JP2007096088A - Device and method for replacing electronic component - Google Patents

Device and method for replacing electronic component Download PDF

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Publication number
JP2007096088A
JP2007096088A JP2005285004A JP2005285004A JP2007096088A JP 2007096088 A JP2007096088 A JP 2007096088A JP 2005285004 A JP2005285004 A JP 2005285004A JP 2005285004 A JP2005285004 A JP 2005285004A JP 2007096088 A JP2007096088 A JP 2007096088A
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electronic component
circuit board
heat shield
hot air
shield cover
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Masaru Saito
優 斉藤
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NEC Electronics Corp
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NEC Electronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for replacing an electronic component that are adaptive to both a small component to be replaced and high-density mounting. <P>SOLUTION: The device 100 for replacing the electronic component comprises a heating nozzle 6 which jets a hot blast 7 to the electronic component 2 to be replaced which is mounted on a circuit board 1, a suction nozzle 5 which sucks the electronic component 2 to be replaced, and a heat shielding cover 4 which covers the top and flank of a peripheral electronic component 3 fitted onto a peripheral circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は電子部品を実装した回路基板より、電子部品を取り外して交換する電子部品交換装置および電子部品交換方法に関し、特に高密度に実装された回路基板の電子部品を交換する電子部品交換装置および電子部品交換方法に関する。   The present invention relates to an electronic component replacement apparatus and an electronic component replacement method for removing and replacing an electronic component from a circuit board on which the electronic component is mounted, and more particularly, to an electronic component replacement apparatus for replacing electronic components on a circuit board mounted at a high density, and The present invention relates to an electronic component replacement method.

電子機器の高機能化に伴い、半導体デバイスの多くは回路基板の表面に直接はんだ付けする表面実装技術によって実装されている。特に、高密度に実装する場合はＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）と呼ばれる外部接続端子がパッケージの下側に配置されたタイプの半導体デバイスが用いられるようになってきた。このような半導体デバイスを回路基板上に複数実装した場合、半導体デバイス自体の不具合や実装時の不良によってこれらの半導体デバイスを交換する必要が生じる。その際、BGAタイプの半導体デバイスの交換では外部接続端子がパッケージの下側に配置されており外部接続端子のみを加熱することが出来ない。このためパッケージ全体を加熱することで外部接続端子部のはんだを溶融して交換する方法が一般的に行われている。多くの場合、回路基板には既に幾つもの回路部品が実装されており、これらの部品に過剰な熱が加わると破損したり、またはんだ接合部が溶融することで接合不良を引き起こしたりするため交換対象部品のみを加熱する工法が望まれていた。   As electronic devices become more sophisticated, many semiconductor devices are mounted by surface mounting technology that directly solders to the surface of a circuit board. In particular, when mounting at high density, a semiconductor device of a type in which external connection terminals called BGA (Ball Grid Array) are arranged on the lower side of a package has been used. When a plurality of such semiconductor devices are mounted on a circuit board, it is necessary to replace these semiconductor devices due to defects in the semiconductor device itself or defects during mounting. At that time, in the replacement of the BGA type semiconductor device, the external connection terminals are arranged on the lower side of the package, and it is not possible to heat only the external connection terminals. For this reason, a method of melting and replacing the solder of the external connection terminal portion by heating the entire package is generally performed. In many cases, many circuit components are already mounted on the circuit board. If excessive heat is applied to these components, they will be damaged, or the soldered joint will melt and cause defective bonding. A construction method for heating only the target part has been desired.

このような電子部品の交換装置としては、従来、例えば、図４に示すようなものがあった。   Conventionally, there has been an electronic component replacement apparatus as shown in FIG. 4, for example.

