JP2970009B2 - Bump molding method - Google Patents
Bump molding methodInfo
- Publication number
- JP2970009B2 JP2970009B2 JP3051027A JP5102791A JP2970009B2 JP 2970009 B2 JP2970009 B2 JP 2970009B2 JP 3051027 A JP3051027 A JP 3051027A JP 5102791 A JP5102791 A JP 5102791A JP 2970009 B2 JP2970009 B2 JP 2970009B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jig
- solder portion
- leads
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はバンプの成形方法に係
り、基板に形成された半田部に加熱された治具を着地さ
せて溶融させ、次いでこの治具を上昇させることによ
り、半田部の高さを高くして、電子部品のリードの接着
性を向上させるようにしたものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a bump, and a method for forming a bump on a solder portion formed on a substrate by melting a heated jig, and then raising the jig. The height is increased to improve the adhesiveness of the lead of the electronic component.
【０００２】[0002]
【従来の技術】図５は、従来手段により、電子部品を基
板に搭載した状態を示している。図中、１は電子部品、
２はリード、３は基板、４は基板３に形成された回路パ
ターン、５は回路パターン４上に形成された半田部、６
は電子部品１を半田部５上に搭載する移載ヘッドのノズ
ルである。2. Description of the Related Art FIG. 5 shows a state in which electronic components are mounted on a substrate by conventional means. In the figure, 1 is an electronic component,
2 is a lead, 3 is a substrate, 4 is a circuit pattern formed on the substrate 3, 5 is a solder portion formed on the circuit pattern 4, 6
Reference numeral denotes a nozzle of a transfer head for mounting the electronic component 1 on the solder portion 5.
【０００３】このものは、電子部品１をノズル６に吸着
し、基板３上に搭載した後、基板３をリフロー装置へ送
り、半田部５を加熱処理して、リード２を半田部５に接
着するようになっている。In this method, the electronic component 1 is attracted to the nozzle 6 and mounted on the substrate 3, the substrate 3 is sent to a reflow device, the solder portion 5 is heated, and the lead 2 is bonded to the solder portion 5. It is supposed to.
【０００４】[0004]
【発明が解決しようとする課題】ところが、図示するよ
うに、リード２の高さや半田部５の高さにはばらつきが
あり、このため、すべてのリード２を半田部５に着地さ
せて確実に接着することが困難な問題点があった。However, as shown in the drawing, the heights of the leads 2 and the heights of the solder portions 5 vary, so that all the leads 2 are landed on the solder portions 5 to be sure. There was a problem that bonding was difficult.
【０００５】そこで本発明は、リードや半田部の高さの
ばらつきによるリードの接着不良を解消できる手段を提
供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a means capable of eliminating lead adhesion failure due to variations in the height of leads and solder portions.
【０００６】[0006]
【課題を解決するための手段】本発明は、基板に形成さ
れた半田部に加熱された治具を着地させてこの半田部を
溶融させ、次いでこの治具を上昇させることにより、溶
融された半田部の上面を突出させるようにしたものであ
る。According to the present invention, the molten solder is formed by landing a heated jig on a solder portion formed on a substrate, melting the solder portion, and then raising the jig. The upper surface of the solder portion is made to protrude.
【０００７】[0007]
【作用】上記のようにして半田部の上面を高くすれば、
電子部品を基板に搭載して、リフロー装置により半田部
を加熱溶融させる際に、電子部品は自重により半田部の
突出部を圧縮しながら徐々に沈下し、すべてのリードは
半田部に接着される。[Action] If the upper surface of the solder portion is raised as described above,
When the electronic component is mounted on the board and the solder part is heated and melted by the reflow device, the electronic component gradually sinks while compressing the protruding part of the solder part by its own weight, and all the leads are bonded to the solder part .
【０００８】[0008]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【０００９】図１はバンプ成形装置の斜視図である。図
中、１０はＸテーブル１０ＡとＹテーブル１０Ｂから成
るＸＹテーブルである。図２に示すように、Ｙテーブル
１０Ｂにはボックス９が装着されている。このボックス
９にはシャフト１１が垂設されており、このシャフト１
１には治具１２が装着されている。この治具１２はＸＹ
テーブル１０に駆動されて、ＸＹ方向に移動する。この
治具１２は矩形板状であり、その側縁部には押圧部１３
が枠形状に形成されている。３は基板、５は半田部であ
る。FIG. 1 is a perspective view of a bump forming apparatus. In the figure, reference numeral 10 denotes an XY table including an X table 10A and a Y table 10B. As shown in FIG. 2, a box 9 is mounted on the Y table 10B. A shaft 11 is suspended from the box 9.
