WO2021145096A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2021145096A1
WO2021145096A1 PCT/JP2020/045477 JP2020045477W WO2021145096A1 WO 2021145096 A1 WO2021145096 A1 WO 2021145096A1 JP 2020045477 W JP2020045477 W JP 2020045477W WO 2021145096 A1 WO2021145096 A1 WO 2021145096A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
lid
electronic component
heat sink
Prior art date
Application number
PCT/JP2020/045477
Other languages
French (fr)
Japanese (ja)
Inventor
岳史 石川
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Publication of WO2021145096A1 publication Critical patent/WO2021145096A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This disclosure relates to electronic devices.
  • Patent Document 1 discloses a configuration in which heat generated from an electronic component is transferred to a heat sink via a heat radiating member in order to improve the heat dissipation of the electronic component.
  • Patent Document 2 has a configuration in which a shield member is used to connect a lid for heat dissipation of an electronic component to a printed circuit board in order to achieve both EMC (Electromagnetic Compatibility) measures and improvement of heat dissipation of the electronic component. It is disclosed.
  • EMC Electromagnetic Compatibility
  • fans heat sinks, and heat dissipation members as means for improving the heat dissipation of electronic components, and it is conceivable to improve these means.
  • the fan if it is attempted to improve the cooling performance, there is a concern that the power consumption of the motor and the driving noise will increase, so it is difficult to adopt a method for improving the fan.
  • the heat sink in order to improve the heat transfer performance, it is necessary to optimize it according to the design requirements such as the area of the heat sink and the number of heat radiation fins, so there is a limit to the method for improving the heat sink.
  • the heat radiating member high thermal conductivity of the material is considered, but there are concerns about problems such as high cost and high interfacial thermal resistance with the heat sink, and it is difficult to adopt a method for improving the heat radiating member.
  • thermal resistance like electrical resistance, is proportional to the thermal conductivity and thickness of the material and inversely proportional to the area. Therefore, in order to reduce the thermal resistance, it is effective to reduce the thickness of the heat radiating member or increase the area.
  • the thickness of the heat dissipation member there is a method of reducing the thickness of the heat dissipation member by applying downward pressure to the heat sink, but in that case, stress is applied to the solder bumps of the electronic components and cracks occur. There is a concern that it may break or break. Further, regarding the area of the heat radiating member, since the size of the electronic component is fixed, there is a limit to the area that can be expanded. Therefore, a method of expanding the heat dissipation area by attaching a metal heat spreader to the electronic component is envisioned.
  • fine wiring is required as the performance and speed of electronic components increase, and wiring must be routed to the surface layer of the printed circuit board. Therefore, it is necessary not only to shield only the electronic components but also to shield the area including the electronic components and the surrounding fine wiring, and the lid covering the area including the electronic components and the surrounding fine wiring is used as a heat spreader. Is assumed. The lid must be grounded for the shield.
  • a first heat radiating member is provided between the electronic component and the lid, and a second heat radiating member is provided between the lid and the heat sink.
  • it is the thickness of the first heat radiating member and the second heat radiating member that is caused by the increase in the thermal resistance, and the thermal resistance is reduced by reducing the thickness of the first heat radiating member and the second heat radiating member. It can be reduced.
  • an electronic device in an electronic device, a printed circuit board, an electronic component mounted on the printed circuit board, a lid composed of a metal material, covering the electronic component and grounding to the printed circuit board, and an electronic component.
  • a first heat-dissipating member provided between the lid and the lid, a heat sink provided above the lid and fixed to the printed circuit board in a state where a downward pressing force acts, and the lid and the heat sink. It is provided with a second heat radiating member provided between them.
  • the configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part, and radiation noise is generated. It can be suppressed.
  • the heat sink When the heat sink is fixed to the printed circuit board, a downward pressure is applied, but the pressure applied directly above the electronic component is suppressed, so the stress applied to the solder bumps of the electronic component is suppressed.
  • the thickness of the heat radiating member can be reduced, and the thermal resistance from the electronic component to the heat sink can be reduced.
  • a lid made of a material, which covers an electronic component and is grounded to a second printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the second printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed.
  • the heat sink When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink.
  • a lid made of a material, which covers an electronic component and is grounded to a first printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the first printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed.
  • the heat sink When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink.
  • FIG. 1 is a vertical sectional side view showing the first embodiment.
  • FIG. 2 is a plan view of the second heat radiating member.
  • FIG. 3 is a vertical sectional side view showing the second embodiment.
  • FIG. 4 is a vertical sectional side view showing the third embodiment.