図４の電子部品交換装置２００は、交換対象部品２２を加熱するための熱風を噴出す加熱用ノズル２６と、交換対象部品を吸着する吸着ノズル２５と、加熱用ノズル２６から排出される熱風２７を遮断する遮熱カバー２４とを有している。遮熱カバー２４の先端には、熱風を遮熱カバー内から外に排気するための排気口３０が設けられている。さらに、排気口３０には、排気した熱風が、周辺部品２３に直接当たるのを防ぐためのフィン２９を設けている。   The electronic component replacement apparatus 200 of FIG. 4 includes a heating nozzle 26 that ejects hot air for heating the replacement target component 22, an adsorption nozzle 25 that sucks the replacement target component, and hot air 27 discharged from the heating nozzle 26. And a heat shield cover 24 for shutting off the heat. An exhaust port 30 is provided at the tip of the heat shield cover 24 for exhausting hot air from the heat shield cover to the outside. Further, the exhaust port 30 is provided with fins 29 for preventing the exhausted hot air from directly hitting the peripheral component 23.

次に電子部品交換装置２００を用いた電子部品の交換方法について説明する。   Next, an electronic component replacement method using the electronic component replacement apparatus 200 will be described.

まず、交換対象部品（例えば、半導体デバイス）２２を囲むように、回路基板２１上に遮熱カバー２４を設ける。     First, a heat insulating cover 24 is provided on the circuit board 21 so as to surround the replacement target component (for example, a semiconductor device) 22.

次に、加熱用ノズル２６から、熱風２７を交換対象部品２２に吹き付けて、交換対象部品２２と回路基板２１とを接続している半田などを溶融する。このときに、加熱用ノズル２７から排出される熱風２７は、排気口３０に設けられているフィン２９によって、周辺部品（例えば、半導体デバイス）２３に直接当たらないようになっているので、周辺部品２３に過剰な熱が加わらない構成になっている。   Next, hot air 27 is blown from the heating nozzle 26 to the replacement target component 22 to melt the solder or the like connecting the replacement target component 22 and the circuit board 21. At this time, the hot air 27 discharged from the heating nozzle 27 is prevented from directly hitting the peripheral component (for example, the semiconductor device) 23 by the fins 29 provided in the exhaust port 30. 23 is configured such that excessive heat is not applied.

次に、吸着ノズル２５によって、交換対象部品２２を吸着して、交換対象部品２２を回路基板２１から取り外す。   Next, the replacement target part 22 is sucked by the suction nozzle 25 and the replacement target part 22 is removed from the circuit board 21.

このような構成の半導体デバイスの交換装置が、特許文献1（特開平１１−３１２８６５号公報）に示されている。   A semiconductor device exchanging apparatus having such a configuration is shown in Patent Document 1 (Japanese Patent Laid-Open No. 11-31865).

特開平１１−３１２８６５号公報Japanese Patent Laid-Open No. 11-312865

図４に示された電子部品交換装置では、遮熱カバー２４の中に加熱用ノズルを収めているので、遮熱カバー２４を小さくすることが困難であり、交換対象部品（図４では交換対象の半導体デバイス２２に相当）が小さい場合には、対応が難しいといった問題があった。   In the electronic component replacement apparatus shown in FIG. 4, since the heating nozzle is housed in the heat shield cover 24, it is difficult to make the heat shield cover 24 small. In the case of a small semiconductor device 22), it is difficult to cope with the problem.

また、排気した熱風が周辺部品２３に直接当たるのを防ぐ目的で遮熱カバー先端の排気口３０にフィン２９を設けているため、遮熱カバーの厚さが一定以上必要になり、遮熱カバーを配置する面積を確保するために、交換対象の電子部品２２と周辺部品２３との間隔をある程度以上狭くできないという問題もあった。   In addition, since the fin 29 is provided at the exhaust port 30 at the tip of the heat shield cover for the purpose of preventing the exhausted hot air from directly hitting the peripheral component 23, the heat shield cover needs to have a certain thickness or more. In order to secure an area for arranging the components, there is a problem that the interval between the electronic component 22 to be replaced and the peripheral component 23 cannot be narrowed to some extent.

