CN1549675A - Functional module and producing method thereof - Google Patents
Functional module and producing method thereof Download PDFInfo
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- CN1549675A CN1549675A CNA03136702XA CN03136702A CN1549675A CN 1549675 A CN1549675 A CN 1549675A CN A03136702X A CNA03136702X A CN A03136702XA CN 03136702 A CN03136702 A CN 03136702A CN 1549675 A CN1549675 A CN 1549675A
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- planarization member
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- planarization
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Abstract
A function moduice consists of a circuit board, the first element, the second element, a flatting structure and a plate heat radiating element. The preparing method is as follows: a circuit board and a plate heat radiating element are provided, multiple element in different height are set on the circuit board, a flatting structure is set on the circuit board as element are surround by the flatting structure, a flat face is formed at flatting structure and height of flat face is higher or equal to height of the highest element among all elements so as to place the plate heat radiating element on the flat face.
Description
Technical field
The present invention relates to a kind of functional module and manufacture method thereof, particularly, the method for flat heat dissipation element is set easily relevant on a kind of circuit board that can be provided with the element that a plurality of height differ thereon.
Background technology
Along with the progress of semiconductor technology, the operating rate of electronic component is more and more faster, and greater functionality is integrated in the single element, thus cause element radiating, signal quality, and design such as electromagnetic radiation protection on difficulty.
Generally speaking, normally finish the connection of signal each other between the electronic component via circuit board, please refer to Figure 1A and Figure 1B, in computer system 10, electronic components such as central processing unit (CPU) 1, chipset (Chipset) 2, painting processor or drawing interface (GPU or AGP) 3 and memory (DRAM) 4 all are set on the motherboard of being made by printed circuit board (PCB) 7, and are disposed at zones different on the motherboard.Above-mentioned these electronic components all can produce heat when work, in order to solve the problem of its heat radiation, the existing means of being taked are to propose solution respectively at each element.
As follows at the radiating mode that each high heater element adopted in the computer system in the past: the heat dissipation element that central processing unit often uses is that radiating fin, heat pipe add fan, and the heat dissipation element that chipset, painting processor often use then is radiating fin and/or fan.If think effectively to solve simultaneously the heat dissipation problem of these high heater elements on the motherboard, above-mentioned settling mode can't satisfy such radiating requirements, therefore must introduce more efficient heat dissipation element.But these more efficient heat dissipation elements only are applicable to flat surfaces usually, promptly, if these heat dissipation elements are applied on the aforesaid high heater element, then will in the face of how with above-mentioned high efficiency heat radiation element application in each the high heater element that is dispersed on the motherboard, and how to solve on the motherboard problem of difference in height between each high heater element.
Summary of the invention
The object of the present invention is to provide a kind of functional module and manufacture method thereof, it can utilize the material of planarization, the circuit board planarization of the element that a plurality of height that are provided with in it are differed, thus flat heat dissipation element can be set easily.
Another object of the present invention is to utilize the high thermal conduction characteristic of smoothing material, make that the temperature of each element evenly distributes on the circuit board, and compare, also have lower cost and height with existing method.
According to the present invention, it provides a kind of functional module, and it comprises a circuit board, one first element, one second element, a planarization member and a flat heat dissipation element; Circuit board has a surface, and first element and second element all are arranged on the surface, and the height height of aspect ratio first element of second element; The planarization member has a tabular surface, and is arranged on the surface in the mode of surrounding first element and second element, and the height of tabular surface is more than or equal to the height of second element; Flat heat dissipation element is arranged on the tabular surface.
In a preferred embodiment, the material of planarization member can be a thermosetting polymer.
In addition, the material of planarization member also can be polyimides, silicone (Silicone).
In another preferred embodiment, also can sneak into a Heat Conduction Material in the planarization member, and this Heat Conduction Material can be aluminium nitride, carborundum, boron nitride or zinc oxide.
In another preferred embodiment, the coefficient of heat conduction of planarization member is preferably greater than 0.5W/m ° of K.
In another preferred embodiment, the planarization member also comprises two diaphragms, and it is arranged at two opposition sides of planarization member respectively in detachable mode, or a side of planarization member is directly adhered on the flat heat dissipation element.