  • FIG. 5 is a vertical sectional side view showing the fourth embodiment.
  • FIG. 6 is a vertical sectional side view showing the fifth embodiment.
  • FIG. 7 is a vertical sectional side view to be compared.
  • FIG. 8 is a vertical sectional side view showing the sixth embodiment.
  • FIG. 9 is a vertical sectional side view to be compared.
  • FIG. 10 is a vertical sectional side view showing the seventh embodiment.
  • the electronic device 1 is, for example, an in-vehicle electronic device mounted on a vehicle, and includes a printed circuit board 2, a plurality of (three in this embodiment) electronic components 3 to 5 mounted on the printed circuit board 2.
  • a lid 6 and a heat sink 7 are provided.
  • the electronic components 3 to 5 are, for example, ball grid array package type (BGA type) semiconductor elements, in which the semiconductor chip and the package substrate are electrically connected by bonding wires, and the resin mold on the upper surface side of the package substrate as a whole. It is formed as a thin rectangular package.
  • BGA type ball grid array package type
  • solder bumps 8 to 10 are provided on the mounting surface (lower surface in FIG. 1) of the package substrate by a large number of solder balls.
  • solder balls for example, lead-free solder using an alloy such as tin, silver, or copper can be applied.
  • the electronic component 3 is a SoC (System on Chip)
  • the electronic component 4 is a power supply IC (Integrated Circuit)
  • the electronic component 5 is a memory element.
  • the electronic component 3 and the electronic component 4 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2.
  • the electronic component 3 and the electronic component 5 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2.
  • the calorific value of the electronic component 3 is relatively larger than the calorific value of the other electronic components 4 and 5.
  • the printed circuit board 2 is a multilayer substrate in which insulating substrates such as epoxy resin containing glass fibers are laminated in multiple layers, and a conductor pattern is formed on the surface and between layers thereof, and a ground pattern is formed between the layers. Has been done.
  • the surface of the printed circuit board 2 is provided with a land for conduction for solder-bonding the electronic components 3 to 5 corresponding to the solder bumps 8 to 10 of the electronic components 3 to 5 described above, and the lid 6 is provided. There is a grounding land for the grounding. Further, on the surface of the printed circuit board 2, a solder resist layer is provided so as to cover a portion excluding the land for conduction and the land for grounding.
  • the solder resist layer is formed as an outermost layer that protects the conductor pattern and the insulating base material on the surface of the printed circuit board 2 and exposes the land for conduction and the land for grounding.
  • a printed body is provided on the land for conduction and the land for grounding by printing a solder paste using a printing mask. Further, the ground for grounding is conducting with the ground pattern via the via.
  • solder bumps 8 to 10 of the electronic components 3 to 5 are aligned and overlapped with respect to the land for conduction, and heated while controlling the temperature to perform solder bonding. conduct. This heating is performed through a reflow oven (not shown).
  • the printed matter, which is a solder paste, and the solder bumps 8 to 10 are melted and integrated, and then cooled to solidify the solder to form a solder joint, whereby the electronic components 3 to 5 are formed on the printed circuit board 2. It is electrically and physically connected to the solder bumps 8 to 10 via solder bumps 8 to 10.
  • the lid 6 is provided so as to cover the electronic components 3 to 5 from above.
  • the lid 6 is made of a metal material such as aluminum or copper, and has a concave shape having a hollow portion 13 formed of a ceiling surface portion 11 and a side surface portion 12.
  • a first heat radiating member 14 is provided between the upper surface 3a of the electronic component 3 and the lower surface 11a of the ceiling surface 11 of the lid 6.
  • the first heat radiating member 14 is, for example, a heat radiating gel formed in a sheet shape.
  • the lower end of the side surface portion 11 of the lid 6 is aligned with the ground for grounding, overlapped, heated while controlling the temperature, and solder-bonded.
  • the lid 6 is physically connected to the printed circuit board 2 and grounded.
  • the heat sink 7 is provided above the lid 6.
  • the heat sink 7 is made of a metal material such as aluminum or copper, and has a base plate 15 and a plurality of heat radiation fins 16.
  • the base plate 15 has a flat plate shape that extends in the plane direction of the ceiling surface portion 11 of the lid 6.
  • the heat radiating fins 16 are thin plate-shaped heat radiating plates, which are erected vertically from the upper surface 15b of the base plate 15 and arranged substantially parallel to each other, and a ventilation path is formed between adjacent heat radiating fins 16. There is.
  • a second heat radiating member 17 is provided between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 15a of the base plate 15.
