CN100349094C - Radiator structure - Google Patents
Radiator structure Download PDFInfo
- Publication number
- CN100349094C CN100349094C CNB2005100052011A CN200510005201A CN100349094C CN 100349094 C CN100349094 C CN 100349094C CN B2005100052011 A CNB2005100052011 A CN B2005100052011A CN 200510005201 A CN200510005201 A CN 200510005201A CN 100349094 C CN100349094 C CN 100349094C
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- Prior art keywords
- heat
- column
- conducting plate
- heating radiator
- radiator according
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 238000009434 installation Methods 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a radiator structure which is applied into an electronic device to carry out heat dissipation of a heating element of the electronic device. The present invention comprises a heat conducting part, a heat transferring part and a heat-dissipating fin group, wherein the heat conducting part comprises a heat conducting plate and a buckling shrapnel. One side of the heat conducting plate, which is combined with the heating element, is provided with at least one snap ring column and at least one locking hole column. One end of the heat transferring part and the heat conducting plate are in heat conducting combination, and the heat-dissipating fin group and the other end of the heat transferring part are in heat conducting combination. The present invention can use the snap ring column and the locking hole column of the heat conducting plate for supporting the buckling shrapnel and is fixedly clamped and fixedly locked on the snap ring column and the locking hole column by the buckling shrapnel to clamp a heating element, and thus, the heating surface of the heating element and the heat conducting plate can be in heat conducting combination.
Description
Technical field
The present invention relates to a kind of heating radiator of electronic installation, particularly relate to kind and be applied in the computing machine, in order to heating radiator to the euthermic chip heat transmission.
Background technology
Along with the calculation function and the speed of electronic components such as central processing unit (CPU) or display chip constantly promotes, the result of these electronic components high speeds or a large amount of computings, supervened the problem of high temperature, yet its working temperature of each electronic component all there is certain restriction.High temperature except meeting influences work efficiency, also may cause problems such as electronic component damage even burning for electronic component when serious, therefore the problem of heat radiation has become indispensable in a product design link.Calculate function in the following operate as normal of a normal temperature value in order to make, the use of heating radiator has become the indispensable necessary member of notebook computer.
As shown in Figure 1, it is an existing heat abstractor stereographic map, it mainly is made of a heat conducting module and a diffusing wind module, and wherein this heat conducting module is made up of a heat-conducting plate 211, a heat transfer part 23 and a radiating fin group 24, and the wind module 30 of should loosing is made of a fan and a blower-casting.Heat conducting module by heat-conducting plate with heater element (for example: central processing unit, display chip ... Deng) derive because of the heat energy that produced of work, and by heat transfer part (heat pipe, Heat Pipe) thermal energy transfer that heat-conducting plate is derived is to long-range radiating fin group, because the structure of radiating fin group is arranged in parallel by a plurality of fins and forms, therefore it can enlarge area of dissipation, the cooling air that produce by blower module this moment, the radiating fin group of this band heat energy is blowed and carries out heat interchange with these fins, again the hot gas that is produced after the heat interchange is discharged body, can reach the purpose of heat radiation.
The position that existing heat abstractor mainly is provided with, be positioned on the central processing unit or display chip on the motherboard, thereby with the heat-conducting plate of heat abstractor, closely heat conduction fits on the hot surface of central processing unit or display chip, to reach the effect of heat conduction and heat radiation.Yet present notebook computer, its usefulness to display adapter requires more and more high, and consideration for the adapter upgrading, the design of at present relevant display adapter, all tend to general just like desk-top computer, change the design of card insert type into, make existing heat abstractor therefore no longer suitable.
Summary of the invention
Fundamental purpose of the present invention, be to provide a kind of heating radiator, it can be applicable in the radiating module of an adapter, by enforcement of the present invention, make that radiating module not only can be with firm the fixing of adapter, can be because of not the carrying or move and damage of notebook computer, and can be with the display chip or the drawing chip of adapter, the heat energy that is produced when its work looses effectively and removes.
