JP2003209211A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JP2003209211A JP2003209211A JP2002006849A JP2002006849A JP2003209211A JP 2003209211 A JP2003209211 A JP 2003209211A JP 2002006849 A JP2002006849 A JP 2002006849A JP 2002006849 A JP2002006849 A JP 2002006849A JP 2003209211 A JP2003209211 A JP 2003209211A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat receiving
- fan case
- heat
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＣＰＵ等の電子部
品の冷却モジュールを有する電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a cooling module for electronic parts such as a CPU.
【０００２】[0002]
【従来の技術】近年電子機器に搭載されるＣＰＵは、動
作クロック周波数が向上し、ますます高速、高性能にな
ってきており、発熱量もますます大きいものとなってき
ており、ＣＰＵの性能を維持する為にはＣＰＵを冷却す
ることが必要となっている。冷却方法として、ヒートシ
ンク等の放熱部材をＣＰＵ上面に接続することで、ＣＰ
Ｕからの熱を放熱する方法が取られている。2. Description of the Related Art In recent years, CPUs installed in electronic devices have improved operating clock frequency, are becoming faster and more efficient, and are generating more and more heat. In order to maintain the above, it is necessary to cool the CPU. As a cooling method, by connecting a heat dissipation member such as a heat sink to the upper surface of the CPU, the CP
The method of radiating the heat from U is taken.
【０００３】従来のコンピュータ等の電子機器は、筐体
に回路基板が内蔵され、この基板上にＣＰＵが実装され
ている。ＣＰＵの底面には複数の電極がマトリックス状
に形成されており、回路基板にＣＰＵの電極が半田付け
等により接続されている。ＣＰＵの上方にはＣＰＵによ
り発熱される熱を放熱する為のヒートシンクが伝熱性の
良好な伝熱シート等を介して実装されている。ヒートシ
ンクはアルミ等の熱伝導性の良好な材料により形成さ
れ、回路基板にヒートシンクを固定する為の支持部を一
体形成している。ヒートシンクの支持部がネジを介して
回路基板に固定されることで、ＣＰＵは回路基板とヒー
トシンクとの間に挟まれるように実装される。In a conventional electronic device such as a computer, a circuit board is built in a housing, and a CPU is mounted on the board. A plurality of electrodes are formed in a matrix on the bottom surface of the CPU, and the electrodes of the CPU are connected to the circuit board by soldering or the like. A heat sink for dissipating heat generated by the CPU is mounted above the CPU via a heat transfer sheet or the like having a good heat transfer property. The heat sink is made of a material having a good thermal conductivity such as aluminum, and a support portion for fixing the heat sink is integrally formed on the circuit board. By fixing the support portion of the heat sink to the circuit board via the screw, the CPU is mounted so as to be sandwiched between the circuit board and the heat sink.
【０００４】上述したような従来の冷却モジュールにお
いては、ヒートシンクはネジにより筐体、あるいは回路
基板等にネジ止され、そのネジ止に係る力がそのままＣ
ＰＵに加わるような構造となっている。また、ＣＰＵの
寸法誤差、ＣＰＵの電極、例えば、半田バンプ、半田ボ
ール等の寸法誤差による実装高さによるバラツキ、ヒー
トシンクの製造公差等のさまざまな寸法誤差を押えなが
ら、さらに、ＣＰＵとヒートシンクの確実な熱接続を確
保する為に、ＣＰＵには非常に大きな加重が加わってい
る。In the conventional cooling module as described above, the heat sink is screwed to the housing, the circuit board or the like by screws, and the force related to the screwing is C as it is.
It has a structure that joins the PU. Further, while suppressing various dimensional errors such as the dimensional error of the CPU, the variation in the mounting height due to the dimensional error of the electrodes of the CPU such as solder bumps and solder balls, and the manufacturing tolerance of the heat sink, the reliability of the CPU and the heat sink is further improved. A great deal of weight is applied to the CPU to ensure proper thermal connection.
【０００５】さらに、近年のコンピュータ等の電子機器
はユーザーの使用目的、好みに合わせた仕様に応じて作
り分ける手法を取り入れたり、ユーザーが自由に仕様を
変更することが可能となってきている。例えば、ＣＰＵ
に関しては、動作クロック周波数の異なるものを容易に
取り替え可能なことが要求される。その為に、回路基板
にＣＰＵ実装用のソケットを実装し、このソケットにＣ
ＰＵを着脱可能に実装する方法が主流となってきてい
る。ソケットはマトリックス状に配置された複数の半田
ボールや、半田バンプ等により回路基板に半田付け実装
される。更にＣＰＵは着脱を容易にする為にＰＧＡ（Ｐ
ＩＮ ＧＲＩＤ ＡＲＲＡＹ）タイプのものが採用されて
いる。このタイプのＣＰＵは、ＣＰＵの電極として複数
のピンがマトリックス状にＣＰＵ下面に配置されてお
り、ソケットにＣＰＵのそれぞれのピンを差込実装する
方式となっている。このようなＣＰＵ実装方法によりユ
ーザーの要求を満たすことが可能となっている。Further, in recent years, electronic devices such as computers have been able to adopt a method of making them differently according to the purpose of use and preferences of the user, or the user can freely change the specifications. For example, CPU
With regard to (2), it is required that those having different operation clock frequencies can be easily replaced. Therefore, a socket for CPU mounting is mounted on the circuit board, and C is mounted on this socket.
A method of removably mounting a PU has become mainstream. The socket is soldered and mounted on the circuit board by a plurality of solder balls arranged in a matrix, solder bumps, and the like. Furthermore, the CPU has a PGA (P
IN GRID ARRAY) type is adopted. In this type of CPU, a plurality of pins as electrodes of the CPU are arranged in a matrix on the lower surface of the CPU, and each pin of the CPU is inserted and mounted in a socket. With such a CPU mounting method, it is possible to meet the user's request.
