrate and the semiconductor device to be removed and remounted are in a vapor atmosphere, so that the mounting substrate and the semiconductor device are kept at a constant temperature. To melt the solder at the connection. In particular, the heating method using the vapor atmosphere has better thermal conductivity to the components and can reduce the variation in temperature distribution as compared with the heating method using hot air.

Further, by forming a repair portion in a structure surrounding the periphery of only the semiconductor device to be removed and remounted, only the semiconductor device to be removed and remounted is brought into a vapor atmosphere, so that other semiconductor devices and Damage to the mounting board and reduction in reliability can be prevented.

Further, by adding a heating means for heating by hot air, and particularly by using a heating temperature of hot air different from the heating temperature of the vapor atmosphere, the temperature difference between the mounting substrate and the semiconductor device to be removed and remounted is reduced. Thus, warpage during repair of the mounting board can be reduced.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, the same members are denoted by the same reference numerals, and the description thereof will not be repeated.

(Embodiment 1) FIG. 1 is a schematic configuration diagram showing a semiconductor device repair apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a flowchart showing a repair method by the repair device of the first embodiment, FIG. 3 is a schematic configuration diagram showing a semiconductor device removal method, and FIG. 4 is a schematic configuration diagram showing a semiconductor device remounting method.

First, a schematic configuration of a repair device for a semiconductor device according to the first embodiment will be described with reference to FIG.

The repair device for a semiconductor device according to the first embodiment is, for example, a repair device for a semiconductor device such as a BGA which is mounted on a mounting board by soldering and has connection terminals arranged in an array. It comprises a solution section 1 for creating an atmosphere, a repair section 2 on which a semiconductor device as a repair component is set, and a drive section 3 for supporting the semiconductor device as the repair component.

The solution section 1 is filled with a solution 4 for creating a vapor atmosphere, and is a section for heating and boiling the solution 4 to a predetermined temperature. A heater 5 for heating and boiling the solution 4 includes a solution section. 1 is provided on the inner peripheral portion. For the solution 4, for example, an inert liquid such as Freon FC70 (boiling point: about 215 ° C .; trade name of DuPont) for a solder having a melting point of about 183 ° C. is used.

The repair section 2 is a section in which a vapor atmosphere 6 is formed by the saturated vapor generated in the solution section 1, and the solder is melted by heating in the vapor atmosphere 6 to repair the semiconductor device to the mounting board. Are formed integrally with the solution part 1 in a structure surrounding only the semiconductor device as a repair part. A mounting board on which a semiconductor device of a repair component or the like is mounted is mounted on the repair unit 2.

The drive section 3 is a section for positioning the semiconductor device as a repair component on the mounting board. The semiconductor device is sucked by the arm 7 in a vacuum or reduced pressure state, and the inside of the repair section 2 and the repair section 2 are connected to each other. It is driven between the outside of the device. The arm 7 can move up and down inside the repair unit 2, for example.

Next, the operation of the first embodiment will be described with reference to FIGS.
This will be described with reference to FIG.

Here, as shown in FIGS. 3 and 4, for example, a repair component B which is surface-mounted on the mounting board 8 is shown.
Example in which peripheral devices 10 such as semiconductor devices such as FPG which are not repaired, semiconductor devices such as transistors and diodes, and electronic devices such as resistors and capacitors are connected by solder 11 in addition to the GA semiconductor device 9. Is shown.

First, as shown in FIG. 3, the mounting substrate 8 is set on the repair unit 2 with the mounting surface facing down (step 201), and the semiconductor device 9 of the repair component to be removed from the mounting substrate 8 is driven. The third arm 7 sucks and supports (Step 202). At this time, the solution 4 in the solution section 1 has not reached the boiling point, and the repair section 2 has not reached the vapor atmosphere 6.

In this state, the solution 4 in the solution section 1 is
Heating and boiling, and repair section 2 in vapor atmosphere 6
Then, the periphery of the semiconductor device 9 as a repair component is brought into a vapor state. The connection portion between the mounting substrate 8 and the semiconductor device 9 is heated by the heat of the vapor, the solder 11 is melted, and the mounting substrate 8 and the semiconductor device 9 become separable (step 203).

Then, the arm 7 supporting the semiconductor device 9 of the repair component by suction is lowered, and the semiconductor device 9 of the repair component is separated from the mounting board 8 set on the upper part of the repair unit 2 and removed ( Step 204). Thus, the removal of the semiconductor device 9 as the repair component from the mounting board 8 is completed.

Subsequently, as shown in FIG. 4, the semiconductor device 9a of the repair component to be remounted is attracted to the mounting board 8 from which the semiconductor device 9 of the repair component has been removed by the arm 7 of the drive unit 3. Positioning is performed (step 205). At this time, the solution 4 in the solution section 1 has not reached the boiling point, and the repair section 2 has not reached the vapor atmosphere 6.

In this state, the solution 4 in the solution section 1 is
Heating and boiling, and repair section 2 in vapor atmosphere 6
Then, the periphery of the semiconductor device 9a as a repair component is brought into a vapor state. The connection portion between the mounting substrate 8 and the semiconductor device 9a is heated by the heat of the vapor to melt the solder 11, and the mounting substrate 8 and the semiconductor device 9a are in a connectable state (step 206).

Further, the arm 7 supporting the semiconductor device 9a of the repair component by suction is lifted, and the semiconductor device 9a of the repair component is connected to and mounted on the mounting board 8 set on the upper part of the repair section 2 ( Step 207).
At this time, since the semiconductor device 9a as the repair component is attracted by the arm 7, the distance between the mounting substrate 8 and the semiconductor device 9a can be maintained at a position effective for connection by the solder 11.

Then, after the mounting board 8 and the semiconductor device 9a as a repair component are completely connected by the solder 11, the heater 5 of the solution section 1 is turned off, and the vapor atmosphere 6 of the repair section 2 is turned off.
Release and lower the temperature. By taking out the mounting board 8 on which the semiconductor device 9a of this repair component has been remounted,
The repair from the removal of the semiconductor device 9 to the mounting board 8 to the attachment of the semiconductor device 9a ends (step 208).

Therefore, according to the repair apparatus of the first embodiment, the repair section 2 is provided by the vapor atmosphere 6 made of the solution section 1, and the semiconductor devices 9 and 9 a are repaired in the vapor atmosphere 6. By doing so, the thermal conductivity is good,
In addition, by reducing the variation in the temperature distribution, the mounting board 8 and the semiconductor devices 9 and 9a to be removed and remounted can be heated to a constant temperature to melt the solder 11 at the connection portion.

In particular, by forming the repair portion 2 in a structure surrounding only the semiconductor devices 9 and 9a as repair parts, only the semiconductor devices 9 and 9a to be removed and remounted can be in the vapor atmosphere 6. Therefore, it is possible to prevent the peripheral components 10 such as other semiconductor devices and electronic devices and the mounting substrate 8 from being damaged and from lowering the reliability.

(Embodiment 2) FIG. 5 is a schematic configuration diagram showing a semiconductor device repair apparatus according to Embodiment 2 of the present invention.

A repair device for a semiconductor device according to the second embodiment is a repair device for a semiconductor device such as a BGA mounted on a mounting board by soldering similarly to the first embodiment. The difference is that the solution section and the repair section are formed as an integral vapor tank, and a heating method using a vapor atmosphere and a heating method using hot air are used in combination.

That is, in the second embodiment, as shown in FIG. 5, for example, the lower part is filled with the solution 4 and the solution 4 is heated and boiled to a predetermined temperature, and the upper part is a vapor atmosphere 6. Then, the solder is melted by the heating in the vapor atmosphere 6, and a vapor tank 12 including a portion for repairing the semiconductor device 9 (9 a) to the mounting substrate 8, and the semiconductor device 9 a as a repair component is placed on the mounting substrate 8. , And an injection unit 14 heated by hot air.

For example, the solution 4 in the vapor tank 12
Freon FC40 having a lower boiling point than that of the first embodiment.
(Boiling point: about 175 ° C.)
Further, a hot air 15 of about 400 ° C.
Is to be injected.