上述した課題を鑑みて、本発明によれば、回路基板上に取り付けられた第１の電子部品、すなわち、交換対象用の電子部品に熱風を吹き付ける加熱用熱風供給部と、回路基板上に取り付けられた第２の電子部品、すなわち周辺の電子部品を覆うように設けられ、前記加熱用ノズルから排出される熱風を遮断する遮熱カバーと、を含み、遮熱カバーが、第２の電子部品の上面を覆う第1の部分と、前記第２の電子部品の側面を覆う第2の部分と、を含む構成となっている電子部品交換用装置が提供される。   In view of the above-described problems, according to the present invention, the first electronic component mounted on the circuit board, that is, the hot air supply unit for heating that blows hot air on the electronic component for replacement, and the circuit board are mounted. A second heat-shielding cover, which is provided so as to cover the second electronic component, that is, the surrounding electronic component, and blocks the hot air discharged from the heating nozzle. There is provided an electronic component replacement device configured to include a first portion that covers the upper surface of the second electronic component and a second portion that covers the side surface of the second electronic component.

また、本発明によれば、回路基板に取り付けられている電子部品の中から、交換対象となる第１の電子部品を特定する工程と、回路基板に取り付けられている第２の電子部品、すなわち周辺の部品の上部および側面を遮熱カバーで覆う工程と、前記第１の電子部品に加熱用熱風供給部で熱風を吹き付ける工程と、第１の電子部品を回路基板から除去する工程と、を含む電子部品交換方法が提供される。   According to the present invention, the step of identifying the first electronic component to be replaced from the electronic components attached to the circuit board, and the second electronic component attached to the circuit board, that is, A step of covering the upper and side surfaces of peripheral components with a heat insulating cover, a step of blowing hot air to the first electronic component with a hot air supply unit for heating, and a step of removing the first electronic component from the circuit board. An electronic component replacement method is provided.

本発明によれば、遮熱カバーを、周辺部品（第２の電子部品）の上部および側面を覆うように設けたので、交換対象の半導体デバイス（第１の電子部品）が小さい場合でも、対応することができる。   According to the present invention, since the heat insulating cover is provided so as to cover the upper part and the side surface of the peripheral component (second electronic component), even when the semiconductor device to be replaced (first electronic component) is small, it is possible to cope with it. can do.

また、この構成によって、遮熱カバーにフィンを設ける必要がなくなったので、遮熱カバーを薄くすることができ、交換対象の半導体デバイスと周辺部品との間隔を狭くできるので、高密度実装品にも対応することができる。   In addition, this configuration eliminates the need to provide fins in the heat shield cover, so the heat shield cover can be made thinner and the distance between the semiconductor device to be replaced and the peripheral components can be narrowed. Can also respond.

さらに、この構成によって、遮熱カバーに排気口およびフィンを設ける必要がなくなるので、従来の半導体デバイスの交換装置と比較して構造が簡単になり、半導体デバイスの交換装置の製造コストを低減できる。   Furthermore, this configuration eliminates the need to provide an exhaust port and fins in the heat shield cover, so that the structure is simpler than that of a conventional semiconductor device exchanging apparatus, and the manufacturing cost of the semiconductor device exchanging apparatus can be reduced.

本発明によれば、交換対象部品が小さい場合でも対応できるとともに、高密度実装品にも対応することができる。   According to the present invention, it is possible to cope with a case where a part to be replaced is small, and it is also possible to cope with a high-density mounted product.

以下、本発明の実施の形態について図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第１の実施形態First embodiment

図１および図２は、本発明の第１の実施形態を示すための図である。   1 and 2 are diagrams for illustrating a first embodiment of the present invention.