【０００６】上記したソケットは通常リフロー半田付け
されている。リフロー半田付けとはまず回路基板上の部
品を実装する為の電極パッド上に半田ペーストを塗布
し、次に高温のリフロー炉の中を通すことで半田ペース
トを溶融させ半田付けさせるものである。また回路基板
は両面に表面実装されており、回路基板表面へ部品（ソ
ケット等）をリフロー半田付けし、次に回路基板の裏面
に他の部品をリフロー半田付けする２ステップのリフロ
ー半田付けにより回路基板両面への部品実装が行われ
る。通常回路基板は、実装する面を上面にしてリフロー
炉内に入れられるThe above-mentioned socket is usually reflow-soldered. Reflow soldering is a method in which a solder paste is first applied onto an electrode pad for mounting a component on a circuit board, and then the solder paste is melted and soldered by passing through a high temperature reflow furnace. In addition, the circuit board is surface-mounted on both sides, and parts (sockets, etc.) are reflow-soldered on the surface of the circuit board, and then other parts are reflow-soldered on the back surface of the circuit board by two-step reflow soldering. Components are mounted on both sides of the board. Normally, the circuit board is placed in the reflow oven with the mounting surface facing up.
【０００７】この際、表面へのリフロー半田付けにより
ソケットが正常に実装されているにも関わらず、裏面へ
のリフロー半田付けの際、回路基板をリフロー炉内に入
れた際、表面（リフロー炉内では下面）に実装されてい
る部品を接続している半田が再度溶融される。この半田
が溶融している状態において、ソケットの自重により、
ソケットが回路基板から離れる方向に傾いたりしてしま
う。At this time, even though the socket is normally mounted by reflow soldering on the front surface, when the circuit board is put in the reflow furnace during reflow soldering on the back surface, the surface (reflow furnace Inside, the solder connecting the components mounted on the bottom surface is melted again. In the state where this solder is melted, due to the weight of the socket,
The socket may tilt away from the circuit board.
【０００８】ソケットの実装において、電極の半田付け
等の品質によるソケットの実装高さ、傾きに大きくバラ
ツキが出てくる。さらにはＣＰＵのピンのソケットへの
差込具合や、ＣＰＵの寸法誤差、ソケットの寸法誤差に
より、ＣＰＵ実装後の回路基板面からＣＰＵ上面までの
高さ寸法はかなりのバラツキが出てきてしまう。In mounting the socket, the mounting height and inclination of the socket greatly vary depending on the quality of soldering the electrodes. Furthermore, the height dimension from the surface of the circuit board after mounting the CPU to the top surface of the CPU varies considerably depending on how the pins of the CPU are inserted into the socket, the dimension error of the CPU, and the dimension error of the socket.
【０００９】このような実装方法を取っているＣＰＵに
上述したようなヒートシンクを接続し、回路基板にネジ
止めすると、ヒートシンクを止めるネジ固定力がそのま
まＣＰＵあるいはソケットに加わってしまう。従って、
ＣＰＵやソケットに許容量以上の加重が加わると、ＣＰ
Ｕ、ソケットそれぞれの電極の亀裂、破損、回路破壊
等、回路モジュールに悪影響を及ぼすという問題を誘発
してしまう。When the heat sink as described above is connected to the CPU adopting such a mounting method and screwed to the circuit board, the screw fixing force for stopping the heat sink is directly applied to the CPU or the socket. Therefore,
If the CPU or socket is loaded more than the allowable amount, CP
This causes a problem that the circuit module is adversely affected, such as cracks, breakage, and circuit destruction of the electrodes of the U and socket.
【００１０】このような問題点を解決する例として例え
ば、特開２００１−１１０９６７号公報「電子素子の放
熱構造」がある。特開２００１−１１０９６７号公報に
開示されている電子素子の冷却構造は、基板に実装され
た電子素子に伝熱ブロックを接触させ、電熱ブロックか
らヒートパイプを介して熱拡散板に熱拡散する冷却構造
において、伝熱ブロックの基板への実装に際し、ブロッ
クの４角に設けられている固定用のネジとブロックとの
間にコイルスプリングをそれぞれ介在させる構造が開示
されている。このような構造で電子素子の高さ寸法の誤
差を吸収する方法を提案している。しかしながら、特開
２００１−１１０９６７号公報に開示の構成では部品点
数の増加につながり、組立て性、部品点数、コストの面
で余り好ましくない。As an example of solving such a problem, there is Japanese Patent Application Laid-Open No. 2001-110967, "heat dissipation structure of electronic element". A cooling structure for an electronic element disclosed in Japanese Patent Laid-Open No. 2001-110967 is a cooling method in which a heat transfer block is brought into contact with an electronic element mounted on a substrate, and heat is diffused from an electric heating block to a heat diffusion plate via a heat pipe. In the structure, when mounting the heat transfer block on the substrate, a structure in which coil springs are respectively interposed between fixing screws provided at four corners of the block and the block is disclosed. With such a structure, a method of absorbing an error in the height dimension of the electronic device is proposed. However, the configuration disclosed in Japanese Patent Laid-Open No. 2001-110967 leads to an increase in the number of parts, which is not very preferable in terms of assemblability, the number of parts, and cost.