1 is provided with a jig 12. This jig 12 is XY
It is driven by the table 10 and moves in the XY directions. The jig 12 has a rectangular plate shape, and has a pressing portion 13 at a side edge thereof.
Are formed in a frame shape. 3 is a board | substrate, 5 is a solder part.
【００１０】図２に示すように、治具１２の内部には、
ニクロム線などの加熱手段１４が内蔵されている。この
加熱手段１４は、押圧部１３を半田の溶融温度（一般に
１８３℃程度）まで加熱する。加熱手段としては、治具
１２の近くにヒーターを設け、このヒーターにより加熱
するようにしてもよい。またボックス９には、治具１２
の冷却手段としてのエアの吹出し部１５が設けられてい
る。また図示しないが、ボックス９の内部には、カムや
モーターなどの治具１２の昇降手段が内蔵されている。
図２において、４は回路パターンである。なお図１にお
いては、回路パターン４は省略している。[0010] As shown in FIG.
A heating means 14 such as a nichrome wire is incorporated. The heating means 14 heats the pressing portion 13 to a solder melting temperature (generally about 183 ° C.). As the heating means, a heater may be provided near the jig 12, and the heater may be used for heating. The box 9 has a jig 12
An air blowing portion 15 is provided as a cooling means. Although not shown, the box 9 has built-in means for raising and lowering the jig 12 such as a cam and a motor.
In FIG. 2, reference numeral 4 denotes a circuit pattern. In FIG. 1, the circuit pattern 4 is omitted.
【００１１】本発明は上記のような構成より成り、次に
動作の説明を行う。ＸＹテーブル１０を駆動して、治具
１２を半田部５の真上に位置させる。次いで治具１２を
下降させて、半田部５に着地させる（図２鎖線参照）。
次いで治具１２を上昇させる（図３参照）。The present invention has the above configuration, and the operation will be described next. The XY table 10 is driven to position the jig 12 right above the solder portion 5. Next, the jig 12 is lowered to land on the solder portion 5 (see the chain line in FIG. 2).
Next, the jig 12 is raised (see FIG. 3).
【００１２】治具１２は加熱手段１４により加熱されて
おり、この治具１２を半田部５に押し当てると、半田部
５は加熱されて溶融する。したがって治具１２が上昇す
ると、溶融した半田部５の上面は、押圧部１３に付着し
て引き上げられ、ひげ状の突出部５ａが形成される。The jig 12 is heated by the heating means 14. When the jig 12 is pressed against the solder portion 5, the solder portion 5 is heated and melted. Therefore, when the jig 12 is raised, the upper surface of the melted solder portion 5 adheres to the pressing portion 13 and is pulled up, so that the beard-shaped protrusion 5a is formed.
【００１３】次いで吹出し部１５からエアを吹き出し
て、突出部５ａや押圧部１３を冷却することにより、押
圧部１３の突出部５ａからの離れを良くし、更に治具１
２を上昇させることにより、押圧部１３を突出部５ａか
ら離陸させる。Next, air is blown out from the blow-out portion 15 to cool the protruding portion 5a and the pressing portion 13, thereby improving the separation of the pressing portion 13 from the protruding portion 5a.
By lifting 2, the pressing portion 13 is taken off from the protruding portion 5a.
【００１４】以上のようにして、半田部５の上面に突出
部５ａが部分的に形成され、半田部５の高さＨは高くな
る。As described above, the protruding portion 5a is partially formed on the upper surface of the solder portion 5, and the height H of the solder portion 5 increases.
【００１５】図４（ａ）は上記のようにして成形された
半田部５に電子部品１を搭載した状態を示している。上
述したように、リード２の高さにはばらつきがあり、し
たがって高さの最も低いリード２（本実施例では右端の
リード２ａ）のみが上記突出部５ａに着地し、他のリー
ド２は突出部５ａから浮き上っている。FIG. 4A shows a state in which the electronic component 1 is mounted on the solder portion 5 formed as described above. As described above, the height of the lead 2 varies, so that only the lead 2 having the lowest height (the right end lead 2a in this embodiment) lands on the protruding portion 5a, and the other leads 2 protrude. It emerges from the part 5a.