  • the second heat radiating member 17 is, for example, a heat radiating gel formed in a sheet shape. Since the second heat radiating member 17 is provided, most of the heat transferred from the electronic component 3 to the lid 6 via the first heat radiating member 14 is directly transferred to the second heat radiating member 17 and from the second heat radiating member 17. It is transmitted to the base plate 15. Then, most of the heat transferred to the base plate 15 is transferred to the heat radiation fins 16 and diffused from the heat radiation fins 16.
  • the heat sink 7 is fixed to the printed circuit board 2 by the fastening member 18.
  • the fastening member 18 includes a bolt 19, a spring 20, a nut 21, and the like, and is arranged at four corners of a base plate 15 in, for example, a heat sink 4. Through holes 22 through which bolts 19 are inserted are provided at the four corners of the base plate 15. Further, at the four corners of the printed circuit board 2, through holes 23 corresponding to the through holes 22 of the base plate 15 and through which the bolts 19 are inserted are provided.
  • a bolster plate 24 is arranged on the back surface side of the printed circuit board 2. One end side (lower end side in FIG. 1) of the bolt 19 is connected to the bolster plate 24 via a fixture 25 such as a driving screw.
  • a nut 21 and a spring 20 are mounted on the other end side (upper end side in FIG. 1) of the bolt 19, and the spring 20 is compressed by tightening the nut 21.
  • the restoring force of the spring 20 presses the heat sink 7 against the printed circuit board 2. That is, the heat sink 7 is fastened to the printed circuit board 2 by the fastening member 18, and the heat sink 7 is fixed to the printed circuit board 2 in a state where a pressing force is applied to the printed circuit board 2 side.
  • the direction from the heat sink 7 toward the printed circuit board 2 (the direction indicated by the arrow A in FIG. 1) is referred to as a downward direction.
  • the second heat radiating member 17 is formed into a shape having a hollow portion, and is in contact with the hollow portion 26 and the upper surface 11b of the ceiling surface portion 11 of the lid 6 around the hollow portion 26 and a heat sink. It has a contact portion 27 in contact with the lower surface 15a of the base plate 15 of 7.
  • the hollow portion 26 is arranged directly above the electronic component 3
  • the contact portion 27 is arranged away from directly above the electronic component 3. .. That is, the second heat radiating member 17 is partially in contact with the upper surface 11b of the ceiling surface portion 11 of the lid 6 and is partially in contact with the lower surface 15a of the base plate 15 of the heat sink 7.
  • the second heat radiating member 17 is present at a portion detached from directly above the electronic component 3, but the second heat radiating member 17 is omitted directly above the electronic component 3.
  • the lid 6 is grounded to the printed circuit board 2 in the electronic device 1, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is grounded. Radiation noise can be suppressed by being discharged to the portion.
  • the heat sink 7 is fixed to the printed circuit board 2, a downward pressing force acts, but the second heat radiating member 17 is omitted directly above the electronic component 3, and the pressing force acts directly above the electronic component 3. Therefore, the thickness of the first heat radiating member 14 and the second heat radiating member 17 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the thermal resistance from the electronic component 3 to the heat sink 7 is reduced. It can be reduced. As a result, radiation noise from the electronic components 3 to 5 can be appropriately suppressed, and heat dissipation can be appropriately improved.
  • the configuration in which the first heat radiating member 14 is provided between the electronic component 3 and the lid 6 having the largest heat generation among the electronic components 3 to 5 is illustrated, but other electronic components are illustrated.
  • a heat radiating member may be provided between the components 4 and 5 and the lid 6. Even in that case, a downward pressing force acts when the heat sink 7 is fixed to the printed circuit board 2, but since the second heat radiating member 17 is omitted directly above the electronic component 3 as described above. , The action of the pressing force directly above the electronic component 3 is suppressed.
  • the shape of the upper surface of the ceiling surface portion of the lid is different from that of the first embodiment described above.
  • the lid 32 has a shape in which directly above the electronic component 3 is recessed downward on the upper surface 33b of the ceiling surface portion 33. That is, the upper surface 33b of the ceiling surface 33 of the lid 32 has a reference surface 33c and a concave surface 33d recessed downward from the reference surface 33c. Further, the lid 32 is physically connected to the printed circuit board 2 and is grounded.
  • the second heat radiating member 34 is in contact with the entire lower surface 15a of the base plate 15 of the heat sink 7, and is in contact with the entire upper surface 33b of the ceiling surface 33 of the lid 32.
  • the heat sink 7 when the heat sink 7 is fixed to the printed circuit board 2, the heat sink 7 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 7.