【００１１】[0011]
【発明が解決しようとする課題】本発明は上記のような
点に鑑みてなされたもので、電子部品や電子部品の実装
寸法に誤差が生じたとしても、電子部品を破損させるこ
となく良好に冷却することができ、組立て性の向上、部
品点数の削減、コストの削減に良的な電子機器を提供す
ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above points. Even if an error occurs in the electronic component or the mounting dimension of the electronic component, the electronic component can be satisfactorily maintained without being damaged. It is an object of the present invention to provide a good electronic device which can be cooled, which improves the assembling property, reduces the number of parts, and reduces the cost.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するため
に、請求項１に係る電子機器では、本体と、本体に内蔵
され、動作中発熱する電子部品が実装された回路基板
と、回路基板に実装され、電子部品に熱的に接続されて
電子部品からの熱が伝熱されるとともに板バネ状に形成
された受熱部と、この受熱部と一体形成されたファンケ
ースと、このファンケースに支持されたファンユニット
とを具備する冷却モジュールと、を具備することを特徴
とする。In order to achieve the above object, in an electronic device according to a first aspect, a main body, a circuit board on which an electronic component built in the main body and which generates heat during operation is mounted, and a circuit board. Mounted to the electronic component, the heat from the electronic component is transferred to the electronic component, and the heat receiving portion is formed in a leaf spring shape, the fan case integrally formed with the heat receiving portion, and the fan case. And a cooling module having a supported fan unit.
【００１３】請求項６に係る電子機器は、本体と、本体
に内蔵され、動作中発熱する電子部品が実装された回路
基板と、回路基板に実装され、電子部品に熱的に接続さ
れて電子部品からの熱が伝熱されるとともに板バネ状に
形成された受熱部と、この受熱部と一体形成されたファ
ンケースと、このファンケースに支持されたファンユニ
ットと、ファンケースの上面に設けられ空気を流入する
流入口と、ファンケースの側面に設けられ流入された空
気を吐き出す吐出口とを具備する冷却モジュールと、を
具備することを特徴とする。According to a sixth aspect of the present invention, there is provided an electronic apparatus, a main body, a circuit board which is built in the main body and on which electronic components that generate heat during operation are mounted, and a circuit board which is mounted on and thermally connected to the electronic components. The heat receiving portion formed in a leaf spring shape while transmitting heat from the components, the fan case integrally formed with the heat receiving portion, the fan unit supported by the fan case, and provided on the upper surface of the fan case. It is characterized by comprising an inflow port for inflowing air and a cooling module provided on a side surface of the fan case and having a discharge port for discharging the inflowing air.
【００１４】請求項１０に係る電子機器は、本体と、本
体に内蔵され、動作中発熱する電子部品が実装された回
路基板と、回路基板に実装され、電子部品に熱的に接続
されて電子部品からの熱が伝熱されるとともに、電子部
品の実装高さに応じて実装方向に変位可能である受熱部
と、この受熱部と一体形成されたファンケースと、この
ファンケースに支持されたファンユニットとを具備する
冷却モジュールと、を具備することを特徴とする。According to a tenth aspect of the present invention, there is provided an electronic apparatus, a main body, a circuit board which is built in the main body, on which electronic components that generate heat during operation are mounted, and a circuit board which is mounted on the circuit board and is thermally connected to the electronic components. The heat from the components is transferred, and the heat receiving portion is displaceable in the mounting direction according to the mounting height of the electronic component, the fan case integrally formed with the heat receiving portion, and the fan supported by the fan case. And a cooling module including a unit.
【００１５】請求項１５に係る電子機器は、本体と、本
体に内蔵され、動作中発熱する電子部品が実装された回
路基板と、電子部品に熱的に接続されて電子部品からの
熱が伝熱されるとともに板バネ状に形成された受熱部
と、この受熱部の一端に一体形成されたファンケース
と、このファンケースに支持されたファンユニットと、
受熱部の他端に一体形成され回路基板に固定される固定
部とを具備する冷却モジュールと、を具備し、受熱板と
固定部との境界もしくは受熱板とファンケースとの境界
は少なくともファンケースの厚み寸法よりも薄く形成さ
れる事を特徴とする。このような構成により、電子部品
や電子部品の実装寸法に誤差が生じたとしても、電子部
品を破損させることなく良好に冷却することができ、組
立て性の向上、部品点数の削減、コストの削減が可能と
なる。According to a fifteenth aspect of the present invention, an electronic device has a main body, a circuit board mounted in the main body, on which electronic components that generate heat during operation are mounted, and the electronic components are thermally connected to transfer heat from the electronic components. A heat receiving portion that is heated and formed in a leaf spring shape, a fan case integrally formed at one end of the heat receiving portion, and a fan unit supported by the fan case,
A cooling module having a fixing portion integrally formed at the other end of the heat receiving portion and fixed to the circuit board, and a boundary between the heat receiving plate and the fixing portion or a boundary between the heat receiving plate and the fan case is at least the fan case. It is characterized in that it is formed thinner than the thickness dimension of. With this configuration, even if there is an error in the electronic components or the mounting dimensions of the electronic components, the electronic components can be cooled well without being damaged, improving the assemblability, reducing the number of components, and reducing the cost. Is possible.
【００１６】[0016]
【発明の実施の形態】以下ノート型コンピュータ等の電
子機器に適用した本発明に係る実施の形態を、図面を参
照して説明する。図１はコンピュータの斜視図である。
コンピュータ１は本体４を有している。本体４は上ケー
ス２および下ケース３を有している。本体４の上面には
キーボード５が配置されている。本体４の後部にはヒン
ジ部６が設けられており、このヒンジ部６を介して表示
部７が本体４に対して回動可能に接続されている。本体
４の側面には開口８が形成される。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention applied to an electronic device such as a notebook computer will be described below with reference to the drawings. FIG. 1 is a perspective view of a computer.
The computer 1 has a main body 4. The main body 4 has an upper case 2 and a lower case 3. A keyboard 5 is arranged on the upper surface of the main body 4. A hinge portion 6 is provided at the rear portion of the main body 4, and the display portion 7 is rotatably connected to the main body 4 via the hinge portion 6. An opening 8 is formed on the side surface of the body 4.
