JPH01243497A - Solder removing device for through hole in substrate - Google Patents
Solder removing device for through hole in substrateInfo
- Publication number
- JPH01243497A JPH01243497A JP6934788A JP6934788A JPH01243497A JP H01243497 A JPH01243497 A JP H01243497A JP 6934788 A JP6934788 A JP 6934788A JP 6934788 A JP6934788 A JP 6934788A JP H01243497 A JPH01243497 A JP H01243497A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- substrate
- board
- solder
- exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 title abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 3
- 230000003028 elevating effect Effects 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板に挿入・はんだ付けされた多ピン電子部
品の交換に当り、部品取りはずし後、基板スルーホール
内の残留ハンダを除去するのに好適な熱風噴射方式のは
んだ除去装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a method for removing residual solder in through-holes of a board after removing the component when replacing a multi-pin electronic component inserted and soldered to a board. The present invention relates to a hot air jetting type desoldering device suitable for
従来、基板スルーホール内のはんだの除去は、実公昭５
８−１４６２３号に記載のように１人手作業に頼ってい
た。すなわち、人手ではんだごてを持ち、こての先端を
基板のスルーホールに当てて、内部のはんだを溶かし、
こてに付けられた吸気機構により、周囲の空気とともに
はんだを吸込み除去していた。Conventionally, the removal of solder inside the board through-holes was
As described in No. 8-14623, manual work by one person was required. In other words, manually hold a soldering iron and apply the tip of the iron to the through hole of the board to melt the solder inside.
A suction mechanism attached to the iron sucked in the surrounding air and removed the solder.
上記従来技術は、多ピン電子部品が数多く実装される大
形基板のスルーホールのはんだ除去について考慮されて
おらず、このような大形基板のスルーホールのはんだ除
去に当って次のような課題があった。すなわち、（１）
ノズルの吸引作用により、スルーホール内のはんだと一
緒に基板周囲の冷たい空気も吸込んでしまうため、基板
が冷されてしまい、１回の加熱で多数のスルーホール内
のはんだを除去することができない。（２）ノズルを基
板に押し当てるため、基板上の配線パターンを損傷する
恐れがある。The above-mentioned conventional technology does not take into consideration the desoldering of through-holes in large-sized boards on which many multi-pin electronic components are mounted, and the following problems arise when desoldering the through-holes in such large-sized boards: was there. That is, (1)
The suction action of the nozzle sucks in the cold air around the board along with the solder in the through holes, which cools the board and makes it impossible to remove the solder in many through holes with one heating. . (2) Since the nozzle is pressed against the board, there is a risk of damaging the wiring pattern on the board.
本発明の目的は、基板に損傷を与えることなく、大形基
板の多数のスルーホール内のはんだを短時間にむらなく
除去できる装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus that can uniformly remove solder in a large number of through holes of a large substrate in a short time without damaging the substrate.
上記目的は、゛ヒータを内蔵し、基板に上方から熱風を
吹きつけるノズルと、上記ノズルを水平移動させる駆動
手段と、基板を下方から非接触で加熱する手段と、基板
上面と気密を保ち、上記ノズルをその内部に含み、内部
でノズルの移動を可能とする上部囲い枠と、基板下面と
気密を保ち、上記加熱手段をその内部に含み、かつ排気
手段を具備する下部囲い枠とを設けることにより達成さ
れる。The above purpose is to provide a nozzle with a built-in heater that blows hot air onto the substrate from above, a driving means for horizontally moving the nozzle, a means for heating the substrate from below without contact, and a device that maintains airtightness with the top surface of the substrate. An upper enclosing frame that includes the nozzle therein and allows movement of the nozzle therein, and a lower enclosing frame that maintains airtightness with the lower surface of the substrate, includes the heating means therein, and is equipped with an exhaust means. This is achieved by
（１）ノズルからの熱風噴射方式の採用により、ノズル
が基板に触れることなく、すなわち配線パターンを傷付
けないで、はんだを除去できるようになった。(1) By adopting a hot air injection method from the nozzle, it is now possible to remove solder without the nozzle touching the board, that is, without damaging the wiring pattern.
（２）幅広のノズルを水平移動させることにより、多数
のスルーホール内のはんだを短時間で除去できるように
なった。(2) By horizontally moving the wide nozzle, it became possible to remove solder in many through holes in a short time.