For achieving the above object, the invention provides a heating radiator, it comprises: a heat-conducting part, and a heat transfer part and a radiating fin group, and this heat-conducting part comprises: a heat-conducting plate and a fastening spring sheet.
The heat-conducting plate of heat-conducting part is the good metal plate of a heat conduction, its in order to electronic installation in the heater element operative connection, and its one side that combines with heater element is provided with at least one clasp column and at least one lockhole column.And the fastening spring sheet of heat-conducting part, by a pair of pressing plate and a pair of structural slab be combined into, this pressing plate is corresponding to each clasp column place, be equipped with one and collude the hole, and pressing plate then is provided with a locking hole corresponding to each lockhole column place, and described pressing plate is low and a shell fragment that both sides are high in the middle of.
Heat transfer part, one end and this heat-conducting plate operative connection in order to the heat energy that heat-conducting plate is derived, are passed to a radiating fin group further.The radiating fin group, the other end operative connection of itself and heat transfer part in order to heat transfer part is conducted the heat energy that, by the cooling air that blower module provided, can discharge it effectively.
Heat-conducting plate is by at least one clasp column and at least one this lockhole column, to support a fastening spring sheet, fixes and is locked on these columns with clamping one heater element by fastening spring sheet again, and make the heating face of this heater element, can operative connection in this heat-conducting plate.
By enforcement of the present invention, can be achieved as follows described effect at least:
1. by enforcement of the present invention, make adapter, can derive effectively and distribute because of the heat energy that work is produced.
2. by enforcement of the present invention, adapter and heat spreader structures firmly are combined as a whole.
3. by enforcement of the present invention, it is more simple and efficient that the operation that adapter is combined with heat spreader structures becomes.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is an existing heat abstractor three-dimensional exploded view.
Fig. 2 is the heat spreader structures stereographic map of present embodiment.
Fig. 3 is the stereographic map of a blower module and radiator supporting plate structure.
Fig. 4 is incorporated into the stereographic map of blower module and radiator supporting plate structure for the heat spreader structures of present embodiment.
Fig. 5 is the heat spreader structures of present embodiment and the three-dimensional exploded view of an adapter.
Fig. 6 is that the heat spreader structures of present embodiment combines figure with the solid of an adapter.
Fig. 7 is the A-A cut-open view of present embodiment heat spreader structures when combining with display card.
Wherein, Reference numeral:
The 20-heat spreader structures
The 21-heat-conducting part
The 23-heat transfer part
24-radiating fin group
The 211-heat-conducting plate
212-clasp column
The 213-ring groove
214-lockhole column
The 215-screw
The 216-fastening spring sheet
The 217-pressing plate
The 218-locking hole
219-colludes the hole
220-colludes hole portion
221-elongated hole portion
The 222-structural slab
The 30-blower module
The 40-radiator supporting plate structure
The 50-adapter
The 51-heater element
The 52-perforation
The 60-motherboard
The 61-slot
Embodiment
As shown in Figure 2, heat spreader structures stereographic map for present embodiment, it is applied in the electronic installation, its heater element (display chip or drawing chip) is dispelled the heat, it comprises: a heat-conducting part 21, one heat transfer part 23 and a radiating fin group 24, and heat-conducting part 21 comprises a heat-conducting plate 211 and a fastening spring sheet 216.
The heat-conducting plate 211 of heat-conducting part 21 is the good metal plate of a heat conduction, its in order to an electronic installation in heater element 51 operative connection, in order to the heat energy that this heater element 51 is produced because of work, derive effectively by the contact of heat-conducting plate 211 its faces, and this heater element is a display chip or a drawing chip.In order to conduct heat energy effectively, heat-conducting plate 211 is generally made with copper or aluminium material, and its heat-conducting effect is preferable.