【００１７】図２は、ＣＰＵの実装分解斜視図である。
コンピュータ１には回路基板１０が内蔵される。回路基
板１０にはマトリックス状に配置された電極パッド１１
が設けられている。電極パッド１１上には電子部品であ
るＣＰＵ１６を実装するためのＣＰＵソケット１２が実
装される。ＣＰＵソケット１２は基台１３に複数の半田
ボール１５が形成されたＢＧＡタイプのソケットであ
り、半田ボール１５はパッド１１に半田付けされる。Ｃ
ＰＵソケット１２の上面には複数の孔１４がマトリック
ス状に形成されている。FIG. 2 is an exploded perspective view of the mounting of the CPU.
A circuit board 10 is built in the computer 1. Electrode pads 11 arranged in a matrix on the circuit board 10.
Is provided. A CPU socket 12 for mounting a CPU 16, which is an electronic component, is mounted on the electrode pad 11. The CPU socket 12 is a BGA type socket in which a plurality of solder balls 15 are formed on a base 13, and the solder balls 15 are soldered to the pads 11. C
A plurality of holes 14 are formed in a matrix on the upper surface of the PU socket 12.
【００１８】ＣＰＵ１６の基台１７の下面には複数の電
極ピン１９が形成されており、ＰＧＡタイプのＣＰＵと
なっている。基台１７には素子１８が実装されており、
素子１８とピン１９とは電気的に接続されている。A plurality of electrode pins 19 are formed on the lower surface of the base 17 of the CPU 16 to form a PGA type CPU. An element 18 is mounted on the base 17,
The element 18 and the pin 19 are electrically connected.
【００１９】図３は、第１の実施形態に係る冷却モジュ
ールの斜視図である。回路基板１０に実装されているＣ
ＰＵソケット１２およびＣＰＵ１６上には冷却モジュー
ル２０が実装される。冷却モジュール２０はファンケー
ス２１および受熱板２２とがアルミニウム等の金属材料
にて一体形成されている。ファンケース２１はローター
２５およびファン２６および後述するモータを覆うよう
なハウジング状に形成されており、上面には２１ａには
吸入口２３が形成される。吸入口２３とはファン２６お
よびローター２５とが露出される。これらファン２６の
回転により、冷却モジュール２０の周囲の空気は吸入口
２３に流入されるようになる。さらにファンケース２１
の側面には吐出口２４が形成される。吸入口２３から流
入した空気は吐出口２４からは吐き出される構成とな
る。回路基板１０および冷却モジュール２０は本体４に
実装されると、冷却モジュール２０の吐出口２４は開口
８と対向するように配置される。ファンケース２１に
は、冷却モジュール２０を回路基板１０にネジ固定する
ためのネジ固定部２９ａ，２９ｂ，２９ｃが形成され
る。ネジ固定部２９ａ，２９ｂ，２９ｃはボス３１ａ，
３１ｂ，３１ｃおよび、ネジ３３ａ，３３ｂ，３３ｃを
介して回路基板１０に固定される。FIG. 3 is a perspective view of the cooling module according to the first embodiment. C mounted on the circuit board 10
The cooling module 20 is mounted on the PU socket 12 and the CPU 16. In the cooling module 20, the fan case 21 and the heat receiving plate 22 are integrally formed of a metal material such as aluminum. The fan case 21 is formed in a housing shape so as to cover the rotor 25, the fan 26, and a motor described later, and an intake port 23 is formed in the upper surface 21a. The fan 26 and the rotor 25 are exposed to the suction port 23. The rotation of the fans 26 allows the air around the cooling module 20 to flow into the suction port 23. Further fan case 21
A discharge port 24 is formed on the side surface of the. The air flowing in through the suction port 23 is discharged through the discharge port 24. When the circuit board 10 and the cooling module 20 are mounted on the main body 4, the discharge port 24 of the cooling module 20 is arranged so as to face the opening 8. The fan case 21 is formed with screw fixing portions 29a, 29b, 29c for fixing the cooling module 20 to the circuit board 10 with screws. The screw fixing portions 29a, 29b, 29c are bosses 31a,
It is fixed to the circuit board 10 via 31b, 31c and screws 33a, 33b, 33c.
【００２０】受熱板２２は平らな板バネ状に形成され、
バネ特性を有している。したがって受熱板２２はファン
ケース２１との境界付近がファンケース２１に支持され
ているような片持ちの板バネとして機能する。受熱板２
２はＣＰＵ１６からの熱に熱的に接続された状態で回路
基板１０に支持される。受熱板２２の端部には回路基板
１０に固定するために固定部２７、２８が一体形成され
る。固定部２７，２８も受熱板２２と同厚寸法で形成さ
れる為板バネ特性を有するものである。固定部２７，２
８には回路基板１０にネジ固定するためのネジ孔３０
ａ，３０ｂが形成される。固定部２７，２８は回路基板
１０にネジ３５ａ，３５ｂおよびボス３２ａ，ｂを介し
てネジ固定される。The heat receiving plate 22 is formed into a flat leaf spring shape,
It has spring characteristics. Therefore, the heat receiving plate 22 functions as a cantilever plate spring in which the vicinity of the boundary with the fan case 21 is supported by the fan case 21. Heat receiving plate 2
2 is supported by the circuit board 10 while being thermally connected to the heat from the CPU 16. Fixing portions 27 and 28 are integrally formed at the end of the heat receiving plate 22 for fixing to the circuit board 10. Since the fixing portions 27 and 28 are also formed with the same thickness as the heat receiving plate 22, they have leaf spring characteristics. Fixed parts 27, 2
8 is a screw hole 30 for fixing the screw to the circuit board 10.
a and 30b are formed. The fixing portions 27 and 28 are fixed to the circuit board 10 with screws 35a and 35b and bosses 32a and 32b.