  • the second heat radiating member 34 When a downward pressing force acts on the heat sink 7, the second heat radiating member 34 is pressed against the heat sink 7, and the thickness of the second heat radiating member 34 is reduced to some extent.
  • the downward pressing force acting on the heat sink 7 is transmitted to the lid 32 via the second heat radiating member 34, and the downward pressing force acts on the lid 32.
  • the first heat radiating member 14 When a downward pressing force acts on the lid 32, the first heat radiating member 14 is pressed against the lid 32, and the thickness of the first heat radiating member 14 is reduced to some extent.
  • the same effect as that of the first embodiment can be obtained. That is, since the lid 32 is grounded to the printed circuit board 2 in the electronic device 31, even if a noise current is induced in the lid 32 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is generated. Is discharged to the grounded portion, so that radiation noise can be suppressed.
  • a downward pressing force acts, but on the upper surface 33b of the ceiling surface 33 of the lid 32, the concave surface 33d is directly above the electronic component 3, and is directly above the electronic component 3.
  • the thickness of the first heat radiation member 14 and the second heat radiation member 34 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 7 are used. It is possible to reduce the thermal resistance up to.
  • the third embodiment will be described with reference to FIG.
  • the shape of the lower surface of the base plate of the heat sink is different from that of the first embodiment described above.
  • the heat sink 42 has an upper surface recessed directly above the electronic component 3 on the lower surface 43a of the base plate 43. That is, the lower surface 43a of the base plate 43 of the heat sink 42 has a reference surface 43c and a concave surface 43d recessed upward from the reference surface 43c.
  • the second heat radiating member 44 is in contact with the entire lower surface 43a of the base plate 43 of the heat sink 42, and is in contact with the entire upper surface 11b of the ceiling surface portion 11 of the lid 6.
  • the heat sink 42 when the heat sink 42 is fixed to the printed circuit board 2, the heat sink 42 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 42.
  • a downward pressing force acts on the heat sink 42
  • the second heat radiating member 44 is pressed against the heat sink 42, and the thickness of the second heat radiating member 44 is reduced to some extent.
  • the downward pressing force acting on the heat sink 42 is transmitted to the lid 6 via the second heat radiating member 44, and the downward pressing force acts on the lid 6.
  • the first heat radiating member 14 When a downward pressing force acts on the lid 6, the first heat radiating member 14 is pressed against the lid 6, and the thickness of the first heat radiating member 14 is reduced to some extent.
  • the same effect as that of the first embodiment can be obtained. That is, since the lid 6 is grounded to the printed circuit board 2 in the electronic device 41, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is induced. Is discharged to the grounded portion, so that radiation noise can be suppressed.
  • the heat sink 42 is fixed to the printed circuit board 2, a downward pressing force acts.
  • the concave surface 43d is formed directly above the electronic component 3, and the heat sink 42 is directly above the electronic component 3.
  • the thickness of the first heat radiating member 14 and the second heat radiating member 44 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 42 are used.
  • the thermal resistance of the solder can be reduced.
  • the fourth embodiment will be described with reference to FIG.
  • the fourth embodiment is the same as the first embodiment described above in that the second printed circuit board is mounted on the first printed circuit board and the same configuration as that of the third embodiment described above is mounted on the second printed circuit board. different.
  • the first printed circuit board functions as a mother board, and the second printed circuit board functions as a module board.
  • the electronic device 51 includes a flat plate-shaped first printed circuit board 52 and a flat plate-shaped second printed circuit board 53 mounted on the first printed circuit board 52.
  • the second printed circuit board 53 is equivalent to the printed circuit board 2 described in the first embodiment, and the electronic components 3 to 5, the lid 6, the heat sink 42, and the second printed circuit board 53 described in the third embodiment are placed on the second printed circuit board 53.
  • the first heat radiating member 14 and the second heat radiating member 44 and the like are mounted.
  • the lid 6 is physically connected to and grounded to the second printed circuit board 53.
  • the second printed circuit board 53 is electrically and physically connected to the first printed circuit board 52 via the solder bumps 54.
  • the heat sink 42 is fixed to the first printed circuit board 52 by the fastening member 18.
  • the second printed circuit board 53 is mounted on the first printed circuit board 52, and the lid 6 is physically connected to the second printed circuit board 53 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained.
  • the lid 6 is physically connected to the second printed circuit board 53 and grounded, stress is applied to the second printed circuit board 53 and stress is applied to the solder bumps 54, so that the lid 6 is installed. It is desirable that the solder bumps 54 are provided so as to avoid the periphery of the portion physically connected to the second printed circuit board 53.