For can be closely in conjunction with this heater element 51, so heat-conducting plate 211 itself and the one side that this heater element 51 combines, at least one clasp column 212 and at least one lockhole column 214 be provided with.The mode that these columns connect with the fourth of the twelve Earthly Branches, the fourth of the twelve Earthly Branches are connected on this heat-conducting plate 211, so that it can firmly combine with heat-conducting plate 211.And wherein clasp column 212 in its column near the upper limb place, be provided with the ring groove 213 of a level; Lockhole column 214 then is provided with a screw 215 in the top of its column.
Fastening spring sheet 216, by a pair of pressing plate 217 and a pair of structural slab 222 be combined intos, structural slab 222 is in order to support and to fix this pressing plate 217, and pressing plate 217 is low and a metal clips that both sides are high in the middle of, and pressing plate 217 its corresponding to each clasp column 212 place, be equipped with one and collude hole 219, and corresponding to each lockhole column 214 place, then be provided with a locking hole 218, again for fastening spring sheet 216 can be combined more easily with clasp column 212, be designed to include one and collude a hole portion 220 and an elongated hole portion 221 so will collude hole 219.
Heat transfer part 23, one end and this heat-conducting plate 211 operative connection are passed to a radiating fin group 24 further in order to the heat energy that heat-conducting plate 211 is derived, and this heat transfer part 23 is that a heat pipe (Heatpipe) is for best.
Radiating fin group 24, the other end operative connection of itself and heat transfer part 23, this radiating fin group 24 is made of perpendicular to this heat transfer part 23 and the fin that is arranged parallel to each other a plurality of, and each fin is one laminar.
As shown in Figure 3, be the stereographic map of a blower module and radiator supporting plate structure, as shown in Figure 4, be incorporated into the stereographic map of blower module and radiator supporting plate structure for the heat spreader structures of present embodiment.Learn by above icon, when the heat spreader structures 20 of present embodiment uses, support by radiator supporting plate structure 40, make heat-conducting plate 211 firmly to combine with heater element 51, the cooling air of heat transmission is provided by blower module 30 again, make the heat energy that concentrates on radiating fin group 24, can discharge effectively.
As shown in Figure 5, and for example shown in Figure 6 for the heat spreader structures of present embodiment and the three-dimensional exploded view of an adapter, for the heat spreader structures of present embodiment combines figure with the solid of an adapter.A wherein for example display adapter (VGA card) or drawing adapter (MXM card) etc. of this adapter 50, and the display chip of this adapter 50 or drawing chip are positioned at the below of this adapter 50.This adapter 50 is connected with motherboard 60 by slot (Slot) 61 who is located on the motherboard 60, and by the perforation of being located on this adapter 50 52, feasible clasp column 212 and the lockhole column of being located on the heat-conducting plate 211 214, can pass these perforation 52, relend afterwards and collude hole 219 by a fastening spring sheet 216, be sheathed on ring groove 213 places of clasp column 212 and combination, and again with the locking hole 218 of fastening spring sheet 216, aim at the screw 215 of lockhole column 214, and by the screw combination that locked.
When fastening spring sheet 216 is desired ring groove 213 in conjunction with clasp column 212, comprise a hole portion 220 and the elongated hole portion 221 of colluding because collude hole 219, therefore can be by the space of elongated hole portion 221, make and collude hole 219 to aim at the operation of clasp columns 212 more convenient.Again because the pressing plate 217 of fastening spring sheet 216, it is low and shell fragment that both sides are high in the middle of, dimension closes behind clasp column 212 when fastening spring sheet 216 1 ends collude, and the other end is when screw is locked in a lockhole column 214, this moment, shell fragment was oppressed and can produce tension force, by this tension force adapter 50 very firmly was fixed.