【００２１】図４は、図３におけるＡ−Ａ’線に沿う断
面を示す図である。ファン２６およびローター２５はフ
ァンケース２１に支持されたモータ２５ａにより回転駆
動される。受熱板２２の裏面のほぼ中央部には受熱板２
２より若干突出した受熱部２２ａが一体形成される。FIG. 4 is a view showing a cross section taken along the line AA 'in FIG. The fan 26 and the rotor 25 are rotationally driven by a motor 25a supported by the fan case 21. The heat receiving plate 2 is provided on the back surface of the heat receiving plate 22 in a substantially central portion
The heat receiving portion 22a slightly protruding from 2 is integrally formed.
【００２２】図４に示すように回路基板１０にＣＰＵソ
ケット１２を介して実装されたＣＰＵ１６の素子１８か
らの熱は伝熱シートもしくは伝熱グリス等の伝熱部材４
０を介して受熱板２２の受熱部２２ａに伝熱される。受
熱板２２に伝熱された熱はファンケース２１に伝熱さ
れ、ファン２６の回転により吸入口２３より流入した空
気により冷却され、吐出口２４より横方に吐き出され
る。吐出口２４より吐き出された空気は本体側面の開口
８より外部に吐き出される。As shown in FIG. 4, the heat from the element 18 of the CPU 16 mounted on the circuit board 10 via the CPU socket 12 is a heat transfer member 4 such as a heat transfer sheet or heat transfer grease.
The heat is transferred to the heat receiving portion 22a of the heat receiving plate 22 via 0. The heat transferred to the heat receiving plate 22 is transferred to the fan case 21, is cooled by the air flowing in through the suction port 23 by the rotation of the fan 26, and is discharged laterally through the discharge port 24. The air discharged from the discharge port 24 is discharged to the outside through the opening 8 on the side surface of the main body.
【００２３】図５は、第１の実施形態に係る冷却モジュ
ールの断面図である。図５に示すように受熱板２２はフ
ァンケース２１と一体形成されており、受熱板２２はフ
ァンケース２１との境界２２ｂを境に板バネとして機能
する。図のように受熱板２２は上下への変位が可能であ
る。FIG. 5 is a sectional view of the cooling module according to the first embodiment. As shown in FIG. 5, the heat receiving plate 22 is integrally formed with the fan case 21, and the heat receiving plate 22 functions as a leaf spring with a boundary 22b with the fan case 21 as a boundary. As shown, the heat receiving plate 22 can be displaced up and down.
【００２４】図６は、ＣＰＵの実装高さ寸法に応じて冷
却モジュールが実装された場合の図５におけるＡ−Ａ’
線に沿う断面を示す図である。図６に示すようにＣＰＵ
ソケット１２の実装高さに狂いが生じ、ＣＰＵ１６の実
装高さにばらつきが生じた場合でも、受熱板２２は受熱
部２２ａ付近がＣＰＵ１６の実装高さに応じて上方に盛
り上がった状態、すなわち図６中矢印方向へ変位した状
態でＣＰＵ１６に密着するようになる。したがって、Ｃ
ＰＵ１６やＣＰＵソケット１２への過度の応力が加わら
ないため、ＣＰＵ１６やＣＰＵソケット１２自身もしく
はこれらのピン１９や半田ボール１５にダメージを与え
ることが極力抑えられることになる。FIG. 6 shows an AA ′ line in FIG. 5 when the cooling module is mounted according to the mounting height dimension of the CPU.
It is a figure which shows the cross section along a line. CPU as shown in FIG.
Even when the mounting height of the socket 12 is distorted and the mounting height of the CPU 16 varies, the heat receiving plate 22 is in a state in which the vicinity of the heat receiving portion 22a is raised upward according to the mounting height of the CPU 16, that is, FIG. It comes into close contact with the CPU 16 while being displaced in the direction of the middle arrow. Therefore, C
Since excessive stress is not applied to the PU 16 and the CPU socket 12, damage to the CPU 16 and the CPU socket 12 itself or the pins 19 and the solder balls 15 thereof can be suppressed as much as possible.
【００２５】図７は、第２の実施形態に係る冷却モジュ
ールの斜視図である。図８は、図７におけるＢ−Ｂ’線
に沿う断面を示す図である。第１の実施の形態と同一構
造の部分には同一符号を付して説明を省略する。FIG. 7 is a perspective view of a cooling module according to the second embodiment. FIG. 8 is a view showing a cross section taken along the line BB ′ in FIG. 7. The parts having the same structures as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
【００２６】受熱板２２からは延出部４１ａ，４１ｂが
一体形成される。延出部４１ａ，４１ｂは受熱板２２と
同厚寸法に形成されるため、板バネとしても機能する。
さらに延出部４１ａ，４１ｂからはそれぞれ下方に伸び
る脚部４１ｃ，４１ｄがそれぞれ一体形成され，これら
脚部４１ｃ，４１ｄからは固定部４１ｅ，４１ｆが形成
される。図８に示すように、固定部４１ｅ，４１ｆには
ネジ固定用のネジ孔４２ａ，４２ｂが形成され、ネジ３
５ａ，３５ｂにより回路基板１０にネジ固定される。Extension portions 41a and 41b are integrally formed from the heat receiving plate 22. Since the extending portions 41a and 41b are formed to have the same thickness as the heat receiving plate 22, they also function as leaf springs.
Further, leg portions 41c and 41d extending downward from the extending portions 41a and 41b are integrally formed, and fixing portions 41e and 41f are formed from the leg portions 41c and 41d. As shown in FIG. 8, screw holes 42a and 42b for fixing screws are formed in the fixing portions 41e and 41f, respectively.