図１を参照すると、本発明の第１の実施形態の電子部品交換装置１００は、回路基板１上に実装されている交換対象の電子部品（第１の電子部品、例えば半導体デバイス）２に熱風７を噴射する加熱用ノズル６（熱風供給部）と、交換対象の電子部品２を吸着する吸着ノズル５と、交換対象の電子部品２に周辺の回路基板上に取り付けられた周辺の電子部品（第２の電子部品、例えば半導体デバイス）３の上部および側面を覆う遮熱カバー４とからなる。   Referring to FIG. 1, an electronic component replacement apparatus 100 according to a first embodiment of the present invention applies hot air to an electronic component (first electronic component, for example, a semiconductor device) 2 to be replaced mounted on a circuit board 1. Heating nozzle 6 (hot air supply unit) for injecting 7, suction nozzle 5 for sucking the electronic component 2 to be replaced, and peripheral electronic components (on the peripheral circuit board attached to the electronic component 2 to be replaced) And a heat insulating cover 4 covering the upper and side surfaces of the second electronic component (for example, a semiconductor device) 3.

なお、交換対象の電子部品２は、交換対象の電子部品２に設けられた外部接続端子８によって回路基板１に実装されている。   The electronic component 2 to be replaced is mounted on the circuit board 1 by the external connection terminal 8 provided on the electronic component 2 to be replaced.

図２は、図１の電子部品の交換装置１００および回路基板１を上面から見た図であり、図２より、遮熱カバー４が周辺の電子部品３を取り囲むように設けられていることがわかる。なお、図１は、図２のＡ−Ａ’断面図に相当している。   FIG. 2 is a view of the electronic component replacement device 100 and the circuit board 1 of FIG. 1 as viewed from above. From FIG. 2, the heat shield cover 4 is provided so as to surround the peripheral electronic component 3. Recognize. 1 corresponds to a cross-sectional view taken along the line A-A ′ of FIG. 2.

また、図１および図２において、周辺の電子部品３は１つしか示されていないが、周辺の電子部品３が複数設けられていてもよい。さらに、周辺の電子部品３が複数設けられている場合には、遮熱カバー４は、周辺の電子部品３のそれぞれを覆うように複数設けられていてもよいし、複数の周辺の電子部品３を一括して覆うように設けられていてもよい。   1 and 2, only one peripheral electronic component 3 is shown, but a plurality of peripheral electronic components 3 may be provided. Further, when a plurality of peripheral electronic components 3 are provided, a plurality of the heat shielding covers 4 may be provided so as to cover each of the peripheral electronic components 3, or a plurality of peripheral electronic components 3 may be provided. May be provided so as to cover all together.

また、図１および図２において、２つの加熱用ノズル６が設けられているが、加熱用ノズル６の数は、必要に応じて増やしてもよし、減らしてもよい。   1 and 2, two heating nozzles 6 are provided, but the number of heating nozzles 6 may be increased or decreased as necessary.

次に上述した半導体デバイスの交換装置１００を用いて、回路基板１上に実装されている交換対象の電子部品２を取り外す方法について説明する。   Next, a method of removing the electronic component 2 to be exchanged mounted on the circuit board 1 using the semiconductor device exchange apparatus 100 described above will be described.

まず、遮熱カバー４を周辺の電子部品３の上部および側面を覆うように、回路基板１に取り付ける。   First, the heat insulating cover 4 is attached to the circuit board 1 so as to cover the upper and side surfaces of the peripheral electronic component 3.

次に、交換対象の電子部品２の上部に設けられた加熱用ノズル６より熱風７を噴出させ、交換対象の電子部品２を加熱する。このときに、周辺の電子部品３の上部および側面は、遮熱カバー４で覆われているので、過剰な熱が加わることがない。なお、熱風７の温度は、交換対象の電子部品２と回路基板１との接続している外部接続端子８を溶融させるのに必要な温度以上であることが好ましい。   Next, hot air 7 is ejected from the heating nozzle 6 provided on the upper part of the electronic component 2 to be replaced, and the electronic component 2 to be replaced is heated. At this time, the upper and side surfaces of the peripheral electronic component 3 are covered with the heat shield cover 4, so that excessive heat is not applied. The temperature of the hot air 7 is preferably equal to or higher than the temperature necessary for melting the external connection terminal 8 connected to the electronic component 2 to be replaced and the circuit board 1.

次に、交換対象の電子部品２と回路基板１とを接続している外部接続端子８が溶融したら、吸着ノズル5を用いて交換対象の電子部品２を吸着し、回路基板１より引き剥がす。
なお、吸着ノズル5を用いずに、作業者がピンセットなどの治具を用いて交換対象の電子部品２を回路基板１から引き剥がしてもよい。 Next, when the external connection terminal 8 connecting the electronic component 2 to be replaced and the circuit board 1 is melted, the electronic component 2 to be replaced is sucked using the suction nozzle 5 and is peeled off from the circuit board 1.
Instead of using the suction nozzle 5, an operator may peel off the electronic component 2 to be replaced from the circuit board 1 using a jig such as tweezers.

本実施形態では、熱風を遮断する遮熱カバー４は、吸着ノズル５および加熱用ノズル６を収容する必要がなく、遮熱カバーは、周辺の電子部品３に合わせて作られるため、交換対象の電子部品２が小さい場合にも対応可能である。   In the present embodiment, the heat shield cover 4 that blocks the hot air does not need to accommodate the suction nozzle 5 and the heating nozzle 6, and the heat shield cover is made in accordance with the surrounding electronic components 3, so It is possible to cope with the case where the electronic component 2 is small.

また、本実施形態では、遮熱カバー４は周辺の電子部品３を覆う構造とすればよいため、遮熱カバー４の交換対象の電子部品２と接する側面部を薄くすることが可能となり、遮熱カバーを配置する面積を確保するために、交換対象の半導体デバイス２と周辺の電子部品３との間隔を広くとる必要がなくなる。これにより、高密度実装品への対応が可能になる。   In the present embodiment, the heat shield cover 4 only needs to have a structure that covers the surrounding electronic components 3, so that the side surface portion of the heat shield cover 4 that is in contact with the electronic component 2 to be replaced can be thinned. In order to secure an area for arranging the heat cover, it is not necessary to widen the distance between the semiconductor device 2 to be replaced and the peripheral electronic component 3. Thereby, it becomes possible to cope with high-density mounting products.

さらに、本実施形態では、遮熱カバー４は周辺の電子部品３を覆う構造とすればよいため、遮熱カバー４の構造を簡単にすることができ、電子部品交換装置１００の製造コストを抑えることが可能となる。   Furthermore, in the present embodiment, the heat shield cover 4 may be structured to cover the surrounding electronic components 3, so that the structure of the heat shield cover 4 can be simplified and the manufacturing cost of the electronic component replacement apparatus 100 can be reduced. It becomes possible.

また、本実施形態では、加熱用ノズル６より噴出した熱風７は、風量の変化を起こすような経路をもたないので、交換対象の電子部品２を安定させて加熱することができる。   Moreover, in this embodiment, the hot air 7 ejected from the heating nozzle 6 does not have a path that causes a change in the air volume, so that the electronic component 2 to be replaced can be stably heated.

第２の実施形態Second embodiment

図３は、本発明の第２の実施形態を示すための図である。   FIG. 3 is a diagram for illustrating a second embodiment of the present invention.

図３を参照すると、本発明の第２の実施形態の電子部品交換装置１０１は、回路基板１上に実装されている交換対象の電子部品（第１の電子部品、例えば半導体デバイス）２に熱風７を噴射する加熱用ノズル６と、交換対象の電子部品２を吸着する吸着ノズル５と、交換対象の電子部品２に周辺の回路基板上に取り付けられた周辺の電子部品（第２の電子部品、例えば半導体デバイス）３の上部および側面を覆う遮熱カバー４とからなる。さらに、遮熱カバー４の上部には、冷却機構が設けられている。   Referring to FIG. 3, an electronic component replacement apparatus 101 according to the second embodiment of the present invention applies hot air to an electronic component (first electronic component, for example, a semiconductor device) 2 to be replaced mounted on the circuit board 1. Heating nozzle 6 for injecting 7, suction nozzle 5 for sucking the electronic component 2 to be replaced, and peripheral electronic component (second electronic component) mounted on the peripheral circuit board to the electronic component 2 to be replaced , For example, a semiconductor device) 3 and a heat insulating cover 4 covering the upper and side surfaces. Furthermore, a cooling mechanism is provided on the top of the heat shield cover 4.

図３においては、冷却機構は、冷却水を通す冷却水循環溝１１と、冷却水を循環させるためのポンプ１２とからなる。なお、冷却機構はこれに限定されるものではなく、例えば、冷却ファンを遮熱カバー４の上部に設けてもよい。   In FIG. 3, the cooling mechanism includes a cooling water circulation groove 11 through which cooling water passes and a pump 12 for circulating the cooling water. The cooling mechanism is not limited to this, and for example, a cooling fan may be provided in the upper part of the heat shield cover 4.

次に上述した半導体デバイスの交換装置１０１を用いて、回路基板１上に実装されている交換対象の電子部品２を取り外す方法について説明する。   Next, a method for removing the electronic component 2 to be exchanged mounted on the circuit board 1 using the semiconductor device exchange apparatus 101 described above will be described.

まず、遮熱カバー４を周辺の電子部品３の上部および側面を覆うように、回路基板１に取り付ける。   First, the heat insulating cover 4 is attached to the circuit board 1 so as to cover the upper and side surfaces of the peripheral electronic component 3.

次に、遮熱カバー４の上部に設けられた冷却機構を動作させる。冷却機構が冷却水循環溝１１とポンプ１２とからなる場合には、ポンプ１２を動作させて、冷却水を冷却水循環溝１１内で循環させるようにする。冷却ファンの場合には、ファンを回転させる。   Next, the cooling mechanism provided in the upper part of the heat shield cover 4 is operated. When the cooling mechanism includes the cooling water circulation groove 11 and the pump 12, the pump 12 is operated to circulate the cooling water in the cooling water circulation groove 11. In the case of a cooling fan, the fan is rotated.

次に、交換対象の電子部品２の上部に設けられた加熱用ノズル６より熱風７を噴出させ、交換対象の電子部品２を加熱する。このときに、周辺の電子部品３の上部および側面は、遮熱カバー４で覆われていると同時に、周辺の電子部品３は、遮熱カバー４の上部に設けられた冷却機構によって冷却されるので、周辺の電子部品３に過剰な熱が加わることがない。   Next, hot air 7 is ejected from the heating nozzle 6 provided on the upper part of the electronic component 2 to be replaced, and the electronic component 2 to be replaced is heated. At this time, the upper and side surfaces of the peripheral electronic component 3 are covered with the heat shield cover 4, and at the same time, the peripheral electronic component 3 is cooled by the cooling mechanism provided on the upper portion of the heat shield cover 4. Therefore, excessive heat is not applied to the peripheral electronic component 3.

次に、交換対象の電子部品２と回路基板１とを接続している外部接続端子８が溶融したら、吸着ノズル5を用いて交換対象の電子部品２を吸着し、回路基板１より引き剥がす。
なお、吸着ノズル5を用いずに、作業者がピンセットなどの治具を用いて交換対象の電子部品２を回路基板１から引き剥がしてもよい。 Next, when the external connection terminal 8 connecting the electronic component 2 to be replaced and the circuit board 1 is melted, the electronic component 2 to be replaced is sucked using the suction nozzle 5 and is peeled off from the circuit board 1.
Instead of using the suction nozzle 5, an operator may peel off the electronic component 2 to be replaced from the circuit board 1 using a jig such as tweezers.

本実施形態では、第１の実施形態の電子部品交換装置に、遮熱カバー４の上部に設けられた冷却機構を加えているので、第１の実施形態と比較して、周辺の電子部品３に伝わる熱を一層抑えることができる。
In this embodiment, since the cooling mechanism provided in the upper part of the heat shield cover 4 is added to the electronic component replacement apparatus of the first embodiment, the peripheral electronic components 3 are compared with those of the first embodiment. The heat transmitted to can be further suppressed.