A-A cut-open view when combining with display card as shown in Figure 7, for the present embodiment heat spreader structures.By the heat spreader structures of present embodiment, can make the heating face of being located at heater element 51 on this adapter 50, with this heat-conducting plate 211 operative connection closely.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (8)
1, a kind of heating radiator is characterized in that, is applied in the electronic installation, in order to cooperate a diffusing wind module, dispels the heat with the heater element to described electronic installation, and it comprises:
One heat-conducting part, it comprises: a heat-conducting plate and a fastening spring sheet;
Described heat-conducting plate and the one side that described heater element combines are provided with at least one clasp column and at least one lockhole column;
Described fastening spring sheet is by a pair of pressing plate and a pair of structural slab be combined into, described pressing plate its corresponding to each described clasp column place, is equipped with one and colludes the hole, and it is corresponding to each described lockhole column place, then be provided with a locking hole, described pressing plate is low and a shell fragment that both sides are high in the middle of;
One heat transfer part, one end and described heat-conducting plate operative connection; And
One radiating fin group, the other end operative connection of itself and described heat transfer part;
Wherein said heat-conducting plate is by described clasp column and described lockhole column, to support described fastening spring sheet, and by described fastening spring sheet, fix and be locked on described clasp column and the described lockhole column and the described heater element of clamping, make the heating face of described heater element, can operative connection in described heat-conducting plate.
2, heating radiator according to claim 1 is characterized in that, described heat-conducting plate is a tabular.
3, heating radiator according to claim 1 is characterized in that, described heat-conducting plate is made with copper or aluminium material.
4, heating radiator according to claim 1 is characterized in that, the described clasp column and the described lockhole column fourth of the twelve Earthly Branches are connected to described heat-conducting plate.
5, heating radiator according to claim 1 is characterized in that, described heat transfer part is a heat pipe.
6, heating radiator according to claim 1 is characterized in that, described radiating fin group is made of perpendicular to described heat transfer part and the fin that is arranged parallel to each other a plurality of.
7, heating radiator according to claim 6 is characterized in that, described fin is one laminar.
8, heating radiator according to claim 1 is characterized in that, the described hole of colluding comprises a hole portion and the elongated hole portion of colluding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100052011A CN100349094C (en) | 2005-02-01 | 2005-02-01 | Radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100052011A CN100349094C (en) | 2005-02-01 | 2005-02-01 | Radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1815402A CN1815402A (en) | 2006-08-09 |
| CN100349094C true CN100349094C (en) | 2007-11-14 |
Family
ID=36907632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100052011A Expired - Fee Related CN100349094C (en) | 2005-02-01 | 2005-02-01 | Radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100349094C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422111A (en) * | 2001-11-29 | 2003-06-04 | 株式会社东芝 | Cooling apparatus with cooling fan and electronic equipment |
| JP2003209211A (en) * | 2002-01-16 | 2003-07-25 | Toshiba Corp | Electronic apparatus |
| CN2603431Y (en) * | 2003-01-17 | 2004-02-11 | 大众电脑股份有限公司 | Holder structure for CPU heat sink |
| CN2611970Y (en) * | 2003-03-27 | 2004-04-14 | 广达电脑股份有限公司 | Fixer of radiator |
-
2005
- 2005-02-01 CN CNB2005100052011A patent/CN100349094C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1422111A (en) * | 2001-11-29 | 2003-06-04 | 株式会社东芝 | Cooling apparatus with cooling fan and electronic equipment |
| JP2003209211A (en) * | 2002-01-16 | 2003-07-25 | Toshiba Corp | Electronic apparatus |
| CN2603431Y (en) * | 2003-01-17 | 2004-02-11 | 大众电脑股份有限公司 | Holder structure for CPU heat sink |
| CN2611970Y (en) * | 2003-03-27 | 2004-04-14 | 广达电脑股份有限公司 | Fixer of radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1815402A (en) | 2006-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Cheng Yi Inventor before: Yang Zhikai Inventor before: Wang Fenggu Inventor before: Zheng Yilun |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170412 Address after: Hebei city of Langfang province Xianghe County Shu Yang Industrial Park Fu District No. 477 Patentee after: Cheng Yi Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071114 Termination date: 20180201 |