CN2713633Y - Heat pipe radiator assembly - Google Patents

Heat pipe radiator assembly Download PDF

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Publication number
CN2713633Y
CN2713633Y CNU2004200464243U CN200420046424U CN2713633Y CN 2713633 Y CN2713633 Y CN 2713633Y CN U2004200464243 U CNU2004200464243 U CN U2004200464243U CN 200420046424 U CN200420046424 U CN 200420046424U CN 2713633 Y CN2713633 Y CN 2713633Y
Authority
CN
China
Prior art keywords
heat
heat pipe
pipe
radiation fins
perforations
Prior art date
Application number
CNU2004200464243U
Other languages
Chinese (zh)
Inventor
盛剑青
李孟慈
林淑和
Original Assignee
鸿富锦精密工业(深圳)有限公司
鸿海精密工业股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鸿富锦精密工业(深圳)有限公司, 鸿海精密工业股份有限公司 filed Critical 鸿富锦精密工业(深圳)有限公司
Priority to CNU2004200464243U priority Critical patent/CN2713633Y/en
Application granted granted Critical
Publication of CN2713633Y publication Critical patent/CN2713633Y/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model relates to a heat pipe radiator assembly, assisting the heating electronic elements, such as the central processing unit, etc to radiate, and including at least a heat pipe and a plurality of radiation fins. The heat pipe is provided with a heat absorption section, at least a heat output section, and a bending section connecting the heat absorption section with the heat output section, wherein, the radiation fins are provided with a plurality of perforations. The heat output section of the heat pipe is perforated through the perforations of the radiation fin. The extending direction length along the heat absorption section of the heat pipe of the perforations of the partial radiation fins nearing to the bending section of the heat pipe is greater than those of the corresponding perforations of other radiation fins. During the process that the heat pipe is plugged into the radiation fins, the perforations that the heat pipe mutually supporting connected with the bending section of the heat pipe are provided with enough surplus, accordingly, the mutually interference between the bending section and the radiation fins and the occurrence of the radiation fins deforming are avoided.

Description

The heat-pipe radiator combination

[technical field]

The utility model is about a kind of heat abstractor, is meant a kind of heat-pipe radiator combination of using heat pipe and can effectively improving heat dispersion especially.

[background technology]

Along with large scale integrated circuit continuous advancement in technology and extensive use, the development of information industry is advanced by leaps and bounds, computer is widely used in all trades and professions, especially the application of personal computer becomes basically universal, in order to adapt to the development trend that data processing amount constantly increases and the real-time requirement improves, inevitable requirement computer run speed improves constantly.As everyone knows, central processing unit is the core parts of computer system, the performance of the whole computer of good and bad directly decision of its performance, and therefore, the high-frequency high-speed processor is constantly released.But because the high-frequency high-speed operation makes the processor unit interval produce a large amount of heat, if these heats of untimely eliminating will cause the rising of processor self temperature, safety and performance to system cause very big influence, and heat dissipation problem has become the problem that must will solve when each high speed processor of new generation is released at present.Usually industry is all installed auxiliary its heat radiation of radiator on chips such as central processing unit.Simultaneously, fan is installed on radiator, so that forced draft to be provided the heat of radiator is distributed fast, thereby can carry out more efficiently heat radiation central processing unit.

As shown in Figure 1, it discloses existing heat abstractor, and this heat abstractor comprises a pedestal 1 ', a groups of fins 2 ' and a heat pipe 3 '.This heat pipe 3 ' comprises first end 30 ', the second end 32 ' and connects the kink 34 ' of first end 30 ' and the second end 32 ', this groups of fins 2 ' is provided with the second end 32 ' the directly insertion of open-work 20 ' for this heat pipe 3 ', yet the kink 34 ' of heat pipe 3 ' and the open-work 20 ' edge of groups of fins 2 ' interfere during insertion, cause groups of fins 2 ' buckling deformation, thereby influence its outward appearance and heat dispersion.

