CN100495292C - Radiator supporting plate structure - Google Patents
Radiator supporting plate structure Download PDFInfo
- Publication number
- CN100495292C CN100495292C CNB2005100645252A CN200510064525A CN100495292C CN 100495292 C CN100495292 C CN 100495292C CN B2005100645252 A CNB2005100645252 A CN B2005100645252A CN 200510064525 A CN200510064525 A CN 200510064525A CN 100495292 C CN100495292 C CN 100495292C
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- China
- Prior art keywords
- heat
- recess
- supporting plate
- plate structure
- heater element
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Abstract
The present invention relates to a radiator supporting plate structure, which is used for supporting radiating module of electronic device and can be used to make heat conduction for second heating element. Said supporting plate structure includes the following several portions: a flat plate; a first recessed portion and a second recessed portion, in which the flat plate is a metal plate; first recessed portion is set in the place of said flat plate which is correspondent to the heat-conducting plate of said radiating module; and second recessed portion is set in the second heating element place of said electronic device; and the bottom portion of said first recessed portion is equipped with an opening. Besides, said invention also provides its working principle.
Description
Technical field
The present invention is a kind of radiator supporting plate structure, is to be applied in the notebook computer, not only can support the heat-conducting plate of radiating module and can conduct the radiator supporting plate structure of the second heater element heat energy again.
Background technology
Most information electronic devices are for example: notebook computer; the electronic component of its inside since during duty regular meeting produce a large amount of heat energy; thereby cause the working temperature of this electronic component constantly to rise; and the working temperature of each electronic component all has a reasonable range; if there is not suitable heat radiation; to make this electronic component that overheated phenomenon take place; and cause its running that problem of unstable is arranged the time; when serious even can cause whole electronic installation generation work to stop or the situation of the machine of delaying; and along with its arithmetic speed of various electronic components improves constantly; the heat energy that it produced also constantly improves, so the design of radiating module, promptly becomes an important problem.
The position that general radiating module mainly is provided with is the main heater element place that is arranged at electronic installation, and the heat-conducting plate of radiating module closely heat conduction fit on the hot surface of this heater element, can reach the effect of heat conduction.With general notebook computer, central processing unit, north bridge chips, South Bridge chip and display chip etc. are main heater element, because therefore usually a large amount of computing and the work of those chips also produced many heat energy.
Modern consumer, raise day by day for the usefulness of mobile computer display card and the flexible demand of upgrading, therefore the design of display card, broken away from the past only design on motherboard notion and trend towards the same with desk-top computer, display card is designed to the cassette design that can plug, so the position of display card will can be not in the same plane with central processing unit, South Bridge chip or north bridge chips etc.Because the characteristic of notebook computer slimming, in order to dwindle the space that the plug type display card is installed, the design of its plug-in card mode, different with desk-top computer in the mode of vertical insertion motherboard slot, but be inserted in the slot of motherboard with level, therefore how to solve the problem that plug-in shows the heat radiation of khaki display chip, also just become a problem that must overcome.
Summary of the invention
The present invention's fundamental purpose, be that a radiator supporting plate structure will be provided, it not only can support the heat-conducting plate of radiating module, and can conduct the heat energy of second heater element again, when it is applied in the notebook computer, except can be to the display chip heat radiation, can also its second recess, to second heater element for example: north bridge chips etc., carry out heat conduction.
For realizing above-mentioned purpose, the invention provides a radiator supporting plate structure, it comprises: flat board, first recess and second recess.This flat board is a sheet metal, first recess is arranged at the heat-conducting plate place that this flat board corresponds to this radiating module, first recess is mainly in order to hold a heat-conducting plate, make this heat-conducting plate can obtain good supporting, the bottom of other first recess is provided with an opening, and this opening can be in order to the heat pipe (Heat Pipe) that holds radiating module.Second recess then is arranged at the second heater element place of this electronic installation, uses in order to second heater element is carried out heat conduction.This first recess and second recess form in the mode of punching press flat board.
Enforcement by the present invention, this first recess can be in order to support the heat-conducting plate of radiating module, make this heat-conducting plate carry out heat conduction to first heater element of being located on the interface card, contact with second heater element on being located at motherboard according to second recess again, also can carry out heat conduction, so the present invention has the double effects that supports heat-conducting plate and second heater element is carried out heat conduction to second heater element.Because heating radiator is located between the heater element on opposite, two sides, therefore can significantly dwindle occupation space, and the approach of the thermal energy conduction of heater element carries out between interface card and motherboard, do not cause the product surface temperature too high so can directly not shed.