In the above configuration, when removing the semiconductor device 9 of the repair component from the mounting substrate 8, first, the entire mounting substrate 8 on which the semiconductor device 9 of the repair component is mounted is removed from the vapor tank 12. It is left in the atmosphere 6, and in this state, hot air 15 is injected only to the connection portion between the mounting board 8 and the semiconductor device 9 as a repair component to perform additional heating. As a result, the solder 11 at the connection portion is melted, and the semiconductor device 9 as a repair component can be separated and removed from the mounting board 8.

Similarly, when the semiconductor device 9 a as a repair component is remounted on the mounting board 8, first, the mounting board 8 left in the vapor atmosphere 6 of the vapor tank 12 is repaired. The semiconductor device 9a of the component is positioned, and the mounting board 8 and the semiconductor device 9 of the repair component are positioned in this state.
The hot air 15 is injected only to the connection portion with a to perform additional heating. Thus, the solder 11 at the connection portion is melted, and the semiconductor device 9 a as a repair component can be connected and mounted on the mounting board 8.

Therefore, according to the repair apparatus of the second embodiment, by repairing the semiconductor devices 9 and 9a in the vapor atmosphere 6 of the vapor tank 12, the thermal conductivity is reduced in the same manner as in the first embodiment. It is possible to heat the mounting board 8 and the semiconductor devices 9 and 9a to be detached and remounted to a constant temperature to melt the solder 11 at the connection portion while reducing the variation in the temperature distribution.

In particular, while the entire mounting substrate 8 is left in the vapor atmosphere 6, the hot air 15 is sprayed only on the connecting portions between the mounting substrate 8 and the semiconductor devices 9 and 9a of the repair parts, so that the mounting substrate 8 is The temperature difference between the semiconductor device 9 and the semiconductor devices 9 and 9a is reduced, and the warpage of the mounting substrate 8 can be reduced.

The invention made by the present inventor has been specifically described based on the first and second embodiments.
The present invention is not limited to the above embodiment, and it goes without saying that various changes can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, a case has been described where the present invention is applied to a BGA semiconductor device as a repair part. However, the present invention is not limited to this.
The present invention can be widely applied to a semiconductor device of a surface mounting type such as P, SOP, QFJ, and SOJ, and a semiconductor device such as a transistor and a diode.

Although the case where freon is used as a solution for creating a vapor atmosphere has been described, other inert liquids can be used. The boiling point of this solution depends on the composition ratio of tin and lead. It goes without saying that a solution having a different boiling point is used in accordance with the changing melting point of the solder.

Further, when the heating by the vapor atmosphere and the heating by the hot air are used together, various combinations of temperatures and temperature profiles are possible in consideration of the reliability of the semiconductor device, the electronic device and the mounting substrate. It is desirable that optimal conditions be selected in accordance with, in particular, the semiconductor device to be repaired.

Further, the structure and shape of the repair device are not limited to those shown in FIGS.
It is also possible to add the structure of the injection unit as shown in FIG. 5 to the repair part of the structure surrounding only the semiconductor device of the repair part shown in FIG. 1, or to make various modifications of the structure.

In the above description, the case where the invention made by the present inventor is mainly applied to the repair technique of a semiconductor device, which is a technical field to which the invention belongs, has been described. It is widely applicable as a technique for removing a semiconductor device.

[0047]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) By setting the mounting substrate and the semiconductor device to be removed and remounted in a vapor atmosphere, the mounting substrate and the semiconductor device can be heated to a certain temperature and the solder at the connection portion can be melted. In particular, the thermal conductivity of the components is better than that of heating by hot air, and the semiconductor device can be removed and re-mounted with less variation in temperature distribution.

(2) Since the repair portion is formed in a structure surrounding only the semiconductor device to be removed and remounted, only the semiconductor device to be removed and remounted can be in a vapor atmosphere. It is possible to prevent damage to other semiconductor devices and the mounting substrate and a decrease in reliability.

(3) By adding a heating means for heating with hot air, it is possible to use a heating temperature by hot air different from a heating temperature by vapor atmosphere in particular, so that a semiconductor device to be detached from a mounting board and remounted. And the temperature difference from the temperature of the mounting board becomes small, and it becomes possible to prevent the mounting board from being deformed due to warpage or the like.