  • the fifth embodiment is different from the fourth embodiment described above in that the lid is grounded to the first printed circuit board.
  • the electronic device 61 includes a flat plate-shaped first printed circuit board 62 and a flat plate-shaped second printed circuit board 63 mounted on the first printed circuit board 62.
  • the second printed circuit board 63 is equivalent to the printed circuit board 53 described in the fourth embodiment except that the lid is not physically connected and is not grounded, and the second printed circuit board 63 is on the second printed circuit board 63.
  • the electronic components 3 to 5, the heat sink 42, the first heat radiating member 14, the second heat radiating member 44, and the like described in the third embodiment are mounted.
  • the lid 64 is physically connected to and grounded to the first printed circuit board 62.
  • the second heat radiating member 44 is provided between the upper surface 65b of the ceiling surface portion 65 of the lid 64 and the lower surface 43a of the base plate 43 of the heat sink 42. Further, the second printed circuit board 63 is electrically and physically connected to the first printed circuit board 62 via a solder bump 66.
  • the second printed circuit board 63 is mounted on the first printed circuit board 62, and the lid 64 is physically connected to the first printed circuit board 62 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained.
  • the sixth embodiment will be described with reference to FIGS. 7 to 8.
  • the sixth embodiment shows the measures to be taken when the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52 in the configuration described in the fourth embodiment.
  • the second printed circuit board 53 may be mounted at an angle with respect to the first printed circuit board 52.
  • the heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the first printed circuit board 52 in a state where the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52.
  • the gap between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 43a of the base plate 43 of the heat sink 42 is not constant, and the thickness of the second heat radiating member 44 is non-uniform. Therefore, there is a concern that the heat dissipation property will deteriorate.
  • the degree of fastening by the fastening member 18 is adjusted, and the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52, as shown in FIG.
  • the heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the ceiling surface portion 11 of the lid 6, the upper surface 11b of the ceiling surface portion 11 of the lid 6 is mounted.
  • the gap between the heat sink 42 and the lower surface 43a of the base plate 43 of the heat sink 42 is constant.
  • the surface direction of the base plate 43 of the heat sink 42 is the lid 6. Since the heat sink 42 is mounted so as to be substantially parallel to the surface direction of the ceiling surface portion 11, the thickness of the second heat radiating member 44 can be made uniform, and deterioration of heat radiating property can be avoided. can do.
  • the seventh embodiment will be described with reference to FIGS. 9 to 10.
  • the seventh embodiment shows the measures to be taken when the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62 in the configuration described in the fifth embodiment.
  • the second printed circuit board 63 may be mounted at an angle with respect to the first printed circuit board 62.
  • the lid 64 so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the first printed circuit board 62 in a state where the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62.
  • the gap between the lower surface 65a of the ceiling surface portion 65 of the lid 64 and the electronic component 3 becomes not constant, the thickness of the first heat radiating member 14 becomes non-uniform, and heat is radiated. There is concern that the sex will worsen.
  • a bellows portion 67 is provided on a part of the side surface portion of the lid 64, and the second printed circuit board 63 relates to the first printed circuit board 62.
  • the lid 64 is mounted so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the electronic component 3, so that the ceiling surface portion 65 of the lid 64 is mounted.
  • the gap between the lower surface 65a and the electronic component 3 is constant.
  • the surface direction of the ceiling surface portion 65 of the lid 64 is the electronic component. Since the lid 64 is mounted so as to be substantially parallel to the surface direction of 3, the thickness of the first heat radiating member 14 can be made uniform, and deterioration of heat radiating property can be avoided. ..
  • the number and arrangement of electronic components mounted on the printed circuit board 2 may be other than those illustrated.
  • the number and arrangement modes of the above may be other than those illustrated.
  • one lid may cover a plurality of second printed circuit boards 53 and 63.
  • the lids 6, 32, 64 are grounded to the printed circuit boards 2, 53, 62 by solder bonding. It may be grounded by the above, or it may be grounded by using the pressing force when the heat sinks 7 and 42 are fastened to the printed circuit boards 2, 52 and 62.

Abstract

An electronic device (1) is provided with: a printed circuit board (2); an electronic component (3) mounted on the printed circuit board; a lid (6) that is formed of a metal material and that covers the electronic component and grounds the electronic component to the printed circuit board; a first heat dissipating member (14) provided between the electronic component and the lid; a heatsink (7) that is provided above the lid and that is fixed to the printed circuit board in a state in which a downward pressing force acts; and a second heat dissipating member (17) provided between the lid and the heatsink. In this configuration, the effect of a pressing force applied to the area directly above the electronic component is suppressed.