Will be appreciated that flat heat dissipation element can be flat plate heat tube, miniature radiating fin, steam chamber or water-cooled element, and first element can be a passive or active element, and second element can be a central processing unit.
The present invention also provides a kind of manufacture method of functional module, it comprises the following steps: at first, one circuit board and a flat heat dissipation element are provided, wherein circuit board is provided with the element that a plurality of height differ, then, one planarization member is arranged on the circuit board, and planarization member embracing element, then, make the planarization member be solidified to form a tabular surface, and the height of tabular surface is last more than or equal to the height of element highly the highest in the element, flat heat dissipation element is set on tabular surface.
In a preferred embodiment, the planarization member can be made greater than the material of 0.5W/m ° of K by thermosetting polymer, polyimides, silicone or the coefficient of heat conduction.
In another preferred embodiment, the planarization member can be sneaked into Heat Conduction Material by thermosetting polymer, polyimides or silicone and be made, and is preferably and Heat Conduction Material can be aluminium nitride, carborundum, boron nitride or zinc oxide.
In another preferred embodiment, the planarization member can be coated by two diaphragms, and diaphragm is arranged at two opposition sides of planarization member respectively in detachable mode, or a side of planarization member directly is bonded at a side of flat heat dissipation element.
And, before being arranged at the planarization member on the circuit board, one in the diaphragm is separated with the planarization member, and make before or after the planarization member solidifies, in the diaphragm another separated with the planarization member.
Will be appreciated that flat heat dissipation element can be flat plate heat tube, miniature radiating fin, steam chamber or water-cooled element.
In another preferred embodiment, planarization member step of curing is undertaken by the mode of heating, infrared radiation or ultraviolet irradiation planarization member.In the process of making functional module, also can make the planarization member keep colloidal state (jelly state) to carry out follow-up step, be to decide yet make the planarization member solidify or be colloidal state according to its application target.
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is the schematic diagram of existing computer system;
Figure 1B is the end view of computer system among Figure 1A;
Fig. 2 is arranged at schematic diagram on the functional module with a flat heat dissipation element;
Fig. 3 is arranged at schematic diagram on the functional module with a flat heat dissipation element and a height compensation;
Fig. 4 A～4C is the schematic diagram of first embodiment of the manufacture method of functional module of the present invention;
Fig. 5 A is the schematic diagram of a variation of the planarization member among Fig. 4 B;
Fig. 5 B is the schematic diagram of a variation of the planarization member among Fig. 4 B; And
Fig. 6 A～6C is the schematic diagram of second embodiment of the manufacture method of functional module of the present invention.
Description of reference numerals
1 central processing unit, 2 chipsets
3 painting processors, 4 dynamic random access memorys
5 resistance, 6 electric capacity
7 motherboards, 10 functional modules
20 flat heat dissipation element 30 height compensation
100 functional modules, 110 circuit boards
111 surfaces, 120 first elements
130 second elements, 140 planarization members
141 tabular surfaces, 150 flat heat dissipation elements
161 elements, 162 elements
163 elements, 200 functional modules
210 planarization assemblies, 211 planarization members
212a diaphragm 212b diaphragm
Embodiment
First embodiment
The present invention uses a planarization member to solve on the motherboard problem of difference in height between each element, and introduce such as the flat heat dissipation element of flat plate heat tube, steam chamber (Vapor Chamber), miniature radiating fin (Micro Fin), water-cooled element high efficiency such as (Water Cooling), to solve the heat dissipation problem of each element on the motherboard simultaneously.
See also Fig. 2, it shows a flat heat dissipation element 20 is configured in schematic diagram on the computer system 10 that is made of central processing unit 1, chipset 2, painting processor 3, memory 4, resistance 5, electric capacity 6 and motherboard 7.Because the height difference of each element, therefore flat heat dissipation element 20 can't be passed to the heat that each element produces outside the system while effectively.See also Fig. 3, for solving the problem of difference in height between each element, can use one to cooperate the compensation mechanism 30 of different elements height as the planarization member, it is disposed on the computer system 10, it is connected with each main element (as central processing unit 1, north bridge chips 2, drawing chip 3) heat conduction, and then flat heat dissipation element 20 is configured on the compensation mechanism 30.