The circuit board 10 is fixed by screws 5a and 35b.
【００２７】図９は、第２の実施形態に係る冷却モジュ
ールの断面図である。第１の実施の形態と同様に、受熱
板２２はファンケース２１と一体形成されており、受熱
板２２はファンケース２１との境界２２ｂを境に板バネ
として機能する。図のように受熱板２２は上下への変位
が可能である。FIG. 9 is a sectional view of the cooling module according to the second embodiment. Similar to the first embodiment, the heat receiving plate 22 is integrally formed with the fan case 21, and the heat receiving plate 22 functions as a leaf spring with the boundary 22b with the fan case 21 as a boundary. As shown, the heat receiving plate 22 can be displaced up and down.
【００２８】図１０は、ＣＰＵの実装高さ寸法に応じて
冷却モジュールが実装された場合の図７におけるＢ−
Ｂ’線に沿う断面を示す図である。図１０に示すように
ＣＰＵソケット１２の実装高さに狂いが生じ、ＣＰＵ１
６の実装高さにばらつきが生じた場合でも、受熱板２２
は受熱部２２ａ付近がＣＰＵ１６の実装高さに応じて上
方に盛り上がった状態でＣＰＵ１６に密着するようにな
る。したがって、ＣＰＵ１６やＣＰＵソケット１２への
過度の応力が加わらないため、ＣＰＵ１６やＣＰＵソケ
ット１２自身もしくはこれらのピン１９や半田ボール１
５にダメージを与えることが極力抑えられることにな
る。FIG. 10 shows B- in FIG. 7 when the cooling module is mounted according to the mounting height dimension of the CPU.
It is a figure which shows the cross section along a B'line. As shown in FIG. 10, the mounting height of the CPU socket 12 is incorrect and the CPU 1
Even if the mounting height of 6 varies, the heat receiving plate 22
Comes into close contact with the CPU 16 in a state where the vicinity of the heat receiving portion 22a rises upward depending on the mounting height of the CPU 16. Therefore, since excessive stress is not applied to the CPU 16 and the CPU socket 12, the CPU 16 and the CPU socket 12 themselves or these pins 19 and the solder balls 1 are not applied.
Damage to 5 will be suppressed as much as possible.
【００２９】第２の実施の形態においては、固定部４２
ａ，４２ｂを回路基板１０に直接固定することが出来る
ため第１の実施の形態に比べて部品点数の削減に貢献す
る。さらに、延出部４１ａ，４１ｂおよび脚部４１ｃ，
４１ｄも板バネとして機能するために第１の実施の形態
に比べてＣＰＵ１６の実装高さのばらつきに追従して、
受熱板２２のＣＰＵ１６への密着を効率よく行うことが
可能となる。本発明ではその主旨を逸脱しない範囲であ
れば、上記の実施形態に限定されるものではない。In the second embodiment, the fixing portion 42
Since a and 42b can be directly fixed to the circuit board 10, it contributes to the reduction of the number of parts as compared with the first embodiment. Furthermore, the extending portions 41a and 41b and the leg portions 41c,
Since 41d also functions as a leaf spring, it follows variations in mounting height of the CPU 16 as compared with the first embodiment,
It is possible to efficiently attach the heat receiving plate 22 to the CPU 16. The present invention is not limited to the above embodiment as long as it does not depart from the spirit of the invention.
【００３０】[0030]
【発明の効果】以上詳述した発明によれば、電子部品や
電子部品の実装寸法に誤差が生じたとしても、電子部品
を破損させることなく良好に冷却することができ、組立
て性の向上、部品点数の削減、コストの削減が可能とな
る。According to the invention described in detail above, even if an error occurs in an electronic component or a mounting dimension of the electronic component, the electronic component can be satisfactorily cooled without being damaged, and the assemblability is improved. It is possible to reduce the number of parts and costs.
【図１】コンピュータの斜視図。FIG. 1 is a perspective view of a computer.
【図２】ＣＰＵの実装分解斜視図。FIG. 2 is an exploded perspective view of a CPU mounted.
【図３】第１の実施形態に係る冷却モジュールの斜視
図。FIG. 3 is a perspective view of the cooling module according to the first embodiment.
【図４】図３におけるＡ−Ａ’線に沿う断面を示す図。FIG. 4 is a diagram showing a cross section taken along line A-A ′ in FIG.
【図５】第１の実施形態に係る冷却モジュールの断面
図。FIG. 5 is a sectional view of the cooling module according to the first embodiment.
【図６】ＣＰＵの実装高さ寸法に応じて冷却モジュール
が実装された場合の図３におけるＡ−Ａ’線に沿う断面
を示す図。6 is a diagram showing a cross section taken along the line AA ′ in FIG. 3 when a cooling module is mounted according to the mounting height dimension of a CPU.
【図７】第２の実施形態に係る冷却モジュールの斜視
図。FIG. 7 is a perspective view of a cooling module according to a second embodiment.
【図８】図７におけるＢ−Ｂ’線に沿う断面を示す図。FIG. 8 is a diagram showing a cross section taken along line B-B ′ in FIG. 7.
【図９】第２の実施形態に係る冷却モジュールの断面
図。FIG. 9 is a sectional view of the cooling module according to the second embodiment.
【図１０】ＣＰＵの実装高さ寸法に応じて冷却モジュー
ルが実装された場合の図７におけるＢ−Ｂ’線に沿う断
面を示す図。10 is a diagram showing a cross section taken along line BB ′ in FIG. 7 when a cooling module is mounted according to the mounting height dimension of the CPU.
