CN1979822A

CN1979822A - Radiating apparatus

Info

Publication number: CN1979822A
Application number: CNA2005101021097A
Authority: CN
Inventors: 彭学文
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-12-01
Filing date: 2005-12-01
Publication date: 2007-06-13
Anticipated expiration: 2025-12-01
Also published as: CN100464408C

Abstract

The heat sink includes a heat conducting plate (HCP) contacted to electronic components, and thermal fin set composed of thermal fins. There is a flute setup on one side of HCP. The heat sink also includes a bent heat pipe divided into three sects. The first heat transfer sect is accommodated in the said flute. Two pieces of second heat transfer sect are from two ends of the first heat transfer sect bent and extended to direction apart from HCP. The third heat transfer sects are from second heat transfer sects bent and extended to direction towards to HCP. Second heat transfer sect and third heat transfer sect are heat-connected to thermal fin set respectively. In the invention, bending arrangement increases contact area between heat pipe and thermal fin set so as to raise effect of heat elimination. Cost of one piece of bent pipe is close to cost of one piece of U type heat pipe. Thus, the invention possesses high ratio between performance and cost.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.

[background technology]

Produce a large amount of heats during electronic component (as central processing unit) operation, and itself and system temperature are raise, cause the decline of its runnability then.For guaranteeing that electronic component can normally move, heat abstractor is installed on electronic component usually, discharge the heat that it produces.

Figure 1 shows that a kind of traditional heat abstractor, this heat abstractor comprises a radiator 10, is located at a groups of fins 20 at radiator 10 tops, and with radiator 10 and groups of fins 20 hot linked U type heat pipes 30.Radiator 10 comprises a pedestal 12 and is located at some radiating fins 16 on this pedestal 12 that pedestal 12 is provided with the groove 14 of ccontaining heat pipe.Groups of fins 20 is stacked gradually by some fin that are parallel to each other 22 to be formed, and which is provided with a pair of through hole 24.Heat pipe 30 comprises an evaporation section 32 and a pair of condensation segment 34 that extends from the bending of evaporation section 32 two ends.The evaporation section 32 of heat pipe 30 is placed in the groove 14 on the pedestal 12, and its condensation segment 34 is arranged in respectively in the through hole 24 on the groups of fins 20.This heat abstractor in use, pedestal 12 contacts with electronic component such as central processing unit etc., and absorbs the heat of its generation.The heat part that pedestal 12 absorbs passes to the radiating fin 16 on it and is dispersed in the surrounding environment, and another part heat is dispersed in the surrounding environment after being delivered to groups of fins 20 by heat pipe 30.Heat pipe 30 has fabulous heat conductivity, and the heat that its evaporation section 32 can be absorbed is delivered to its condensation segment 34 fast.Yet, have only two condensation segments 34 of heat pipe 30 to contact with groups of fins 20, heat transfer area between heat pipe 30 and the fin 22 is less, and heat pipe 30 can not evenly and apace be delivered to entire heat dissipation sheet group 20 with the heat that absorbs, and causes failing to make full use of groups of fins 20 and dispels the heat.

For promoting the heat dispersion of traditional heat-dissipating device, can pass through to increase the quantity of heat pipe to increase the contact area between heat pipe and the groups of fins.Yet the quantity that increases heat pipe will cause the cost of traditional heat-dissipating device to increase.The performance and the benefit cost ratio of traditional heat-dissipating device are lower.

[summary of the invention]

In view of this, be necessary to provide a kind of improved heat abstractor.

A kind of heat abstractor, comprise a heat-conducting plate that contacts with electronic component and be positioned at this heat-conducting plate top, a groups of fins of forming by some fin, this heat-conducting plate one side is provided with groove, wherein this heat abstractor also comprises the heat pipe that a bending is provided with, this heat pipe comprises one first heat transfer segment in the groove that is placed on the heat-conducting plate, go out from first heat transfer segment two ends bendings and to 2 second heat transfer segment of extending away from the heat-conducting plate direction, and one the 3rd heat transfer segment that goes out from one second heat transfer segment bending and extend to heat-conducting plate, second of heat pipe, the 3rd heat transfer segment respectively with the groups of fins hot link.

Compared to prior art, the heat pipe that described heat abstractor utilization bending is provided with increases the contact area between heat pipe and the groups of fins, can make full use of the fin heat radiation, thereby promotes the radiating effect of heat abstractor; And the cost of the heat pipe of a bending setting is close with a U type heat pipe, so heat abstractor of the present invention has higher performance and benefit cost ratio.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of traditional heat-dissipating device.

Fig. 2 be heat abstractor one embodiment of the present invention three-dimensional assembly diagram.

Fig. 3 is the part exploded view of heat abstractor among Fig. 2.