（３）基板下部に設けた加熱手段と基板上部に設けたノ
ズルからの熱風により基板スルーホール内のはんだを溶
かし、ノズルと基板上面を上部囲い枠で密閉することに
より、基板を冷すことなく、はんだを溶かしたまま吹き
飛ばすことができ、また下部囲い枠と排気手段により、
外部の冷たい空気のまき込みを防ぐとともに、はんだの
下方への吹き出しをうながし、かつ周囲への飛散を防ぐ
ことができた。(3) By melting the solder in the through holes of the board using the heating means installed at the bottom of the board and the hot air from the nozzle installed at the top of the board, and sealing the nozzle and the top of the board with the upper enclosure frame, the board does not cool down. , the solder can be blown away while remaining melted, and the lower enclosure and exhaust means allow
In addition to preventing cold air from entering the area, it also allowed the solder to blow out downward and prevent it from scattering to the surrounding area.
以下、本発明の実施例を図面により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図において、ノズル１１は図示しないヒータを内蔵
しており、図示しないガス供給源から供給される高圧ガ
スを所定の温度に加熱し、熱風として噴射できる構造と
なっている。このノズル１１は、スライド用ガイド１５
で水平方向に摺動自在に案内されるブロック１６に、ノ
ズル先端を下に向けて取付けられており、水平駆動用モ
ータ１４とスライド用ロープ１２、プーリ１３により上
部囲い枠９内の所定範囲を往復動する。ノズル１１をそ
の内部に含む上部囲い枠９は、フランジ１０を介して可
動プレート８に結合されている。In FIG. 1, the nozzle 11 has a built-in heater (not shown), and has a structure that can heat high-pressure gas supplied from a gas supply source (not shown) to a predetermined temperature and inject it as hot air. This nozzle 11 has a slide guide 15
The nozzle tip is attached to a block 16 that is guided so as to be slidable in the horizontal direction, with the nozzle tip facing downward. Move back and forth. The upper enclosure 9, which contains the nozzle 11 therein, is connected to the movable plate 8 via a flange 10.
可動プレート８は、昇降ガイド４により昇降自在に案内
されており、可動プレート８に搭載された昇降用モータ
５、プーリ６、送りねじ７により。The movable plate 8 is guided by a lift guide 4 so as to be freely raised and lowered, and by a lift motor 5, a pulley 6, and a feed screw 7 mounted on the movable plate 8.
任意の高さに位置決めされる。また、これらはＸＹ子テ
ーブルに取付ベース２、固定プレート３を介して吊下げ
保持され、任意のｘｙ座標位置に移動可能となっている
。また、可動プレート８には、基板２２とノズル１１の
相対高さを計測するため、計測用ロンド１８を持つポテ
ンショメータ１７が昇降用アクチュエータ１９を介して
取付けられている。Can be positioned at any height. Further, these are suspended from an XY child table via a mounting base 2 and a fixing plate 3, and are movable to any xy coordinate position. Further, a potentiometer 17 having a measuring iron 18 is attached to the movable plate 8 via an elevating actuator 19 in order to measure the relative height between the substrate 22 and the nozzle 11.
基板２２の下方には、昇降用アクチュエータ２５に保持
された下部囲い枠２４が設置されており、この下部囲い
枠２４は、内部に基板２２を非接触で加熱する電気ヒー
タのような加熱手段２６を有し、また排気手段として図
示しない排気ポンプに連結された排気ホース２７を具備
している。A lower enclosure frame 24 held by a lifting actuator 25 is installed below the substrate 22, and this lower enclosure frame 24 has heating means 26 such as an electric heater that heats the substrate 22 in a non-contact manner inside. It also includes an exhaust hose 27 connected to an exhaust pump (not shown) as an exhaust means.
以上の構成に基づく本実施例の動作を次に説明する。第
２図、第３図に対象製品を示す。多数のピン２０を有す
る電子部品２１は、基板２２のスルーホール２３に挿入
され、はんだ付けされている。この部品の取りはずしは
、基板を加熱し、はんだを溶かした後、部品を引き抜く
ことにより行うが、その後、新しい部品を挿入するため
には、スルーホール内に残っているはんだを除去しなけ
ればならない。The operation of this embodiment based on the above configuration will be described next. Figures 2 and 3 show the target products. An electronic component 21 having a large number of pins 20 is inserted into a through hole 23 of a board 22 and soldered. Removal of this part is done by heating the board to melt the solder and then pulling out the part, but in order to insert a new part afterwards, the solder remaining in the through hole must be removed. .