１…コンピュータ、２…上ケース、３…下ケース、４…
本体、５…キーボード、６…ヒンジ部、７…表示部、８
・・・開口、１０・・・回路基板、１１・・・電極パッド、１２・
・・ＣＰＵソケット、１３、１７・・・基台、１４・・・孔、１
５・・・半田ボール、１６・・・ＣＰＵ、１８・・・素子、１９・
・・電極ピン、２１・・・冷却モジュール、２１・・・ファンケ
ース、２２・・・受熱板、２２ａ・・・受熱部、２２ｂ・・・境
界、２３・・・吸入口、２４・・・吐出口、２５・・・ロータ
ー、２６・・・ファン、２９ａ，２９ｂ，２９ｃ・・・ネジ固
定部、３１ａ，３１ｂ，３１ｃ，３２ａ，３２ｂ・・・ボ
ス、３３ａ，３３ｂ，３３ｃ、３５ａ，ｂ・・・ネジ、４
０・・・伝熱部材、４１ａ，４１ｂ・・・延出部、４１ｃ，４
１ｄ・・・脚部、４１ｅ，４１ｆ・・・固定部、４２ａ，４２
ｂ・・・ネジ孔1 ... Computer, 2 ... Upper case, 3 ... Lower case, 4 ...
Main body, 5 ... Keyboard, 6 ... Hinge part, 7 ... Display part, 8
... Openings, 10 ... Circuit board, 11 ... Electrode pads, 12 ...
..CPU sockets, 13, 17 ... Base, 14 ... Holes, 1
5 ... Solder ball, 16 ... CPU, 18 ... Element, 19 ...
..Electrode pins, 21 ... Cooling module, 21 ... Fan case, 22 ... Heat receiving plate, 22a ... Heat receiving portion, 22b ... Boundary, 23 ... Intake port, 24 ... Discharge port, 25 ... Rotor, 26 ... Fan, 29a, 29b, 29c ... Screw fixing part, 31a, 31b, 31c, 32a, 32b ... Boss, 33a, 33b, 33c, 35a, b ... Screws, 4
0 ... Heat transfer member, 41a, 41b ... Extension part, 41c, 4
1d ... Legs, 41e, 41f ... Fixed parts, 42a, 42
b ... Screw hole
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０６Ｆ 1/00 ３６０Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification code FI theme code (reference) G06F 1/00 360C
Claims (15)
れた回路基板と、 上記回路基板に実装され、上記電子部品に熱的に接続さ
れて上記電子部品からの熱が伝熱されるとともに板バネ
状に形成された受熱部と、この受熱部と一体形成された
ファンケースと、このファンケースに支持されたファン
ユニットとを具備する冷却モジュールと、 を具備することを特徴とする電子機器。1. A main body, a circuit board built in the main body, on which electronic components that generate heat during operation are mounted, and a circuit board mounted on the circuit board and thermally connected to the electronic components, A cooling module including: a heat receiving portion formed in a leaf spring shape while transferring heat; a fan case integrally formed with the heat receiving portion; and a fan unit supported by the fan case. An electronic device characterized by.
は上記回路基板に固定されることを特徴とする請求項１
記載の電子機器。2. The heat receiving part has a fixing part, and the fixing part is fixed to the circuit board.
Electronic device described.
る流入口を有し、側面に上記流入口から流入された空気
を吐き出す吐出口が形成されたことを特徴とする請求項
１記載の電子機器。3. The electronic device according to claim 1, wherein the fan case has an inflow port for inflowing air on an upper surface, and an ejection port for ejecting air inflowing from the inflow port is formed on a side surface of the fan case. machine.
口は上記開口と対向することを特徴とする請求項３記載
の電子機器。4. The electronic device according to claim 3, wherein the main body has an opening on a side surface thereof, and the ejection port faces the opening.
を介して熱的に接続されることを特徴とする請求項４記
載の電子機器5. The electronic device according to claim 4, wherein the electronic component and the intermediate heating plate are thermally connected via a heat transfer member.
れた回路基板と、 上記回路基板に実装され、上記電子部品に熱的に接続さ
れて上記電子部品からの熱が伝熱されるとともに板バネ
状に形成された受熱部と、この受熱部と一体形成された
ファンケースと、このファンケースに支持されたファン
ユニットと、上記ファンケースの上面に設けられ空気を
流入する流入口と、上記ファンケースの側面に設けられ
上記流入された空気を吐き出す吐出口とを具備する冷却
モジュールと、 を具備することを特徴とする電子機器。6. A main body, a circuit board built in the main body, on which electronic components that generate heat during operation are mounted, and a circuit board mounted on the circuit board and thermally connected to the electronic components, The heat receiving portion formed in a leaf spring shape while transferring heat, the fan case integrally formed with the heat receiving portion, the fan unit supported by the fan case, and the air provided on the upper surface of the fan case are provided. An electronic device comprising: a cooling module having an inflow port for inflow and a discharge port provided on a side surface of the fan case for discharging the inflowing air.
は上記回路基板に固定されることを特徴とする請求項６
記載の電子機器。7. The heat receiving part has a fixing part, and the fixing part is fixed to the circuit board.
Electronic device described.
口は上記開口と対向することを特徴とする請求項６記載
の電子機器。8. The electronic device according to claim 6, wherein the main body has an opening on a side surface, and the ejection port faces the opening.
を介して熱的に接続されることを特徴とする請求項８記
載の電子機器。9. The electronic device according to claim 8, wherein the electronic component and the intermediate heating plate are thermally connected via a heat transfer member.