Fig. 4 is the three-dimensional exploded view of Fig. 2.

Fig. 5 is the part assembly drawing of heat pipe and a fin among Fig. 2.

Fig. 6 is heat pipe and the fin assembling figure among another embodiment of heat abstractor of the present invention.

[embodiment]

Seeing also Fig. 2 to 4, is the stereogram of heat abstractor one embodiment of the present invention.This heat abstractor comprise a rectangle heat-conducting plate 100, be located at a radiator 200, a groups of fins 300 and a heat-conduction component on the heat-conducting plate 100 as the heat pipe 400 of two settings, this heat pipe 400 is with heat-conducting plate 100, radiator 200 and groups of fins 300 hot links.Heat-conducting plate 100 and radiator 200 are by the good material of heat conductivility, make as metallic copper or aluminium etc.

Heat-conducting plate 100 comprises a bottom 110 and the top 120 relative with bottom 110.Wherein, bottom 110 contacts as central processing unit 500 grades that are located on the circuit board 600 with electronic component.The a pair of groove that is parallel to each other 122 is located at the top 120 of heat-conducting plate 100 along the diagonal of heat-conducting plate 100.

Radiator 200 comprises the pedestal 202 that joins with heat-conducting plate 100 tops 120 and is located at some fins 204 on this pedestal 202.This radiator 200 also comprises a pair of groove that is parallel to each other 206 of being located at pedestal 202 middle parts and two pairs of through holes 208 being located at groove 206 both sides respectively.Groove 122 on this groove 206 and the heat-conducting plate 100 is corresponding respectively, and the part of heat pipe 400 is passed in the groove 122 that can be contained in behind the groove 206 on the heat-conducting plate 100.

Please consult Fig. 5 again, each heat pipe 400 comprises first heat transfer segment 410 and is located at the two U type heat transfer segment 420 at first heat transfer segment, 410 two ends.This two U type heat transfer segment 420 comprises from first heat transfer segment, 410 two ends vertical bending and goes out and to a pair of second heat transfer segment 422 of extending away from heat-conducting plate 100 directions, and extends and 2 the 3rd heat transfer segment 424 that form and be parallel to second heat transfer segment 422 from the bending of second heat transfer segment, 422 ends and to heat-conducting plate 100 respectively.The free end of the 3rd heat transfer segment 424 wears respectively and is fixed in the through hole 208 on the pedestal 202.First heat transfer segment 410 of heat pipe 400 is passed in the groove 122 that is fixed in behind the groove 206 on the pedestal 202 on the heat-conducting plate 100 and from heat-conducting plate 100 and is absorbed heats, with as its evaporation section; Second, third heat transfer segment 422,424 of heat pipe 400 contacts with groups of fins 300, is used for heat transferred groups of fins 300 that evaporation section is absorbed, with as its condensation segment.

The condensation segment that groups of fins 300 is sheathed on heat pipe 400 is on second, third heat transfer segment 422,424, and is positioned at radiator 200 tops.Groups of fins 300 is formed by some fin that are parallel to each other are stacked successively.See also Fig. 4 to 5, each fin comprises first lamellar body of being located between two heat pipes 400 310, and 2 second lamellar bodies 320 of being located at first lamellar body, 310 relative both sides, also contacting with the condensation segment of two heat pipes 400 respectively.The edge that faces mutually at first lamellar body 310 and 2 second lamellar bodies 320 is respectively equipped with some semicircular breach 312.When first lamellar body 310 and 2 second lamellar bodies 320 are combined into a fin, semi-circular breach 312 corresponding combinations on first, second lamellar body 310,320 and form the through hole (figure is mark) of some circles in first, second lamellar body 310,320 joints.The manhole that second, third heat transfer segment 422,424 of heat pipe 400 is passed on the fin, and by methods such as welding fin is fixed on second, third heat transfer segment 422,424 of heat pipe 400.According to this kind method,, fin forms groups of fins 300 thereby superposeing successively.

Heat abstractor of the present invention in use, heat-conducting plate 100 contacts with central processing unit 500 and absorbs the heat that central processing unit 500 produces.The heat part that heat-conducting plate 100 absorbs passes to the pedestal 202 of radiator 200, by the fin on it 204 heat is distributed again; Another part heat is delivered to groups of fins 300 fast by heat pipe 400, and then is evenly distributed on the fin and is dispersed in the surrounding environment.