そこで、本実施例の装置では、まず第１図に示すように
１位置決めされた基板２２に対して内部に加熱手段２６
を有する下部囲い枠２４を上昇させ、枠の先端に取付け
た密着用部材３０を基板２２の下面に当て気密を保持さ
せた状態で、基板２２の部品を取りはずしたあとの全域
を加熱手段２６により所定の温度に加熱し、スルーホー
ル２３内のはんだを溶融状態とする。次に、第４図（ａ
）、（ｂ）、（ｃ）に示すように、上部囲い枠９ととも
にノズル１１を下降させ、その際、はんだをむらなく除
去するために高さ計測用ロッド１８とポテンショメータ
１７で基板２２とノズル１１の相対高さを計測し、ロッ
ド１８の先端が基板上面に当ってからＬ、−Ｌ１の距離
だけ下降した所定高さＬｌにノズル１１を位置決めする
。このあと、昇降用アクチュエータ１９によってロッド
１８を上昇退避させる。ノズル１１の位置決めと同時に
、第５図に示すように、上部囲い枠９の先端に取付けた
密着用部材２９を基板２２の上面に当て気密を保持させ
る。この状態で、ノズル１１から熱風を吹き出させるこ
とにより、基板２２の所定域外の部分を熱風にさらすこ
となく、また冷たい外気を枠９内にまき込むこともなく
、高圧の熱風によって基板スルーホール２３内の溶融は
んだを下方に吹き飛ばすことができる。それと同時に、
第１図に示す排気ホース２７により、基板２２の下面に
密着した下部囲い枠２４から吸気させる。これにより、
基板スルーホール２３内の溶融はんだの下方への吹き出
しをうながし、はんだ除去効果を向上させるとともに、
溶融はんだの周囲への飛散を防止できる。なお、このと
き、はんだが加熱手段２６に付着することを防ぐため、
必要に応じカバー２８を設置するとよい。Therefore, in the apparatus of this embodiment, as shown in FIG.
The lower enclosing frame 24 having a lower frame 24 is raised, and the sealing member 30 attached to the tip of the frame is applied to the bottom surface of the board 22 to maintain airtightness, and the entire area of the board 22 after the parts are removed is heated by the heating means 26. The solder in the through hole 23 is heated to a predetermined temperature to melt it. Next, Figure 4 (a
), (b), and (c), the nozzle 11 is lowered together with the upper enclosure frame 9, and at that time, the height measuring rod 18 and the potentiometer 17 are used to connect the board 22 and the nozzle in order to remove the solder evenly. 11 is measured, and the nozzle 11 is positioned at a predetermined height Ll that is lowered by a distance L, -L1 after the tip of the rod 18 hits the top surface of the substrate. Thereafter, the rod 18 is raised and retracted by the lifting actuator 19. Simultaneously with the positioning of the nozzle 11, as shown in FIG. 5, a sealing member 29 attached to the tip of the upper enclosure frame 9 is applied to the upper surface of the substrate 22 to maintain airtightness. In this state, by blowing out hot air from the nozzle 11, the parts of the board 22 outside the predetermined area are not exposed to the hot air, and the cold outside air is not drawn into the frame 9. The molten solder inside can be blown downward. At the same time,
Air is sucked in from the lower enclosure frame 24 that is in close contact with the lower surface of the substrate 22 by means of an exhaust hose 27 shown in FIG. This results in
Promoting the downward blowing of the molten solder in the substrate through-hole 23 and improving the solder removal effect,
It can prevent molten solder from scattering around. At this time, in order to prevent the solder from adhering to the heating means 26,
A cover 28 may be installed if necessary.
このようにして、上部囲い枠９内でノズル１１を水平移
動させながら、はんだ除去を行うものであり、ノズル１
１を移動方向と直角方向に幅広く形成することにより、
ノズル１１の１回の移動で、部品を取り外したあとの全
域の基板スルーホール２３から残留はんだを除去するこ
とができる。In this way, solder is removed while the nozzle 11 is moved horizontally within the upper enclosure frame 9, and the nozzle 1
By forming 1 widely in the direction perpendicular to the direction of movement,
With one movement of the nozzle 11, residual solder can be removed from the entire board through-hole 23 after the component is removed.
以上のように本発明によれば、多ピン電子部品の交換に
当り、基板上の広範囲にわたる多数のスルーホール内の
残留はんだを、基板に損傷を与えることなく短時間で除
去できるようになった。これにより、設計変更、製造不
良等で発生する電子部品の交換に容易に対処でき、製造
期間の短縮。As described above, according to the present invention, when replacing a multi-pin electronic component, residual solder in a large number of through holes over a wide area on a board can be removed in a short time without damaging the board. . This makes it easy to replace electronic parts due to design changes, manufacturing defects, etc., and shortens the manufacturing period.
不良基板の救済等の効果が得られる。Effects such as relief of defective boards can be obtained.