By the present invention's enforcement, can realize effect what follows at least:
1. by the present invention's enforcement, can reach the effect that supports the radiating module heat-conducting plate.
2. by the present invention's enforcement, can reach the effect of the conduction second heater element heat energy.
For feature, purpose and function to the present invention have further cognition and understanding, conjunction with figs. is described in detail as follows now.
Description of drawings
Fig. 1 is the stereographic map of present embodiment radiator supporting plate structure.
Fig. 2 is the stereographic map of present embodiment radiator supporting plate structure and radiating module.
Fig. 3 is the three-dimensional exploded view of present embodiment radiator supporting plate structure and display interface card and motherboard.
Fig. 4 is that the present embodiment radiator supporting plate structure combines figure with display interface card and the solid of motherboard.
Fig. 5 is the A-A sectional view that present embodiment radiator supporting plate structure and display interface card and motherboard combine the back.
The main element description of symbols
212 clasp columns
213 ring grooves
214 lockhole columns
215 screws
216 fastening spring sheets
218 locking holes
219 dog holes
22 heat-conducting plates
23 heat pipes
40 radiator supporting plate structures
41 flat boards
42 first recesses
43 second recesses
44 openings
50 interface cards
51 first heater elements
52 perforation
60 motherboards
61 slots
62 second heater elements
Embodiment
As shown in Figure 1, this figure is the stereographic map of present embodiment radiator supporting plate structure, this structure is used for an electronic installation, in order to the heat-conducting plate (22) of the radiating module that supports this electronic installation and can carry out heat conduction usefulness to second heater element (62), it comprises: dull and stereotyped (41), first recess (42) and second recess (43).This electronic installation can be notebook computer, multimedia player, desk-top computer or server etc. in addition.
This flat board (41) is a sheet metal, and it is good and by the made sheet metal of stainless steel in particular for a heat conduction, because therefore the ductility of metal material can utilize the integrally formed mode of punching press, makes it form first recess (42) and second recess (43).
The radiator supporting plate structure of this embodiment, when only second heater element (62) being carried out heat conduction, its bottom surface according to second recess (43) is carried out heat conduction with the hot surface of this second heater element (62) and is contacted, so this first recess (42) does not need opening (44).
The radiator supporting plate structure of this present embodiment, its be used to support an electronic installation radiating module heat-conducting plate (22) and second heater element (62) is carried out the heat conduction time spent, the position of the depression of first recess (42), being arranged at flat board (41) upward locates corresponding to the heat-conducting plate (22) of radiating module, and first recess (42) is mainly in order to hold this heat-conducting plate (22), and make this heat-conducting plate (22) after obtaining excellent support, can closely be located at first heater element (51) operative connection that interface card (50) is gone up with one, this first heater element (51) is meant display chip or graphic chips especially.
For make heat-conducting plate (22) can be located at first heater element (51) that interface card (50) goes up operative connection closely, so cup depth of this first recess (42), approximate the thickness of this heat-conducting plate (22), so edge will be in same elevation plane with the top of this first recess (42) on this heat-conducting plate (22), and make display chip or graphic chips can with smooth the combining of heat-conducting plate (22), the concave shape and the area of other first recess (42) will reach the degree that can hold this heat-conducting plate (22).In order to make heat pipe (23) combination smoothly that links this heat-conducting plate (22),, be provided with an opening (44), and this opening (44) can hold this heat pipe (23) therefore in the bottom of this first recess (42).
Second recess (43), be arranged at electronic installation with second heater element (62) corresponding section, wherein this second heater element (62) is a kind of in central processing unit, South Bridge chip, north bridge chips or the display chip.For make second recess (43) closely operative connection in second heater element (62).When therefore designing, with the cup depth of this second recess (43), just the bottom of second recess (43) is designed to the hot surface that just in time heat conduction fits in this second heater element (62).