Description

電子機器Electronics 関連出願の相互参照Cross-reference of related applications
　本出願は、２０２０年１月１６日に出願された日本出願番号２０２０－００５１７９号に基づくもので、ここにその記載内容を援用する。 This application is based on Japanese Application No. 2020-005179 filed on January 16, 2020, and the contents of the description are incorporated herein by reference.
　本開示は、電子機器に関する。 This disclosure relates to electronic devices.
　電子機器の多機能化及び高性能化に伴い、電子機器に搭載される電子部品の高性能化及び高速化が進んでおり、消費電力の増加も見込まれている。例えば特許文献１には、電子部品の放熱性を向上させるために、電子部品から発せられた熱を放熱部材を介してヒートシンクに伝達させる構成が開示されている。又、例えば特許文献２には、ＥＭＣ（Electromagnetic Compatibility）対策と電子部品の放熱性の向上とを両立させるために、シールド部材を用いて電子部品の放熱用のリッドからプリント基板まで接続させる構成が開示されている。 Along with the increasing functionality and performance of electronic devices, the performance and speed of electronic components mounted on electronic devices are increasing, and power consumption is expected to increase. For example, Patent Document 1 discloses a configuration in which heat generated from an electronic component is transferred to a heat sink via a heat radiating member in order to improve the heat dissipation of the electronic component. Further, for example, Patent Document 2 has a configuration in which a shield member is used to connect a lid for heat dissipation of an electronic component to a printed circuit board in order to achieve both EMC (Electromagnetic Compatibility) measures and improvement of heat dissipation of the electronic component. It is disclosed.
特許第５９８３０３２号公報Japanese Patent No. 5983032 特開２０１２－１６４８５２号公報Japanese Unexamined Patent Publication No. 2012-164852
　電子部品の放熱性を向上させる手段として、ファン、ヒートシンク、放熱部材があり、これらの手段を改善することが考えられる。ファンについては、冷却性能を向上させようとすると、モータの消費電力や駆動音の増大が懸念されるので、ファンを改善する手法は採用し難い。ヒートシンクについては、熱伝達性能を向上させようとすると、ヒートシンクの面積や放熱フィンの枚数等の設計要件により最適化せざるを得ないので、ヒートシンクを改善する手法では限界がある。放熱部材については、材料の高熱伝導化が検討されるが、高価であったりヒートシンクとの界面熱抵抗が大きかったりする等の問題が懸念され、放熱部材を改善する手法も採用し難い。 There are fans, heat sinks, and heat dissipation members as means for improving the heat dissipation of electronic components, and it is conceivable to improve these means. As for the fan, if it is attempted to improve the cooling performance, there is a concern that the power consumption of the motor and the driving noise will increase, so it is difficult to adopt a method for improving the fan. As for the heat sink, in order to improve the heat transfer performance, it is necessary to optimize it according to the design requirements such as the area of the heat sink and the number of heat radiation fins, so there is a limit to the method for improving the heat sink. As for the heat radiating member, high thermal conductivity of the material is considered, but there are concerns about problems such as high cost and high interfacial thermal resistance with the heat sink, and it is difficult to adopt a method for improving the heat radiating member.
　このような事情から、ファン、ヒートシンク、放熱部材を個別の要素ではなく、全体で考え、電子部品から発せられた熱を如何にしてヒートシンクまで伝達させ、電子部品からヒートシンクまでの熱抵抗を如何にして低減させるかが課題となる。一般的に熱抵抗は電気抵抗と同様に材料の熱伝導率と厚さに比例し、面積に反比例する。そのため、熱抵抗を低減させるには、放熱部材の厚さを小さくするか又は面積を広げることが有効である。 Under these circumstances, consider the fan, heat sink, and heat dissipation member as a whole, not as individual elements, how to transfer the heat generated from the electronic components to the heat sink, and how to reduce the thermal resistance from the electronic components to the heat sink. The issue is how to reduce it. In general, thermal resistance, like electrical resistance, is proportional to the thermal conductivity and thickness of the material and inversely proportional to the area. Therefore, in order to reduce the thermal resistance, it is effective to reduce the thickness of the heat radiating member or increase the area.