(4) According to the above (1) to (3), the reliability of the detached and remounted semiconductor device and the mounting substrate is improved by using a heating method using a vapor atmosphere and a heating method using hot air together. In particular, it is possible to simplify removal and remounting of the semiconductor device in which the connection terminals are arranged in an array.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a repair device for a semiconductor device according to a first embodiment of the present invention;

FIG. 2 is a flowchart illustrating a repair method by the repair device according to the first embodiment of the present invention.

FIG. 3 is a schematic configuration diagram illustrating a method of removing the semiconductor device according to the first embodiment of the present invention;

FIG. 4 is a schematic configuration diagram illustrating a method for remounting the semiconductor device according to the first embodiment of the present invention;

FIG. 5 is a schematic configuration diagram showing a repair device for a semiconductor device according to a second embodiment of the present invention;

FIG. 6 is a schematic configuration diagram showing a repair device of a semiconductor device which is a premise of the present invention.

FIG. 7 is a schematic configuration diagram showing a repair device of another semiconductor device which is a premise of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solution part 2 Repair part 3 Drive part 4 Solution 5 Heater 6 Vapor atmosphere 7 Arm 8 Mounting board 9, 9a Semiconductor device 10 Peripheral parts 11 Solder 12 Vapor tank 13 Drive part 14 Injection part 15 Hot air 16 Semiconductor device

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Tomohiro Shiraishi 2326 Imai, Ome-shi, Tokyo Inside the Hitachi, Ltd.Device Development Center (72) Inventor Hiroshi Kuroda 2326, Imai, Ome-shi, Tokyo Hitachi, Ltd.Device Development Center, Ltd. (72) Inventor Minoru Kubozono 2326 Imai, Ome-shi, Tokyo Hitachi, Ltd.Device Development Center, Hitachi, Ltd. (72) Inventor Yoshiyuki Shirai 2326 Imai, Ome-shi, Tokyo, Device Development Center, Hitachi, Ltd.

Claims (6)

[Claims] 1. A method for repairing a semiconductor device which is surface-mounted on a mounting board by solder connection, wherein a step of heating a connection portion of the semiconductor device mounted on the mounting board in a vapor atmosphere to melt the solder. Removing the semiconductor device from the mounting board where the solder has been melted, positioning the semiconductor device to be re-mounted on the mounting board from which the semiconductor device has been removed, and re-mounting the mounted mounting board and the semiconductor device. A step of heating a connection portion with a semiconductor device to be melted by heating in a vapor atmosphere, and a step of attaching a semiconductor device to be re-mounted on a mounting board in which the solder has been melted. Repair method. 2. A repair device for a semiconductor device which is surface-mounted on a mounting board by solder connection, wherein the solution is filled with a solution for creating a vapor atmosphere, and the solution is heated and boiled to a predetermined temperature. The solder is melted by heating in a vapor atmosphere formed by the solution part, and a repair part for removing and re-mounting the semiconductor device with respect to the mounting board, and inside the repair part and between the repair part and the outside of the device And a driver for positioning the semiconductor device to be removed and remounted on the mounting substrate. 3. The semiconductor device repair device according to claim 2, wherein said repair portion is formed in a structure surrounding only the semiconductor device to be removed and remounted. Equipment repair equipment. 4. The repair device for a semiconductor device according to claim 2, wherein the repair unit is provided with a heating unit for heating a connection portion of the semiconductor device to be removed and remounted by hot air. A repair device for a semiconductor device. 5. The repair device for a semiconductor device according to claim 4, wherein the repair unit uses a heating temperature by the vapor atmosphere and a heating temperature by the hot air at a temperature different from the heating temperature by the vapor atmosphere. A repair device for a semiconductor device, comprising: 6. A method for removing a semiconductor device which is surface-mounted on a mounting board by solder connection, wherein the connecting portion of the semiconductor device mounted on the mounting board is heated in a vapor atmosphere to melt the solder. And a step of removing the semiconductor device from the mounting board in which the solder has been melted.