For simultaneously and effectively the heat that each high heater element produced in the computer system is passed to outside the system, in an embodiment of the present invention, these high heater elements can be concentrated on the specific region of motherboard, or with these high heater element modularizations, re-use planarization member and high efficiency flat heat dissipation element, with problem that overcomes difference in height between each element and the heat dissipation problem that solves each high heater element simultaneously.
Fig. 4 A～4C shows first embodiment of the manufacture method of functional module of the present invention, it comprises the following steps: at first, circuit board 110 shown in Fig. 4 A and the flat heat dissipation element 150 shown in Fig. 4 C are provided, wherein circuit board 110 is provided with the element 120,130,161,162,163 that a plurality of height differ, particularly, circuit board 110 for example is to have utilized surface mounting technology (SMT) that required element finished product thereon is installed, and this circuit board 110 had carried out required functional test; Then, shown in Fig. 4 B, one planarization member 140 is arranged on the circuit board 110, and planarization member 140 embracing elements 120,130,161,162,163, it should be noted in the present embodiment, planarization member 140 can be a macromolecular material, and planarization member 140 can have suitable flowability by this, thereby can insert the space of 120,130,161,162,163 of each elements on the circuit board 110 effectively; Then, make planarization member 140 form a tabular surface 141, and the height of tabular surface 141 is more than or equal to the height of element highly the highest in the element 130, it should be noted that the method that makes planarization member 140 form a tabular surface 141 comprises solidifies planarization member 140 or makes planarization member 140 keep colloidal state, and step of curing can be undertaken by the mode of heated baking, infrared radiation or ultraviolet irradiation planarization member 140; At last, flat heat dissipation element 1 50 is arranged on the tabular surface 141, can finishes the functional module 100 of present embodiment, this functional module 100 also can be regarded as the zone that each high heater element is concentrated on the motherboard.
Because planarization member 140 is between flat heat dissipation element 150 and element 120,130,161,162,163, in order to prevent each element 120,130,161,162,163 short circuit on the circuit board 110, planarization member 140 must have excellent electric insulating, being made by the insulating material with high resistivity is preferably, and its material for example is: thermosetting polymer, polyimides (Polyimide), silicone (Silicone) etc.
In order to increase the temperature homogeneity of functional module 100 integral body, planarization member 140 also needs to possess good thermal conduction characteristic except must having good electrical insulation characteristics.That is, the material of planarization member 140 also need have high heat-conduction coefficient except need have high resistivity, and particularly, planarization member 140 can be made greater than the insulating material of 0.5W/m ° of K by the coefficient of heat conduction.
And for preventing each element 120,130,161,162,163 short circuit on the circuit board 110, planarization member 140 must have excellent electric insulating, but in order to increase the thermal conductivity of planarization member 140, can add other materials therein.The material of planarization member 140 comprises insulating material, and in insulating material, can also add the insulating material of high heat conduction, for example: the ceramic material that aluminium nitride (AlN), carborundum (SiC), boron nitride (BN) or zinc oxide (ZnO) etc. have high heat-conduction coefficient is preferably; Will be appreciated that the planarization member also can directly select for use the material that has high thermal conductivity coefficient and high resistivity simultaneously to make, for example, above-mentioned polyimides or silicone.
In addition, above-mentioned flat heat dissipation element 150 is flat plate heat tube, miniature radiating fin, steam chamber or water-cooled element.
And, though planarization member 140 as above-mentioned as, has certain fluidity, but it is mobile and little, therefore before planarization member 140 is cured, can't the surface 111 of overflow circuit plate 110 outside, certainly in order to ensure preventing that above-mentioned phenomenon from taking place, also baffle plate members such as (not shown) can be set at the periphery of circuit board 110, those skilled in the art can know by inference easily, do not describe in detail at this.
Promptly shown in Fig. 4 C, it comprises a circuit board 110, one first element 120, one second element 130, a planarization member 140, one flat heat dissipation element 150 and other elements 161,162,163 by the resulting functional module 100 of above-mentioned manufacture method; Circuit board 110 has a surface 111, the first elements 120 and second element 130 all is arranged on the surface 111, and the height of second element 130 is greater than the height of first element 120; Planarization member 140 has a tabular surface 141, and be arranged on the surface 111 in the mode of surrounding first element 120, second element 130 and other elements 161,162,163, and the height of tabular surface 141 is more than or equal to the height of second element 130, and flat heat dissipation element 150 is arranged on the tabular surface 141.