　放熱部材の厚さについては、ヒートシンクに下方向への加圧力を作用させて放熱部材の厚さを小さくする手法があるが、その場合、電子部品のはんだバンプに応力が加わり、クラックが発生したり破断したりすることが懸念される。又、放熱部材の面積については、電子部品のサイズが決まっているので、広げられる面積に限界がある。そこで、電子部品に金属製のヒートスプレッダを取り付けることで、放熱面積を広げる手法が想定される。 Regarding the thickness of the heat dissipation member, there is a method of reducing the thickness of the heat dissipation member by applying downward pressure to the heat sink, but in that case, stress is applied to the solder bumps of the electronic components and cracks occur. There is a concern that it may break or break. Further, regarding the area of the heat radiating member, since the size of the electronic component is fixed, there is a limit to the area that can be expanded. Therefore, a method of expanding the heat dissipation area by attaching a metal heat spreader to the electronic component is envisioned.
　一方、ＥＭＣ対策については、電子部品の高性能化及び高速化に伴って微細な配線が必要になってきており、プリント基板の表層にも配線を引き回さざるを得なくなってきている。そのため、電子部品だけをシールドするだけでなく、電子部品と周囲の微細配線も含めた領域をシールドする必要があり、電子部品と周囲の微細配線も含めた領域を覆うリッドをヒートスプレッダとして活用する構成が想定される。尚、シールドのためにはリッドは接地されている必要がある。 On the other hand, with regard to EMC countermeasures, fine wiring is required as the performance and speed of electronic components increase, and wiring must be routed to the surface layer of the printed circuit board. Therefore, it is necessary not only to shield only the electronic components but also to shield the area including the electronic components and the surrounding fine wiring, and the lid covering the area including the electronic components and the surrounding fine wiring is used as a heat spreader. Is assumed. The lid must be grounded for the shield.
　リッドをヒートスプレッダとして活用する構成では、電子部品とリッドとの間に第１放熱部材が設けられ、リッドとヒートシンクとの間に第２放熱部材が設けられる構成となる。このような構成において熱抵抗の増大に起因するのは第１放熱部材及び第２放熱部材の厚さであり、それら第１放熱部材及び第２放熱部材の厚さを小さくすることで熱抵抗を低減させることができる。第１放熱部材及び第２放熱部材の厚さを小さくするには、この場合も、前述したようにヒートシンクに下方向への加圧力を作用させる手法がある。 In the configuration in which the lid is used as a heat spreader, a first heat radiating member is provided between the electronic component and the lid, and a second heat radiating member is provided between the lid and the heat sink. In such a configuration, it is the thickness of the first heat radiating member and the second heat radiating member that is caused by the increase in the thermal resistance, and the thermal resistance is reduced by reducing the thickness of the first heat radiating member and the second heat radiating member. It can be reduced. In order to reduce the thickness of the first heat radiating member and the second heat radiating member, there is also a method of applying a downward pressing force to the heat sink as described above.
　しかしながら、ヒートシンクに下方向への加圧力を作用させる手法では、前述したように電子部品のはんだバンプに応力が加わり、クラックが発生したり破断したりすることが懸念される。このような事情から、電子部品のはんだバンプに加わる応力を抑えつつ放熱部材の厚さを小さくし、放熱性を向上させる構成が望まれている。 However, in the method of applying downward pressure to the heat sink, as described above, stress is applied to the solder bumps of the electronic components, and there is a concern that cracks may occur or breaks may occur. Under these circumstances, a configuration is desired in which the thickness of the heat radiating member is reduced while suppressing the stress applied to the solder bumps of the electronic component to improve the heat radiating property.
　本開示は、プリント基板上の電子部品を覆うようにリッドが設けられ、リッドの上方にヒートシンクが設けられる構成において、電子部品からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることを目的とする。 In the present disclosure, in a configuration in which a lid is provided so as to cover an electronic component on a printed circuit board and a heat sink is provided above the lid, radiation noise from the electronic component is appropriately suppressed and heat dissipation is appropriately improved. The purpose is.