Because each heat pipe 400 comprises four condensation segments such as second, third heat transfer segment 422,424, heat pipe 400 is identical with two U type heat pipes with contact area between the fin, so this heat pipe 400 can be distributed to entire heat dissipation sheet group 300 quickly and evenly with the heat that absorbs, make full use of groups of fins 300 heat radiations and the whole radiating effect of lifting.And one the cost of the cost of long heat pipe 400 and a U-shaped heat pipe is close, than little many of the cost of two U-shaped heat pipes.So the heat pipe 400 that adopts bending to be provided with can effectively promote the heat dispersion of heat abstractor, can reduce cost again simultaneously, heat abstractor of the present invention has higher performance and benefit cost ratio.

In the above-described embodiments, heat abstractor of the present invention adopts two heat pipes 400, is appreciated that ground, and the quantity of heat pipe 400 can be chosen different quantity according to the design needs, as one, three or more.Please join Fig. 6 again, when only using a heat pipe 400, each fin includes only 2 second lamellar bodies 320, and 2 second lamellar bodies, 320 neighboring edge places are provided with some semicircular breach 312 respectively.The corresponding combination of semi-circular breach 312 on first, second lamellar body 310,320 and form the through hole of some circles in 2 second lamellar bodies, 320 joints.The manhole that second, third heat transfer segment 422,424 of heat pipe 400 is passed on the fin, and by methods such as welding fin is fixed on second, third heat transfer segment 422,424 of heat pipe 400.When three of employings or more heat pipes 400, each fin comprises is located at two between the adjacent heat pipe 400 or more first lamellar bodies 310, and is located at 2 second lamellar bodies 320 of two outermost end, first lamellar body, 310 both sides respectively.Other element is same with the above-mentioned embodiment.In addition, between heat-conducting plate 100 and the pedestal 202, between heat-conducting plate 100 and the heat pipe 400, between heat pipe 400 and the pedestal 202 and can fix by methods such as welding between heat pipe 400 and the fin.

Claims

1. heat abstractor, comprise a heat-conducting plate that contacts with electronic component and be positioned at this heat-conducting plate top, a groups of fins of forming by some fin, this heat-conducting plate one side is provided with groove, it is characterized in that: this heat abstractor also comprises the heat pipe that a bending is provided with, this heat pipe comprises one first heat transfer segment in the groove that is placed on the heat-conducting plate, go out from first heat transfer segment two ends bendings and to 2 second heat transfer segment of extending away from the heat-conducting plate direction, and one the 3rd heat transfer segment that goes out from one second heat transfer segment bending and extend to heat-conducting plate, second of heat pipe, the 3rd heat transfer segment respectively with the groups of fins hot link.

2. heat abstractor as claimed in claim 1 is characterized in that: this heat pipe also comprises another the 3rd heat transfer segment that goes out from the bending of its another second heat transfer segment and extend to heat-conducting plate.

3. heat abstractor as claimed in claim 1 is characterized in that: this heat abstractor also comprises a radiator that is located between heat-conducting plate and the groups of fins.

4. heat abstractor as claimed in claim 3, it is characterized in that: this radiator comprises a pedestal that contacts with heat-conducting plate and is located at some fins on the pedestal, this radiator also comprises a groove of being located at pedestal middle part, and first heat transfer segment of heat pipe is passed in the groove that can be contained in behind the groove on the heat-conducting plate.

5. heat abstractor as claimed in claim 4 is characterized in that: this radiator also comprises the through hole of the being located at the groove both sides respectively free end in order to ccontaining the 3rd heat transfer segment.

6. heat abstractor as claimed in claim 1, it is characterized in that: a fin of groups of fins comprises two lamellar bodies, and two lamellar body neighboring edge places are provided with some breach respectively, breach correspondence on two lamellar bodies makes up and forms some through holes in two lamellar body joints, and second, third heat transfer segment of heat pipe is arranged in the through hole on the fin.

7. heat abstractor as claimed in claim 1, it is characterized in that: this heat abstractor also comprises the heat pipe that another bending is provided with, the heat pipe that this another bending is provided with comprises and hot linked evaporation section of heat-conducting plate and the two U type condensation segments that extend from the evaporation section two ends respectively, two U type condensation segments of heat pipe respectively with the groups of fins hot link.

8. heat abstractor as claimed in claim 7 is characterized in that: a fin of groups of fins comprises 2 second lamellar bodies that are located in one first lamellar body between two heat pipes and are located at these first lamellar body both sides, and this 2 second lamellar body contacts with two heat pipes respectively.

9. heat abstractor as claimed in claim 8, it is characterized in that: be respectively equipped with some breach in the edge that first, second lamellar body faces mutually, breach correspondence on first, second lamellar body makes up and forms some through holes in first, second lamellar body joint, and second, third heat transfer segment of two heat pipes and two U type condensation segments are arranged in the through hole on the fin.

10. heat abstractor as claimed in claim 1 is characterized in that: this heat-conducting plate is the square type, and this groove is along a diagonal setting of this heat-conducting plate.