[summary of the invention]

The purpose of this utility model is to provide a kind of and avoids in installation process heat pipe and fin to interfere and cause the not good heat-pipe radiator combination of radiating effect.

The purpose of this utility model realizes by following technical proposal:

The combination of the utility model heat-pipe radiator, the heat radiation of heat-generating electronic elements such as secondary CPU, comprise at least one heat pipe and some radiating fins, heat pipe has an endotherm section, at least one heat release section and connects the kink of endotherm section and heat release section, wherein radiating fin is provided with some perforation, the heat release section of heat pipe is arranged in the perforation of radiating fin, near the perforation of the part radiating fin of heat pipe kink along the length of heat pipe heat-absorbing section bearing of trend length greater than other radiating fin respective perforations.

The combination of the utility model heat-pipe radiator will enlarge near the perforation of heat pipe kink, make heat pipe in inserting the radiating fin process, enough surpluses be arranged, avoided kink and radiating fin to interfere and radiating fin generation warpage with perforation that the kink of heat pipe connects.

[description of drawings]

With reference to the accompanying drawings, the utility model will be further described in conjunction with the embodiments.

Fig. 1 is an existing heat abstractor three-dimensional exploded view.

Fig. 2 is the three-dimensional exploded view of the utility model heat-pipe radiator combination.

Fig. 3 is the constitutional diagram of the utility model heat-pipe radiator combination.

[embodiment]

The utility model heat-pipe radiator combination is dispelled the heat to it in order to be installed on heat-generating electronic elements surface such as central processing unit.

See also Fig. 2 and Fig. 3, the utility model heat-pipe radiator combination preferred embodiment comprises a pedestal 10, two groups of heat pipes 20,30 and some radiating fins 40.

It is tabular and have a upper and lower surface that this pedestal 10 is level, and the upper surface central processing unit (figure does not show) that is sticked waits heat-generating electronic elements surperficial and absorb the heat of its generation, and the lower surface level offers and heat pipe 20,30 corresponding parallel grooves 12.

These two groups of heat pipes 20,30 all are " ㄇ " shape, have the parallel heat release section 24,34 of horizontal endotherm section 22,32, the left and right sides and connect endotherm section 22,32 respectively and the kink 23,33 of heat release section 24,34, endotherm section 22,32 places in pedestal 10 grooves 12 and by welding manner fixedlys connected with pedestal 10, absorb the heat of pedestal 10, heat release section 24,34 be positioned at pedestal 10 belows and with pedestal 10 approximate vertical.

Above-mentioned radiating fin 40 is parallel to each other horizontally and is set on the heat release section 24,34 of heat pipe 20,30 with certain interval, absorbs the heat of heat pipe 20,30.Wherein each radiating fin 30 is rectangular, certainly, also can be other shape.Radiating fin 40 is provided with two groups of perforation 26,36, its middle punch 26 is used to wear the heat release section 24 of heat pipe 20, this perforation 26 is near radiating fin 40 wherein on one side, and perforation 36 is used to wear the heat release section 34 of heat pipe 30, and this perforation 36 is near the relative edge on radiating fin 40 above-mentioned one side.Near the perforation 26,36 of last three to four radiating fins 40 of pedestal 10 along the length of endotherm section 24,34 bearing of trends length greater than other radiating fin 40 respective perforations 26,36.So, when the heat release section 24,34 of heat pipe 20,30 is inserted in the perforation 26,36, and the perforation 26,36 that the endotherm section 22,32 of heat pipe 20,30 and the kink 23,33 between the heat release section 24,34 connect has enough surpluses, thereby avoids kink 23,33 and radiating fin 40 to interfere.

Understandable, heat pipe of the present utility model is not limited to " ㄇ " shape, and the endotherm section of this heat pipe also can directly contact with electronic component and not need pedestal.