【００１６】図４（ｂ）は、リフロー後の状態を示して
いる。リフローにおいて、半田部５は加熱溶融されるの
で、電子部品１は自重により突出部５ａを圧縮しながら
徐々に沈下し、すべてのリード２は半田部５に接着され
る。FIG. 4B shows a state after the reflow. In the reflow, since the solder portion 5 is heated and melted, the electronic component 1 gradually sinks while compressing the protruding portion 5 a by its own weight, and all the leads 2 are bonded to the solder portion 5.
【００１７】本実施例では、最も低い右端のリード２ａ
は突出部５ａを完全圧縮して半田部５ａに接着される。
また中程度の高さを有するリード２ｂ，２ｄも突出部５
ａをほぼ完全に圧縮して半田部５に接着される。また最
も高いリード２ｃは、電子部品１が沈下したことによ
り、突出部５ａに着地して接着される。この場合、この
リード２ｃは突出部５ａを完全に圧縮して十分に半田部
５に接着はされていないが、必要な導通性が得られる程
度には接着されている。In this embodiment, the lowest rightmost lead 2a
Are completely compressed and adhere to the solder portion 5a.
In addition, the leads 2b and 2d having a medium height are
a is almost completely compressed and adhered to the solder portion 5. Further, the highest lead 2c lands on the protruding portion 5a and is adhered by the sinking of the electronic component 1. In this case, the leads 2c are not completely bonded to the solder portions 5 by completely compressing the protruding portions 5a, but are bonded to such an extent that necessary conductivity can be obtained.
【００１８】以上のように本方法によれば、リード２の
高さのばらつきを吸収し、すべてのリード２を半田部５
に接着することができる。As described above, according to the present method, variations in the height of the leads 2 are absorbed, and all the leads 2 are connected to the solder portions 5.
Can be adhered to.
【００１９】[0019]
【発明の効果】以上説明したように本発明は、基板に形
成された半田部に加熱された治具を着地させてこの半田
部を溶融させ、次いでこの治具を上昇させることによ
り、溶融された半田部の上面を突出させるようにしてい
るので、リードの高さのばらつきを吸収し、すべてのリ
ードを半田部に接着することができる。As described above, according to the present invention, the heated jig is landed on the solder portion formed on the substrate, the solder portion is melted, and then the jig is raised, thereby melting the solder portion. Since the upper surface of the solder portion is made to protrude, variations in the height of the leads can be absorbed, and all the leads can be bonded to the solder portion.
【図１】バンプ成形装置の斜視図FIG. 1 is a perspective view of a bump forming apparatus.
【図２】バンプ成形中の模式図FIG. 2 is a schematic view during bump molding.
【図３】バンプ成形中の模式図FIG. 3 is a schematic diagram during bump molding.
【図４】（ａ）は半田部に電子部品を搭載した状態の模
式図 （ｂ）はリフロー後の状態の模式図FIG. 4A is a schematic diagram showing a state in which electronic components are mounted on a solder portion, and FIG. 4B is a schematic diagram showing a state after reflow.
【図５】従来手段の模式図FIG. 5 is a schematic view of a conventional means.
３ 基板 ５ 半田部 １２ 治具 3 Board 5 Solder part 12 Jig
Claims (1)
を着地させてこの半田部を溶融させ、次いでこの治具を
上昇させることにより、溶融された半田部の上面を突出
させることを特徴とするバンプの成形方法。An apparatus according to claim 1, wherein a heated jig is landed on a solder portion formed on the substrate to melt the solder portion, and then the jig is raised so that an upper surface of the melted solder portion is projected. A method for forming a bump, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3051027A JP2970009B2 (en) | 1991-03-15 | 1991-03-15 | Bump molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3051027A JP2970009B2 (en) | 1991-03-15 | 1991-03-15 | Bump molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04286333A JPH04286333A (en) | 1992-10-12 |
| JP2970009B2 true JP2970009B2 (en) | 1999-11-02 |
Family
ID=12875330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3051027A Expired - Fee Related JP2970009B2 (en) | 1991-03-15 | 1991-03-15 | Bump molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2970009B2 (en) |
-
1991
- 1991-03-15 JP JP3051027A patent/JP2970009B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04286333A (en) | 1992-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |