CN101340797B - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101340797B CN101340797B CN2007100763915A CN200710076391A CN101340797B CN 101340797 B CN101340797 B CN 101340797B CN 2007100763915 A CN2007100763915 A CN 2007100763915A CN 200710076391 A CN200710076391 A CN 200710076391A CN 101340797 B CN101340797 B CN 101340797B
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- heat
- plate
- absorber plate
- conducting plate
- absorber
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Abstract
The present invention provides a heat dissipation device which is used for the heat dissipation of a plurality of heating electronic elements on an additional card; wherein, the heat dissipation device comprises a heat adsorbing plate which is arranged on a main heating electric element and a plurality of heat dissipation fins which are formed on the heat absorbing plate; a heat guiding plate is connected with the heat absorbing plate and is covered on other electronic elements, wherein clearance is formed between the heat guiding plate and the heat absorbing plate for piercing of the other elements. Compared with the prior art, the heat dissipation type of the invention that the heat guiding plate is combined with the heat absorbing plate and a plurality of space areas formed between the heat guiding plate and the heat absorbing plate and used for the piercing of elements on the additional card lead the heat guiding plate and the heat absorbing plate to better dissipate the head of the electronic element.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly can be used for the heat abstractor of additional card.
Background technology
Along with technology such as high frequency imaging processing in recent years, wireless telecommunications constantly develop, calculate function and fast, directly use latest technology for making, the additional card that comprises video card, video image card (VGA card) is installed in usually and is used for improving its arithmetic speed, operational capacity in the computer apparatus.For example image card generally comprises an independent processor, is called image processor (GPU), and memory and other circuit elements together are assembled on the circuit board.Be installed in electronic component on the various cards such as GPU and memory on every side thereof and produce a large amount of heats, as can not efficiently radiates heat influencing the normal operation of image card.Therefore, common mounted on surface one heat abstractor at electronic component dispels the heat.
Traditional heat abstractor adopts the mode of a radiator in conjunction with a heat absorption base plate usually, but because the height difference of electronic component on the additional card, perhaps since electronic component with its on every side some other elements have difference in height, a complete heat absorption base plate can not well be sticked on electronic component, thereby influence the heat radiation of electronic component, and make an energy and the fine absorber plate processing difficulties that contacts of the equal energy of differing heights electronic component.
Summary of the invention
In view of this, be necessary in fact to provide a kind of can be simultaneously to the heat abstractor of a plurality of electronic element radiatings and good heat dissipation effect.
A kind of heat abstractor, be used for the heat radiation of some heat-generating electronic elements on the additional card, wherein this heat abstractor comprises that one places the absorber plate on the main heat-generating electronic elements and is formed at some radiating fins on the absorber plate, one heat-conducting plate is connected with described absorber plate and is covered on other electronic components, forms the gap that wears for other elements between described heat-conducting plate and absorber plate.
Compared with prior art, the present invention is by the radiating mode of heat-conducting plate in conjunction with absorber plate, and the some area of space of formation wear for the element on the additional card between heat-conducting plate and absorber plate, make heat-conducting plate and absorber plate can better be electronic element radiating.
With reference to the accompanying drawings, the invention will be further described in conjunction with concrete execution mode.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the enlarged drawing of heat-conducting plate among Fig. 1.
Fig. 3 is the constitutional diagram of Fig. 1.
Fig. 4 is that additional card is taken out the inverted stereogram in back among Fig. 3.
Fig. 5 is a support bracket fastened stereogram among Fig. 4.
Embodiment
Seeing also Fig. 1, is an embodiment of heat abstractor of the present invention.This heat abstractor comprises a fixed support 10, a radiator 30 and two heat-conducting plates 71,75 that match with radiator 30.This heat abstractor is installed on the additional card 50 of a computer housing (figure does not show) lining, makes above-mentioned heat-conducting plate 71,75 and radiator 30 be attached on the heat-generating electronic elements 52,53,54 of additional card 50, so that its heat is distributed.Simultaneously, the two ends of said fixing support 10 are connected with radiator 30 and cabinet respectively, so that a part of weight of radiator 30 is shared on the cabinet, alleviate the strength that additional card 50 is born.In the present embodiment, fixed support 10 is mainly used in the weight of sharing radiator 30, avoids owing to the radiator 30 overweight additional card 50 that cause are out of shape; In other embodiments, can omit other elements that fixed support 10 keeps heat abstractor according to behaviour in service.
One end of additional card 50 is equiped with a mounting panel 51, and an end of this mounting panel 51 is provided with flanging 510.This flanging 510 is in order to fixedly connected with a panel of cabinet and the appropriate section of fixed support 10.Interlacing at a side surface of additional card 50 is provided with two main heat-generating electronic elements 52, is distributed with some other electronic components 53,54 around the main heat-generating electronic elements 52. Electronic component 52,53 and 54 around all offer some through holes 56, in order to fixed heat sink 30.
Please consult Fig. 3 and Fig. 4 simultaneously, this radiator 32 comprise somely be parallel to each other, spaced radiating fin 322, at its opposite end one breach 320 (as shown in Figure 1) is set respectively, breach 320 tops form a stage portion 324.Some heat pipes 40 connect absorber plate 34 and radiating fin 322.
Described two absorber plates 34 cooperate with radiator 32 and are positioned at its bottom, are placed on respectively on two diagonal angles at two ends, radiating fin 322 bottom surface, roughly are " worker " font.The end face 342 of this absorber plate 34 is provided with along the semi-circular recesses 344 that laterally runs through absorber plate 34, and this groove 344 cooperates with radiator 32, is used for accommodating heat pipe 40.On four jiaos that this absorber plate 34 protrudes out, respectively be provided with a screwed hole 346, all form a concave surface with bottom surface and heat-conducting plate 71,75 junctions that screwed hole 346 relative sides offer three screwed holes 348 and each screwed hole 348 respectively on three angles that link to each other.After the radiator 32 of radiator 30 and absorber plate 34 combine by welding or mode such as bonding, screw passed additional card 50 through hole 56 all around, and was combined in four screwed holes 346 on the absorber plate 34, thereby radiator 30 is fixed to additional card 50.At this moment, the lower surface of absorber plate 34 contacts with main heat-generating electronic elements 52 on the additional card 50, to absorb the heat that main heat-generating electronic elements 52 produces; And the electronic component 52,53 around the main heat-generating electronic elements 52 and 54 the heat that produces can be dispersed in the surrounding environment by heat-conducting plate 71,75 and go.
Please consult Fig. 2 simultaneously, heat-conducting plate 71 is the U-shaped framework of a side opening, and this framework is surrounded by three roughly rectangular bodies 711,712,713, and two adjacent bodies 711 are connected with 713 head and the tail with 712,712 and mutual vertical.
Body 712 two ends and body 711,713 places of intersecting vertically offer an installing hole 714, one cantilevers 715 respectively and outwards protrude out from these body 712 1 end inboards.On a jiao of these body 711 outermost end, offer an installing hole 714, rely on the direction of body 713 at relative with installing hole 714 one jiao, extended spot goes out an extension board 716 obliquely.Medial extremity offers a U-lag at the middle part of this body 711, and a cantilever 715 protrudes out from the inner side edge of this U-lag.This U-lag is used for preventing that the heat pipe 40 on body 711 and the radiator 32 from interfering.
The outermost end of the body 713 relative with above-mentioned body 711 stretches out and forms one and protrude out from this inboard, lamellar body 717 top than body 713 wide square lamellar body 717, one cantilevers 715.In above-mentioned body 711,712,713 and electronic component 53,54 contact positions, the square heat-conducting glue 718 that has been sticked respectively is used for contacting with electronic component 53,54.The top of described each cantilever 715 offers the installing hole 7152 that matches with the screwed hole 348 of the absorber plate 34 of radiator 30.The top of described cantilever 715 is contained in the concave surface of absorber plate 34 bottom surfaces.With absorber plate 34 bonding or be welded on the radiator 32 after, retaining element such as screw etc. pass installing hole 7152 on the heat-conducting plate 71 and the screwed hole 348 on the absorber plate 34, heat-conducting plate 71 is fixed on the nearer absorber plate 34 of the mounting panel 51 of additional card 50, again screw is fixed on radiator 30 and heat-conducting plate 71 on the additional card 50 by the installing hole 714 on corresponding through hole 56, the heat-conducting plate 71 on the additional card 50 and the screwed hole 346 on the absorber plate 34 and contacts, absorb the heat that it distributes with electronic component 52,53,54.
Heat-conducting plate 75 is the L shaped plate body, and structure is similar to heat-conducting plate 71, is made up of the two vertical rectangular body 751,752 that link to each other.
Offer an installing hole 753 on one jiao of body 751 outermost end, relative with installing hole 753 one jiao obliquely extended spot go out an extension board 754, a downward depressed part is set at the middle part of this body 751, a cantilever 755 protrudes out from this depressed part inside edge.This depressed part cooperates with the heat pipe 40 of radiator 30, prevents heat-conducting plate 75 and heat pipe 40 interference.
The medial extremity of body 752 is provided with an installing hole 753 for one jiao, obliquely on one jiao of its outermost end has protruded out a lug outward, and an installing hole 753 is arranged on this lug, and a cantilever 755 is arranged at this body 752 inboards.The top of described each cantilever 755 offers the installing hole 7552 that matches with the screwed hole 348 of the absorber plate 34 of radiator 30, and the top of described cantilever 755 is contained in the concave surface of absorber plate 34 bottom surfaces.Same, with absorber plate 34 bonding or be welded on the radiator 32 after, retaining element such as screw etc. pass installing hole 7552 on the heat-conducting plate 75 and the screwed hole 348 on the absorber plate 34, and heat-conducting plate 75 is fixed on the mounting panel 51 of additional card 50 absorber plate 34 far away.Again screw is fixed on electronic component 52,54 surfaces of additional card 50 by installing hole 753 and the screwed hole 346 on the absorber plate 34 on corresponding through hole 56, the heat-conducting plate 75 on the additional card 50 with radiator 30 and heat-conducting plate 75, thereby absorbs the heat that it distributes.
Please further consult Fig. 4, after heat-conducting plate 71,75 and radiator 30 are fixed on the additional card 50,34 of heat-conducting plate 71,75 and absorber plates form some spaces, and this space is used for holding other elements (figure does not show) that are higher than electronic component 52,53,54 on the additional card 50.When electronic component 52 and electronic component 53,54 were not contour, this two heat-conducting plate 71,75 also can be adjusted its thickness as required and come good contact the with electronic component 53,54.
Be appreciated that ground, heat-conducting plate the 71, the 75th is used for electronic component 53,54 heat radiations, and its shape is decided according to the distribution situation of electronic component 53,54.
This heat abstractor further comprises two bracing frames 90 of the opposite side that is positioned at additional card 50, and this bracing frame 90 is used for supporting additional card 50 and prevents that it is stressed overweight and be out of shape.This bracing frame 90 is cross, respectively is provided with a through hole 902 on four jiaos, and the through hole 56 that wears on the additional card 50 for screw combines with the screwed hole 346 of 34 4 jiaos of absorber plates, and absorber plate 34 is fixed on the additional card 50.50 of bracing frame 90 and additional card are provided with some cylindrical isolating pad 904, when this radiator 30 is subjected to external force when vibrations so that cushioning effect to be provided.
Please further consult Fig. 4 and Fig. 5, fixed support 10 comprises one first fixture 11 and one second fixture 15, and this first fixture 11 and second fixture 15 are the sheet body structure of continuous bending.
Second fixture, 15 shapes are similar to first fixture 11, comprise a junction 151, a ribs 153 and a fixed part 155.Wherein, connecting portion 151 is installed on the radiating fin 322 side adjacent with first fixture 11, and the outermost of its connecting portion 151 elongated ends is roughly concordant with the outer end of heat abstractor.Fixed part 155 shapes are identical with the fixed part 115 of first fixture 11.Fixed part 115 overlapping settings with the fixed part 155 and first fixture 11 of second fixture 15, and pass the flanging 510 of the mounting panel 51 of said fixing portion 115,155 and additional card 50 with screw etc., first fixture 11 and second fixture 15 are fixed on the cabinet, have further guaranteed the stable of fixed support 10.
Be appreciated that ground, the fixed part 115 of first fixture 11 and second fixture 15 and 155 shape, can change as required, only need reach the purpose that together first fixture 11 and second fixture 15 is installed on the cabinet with the flanging 510 of the mounting panel 51 of additional card 50 and get final product.
Claims (10)
1. heat abstractor, be used for the heat radiation of some heat-generating electronic elements on the additional card, it is characterized in that: this heat abstractor comprises that one places the absorber plate on the main heat-generating electronic elements and is formed at some radiating fins on the absorber plate, one heat-conducting plate is connected with described absorber plate and is covered on other electronic components, forms the gap that wears for other elements between described heat-conducting plate and absorber plate.
2. heat abstractor as claimed in claim 1 is characterized in that: described heat-conducting plate is located in the absorber plate periphery, and described radiating fin places described absorber plate and heat-conducting plate end face.
3. heat abstractor as claimed in claim 2, it is characterized in that: each heat-conducting plate is formed by connecting by some strip bodies, and each body inboard all protrudes out a cantilever that links to each other with absorber plate, and described cantilever makes and is formed with described gap between body and the absorber plate at interval.
4. heat abstractor as claimed in claim 3 is characterized in that: described heat-conducting plate is the U-shaped of an end opening.
5. heat abstractor as claimed in claim 3 is characterized in that: described heat-conducting plate is L-shaped.
6. heat abstractor as claimed in claim 2 is characterized in that: also comprise some heat pipes, described heat pipe connects described absorber plate and radiating fin.
7. heat abstractor as claimed in claim 6 is characterized in that: described each heat pipe comprises that one is located in a heat transfer segment between absorber plate, heat-conducting plate and the fin and penetrates another heat transfer segment of described fin.
8. heat abstractor as claimed in claim 7 is characterized in that: offer a groove of the described heat transfer segment of ccontaining heat pipe on the described absorber plate, offer the depressed part of ccontaining heat pipe on the described heat-conducting plate.
9. heat abstractor, comprise that one is used to place the absorber plate on the main heat-generating electronic elements, it is characterized in that: this heat abstractor comprises that also one is used to place the heat-conducting plate on other heat-generating electronic elements, this heat-conducting plate extends setting along the periphery of absorber plate, and heat-conducting plate comprises at least two bodies, this two body connects and is positioned at two ipsilaterals not of this absorber plate successively, forms the gap that wears for other elements between described heat-conducting plate and absorber plate, forms some radiating fins on this absorber plate.
10. heat abstractor as claimed in claim 9 is characterized in that: be convexly equipped with a cantilever respectively on two bodies of this heat-conducting plate, this cantilever embeds in the absorber plate, and described cantilever makes and is formed with described gap between body and the absorber plate at interval; This heat abstractor also comprises the plurality of fixed element, and described plurality of fixed element passes a cantilever respectively and removably is fixed in the absorber plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100763915A CN101340797B (en) | 2007-07-04 | 2007-07-04 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100763915A CN101340797B (en) | 2007-07-04 | 2007-07-04 | Heat radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101340797A CN101340797A (en) | 2009-01-07 |
| CN101340797B true CN101340797B (en) | 2011-08-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100763915A Expired - Fee Related CN101340797B (en) | 2007-07-04 | 2007-07-04 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101340797B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873786A (en) * | 2009-04-23 | 2010-10-27 | 富准精密工业(深圳)有限公司 | Heat sink |
| JP5234375B2 (en) * | 2011-03-23 | 2013-07-10 | カシオ計算機株式会社 | Cooling device and projector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435880A (en) * | 2002-01-30 | 2003-08-13 | 广达电脑股份有限公司 | Radiator assembly and radiator assembly fixing devcie |
| US6671177B1 (en) * | 2002-10-25 | 2003-12-30 | Evga.Com Corporation | Graphics card apparatus with improved heat dissipation |
| CN1549675A (en) * | 2003-05-21 | 2004-11-24 | 广达电脑股份有限公司 | Functional module and producing method thereof |
| CN1848037A (en) * | 2005-04-13 | 2006-10-18 | 英业达股份有限公司 | Radiator supporting plate structure |
-
2007
- 2007-07-04 CN CN2007100763915A patent/CN101340797B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435880A (en) * | 2002-01-30 | 2003-08-13 | 广达电脑股份有限公司 | Radiator assembly and radiator assembly fixing devcie |
| US6671177B1 (en) * | 2002-10-25 | 2003-12-30 | Evga.Com Corporation | Graphics card apparatus with improved heat dissipation |
| CN1549675A (en) * | 2003-05-21 | 2004-11-24 | 广达电脑股份有限公司 | Functional module and producing method thereof |
| CN1848037A (en) * | 2005-04-13 | 2006-10-18 | 英业达股份有限公司 | Radiator supporting plate structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101340797A (en) | 2009-01-07 |
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Granted publication date: 20110831 Termination date: 20140704 |
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