本発明の第１の実施形態の電子部品交換装置を示す図である。It is a figure which shows the electronic component replacement apparatus of the 1st Embodiment of this invention. 図１の電子部品交換装置の上面図である。It is a top view of the electronic component replacement apparatus of FIG. 本発明の第２の実施形態の電子部品交換装置を示す図である。It is a figure which shows the electronic component replacement | exchange apparatus of the 2nd Embodiment of this invention. 従来の電子部品交換装置を示す図である。It is a figure which shows the conventional electronic component replacement | exchange apparatus.

符号の説明Explanation of symbols

１ 回路基板
２ 交換対象の電子部品（第１の電子部品）
３ 周辺の電子部品（第２の電子部品）
４ 遮熱カバー
５ 吸着ノズル
６ 加熱用ノズル（熱風供給部）
７ 熱風
８ 外部接続端子
１１ 冷却水循環溝
１２ ポンプ
２１ 回路基板
２２ 交換対象の電子部品
２３ 周辺の電子部品
２４ 遮熱カバー
２５ 吸着ノズル
２６ 加熱用ノズル
２７ 熱風
２９ フィン
３０ 排気口
１００ 電子部品交換装置
１０１ 電子部品交換装置
２００ 電子部品交換装置
1 circuit board 2 electronic component to be replaced (first electronic component)
3 Peripheral electronic components (second electronic components)
4 Heat shield cover 5 Adsorption nozzle 6 Nozzle for heating (hot air supply part)
7 Hot Air 8 External Connection Terminal 11 Cooling Water Circulating Groove 12 Pump 21 Circuit Board 22 Electronic Component to be Replaced 23 Peripheral Electronic Component 24 Heat Insulation Cover 25 Adsorption Nozzle 26 Heating Nozzle 27 Hot Air 29 Fin 30 Exhaust Port 100 Electronic Component Exchanger 101 Electronic component changer 200 Electronic component changer

Claims (13)