Will be appreciated that above-mentioned first element 120 can be highly lower active or passive component, and second element 130 can be highly higher active or passive component, for example is central processing unit.
As mentioned above, present embodiment utilizes circuit board after element is finished surface mount (SMT), add the planarization member so that the technology of functional module planarization, eliminate the difference in height between each element, make flat heat dissipation element easily framework on this functional module, and have the effect of all even transmission heat of the temperature of making, and need not add the difference in height compensation mechanism.
In addition, utilize the high thermal conduction characteristic of smoothing material, the temperature of help function module evenly distributes, and this method is compared with using height compensation, also has lower cost and height.
Second embodiment
Fig. 6 A～6C shows second embodiment of the manufacture method of functional module of the present invention, it comprises the following steps: at first, circuit board 110 shown in Fig. 4 A and the flat heat dissipation element 150 shown in Fig. 4 C are provided, wherein circuit board 110 is all identical with first embodiment with flat heat dissipation element 150, omit it at this and describe in detail, and represent with identical mark; Then, planarization assembly 210 shown in Fig. 5 A is provided, it should be noted in the present embodiment, planarization assembly 210 can be a sandwich structure, it is by two diaphragm 212a of a planarization member 211 and coating planarization member 211,212b makes, and diaphragm 212a, 212b is arranged at two opposition sides of planarization member 211 respectively in detachable mode, promptly, two diaphragm 212a, 212b all can be torn off, in addition, the material behavior that will be appreciated that planarization member 211 is identical with the planarization member 140 of above-mentioned first embodiment, omits its detailed description at this; Then, as shown in Figure 6A, a diaphragm 212a of planarization assembly 210 is torn off, and, make planarization member 211 embracing elements 120,130,161,162,163, shown in Fig. 6 B circuit board 110 and 211 pressings of planarization member; Then, make planarization member 211 be solidified to form a tabular surface 213, perhaps make planarization member 211 keep colloidal state and form a tabular surface 213; At last, another diaphragm 212b of planarization assembly 210 is torn off, shown in Fig. 6 C, more flat heat dissipation element 150 is arranged on the tabular surface 213, can finish the functional module 200 of present embodiment, shown in Fig. 4 C.Will be appreciated that the step that another diaphragm 211b with planarization assembly 210 tears off, can planarization member 211 be carried out before or after solidifying.
In addition, the planarization member 211 flat heat dissipation element 150 of also can directly arranging in pairs or groups uses, shown in Fig. 5 B, and the diaphragm 212b that replaces among Fig. 5 A with flat heat dissipation element 150.It should be noted that in the present embodiment planarization assembly 210 also can be a sandwich structure, its diaphragm 212a and flat heat dissipation element 150 by a planarization member 211 and coating planarization member 211 is made.Similar with above stated specification; diaphragm 212a and flat heat dissipation element 150 are arranged at two opposition sides of planarization member 211 respectively; diaphragm 212a is arranged at a side of planarization member 211 in detachable mode; and it is relative with diaphragm 212a across planarization member 211; that is, diaphragm 212a can be torn off.In addition, will be appreciated that the material behavior of planarization member 211 is identical with the planarization member 140 of above-mentioned first embodiment, omit its detailed description at this.
Then, as shown in Figure 6A, and with the diaphragm 212b among the flat heat dissipation element 150 replacement figure.At first, a diaphragm 212a of planarization assembly 210 is torn off, and, make planarization member 211 embracing elements 120,130,161,162,163, shown in Fig. 6 B circuit board 110 and 211 pressings of planarization member; Then, make planarization member 211 be solidified to form a tabular surface 213, perhaps make planarization member 211 keep colloidal state and form a tabular surface 213; At last, owing to flat heat dissipation element 150 has been arranged on the tabular surface 213, thus can finish the functional module 200 of present embodiment, shown in Fig. 4 C.
With the method for the method of present embodiment and first embodiment relatively after as can be known, in the present embodiment, the planarization assembly that employing has a sandwich structure replaces the planarization member of first embodiment, so present embodiment still can reach the effect identical with first embodiment.
Though the present invention discloses as above in conjunction with the preferred embodiments; right its is not in order to qualification the present invention, those skilled in the art, without departing from the spirit and scope of the present invention; can do a little change and retouching, so protection scope of the present invention is with being as the criterion that claims were defined.
Claims (30)
1. functional module comprises:
One circuit board has a surface;
One first element is arranged on this surface;
One second element is arranged on this surface, and wherein the height of this second element is greater than the height of this first element;
One planarization member has a tabular surface, and is arranged on this surface in the mode of surrounding this first element and this second element, and wherein the height of this tabular surface is more than or equal to the height of this second element; And
One flat heat dissipation element is arranged on this tabular surface.
2. functional module as claimed in claim 1, wherein the material of this planarization member is an electrical insulating material.
3. functional module as claimed in claim 2, wherein this electrical insulating material is a thermosetting polymer.
4. functional module as claimed in claim 3, wherein this electrical insulating material is to be selected from by polyimides, and silicone group and the combination thereof formed.
5. functional module as claimed in claim 2 wherein also comprises a Heat Conduction Material in this planarization member.
6. functional module as claimed in claim 5, wherein this Heat Conduction Material is selected from by aluminium nitride, carborundum, boron nitride, reaches group and combination thereof that zinc oxide is formed.
7. functional module as claimed in claim 1, wherein this flat heat dissipation element is selected from by flat plate heat tube, miniature radiating fin, steam chamber, reaches group and combination thereof that the water-cooled element is formed.
8. functional module as claimed in claim 1, wherein this second element is a central processing unit.
9. the manufacture method of a functional module comprises:
One circuit board and a flat heat dissipation element are provided, and wherein this circuit board is provided with the element that a plurality of height differ;
One planarization member is arranged on this circuit board, and this planarization member surrounds these elements;
Make this planarization member be solidified to form a tabular surface, wherein the height of this tabular surface is more than or equal to the height of element highly the highest in these elements; And
This flat heat dissipation element is set on this tabular surface.
10. manufacture method as claimed in claim 9, wherein this planarization member is made by an electrical insulating material.
11. manufacture method as claimed in claim 10, wherein this electrical insulating material is made by thermosetting polymer.
12. manufacture method as claimed in claim 11, wherein this electrical insulating material is selected from by polyimides, reaches group and combination thereof that silicone is formed.
13. manufacture method as claimed in claim 10, wherein this planarization member comprises this insulating material and a Heat Conduction Material.
14. manufacture method as claimed in claim 13, wherein this Heat Conduction Material is selected from by aluminium nitride, carborundum, boron nitride, reaches group and combination thereof that zinc oxide is formed.
15. manufacture method as claimed in claim 9, wherein this planarization member also can be coated by two diaphragms, and these diaphragms are arranged at two opposition sides of this planarization member respectively in detachable mode.
16. manufacture method as claimed in claim 15; wherein before being arranged at this planarization member on this circuit board; one in these diaphragms is separated with this planarization member, and make before this planarization member solidifies, in these diaphragms another separated with this planarization member.
17. manufacture method as claimed in claim 15; wherein before being arranged at this planarization member on this circuit board; one in these diaphragms is separated with this planarization member, and make after this planarization member solidifies, in these diaphragms another separated with this planarization member.
18. manufacture method as claimed in claim 9, wherein this flat heat dissipation element is selected from by flat plate heat tube, miniature radiating fin, steam chamber, reaches group and combination thereof that the water-cooled element is formed.
19. manufacture method as claimed in claim 9 wherein makes this planarization member step of curing be undertaken by the mode of heating planarization member.
20. manufacture method as claimed in claim 9 wherein makes this planarization member step of curing be undertaken by the mode of infrared radiation planarization member.
21. manufacture method as claimed in claim 9 wherein makes this planarization member step of curing be undertaken by the mode of ultraviolet irradiation planarization member.
22. the manufacture method of a functional module comprises:
One circuit board and a flat heat dissipation element are provided, and wherein this circuit board is provided with the element that a plurality of height differ;
One planarization member is arranged on this circuit board, and this planarization member surrounds these elements;
Make this planarization member form a tabular surface, wherein the height of this tabular surface is more than or equal to the height of element highly the highest in these elements; And
This flat heat dissipation element is set on this tabular surface.
23. manufacture method as claimed in claim 22, wherein this planarization member is made by an electrical insulating material.
24. manufacture method as claimed in claim 23, wherein this planarization member is a thermosetting polymer.
25. manufacture method as claimed in claim 24, wherein this planarization member is selected from by polyimides, reaches group and combination thereof that silicone is formed.
26. manufacture method as claimed in claim 23, wherein this planarization member also comprises a Heat Conduction Material.
27. manufacture method as claimed in claim 26, wherein this Heat Conduction Material is selected from by aluminium nitride, carborundum, boron nitride, reaches group and combination thereof that zinc oxide is formed.
28. manufacture method as claimed in claim 22, wherein this planarization member also can by a diaphragm and should be flat heat dissipation element coat, and this diaphragm and this flat heat dissipation element are arranged at two opposition sides of this planarization member respectively.
29. manufacture method as claimed in claim 28 wherein before being arranged at this planarization member on this circuit board, is separated this diaphragm with this planarization member.
30. manufacture method as claimed in claim 22, wherein this flat heat dissipation element is selected from by flat plate heat tube, miniature radiating fin, steam chamber, reaches group and combination thereof that the water-cooled element is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03136702XA CN1307858C (en) | 2003-05-21 | 2003-05-21 | Functional module and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03136702XA CN1307858C (en) | 2003-05-21 | 2003-05-21 | Functional module and producing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1549675A true CN1549675A (en) | 2004-11-24 |
| CN1307858C CN1307858C (en) | 2007-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03136702XA Expired - Fee Related CN1307858C (en) | 2003-05-21 | 2003-05-21 | Functional module and producing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN1307858C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7551435B2 (en) | 2005-03-11 | 2009-06-23 | Fujitsu Limited | Heat-absorbing member, cooling device, and electronic apparatus |
| CN101115366B (en) * | 2006-07-28 | 2011-01-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102169856A (en) * | 2010-01-29 | 2011-08-31 | 日东电工株式会社 | Heat dissipation structure body |
| CN101340797B (en) * | 2007-07-04 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN105210463A (en) * | 2013-03-26 | 2015-12-30 | 首要金属科技奥地利有限责任公司 | Electronics protection housing for accommodating electronics |
| CN109923317A (en) * | 2016-11-11 | 2019-06-21 | 信浓绢糸株式会社 | Electrodynamic pump |
| CN111912274A (en) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001280773A1 (en) * | 2000-08-03 | 2002-02-18 | Hamilton Sundstrand Corporation | Adhesive bonding of printed circuit boards to heat sinks |
| CN2534775Y (en) * | 2002-04-03 | 2003-02-05 | 英业达股份有限公司 | Heat conduction radiating structure for electronic element of circuit board |
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2003
- 2003-05-21 CN CNB03136702XA patent/CN1307858C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7551435B2 (en) | 2005-03-11 | 2009-06-23 | Fujitsu Limited | Heat-absorbing member, cooling device, and electronic apparatus |
| CN101142866B (en) * | 2005-03-11 | 2012-07-04 | 富士通株式会社 | Heat-absorbing member, cooling device, and electronic apparatus |
| CN101115366B (en) * | 2006-07-28 | 2011-01-19 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101340797B (en) * | 2007-07-04 | 2011-08-31 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN102169856A (en) * | 2010-01-29 | 2011-08-31 | 日东电工株式会社 | Heat dissipation structure body |
| CN104658994A (en) * | 2010-01-29 | 2015-05-27 | 日东电工株式会社 | Heat dissipation structure |
| CN102169856B (en) * | 2010-01-29 | 2015-06-24 | 日东电工株式会社 | Heat dissipation structure body |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN103096636B (en) * | 2012-12-27 | 2015-09-09 | 华为技术有限公司 | A kind of manufacture method of conductive structure part and producing device and conductive structure part |
| CN105210463A (en) * | 2013-03-26 | 2015-12-30 | 首要金属科技奥地利有限责任公司 | Electronics protection housing for accommodating electronics |
| CN109923317A (en) * | 2016-11-11 | 2019-06-21 | 信浓绢糸株式会社 | Electrodynamic pump |
| CN111912274A (en) * | 2019-05-10 | 2020-11-10 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1307858C (en) | 2007-03-28 |
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