第１図は本発明の実施例を示す一部切断した正面図、第
２図は本実施例が対象とする製品の外観斜視図、第３図
は第２図のＡ矢視図、第４図は本実施例のノズル位置決
め動作の説明図、第５図はノズル位置決め後の動作説明
図である。
９・・・上部囲い枠、１１・・・ノズル、１２・・・ノ
ズルスライド用ロープ、１３・・・プーリ、１４・・・
水平駆動用モータ、２２・・・基板、２３・・・スルー
ホール。
２４・・・下部囲い枠、２６・・・加熱手段、２７・・
・排気手段である排気ホース。
こ
第 １ 国Fig. 1 is a partially cutaway front view showing an embodiment of the present invention, Fig. 2 is an external perspective view of a product targeted by this embodiment, Fig. 3 is a view taken in the direction of arrow A in Fig. 2, and Fig. 4 The figure is an explanatory diagram of the nozzle positioning operation of this embodiment, and FIG. 5 is an explanatory diagram of the operation after nozzle positioning. 9... Upper enclosure frame, 11... Nozzle, 12... Rope for nozzle slide, 13... Pulley, 14...
Horizontal drive motor, 22... Board, 23... Through hole. 24... Lower enclosure frame, 26... Heating means, 27...
・Exhaust hose which is an exhaust means. This first country
Claims (1)
）に上方から熱風を吹き付けるノズルと、上記ノズルを
水平移動させる駆動手段と、基板を下方から非接触で加
熱する手段と、基板上面と気密を保ち、上記ノズルをそ
の内部に含み、内部でノズルの移動を可能とする上部囲
い枠と、基板下面と気密を保ち、上記加熱手段をその内
部に含み、かつ排気手段を具備する下部囲い枠とを設け
たことを特徴とする基板スルーホールのはんだ除去装置
。1. A nozzle with a built-in heater blows hot air onto a printed circuit board (hereinafter referred to as a board) from above, a drive means for horizontally moving the nozzle, a means for heating the board from below without contact, and an airtight connection with the top surface of the board. an upper enclosing frame which holds the nozzle therein and allows the nozzle to move therein; a lower enclosing frame which maintains airtightness with the lower surface of the substrate, contains the heating means therein, and is equipped with an exhaust means; A desoldering device for through-holes on a board, characterized in that it is provided with a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63069347A JP2515843B2 (en) | 1988-03-25 | 1988-03-25 | Substrate through-hole desoldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63069347A JP2515843B2 (en) | 1988-03-25 | 1988-03-25 | Substrate through-hole desoldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01243497A true JPH01243497A (en) | 1989-09-28 |
| JP2515843B2 JP2515843B2 (en) | 1996-07-10 |
Family
ID=13399926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63069347A Expired - Lifetime JP2515843B2 (en) | 1988-03-25 | 1988-03-25 | Substrate through-hole desoldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515843B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5402563A (en) * | 1992-08-28 | 1995-04-04 | Hitachi, Ltd. | Apparatus for removing electronic device from printed circuit board |
| JP2007324414A (en) * | 2006-06-01 | 2007-12-13 | Sumitomo Electric Ind Ltd | Method and apparatus of assembling semiconductor laser module |
| CN104400174A (en) * | 2014-10-10 | 2015-03-11 | 中国电子科技集团公司第四十一研究所 | Novel welding device and method for soldering components on ceramic substrate |
| CN109249104A (en) * | 2018-11-01 | 2019-01-22 | 刘慧华 | A kind of automatic brazing device suitable for integrated circuit |
| CN110444487A (en) * | 2019-06-28 | 2019-11-12 | 广东晶科电子股份有限公司 | A kind of repair method of Mini LED module |
| CN111702282A (en) * | 2020-07-13 | 2020-09-25 | 迈普通信技术股份有限公司 | Through hole element unsoldering device, system and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873188A (en) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | Device for automatically removing electronic part from printed board |
| JPS59113971A (en) * | 1982-12-17 | 1984-06-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Device for removing solder |
-
1988
- 1988-03-25 JP JP63069347A patent/JP2515843B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873188A (en) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | Device for automatically removing electronic part from printed board |
| JPS59113971A (en) * | 1982-12-17 | 1984-06-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Device for removing solder |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5402563A (en) * | 1992-08-28 | 1995-04-04 | Hitachi, Ltd. | Apparatus for removing electronic device from printed circuit board |
| JP2007324414A (en) * | 2006-06-01 | 2007-12-13 | Sumitomo Electric Ind Ltd | Method and apparatus of assembling semiconductor laser module |
| CN104400174A (en) * | 2014-10-10 | 2015-03-11 | 中国电子科技集团公司第四十一研究所 | Novel welding device and method for soldering components on ceramic substrate |
| CN109249104A (en) * | 2018-11-01 | 2019-01-22 | 刘慧华 | A kind of automatic brazing device suitable for integrated circuit |
| CN110444487A (en) * | 2019-06-28 | 2019-11-12 | 广东晶科电子股份有限公司 | A kind of repair method of Mini LED module |
| CN111702282A (en) * | 2020-07-13 | 2020-09-25 | 迈普通信技术股份有限公司 | Through hole element unsoldering device, system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515843B2 (en) | 1996-07-10 |
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