KR100657220B1 - Equipment for soldering of printed circuit board - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus for a printed circuit board, wherein a red, yellow, and green light is turned on according to each state when a solder is prepared using solder melted in a lead bath. Impeller to raise the lead to the upper part by the operation of the motor connected to interlock with the green light on, and moving up and down by the power of the pneumatic cylinder formed at the bottom, the conveying work platform with a rectangular hole in the center, It is connected to the pneumatic cylinder and the status indicator to drive the motor and driving the workbench to control the operation, the control unit to control the solder time and the temperature of the lead and display the status through the status indicator, and the upper part of the tank Holes are formed only in the area to be soldered, and lead is introduced into the place to be soldered. Since soldering is done so that only consists of a lead bath consisting jig, since the printed circuit can be soldered to the automatic or semi-automatic pin parts to be inserted on both sides of the substrate, there is an effect that can be applied to the environment, such as solder-free.

Description

Partial Soldering Device for Printed Circuit Boards {EQUIPMENT FOR SOLDERING OF PRINTED CIRCUIT BOARD}

1 is a view schematically showing an example of a conventional general soldering apparatus.

2 and 3 are views illustrating a process in which soldering is performed by a conventional soldering apparatus.

4A to 4C schematically show a local soldering apparatus of a conventional printed circuit board.

5A and 5B are left and right side views, respectively, schematically showing the configuration of a partial soldering apparatus of a printed circuit board according to the present invention;

6 is a view showing a flux mask in a partial soldering apparatus of a printed circuit board according to an embodiment of the present invention.

7A to 7C are cross-sectional views of a flux mask taken along lines A-A ', B-B', and C-C 'of FIG. 6, respectively.

8 is a perspective view showing in more detail the jig according to an embodiment of the present invention.

9A and 9C are cross-sectional views illustrating cross-sections of jigs taken along lines A-A ', B-B', and C-C 'of FIG. 8, respectively.

10 is a block diagram showing a configuration of a control unit of a partial soldering apparatus of a printed circuit board according to an embodiment of the present invention.

<Brief description of symbols for the main parts of the drawings>

510: status indicator 520: control unit

521: temperature sensor 522: detection sensor

523: input panel 524: timer

525: Micom 530: motor

532 power transmission unit 534 impeller

536: Delivery 538: Taxation

539 protective case 540 pneumatic cylinder

542: heating rod 544: transfer work platform

546: frame 550: lead tank jig

560 flux mask

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus for a printed circuit board, and in particular, to configure a jig for fixing a printed circuit board, and to partially mount parts having a surface mounted on the printed circuit board or a terminal inserted therein while being fixed by the jig. A partial soldering apparatus for a printed circuit board capable of soldering only necessary portions.

In general, a plurality of terminals are inserted into a printed circuit board used in various electronic components, or these terminals are fixed to the printed circuit board using a soldering apparatus after surface mounting.

Figure 1 schematically shows an example of a conventional general soldering apparatus. Conventional conventional soldering apparatus, as shown in Figure 1, the solder tank 10 containing the molten lead solution, the nozzle 100 for ejecting the molten lead 11 in the solder tank toward the printed circuit board and It is made of an impeller (Impeller, 300) for supplying the molten lead 11 to the nozzle.

In the above apparatus, the printed circuit board 40 is mounted on a pallet 200 and moved by a conveyor 300, and when the printed circuit board is at a predetermined position, lead is delivered through the nozzle 100. It is ejected and soldered.

Hereinafter, a process of soldering by the conventional soldering apparatus will be described with reference to FIGS. 2 and 3.

First, when a terminal is inserted only on one side of a printed circuit board, as shown in FIG. 2, only the terminal 50 that needs to be soldered is left, and other portions are shielded by the pallet 200 and soldered. Since the pallet 200 is made of glass epoxy and serves as a solder resistor during the soldering process, only the terminals required by the molten lead 11 ejected from the nozzle 100 are soldered. You can do it.

However, according to the conventional soldering method, since the molten lead 11 is sprayed on the entire printed circuit board through the nozzle, other parts of the printed circuit board except for the terminal requiring soldering are shielded with the pallet 200. There is this.

In addition, when terminals are inserted at both sides of the printed circuit board, as shown in FIG. 3, one side must be soldered first, and then the other side of the printed circuit board must be soldered. At this time, in order to protect the pre-soldered terminal portion from the injection of the molten lead 11, a pallet 200 having a complicated shape must be used, and even if it is sealed with the pallet 200, it is difficult to completely seal the molten lead 11 ) Penetrates not only the terminal part requiring soldering but also other parts, and as a result, soldering quality deteriorates.

The printed circuit board is a part where the female terminal of the printed circuit board, the male terminal of the counterpart and the female terminal of the counterpart of the male terminal of the printed circuit board are electrically connected to each other. Therefore, soldering of each terminal should be made uniform. There should be no molten lead in the part of. However, the soldering apparatus described above has a problem in that soldering is uneven and molten lead is left in portions other than the terminals, thereby degrading the quality of the printed circuit board.

There has been proposed a local soldering device for locally soldering only the terminal parts necessary to solve the above problems. As an example, a soldering iron tip and a lead supply device having the same structure as the soldering iron is mounted on the automation equipment to X and Y axes. A device can be soldered onto a moving worktable.

The local soldering device has the advantage of local soldering only necessary terminal portion, but in order to solder the automotive connection terminal flowing about 10 amps or more on the power printed circuit board, heat transfer takes a long time, so-called There is a problem that the cold solder phenomenon occurs. In addition, after soldering one side of the printed circuit board, and the soldering in the state in which the printed circuit board is turned upside down, there is a problem that lead is buried in the terminal surface through the insertion hole of the terminal.

On the other hand, as another local soldering apparatus, a local soldering apparatus is known which controls the height of solder and the soldering time, etc. through a controller and mounts a printed circuit board on a table and automatically moves to a portion to be soldered. The device is an automated product of a table solder device developed for local soldering and correction and removal of local soldering portions.

However, in the above local soldering apparatus, when a plurality of terminals are provided at minute intervals of less than 3 mm between the terminals, it is difficult to solder them uniformly so that the terminals do not touch each other. That is, lead must be buried in a terminal protruding in the same direction as a soldering portion where soldering is not desired, and in particular, when the spacing between the terminals is small, the lead may be buried in the terminal due to the flow of lead from the lead ejecting portion. There was a problem that became more serious.

Figure 4 is a schematic view of a local soldering apparatus of a conventional printed circuit board, Figure 4a is a perspective view showing before the soldering, Figure 4b is a perspective view showing a state that the soldering is done, Figure 4c is a soldering It is a perspective view which shows after this was done.

Referring to Figures 4a to 4c, such a device has the advantage of being able to solder locally cleanly on both sides, but the speed is very slow because the soldering place must be processed by one terminal, and the terminal protrudes There is a problem that can only be done in one place.

The present invention has been proposed to solve the above-mentioned problems of the prior art, and provides a partial soldering apparatus for a printed circuit board capable of automatically or semi-automatically processing pins of a component inserted into both sides of the printed circuit board. There is a purpose.

Still another object of the present invention is to work on batches of soldering mounting pins of a printed circuit board in parts which are impossible by hand, and automatically transfer the soldered printed circuit board by a program of a control unit after soldering. It is to provide a partial soldering device of a printed circuit board.

It is still another object of the present invention to provide a soldering apparatus for a printed circuit board having a solder bath and a heat insulating material on the outside and the inside of a protection tank for supporting a bath and a bath for supporting a bath.

It is still another object of the present invention to provide a partial soldering apparatus for a printed circuit board configured to selectively apply flux only to a portion to be soldered by constructing a jig-like screen and fluxing through the screen. will be.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial soldering apparatus for a printed circuit board, wherein a red, yellow, and green light is turned on according to each state when a solder is prepared using solder melted in a lead bath. Impeller to raise the lead to the upper part by the operation of the motor connected to interlock with the green light on, and moving up and down by the power of the pneumatic cylinder formed at the bottom, the conveying work platform with a rectangular hole in the center, It is connected to the pneumatic cylinder and the status indicator to drive the motor and driving the workbench to control the operation, the control unit to control the solder time and the temperature of the lead and display the status through the status indicator, and the upper part of the tank Holes are formed only in the area to be soldered, and lead is introduced into the place to be soldered. Only consists of a lead bath jig adapted to soldering takes place.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the configuration of the present invention.

5A and 5B are left and right side views, respectively, schematically showing the configuration of a partial soldering apparatus of a printed circuit board according to the present invention;

Referring to FIGS. 5A and 5B, first, lead is melted in a tub 538. A plurality of rod-shaped heating rods 542 are formed inside the tub 538 inside. The heating rod 542 generates heat by electric resistance, and the generated heat is used to melt lead. On the other hand, the red light 512 of the status indicator 510 is turned on in the state before the lead stored in the lead tank 538 is melted. The status indicator 510 includes a red light 512, a yellow light 514, and a green light 516.

On the other hand, the controller 520 for controlling the driving and soldering of the motor 530 is connected to the motor 530 for driving the impeller 534 and the pneumatic cylinder 540 for driving the transfer work table 544 to control the operation. . In addition, the control unit 520 is also connected to the status indicator 510, the red light 512, the yellow light 514 to the status light 510, respectively, according to the state of the delivery 536 stored in the tub 538. Or control the green light 516 to be turned on. The controller 520 will be described in more detail with reference to FIG. 10 below.

The transfer work table 544 moves up and down by the power of the pneumatic cylinder 540 installed at the lower portion thereof, and a rectangular hole is formed in the center portion thereof to contain the lead bath jig 550. When soldering is lowered to the position where the solder tank jig 550 is installed, when the soldering is completed, the printed circuit board is separated from the solder tank jig 550 and raised to the top.

On the other hand, when the temperature of the lead stored in the lead bath 538 by the heating rod 542 rises, and the lead is melted to lead the lead 536 of a temperature suitable for soldering, work preparation is completed. When the work preparation is completed, the status indicator 510 is turned on amber 514.

In addition, when soldering is started with the appropriate amount of lead 536 contained in the lead bath 538 at a suitable temperature, the status indicator 510 is turned on with a green light 516.

When soldering is started, an impeller 534 configured under the brazing jig 550 inside the brazing tank 538 is driven by a motor 530 outside the brazing tank 538 and connected to the motor 530. Is driven. The lead 536 is introduced into the printed circuit board fixed to the lead tank jig 550 by the driving of the impeller 534.

The lead 536 is introduced into the inside of the lead bath jig 550 formed only in the portion to be soldered, and the solder is partially soldered only to the desired portion of the printed circuit board. At this time, the flux is applied only to the soldered portion of the printed circuit board before soldering as described in FIG.

On the other hand, if the lead 536 is insufficient, the control unit 520 recognizes the same state as the state that the lead is not dissolved in the status indicator 510, so that the red light 512 of the status indicator 510 is turned on do.

The lower and side surfaces of the tub 538 are provided with a protective case 539 for protecting the tub 538 and preventing heat from leaking to the outside. The protective case 539 is configured to surround the tub 538 on the outside of the tub 539, the body is composed of a heat insulator or a helibon so that the heat of the tub is not transmitted to the outside.

In addition, soldering apparatuses such as the lead bath 536, the protective case 539, the status indicator 510, the motor 530, and the like are supported by the frame 546. In addition, the frame 546 is composed of four legs, and the end of each leg is provided with wheels in contact with the ground is configured to move easily. In addition, each wheel is provided with a brake is configured to be easy to control the fixing and movement.

6 is a view illustrating a flux mask in a partial soldering apparatus of a printed circuit board according to an exemplary embodiment of the present invention. 7A to 7C are cross-sectional views illustrating a flux mask taken along lines A-A ', B-B', and C-C 'of FIG. 6, respectively.

6 to 7C, the flux mask 560 has a flux hole 564 formed in a portion to be soldered, and a part to be soldered in the parts of the printed circuit board inside the flux hole 564. I can receive it. In addition, a groove 562 is formed in a portion where the flux is not painted in accordance with the shape of the printed circuit board to accommodate the printed circuit board.

When the flux is applied while the printed circuit board is stored in the flux mask 560, the flux is painted only in the part accommodated in the flux hole 564, and the part stored in the groove 562 and the part except the flux hole 564 are The flux remains unpainted.

At this time, the flux hole 564 may be configured to have a different size of the flux hole 564 according to the size of the component to be soldered and the size of the region to be soldered.

In addition, if the flux mask 560 is applied to the flux after storing a plurality of printed circuit boards, the process can be further shortened, so that two or more identical patterns are formed and multiple printing thereon to process multiple substrates at once. It is configured to be able to paint flux with the circuit board on.

8 is a perspective view showing in more detail the jig according to an embodiment of the present invention. 9A and 9C are cross-sectional views illustrating cross-sections of jigs taken along lines A-A ', B-B', and C-C 'of FIG. 8, respectively.

8 to 9C, a plurality of holes are drilled in the lead bath jig 550. The lead bath jig 550 is similar to the flux mask 560 of FIG. 6 described above. This is because it is applied to the same printed circuit board. However, the flux mask 560 is larger than the solder hole 554 formed in the lead bath jig 550 because the flux mask 560 needs to be applied to the soldering place. The solder hole 554 formed in the lead bath jig 550 has to be soldered precisely, so that it is as small as the soldering area. In addition, the solder tank jig 550 is fixed to the upper portion of the inner side of the tank, but the flux mask 560 is configured separately.

On the other hand, the solder hole 554 of the lead bath jig 550 is a portion to be soldered to the printed circuit board and components. When the lead 536 is raised to the solder hole 554, the lead 536 is soldered to the corresponding part of the printed circuit board. In addition, the extra lead 536 is discharged through the lead jet groove 558 formed across the lead bath jig 550 to the left and right of the solder hole 554. The lead 536 does not remain on the lead tank jig 550.

The component storage groove 556 accommodates the components on the printed circuit board, but the components accommodated in the component storage groove 556 formed in the groove shape only on the upper part because the lead 536 in the tub 538 cannot pass. Alternatively, the terminal is not soldered, and the printed circuit board is also fixed because the parts accommodated in the printed circuit board are fixed to the solder holes 554 of the lead bath jig 538.

The frame 546, the pneumatic cylinder 540, the motor 530, the control unit 520, etc. are configured in one set, while the lead bath jig 550 has to change its shape according to the shape of the printed circuit board. It was configured to be removable.

In addition, the control unit 520 is configured not to operate in a state that is not preheated, and also to warn it when overheating.

In addition, the conveying work table 544 is configured to be moved up and down by the pneumatic cylinder 540 that obtains power by using the pressure of the air, and during the operation to cover the upper portion of the lead bath 538 that the lead water splashes to the outside It also serves to prevent.

10 is a block diagram illustrating a configuration of a control unit of a partial soldering apparatus of a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 10, the microcomputer 525 includes a program for maintaining an optimal soldering condition by an automatic sensing system, and operates the motor 530 and the pneumatic cylinder 540 by the operation of this program. Operate each impeller 534 and transfer platform 544 connected to it.

In addition, the microcomputer 525 is connected to the temperature sensor 521 and the sensor 522 having heat resistance configured on one side of the inner side of the tub 538. The temperature sensor 521 measures the temperature of the lead. The microcomputer 525 receives the temperature value measured by the temperature sensor 521 and warns that the temperature value is low and that the red light 512 of the status indicator 510 is not suitable for soldering when the temperature value is low and overheating. can do. The detection sensor 522 detects the pressure generated by the lead 536, and when the lead 536 is insufficient, the pressure generated by the lead 536 drops and detects this to generate a warning signal. Then, the microcomputer 525 receives the warning signal from the sensor 522 and recognizes that the delivery item 536 is insufficient, and emits the red light 512 of the status indicator 510.

In addition, the microcomputer 525 is connected to the timer 524 to control the soldering time and the like according to the control of the soldering program configured in the microcomputer 525. That is, when exposed to high temperature for too long time, a failure may occur in the components attached to the printed circuit board, so that the time exposed to the lead 536 can be exposed only for a certain time.

The pneumatic cylinder 540 is controlled by the microcomputer 525 by the force of vacuum to automatically transfer the printed circuit board placed on the lead bath jig 538 and the transfer work table 544 after soldering. At this time, if the conveying work table 542 is raised upward, the printed circuit board moves together with the conveying work table 542, and is separated from the lead tank jig 538.

On the other hand, the input panel 523 is an external panel which allows an operator or an operator of the soldering machine to operate the soldering machine by setting the power supply of the soldering machine, the motor on / off, the heating temperature and the soldering time.

The present invention can automatically or semi-automatically solder the pins of the components inserted into both sides of the printed circuit board, there is an effect that can be applied to the environment, such as solder-free.

In addition, since the present invention solves the manual soldering problem of manpower and work automatically, it is possible to perform a quick soldering process by allowing the manual mounting of the soldering mounting pins of the printed circuit board at the time of soldering. In addition, there is an effect that can prevent workers from being injured by the heated lead.

In addition, the present invention has the effect of preventing the burn of the worker by configuring the outside and the inside of the protective casing for supporting the tub and the lead tank with a helibon and heat insulating material so that the heat of the upper tub is hardly transmitted to the lower protective case. .

In addition, the present invention constitutes a screen shaped like a lead bath jig, and by fluxing through the screen, the flux can be selectively coated only on the soldered part, so that the flux does not get on the pre-loaded part or the part that does not need soldering. There is an effect that can be soldered effectively.

In addition, the present invention is to automatically transfer the printed circuit board soldered by the program of the control unit after the soldering process and automatically processing a large portion has the effect of requiring less manpower protection and manpower.

Claims (8)

In a partial soldering apparatus of a printed circuit board in which lead is melted using a heating rod 542 formed in a lead bath 538 for accommodating lead 536, and soldered using the melted lead 536. When preparing for soldering using the lead 536 melted in the lead bath 538, a status light configured to turn on a red light 512, a yellow light 514, and a green light 516 according to each state. 510; An impeller 534 which is connected to interlock with the motor 530 in a state where soldering is prepared, and raises the lead 536 by the operation of the motor 530; A transfer worktable 544 which moves up and down by the power of the pneumatic cylinder 540 formed in the lower portion, and has a rectangular hole in the center portion thereof; It is connected to the pneumatic cylinder 540 for driving the impeller 534 and the pneumatic cylinder 540 for driving the conveying work table 544 and the status indicator 510 to control the operation, the solder time and the lead ( A control unit 520 for controlling the temperature of 536 and displaying a state through the state indicator 510; The lead bath jig 550 is formed on the upper part of the solder tank 538, the hole is formed only in the portion to be soldered, and the solder 536 is introduced into the soldering portion to partially solder only the desired portion of the printed circuit board. Wow; It is configured separately from the soldering apparatus to apply the flux which is applied to make the lead adhere well before soldering the printed circuit board, and a flux hole 564 is drilled in the portion to be soldered, and the Partial soldering apparatus of a printed circuit board comprising a flux mask (560) configured to accommodate a part to be soldered, etc. of the components of the printed circuit board inside. delete The method of claim 1, The flux mask 560 is configured to configure the two or more same patterns to process the plurality of printed circuit boards at once, and to print the flux in a state in which a plurality of printed circuit boards are placed thereon Partial soldering device on a circuit board. The method of claim 1, When the lead 536 of the tub 538 is insufficient, the controller 520 causes the red light 512 to light up in the status indicator 510, and the lead stored in the tub 538. The red light 512 is turned on in the status indicator 510 in the state before melting, and the red light is turned on in the red light 512 of the status indicator 510 when the lead 536 is overheated. When the temperature of the lead stored in the lead bath 538 by the heating rod 542 rises, and the lead is melted and becomes a lead 536 of a temperature suitable for soldering, when the work is completed, the status indicator 510 Yellow light (514) is turned on, the green light is turned on when the motor (530) is started and the solder is started. The method of claim 1, The solder tank 538 is configured to surround the lower side and the lower portion, and further comprising a protective case 539 composed of an insulation or a helibon to protect the solder tank 538 and prevent heat from leaking to the outside. Partial soldering device on a circuit board. The method of claim 1, The lead tank jig 550, The soldering portion 554 of the printed circuit board and the component is placed, and the solder 536 rises and rises so that the solder 536 can be soldered to the soldering position of the printed circuit board. )and; The excess lead 536 remaining after the soldering of the printed circuit board is formed across the lead jig 550 to the left and right of the solder hole 554 and configured to discharge the lead 536. )and; Since the parts on the printed circuit board are accommodated and the lead 536 in the lead bath 538 cannot pass, the parts or the terminals accommodated in the part receiving groove 556 formed in the groove shape only on the upper part are not soldered. Partial soldering device of a printed circuit board, characterized in that consisting of a component receiving groove 556 configured so as not to. The method of claim 5, Supporting the lead tank 536, the protective case 539, the status indicator 510, the motor 530, four legs are configured, the end of each of the legs wheels in contact with the ground Is installed is configured to be convenient to move, each wheel is part of the soldering device of the printed circuit board, characterized in that it further comprises a frame (546) configured to control the fixing and movement is installed brake. The method of claim 1, The control unit 520, A temperature sensor 521 configured on one side of the inner side of the lead bath 538 and having heat resistance and measuring a temperature of the lead 536; A sensing sensor 522 configured at one side of the inside of the tub 538, having heat resistance, and sensing a pressure of the lead 536; An input panel 523 which is an external panel which can operate the soldering machine by setting the power of the soldering device on and off, the motor 530 on and off, a heating temperature and a soldering time; A timer 524 for counting time; Receives a temperature value measured by the temperature sensor 521 and warns that the temperature value is low and that the red light 512 of the status indicator 510 is not suitable for soldering when the temperature value is low and overheating. When receiving the pressure value from the sensor 522, if the lead 536 is determined to be insufficient, the red light 512 of the status indicator 510 to emit light, connected to the timer 524 to control the soldering time Partial soldering apparatus of a printed circuit board, characterized in that consisting of a microcomputer (525).

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