Fig. 2 is the stereographic map of present embodiment radiator supporting plate structure and radiating module, Fig. 3 is the three-dimensional exploded view of present embodiment radiator supporting plate structure and display interface card and motherboard, Fig. 4 is that the present embodiment radiator supporting plate structure combines figure with display interface card and the solid of motherboard, Fig. 5 is the A-A sectional view that present embodiment radiator supporting plate structure and display interface card and motherboard combine the back, learn by above diagram, the radiator supporting plate structure of present embodiment (40) can be used in conjunction with motherboard (60), and second heater element (62) that this motherboard (60) is gone up carries out heat conduction, can support heat-conducting plate (22) again, heat-conducting plate (22) can be combined with interface card (50), and to first heater element (51) of this interface card (50) just display chip or graphic chips dispel the heat, and this interface card (50) is display interface card (VGA card) or GUI card (MXM card).
During use, at first the radiator supporting plate structure with the present invention combines with radiating module, then will be locked on the motherboard (60) in conjunction with the radiator supporting plate structure and the radiating module of back, second recess (43) of radiator supporting plate structure this moment (40), just in time fitted in second heater element (62) that this motherboard (60) is gone up, this second heater element (62) refers in particular to north bridge chips, first concave surface because of side under the heat-conducting plate (22) and radiator supporting plate structure (40) fits tightly again, therefore the heat energy of north bridge chips is by the conduction of second recess (43), can conduct to first recess (42), and conduct to heat-conducting plate (22) by first recess (42) again, and further dispel the heat by radiating module.
Then interface card (50) is connected with motherboard (60) by a slot (Slot) (61), and interface card (50) is according to being located at the last perforation (52) of this interface card (50), feasible clasp column (212) and the lockhole column (214) of being located at heat-conducting plate (22), can pass these perforation (52), then with the dog hole (219) of a fastening spring sheet (216), the ring groove (213) that is sheathed on clasp column (212) is located, again with the locking hole (218) of fastening spring sheet (216), aim at the screw (215) of lockhole column (214), at last by the screw combination that locked.So far make that the heat-conducting plate (22) that is positioned at first recess (42) can fit tightly with the display chip or the graphic chips of interface card (50), thereby can dispel the heat this display chip or graphic chips.Therefore pass through the enforcement of present embodiment radiator supporting plate structure (40), can make second heater element (62) of being located at last first heater element (51) of interface card (50) and being located at motherboard (60), with the heat conduction of carrying out of time, at last again by radiating module to dispel the heat.
The above only is the present invention's preferred embodiment, when not limiting the scope of the invention with it.I.e. equivalent variations and the improvement of being done according to the present patent application claim generally, the main idea place that will not lose the present invention, the spirit and the scope that also do not break away from the present invention, the former capital should be considered as the present invention's further enforcement situation.
Claims (6)
1. radiator supporting plate structure, this structure are used to support one of electronic installation radiating module and one second heater element are carried out heat conduction usefulness, it is characterized in that comprising:
One flat board is a sheet metal;
One first recess is arranged at this flat board and corresponds to one of this radiating module heat-conducting plate place, and it is in order to hold this heat-conducting plate; And
One second recess is arranged at the second heater element place of this electronic installation, and wherein this heat-conducting plate and this second heater element lay respectively at the relative both sides of this flat board.
2. the radiator supporting plate structure according to claim 1 is characterized in that the cup depth of described first recess, equals the thickness of this heat-conducting plate.
3. the radiator supporting plate structure according to claim 1 is characterized in that the concave shape and the area of described first recess can holding this heat-conducting plate.
4. the radiator supporting plate structure according to claim 1 is characterized in that described first recess and this flat board are integrally formed.
5. the radiator supporting plate structure according to claim 1 is characterized in that the cup depth of described second recess, just in time makes the bottom of second recess, and heat conduction fits in the hot surface of second heater element.
6. the radiator supporting plate structure according to claim 1 is characterized in that described first recess further is provided with an opening, and the length of this opening and width can hold the heat pipe of radiating module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100645252A CN100495292C (en) | 2005-04-13 | 2005-04-13 | Radiator supporting plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100645252A CN100495292C (en) | 2005-04-13 | 2005-04-13 | Radiator supporting plate structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1848037A CN1848037A (en) | 2006-10-18 |
| CN100495292C true CN100495292C (en) | 2009-06-03 |
Family
ID=37077625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100645252A Expired - Fee Related CN100495292C (en) | 2005-04-13 | 2005-04-13 | Radiator supporting plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100495292C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340797B (en) * | 2007-07-04 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Heat radiating device |
-
2005
- 2005-04-13 CN CNB2005100645252A patent/CN100495292C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1848037A (en) | 2006-10-18 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090603 Termination date: 20210413 |