れた回路基板と、 上記回路基板に実装され、上記電子部品に熱的に接続さ
れて上記電子部品からの熱が伝熱されるとともに、上記
電子部品の実装高さに応じて実装方向に変位可能である
受熱部と、この受熱部と一体形成されたファンケース
と、このファンケースに支持されたファンユニットとを
具備する冷却モジュールと、 を具備することを特徴とする電子機器。10. A main body, a circuit board built in the main body, on which electronic components that generate heat during operation are mounted, and a circuit board mounted on the circuit board and thermally connected to the electronic components, A heat receiving portion that is capable of displacing heat in the mounting direction according to the mounting height of the electronic component, a fan case integrally formed with the heat receiving portion, and a fan unit supported by the fan case. An electronic device comprising: a cooling module comprising:
部は上記回路基板に固定されることを特徴とする請求項
１０記載の電子機器。11. The electronic device according to claim 10, wherein the heat receiving portion has a fixing portion, and the fixing portion is fixed to the circuit board.
する流入口を有し、側面に上記流入口から流入された空
気を吐き出す吐出口が形成されたことを特徴とする請求
項１０記載の電子機器。12. The electronic device according to claim 10, wherein the fan case has an inflow port through which air flows in, and a discharge port through which air that flows in from the inflow port is discharged through a side face. machine.
出口は上記開口と対向することを特徴とする請求項１２
記載の電子機器。13. The body according to claim 12, wherein the main body has an opening on a side surface, and the discharge port faces the opening.
Electronic device described.
材を介して熱的に接続されることを特徴とする請求項１
３記載の電子機器14. The electronic component and the heat receiving plate are thermally connected via a heat transfer member.
Electronic device according to 3
れた回路基板と、 上記電子部品に熱的に接続されて上記電子部品からの熱
が伝熱されるとともに板バネ状に形成された受熱部と、
この受熱部の一端に一体形成されたファンケースと、こ
のファンケースに支持されたファンユニットと、上記受
熱部の他端に一体形成され上記回路基板に固定される固
定部とを具備する冷却モジュールと、を具備し、 上記受熱板と上記固定部との境界もしくは上記受熱板と
上記ファンケースとの境界は少なくとも上記ファンケー
スの厚み寸法よりも薄く形成される事を特徴とする電子
機器。15. A main body, a circuit board built in the main body, on which electronic components that generate heat during operation are mounted, and a plate that is thermally connected to the electronic components to transfer heat from the electronic components and a plate. A heat receiving portion formed in a spring shape,
A cooling module including a fan case integrally formed at one end of the heat receiving portion, a fan unit supported by the fan case, and a fixing portion integrally formed at the other end of the heat receiving portion and fixed to the circuit board. And a boundary between the heat receiving plate and the fixed portion or a boundary between the heat receiving plate and the fan case is formed to be at least thinner than a thickness dimension of the fan case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002006849A JP3659634B2 (en) | 2002-01-16 | 2002-01-16 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002006849A JP3659634B2 (en) | 2002-01-16 | 2002-01-16 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003209211A true JP2003209211A (en) | 2003-07-25 |
| JP3659634B2 JP3659634B2 (en) | 2005-06-15 |
Family
ID=27645496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002006849A Expired - Lifetime JP3659634B2 (en) | 2002-01-16 | 2002-01-16 | Electronics |
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| Country | Link |
|---|---|
| JP (1) | JP3659634B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | Externally mounted heat abstractor |
| JP2007096088A (en) * | 2005-09-29 | 2007-04-12 | Nec Electronics Corp | Device and method for replacing electronic component |
| CN100349094C (en) * | 2005-02-01 | 2007-11-14 | 英业达股份有限公司 | Radiator structure |
| JP2008084215A (en) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | Electronic appliance and cooling component |
| CN100390703C (en) * | 2005-02-02 | 2008-05-28 | 英业达股份有限公司 | Radiator heat transfer portion structure |
| WO2014136266A1 (en) * | 2013-03-08 | 2014-09-12 | 株式会社 東芝 | Electronic device |
| JP2015083251A (en) * | 2015-02-04 | 2015-04-30 | 株式会社三洋物産 | Game machine |
| DE102006003563B4 (en) * | 2005-02-02 | 2016-04-07 | Denso Corporation | Fan for a semiconductor or the like |
| CN113612950A (en) * | 2021-08-02 | 2021-11-05 | 上海建晖信息科技有限公司 | Signal receiving device for digital broadcast television engineering |
-
2002
- 2002-01-16 JP JP2002006849A patent/JP3659634B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | Externally mounted heat abstractor |
| CN100349094C (en) * | 2005-02-01 | 2007-11-14 | 英业达股份有限公司 | Radiator structure |
| CN100390703C (en) * | 2005-02-02 | 2008-05-28 | 英业达股份有限公司 | Radiator heat transfer portion structure |
| DE102006003563B4 (en) * | 2005-02-02 | 2016-04-07 | Denso Corporation | Fan for a semiconductor or the like |
| JP2007096088A (en) * | 2005-09-29 | 2007-04-12 | Nec Electronics Corp | Device and method for replacing electronic component |
| JP2008084215A (en) * | 2006-09-28 | 2008-04-10 | Fujitsu Ltd | Electronic appliance and cooling component |
| WO2014136266A1 (en) * | 2013-03-08 | 2014-09-12 | 株式会社 東芝 | Electronic device |
| JP2014174979A (en) * | 2013-03-08 | 2014-09-22 | Toshiba Corp | Electronic apparatus |
| JP2015083251A (en) * | 2015-02-04 | 2015-04-30 | 株式会社三洋物産 | Game machine |
| CN113612950A (en) * | 2021-08-02 | 2021-11-05 | 上海建晖信息科技有限公司 | Signal receiving device for digital broadcast television engineering |
| CN113612950B (en) * | 2021-08-02 | 2024-04-30 | 上海建晖信息科技有限公司 | Signal receiving device for digital broadcast television engineering |
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|---|---|
| JP3659634B2 (en) | 2005-06-15 |
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