回路基板上に取り付けられた第１の電子部品に熱風を吹き付ける熱風供給部と、
前記回路基板上に取り付けられた第２の電子部品を覆うように設けられ、前記熱風供給部から排出される熱風を遮断する遮熱カバーと、
を含み、
前記遮熱カバーが、前記第２の電子部品の上面を覆う第１の部分と、前記第２の電子部品の側面を覆う第２の部分と、を含むことを特徴とする、電子部品交換装置。 A hot air supply section for blowing hot air to the first electronic component mounted on the circuit board;
A heat insulating cover provided to cover the second electronic component mounted on the circuit board and blocking hot air discharged from the hot air supply unit;
Including
An electronic component replacement apparatus, wherein the heat shield cover includes a first portion that covers an upper surface of the second electronic component, and a second portion that covers a side surface of the second electronic component. . 前記第１の電子部品を吸着し、持ち上げるための吸着ノズルをさらに含むことを特徴とする請求項1に記載の電子部品交換装置。 2. The electronic component replacement apparatus according to claim 1, further comprising a suction nozzle for sucking and lifting the first electronic component. 前記遮熱カバーの前記第２の部分は、少なくとも前記第１の電子部品に接している側の前記第２の電子部品の側面を覆うように設けられていることを特徴とする請求項１または２に記載の電子部品交換装置。 The second portion of the heat shield cover is provided so as to cover at least a side surface of the second electronic component that is in contact with the first electronic component. 2. The electronic component replacement apparatus according to 2. 前記熱風供給部が、加熱用ノズルからなることを特徴とする請求項１乃至３に記載の電子部品交換装置 The electronic component replacement apparatus according to claim 1, wherein the hot air supply unit includes a heating nozzle. 前記遮熱カバーの前記第２の部分は、冷却機構を有していることを特徴とする請求項１乃至４のいずれかに記載の電子部品交換装置。 5. The electronic component replacement apparatus according to claim 1, wherein the second portion of the heat shield cover has a cooling mechanism. 前記冷却機構は、冷却水循環溝と、前記冷却水循環溝に接続され、前記冷却水循環溝内の冷却水を循環させるためのポンプと、からなることを特徴とする請求項５に記載の電子部品交換装置。 6. The electronic component replacement according to claim 5, wherein the cooling mechanism includes a cooling water circulation groove and a pump connected to the cooling water circulation groove for circulating the cooling water in the cooling water circulation groove. apparatus. 前記冷却機構は、冷却ファンからなることを特徴とする請求項５に記載の電子部品交換装置。 The electronic component replacement apparatus according to claim 5, wherein the cooling mechanism includes a cooling fan. 回路基板に取り付けられている電子部品の中から、交換対象となる第１の電子部品を特定する工程と、
前記回路基板に取り付けられている第２の電子部品の上部および側面を遮熱カバーで覆う工程と、
前記第１の電子部品に熱風供給部で熱風を吹き付ける工程と、
前記第１の電子部品を前記回路基板から除去する工程と、
を含むことを特徴とする電子部品交換方法。 Identifying the first electronic component to be replaced from among the electronic components attached to the circuit board;
Covering the upper and side surfaces of the second electronic component attached to the circuit board with a heat insulating cover;
Spraying hot air on the first electronic component with a hot air supply unit;
Removing the first electronic component from the circuit board;
An electronic component replacement method comprising: 前記第１の電子部品を前記回路基板から除去する工程が、吸着ノズルで前記第１の電子部品を吸着する工程を含んでいることを特徴とする請求項８に記載の電子部品交換方法。 9. The electronic component replacement method according to claim 8, wherein the step of removing the first electronic component from the circuit board includes a step of sucking the first electronic component with a suction nozzle. 前記回路基板に取り付けられている第２の電子部品の上部および側面を遮熱カバーで覆う工程は、前記第２の電子部品の上部と、少なくとも前記第１の電子部品に接している側の前記第２の電子部品の側面を遮熱カバーで覆う工程であることを特徴とする請求項８または９に記載の電子部品の交換方法。 The step of covering the upper and side surfaces of the second electronic component attached to the circuit board with a heat insulating cover includes the step of covering the upper portion of the second electronic component and at least the side in contact with the first electronic component. The method for replacing an electronic component according to claim 8, wherein the second electronic component is a step of covering the side surface of the second electronic component with a heat insulating cover. 前記遮熱カバーに設けられている冷却機構を動作させる工程をさらに含むことを特徴とする請求項８乃至１０のいずれかに記載の電子部品交換方法。 The electronic component replacement method according to claim 8, further comprising a step of operating a cooling mechanism provided in the heat shield cover. 前記遮熱カバーに設けられている冷却機構を動作させる工程が、前記遮熱カバーに設けられている冷却水循環溝に冷却水を循環させる工程を含んでいることを特徴とする請求項１１に記載の電子部品交換方法 12. The step of operating a cooling mechanism provided in the heat shield cover includes a step of circulating cooling water in a cooling water circulation groove provided in the heat shield cover. Electronic parts replacement method 前記遮熱カバーに設けられている冷却機構を動作させる工程が、前記遮熱カバーに設けられている冷却ファンを動作させる工程を含んでいることを特徴とする請求項１１に記載の電子部品交換方法。

12. The electronic component replacement according to claim 11, wherein the step of operating the cooling mechanism provided in the heat shield cover includes the step of operating a cooling fan provided in the heat shield cover. Method.

JP2005285004A 2005-09-29 2005-09-29 Device and method for replacing electronic component Pending JP2007096088A (en)

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GB2460307A (en) * 2008-05-26 2009-12-02 Fujitsu Ltd Solder re-work apparatus
JP2015099894A (en) * 2013-11-20 2015-05-28 富士通株式会社 Rework method of electronic component
CN110444487A (en) * 2019-06-28 2019-11-12 广东晶科电子股份有限公司 A kind of repair method of Mini LED module

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JPS54162465A (en) * 1978-06-14 1979-12-24 Hitachi Ltd Chip replacing method
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GB2460307A (en) * 2008-05-26 2009-12-02 Fujitsu Ltd Solder re-work apparatus
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