Claims (4)

1. heat-pipe radiator combination, the heat radiation of heat-generating electronic elements such as secondary CPU, comprise at least one heat pipe and some radiating fins, heat pipe has an endotherm section, at least one heat release section and connects the kink of endotherm section and heat release section, radiating fin is provided with some perforation, the heat release section of heat pipe is arranged in the perforation of radiating fin, it is characterized in that: near the perforation of the part radiating fin of heat pipe kink along the length of heat pipe heat-absorbing section bearing of trend length greater than other radiating fin respective perforations.
2. heat-pipe radiator according to claim 1 combination, it is characterized in that: described heat pipe is " ㄇ " shape, has horizontal segment and perpendicular to the vertical section of horizontal segment, its horizontal segment is an endotherm section, and vertical section is a heat release section.
3. heat-pipe radiator according to claim 1 combination is characterized in that: this heat-pipe radiator combination comprises that further one contacts with the pedestal of absorption heat with electronic component.
4. heat-pipe radiator combination according to claim 3, it is characterized in that: described pedestal lower surface has groove, and the endotherm section of heat pipe places groove.
CNU2004200464243U 2004-05-21 2004-05-21 Heat pipe radiator assembly CN2713633Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2004200464243U CN2713633Y (en) 2004-05-21 2004-05-21 Heat pipe radiator assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2004200464243U CN2713633Y (en) 2004-05-21 2004-05-21 Heat pipe radiator assembly
US11/107,714 US20050257920A1 (en) 2004-05-21 2005-04-15 Heat dissipating device

Publications (1)

Publication Number Publication Date
CN2713633Y true CN2713633Y (en) 2005-07-27

Family

ID=34872227

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2004200464243U CN2713633Y (en) 2004-05-21 2004-05-21 Heat pipe radiator assembly

Country Status (2)

Country Link
US (1) US20050257920A1 (en)
CN (1) CN2713633Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007053992A1 (en) * 2005-11-08 2007-05-18 Byd Company Limited A heat dissipating device for a battery pack, and a battery pack using the same
CN109084605A (en) * 2018-08-01 2018-12-25 中国科学技术大学 A kind of pulsating heat pipe of the non-elbow structure of bringing-up section

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI255689B (en) * 2003-12-16 2006-05-21 Asia Vital Components Co Ltd Structure and manufacturing method of heat sink module
CN100464408C (en) * 2005-12-01 2009-02-25 富准精密工业(深圳)有限公司 Radiating apparatus
US7455102B2 (en) * 2005-12-22 2008-11-25 Golden Sun News Techniques Co., Ltd. Method for manufacturing heat pipe cooling device
US7093648B1 (en) * 2005-12-22 2006-08-22 Golden Sun News Technologies Co., Ltd. Heat pipe cooling device and method for manufacturing the same
US7509996B2 (en) * 2005-12-27 2009-03-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20100270007A1 (en) * 2009-04-23 2010-10-28 Wen-Te Lin Heat sink
US10036596B2 (en) * 2016-01-11 2018-07-31 Asia Vital Components Co., Ltd. Combination structure of heat dissipation module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW543828U (en) * 2001-07-12 2003-07-21 Foxconn Prec Components Co Ltd Assembly of heating-tube heat sink
US6959755B2 (en) * 2002-01-30 2005-11-01 Kuo Jui Chen Tube-style radiator structure for computer
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US6717813B1 (en) * 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US7021368B2 (en) * 2003-11-12 2006-04-04 Cpumate Inc. Heat dissipating device with uniform heat points

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007053992A1 (en) * 2005-11-08 2007-05-18 Byd Company Limited A heat dissipating device for a battery pack, and a battery pack using the same
US8574739B2 (en) 2005-11-08 2013-11-05 Byd Company Limited Heat dissipating device for a battery pack, and a battery pack using the same
CN109084605A (en) * 2018-08-01 2018-12-25 中国科学技术大学 A kind of pulsating heat pipe of the non-elbow structure of bringing-up section

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US20050257920A1 (en) 2005-11-24

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GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050727

Termination date: 20130521

C17 Cessation of patent right