　本開示の一態様によれば、電子機器において、プリント基板と、プリント基板上に実装されている電子部品と、金属材料から構成され、電子部品を覆うと共にプリント基板に接地するリッドと、電子部品とリッドとの間に設けられている第１放熱部材と、リッドの上方に設けられ、下方向への加圧力が作用する状態でプリント基板に対して固定されるヒートシンクと、リッドとヒートシンクとの間に設けられている第２放熱部材と、を備える。電子部品の直上に対する加圧力の作用が抑えられる構成である。 According to one aspect of the present disclosure, in an electronic device, a printed circuit board, an electronic component mounted on the printed circuit board, a lid composed of a metal material, covering the electronic component and grounding to the printed circuit board, and an electronic component. A first heat-dissipating member provided between the lid and the lid, a heat sink provided above the lid and fixed to the printed circuit board in a state where a downward pressing force acts, and the lid and the heat sink. It is provided with a second heat radiating member provided between them. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
　プリント基板にリッドが接地する構成としたので、電子部品から放射された電磁波によりリッドにノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンクがプリント基板に対して固定される際に下方向への加圧力が作用するが、電子部品の直上に対する加圧力の作用が抑えられる構成としたので、電子部品のはんだバンプに加わる応力を抑えつつ放熱部材の厚さを小さくし、電子部品からヒートシンクまでの熱抵抗を低減させることができる。これにより、プリント基板上の電子部品を覆うようにリッドが設けられ、リッドの上方にヒートシンクが設けられる構成において、電子部品からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることができる。 Since the lid is grounded to the printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part, and radiation noise is generated. It can be suppressed. When the heat sink is fixed to the printed circuit board, a downward pressure is applied, but the pressure applied directly above the electronic component is suppressed, so the stress applied to the solder bumps of the electronic component is suppressed. At the same time, the thickness of the heat radiating member can be reduced, and the thermal resistance from the electronic component to the heat sink can be reduced. As a result, in a configuration in which a lid is provided so as to cover the electronic components on the printed circuit board and a heat sink is provided above the lid, radiation noise from the electronic components is appropriately suppressed and heat dissipation is appropriately improved. Can be done.
　本開示の一態様によれば、電子機器において、第１プリント基板と、第１プリント基板上に実装されている第２プリント基板と、第２プリント基板上に実装されている電子部品と、金属材料から構成され、電子部品を覆うと共に第２プリント基板に接地するリッドと、電子部品とリッドとの間に設けられている第１放熱部材と、リッドの上方に設けられ、下方向への加圧力が作用する状態で第１プリント基板に対して固定されるヒートシンクと、リッドとヒートシンクとの間に設けられている第２放熱部材と、を備える。電子部品の直上に対する加圧力の作用が抑えられる構成である。 According to one aspect of the present disclosure, in an electronic device, a first printed circuit board, a second printed circuit board mounted on the first printed circuit board, an electronic component mounted on the second printed circuit board, and a metal A lid made of a material, which covers an electronic component and is grounded to a second printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
　第２プリント基板にリッドが接地する構成としたので、電子部品から放射された電磁波によりリッドにノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンクが第１プリント基板に対して固定される際に下方向への加圧力が作用するが、電子部品の直上に対する加圧力の作用が抑えられる構成としたので、電子部品のはんだバンプに加わる応力を抑えつつ放熱部材の厚さを小さくし、電子部品からヒートシンクまでの熱抵抗を低減させることができる。これにより、第１プリント基板上に第２プリント基板が実装され、第２プリント基板上の電子部品を覆うようにリッドが設けられ、リッドの上方にヒートシンクが設けられる構成においても、電子部品からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることができる。 Since the lid is grounded to the second printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed. When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink. As a result, even in a configuration in which the second printed circuit board is mounted on the first printed circuit board, a lid is provided so as to cover the electronic components on the second printed circuit board, and a heat sink is provided above the lid, the electronic components can be used. Radiation noise can be appropriately suppressed and heat dissipation can be appropriately improved.
　本開示の一態様によれば、電子機器において、第１プリント基板と、第１プリント基板上に実装されている第２プリント基板と、第２プリント基板上に実装されている電子部品と、金属材料から構成され、電子部品を覆うと共に第１プリント基板に接地するリッドと、電子部品とリッドとの間に設けられている第１放熱部材と、リッドの上方に設けられ、下方向への加圧力が作用する状態で第１プリント基板に対して固定されるヒートシンクと、リッドとヒートシンクとの間に設けられている第２放熱部材と、を備える。電子部品の直上に対する加圧力の作用が抑えられる構成である。 According to one aspect of the present disclosure, in an electronic device, a first printed circuit board, a second printed circuit board mounted on the first printed circuit board, an electronic component mounted on the second printed circuit board, and a metal A lid made of a material, which covers an electronic component and is grounded to a first printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
　第１プリント基板にリッドが接地する構成としたので、電子部品から放射された電磁波によりリッドにノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンクが第１プリント基板に対して固定される際に下方向への加圧力が作用するが、電子部品の直上に対する加圧力の作用が抑えられる構成としたので、電子部品のはんだバンプに加わる応力を抑えつつ放熱部材の厚さを小さくし、電子部品からヒートシンクまでの熱抵抗を低減させることができる。これにより、第１プリント基板上に第２プリント基板が実装され、第２プリント基板上の電子部品を覆うようにリッドが設けられ、リッドの上方にヒートシンクが設けられる構成においても、電子部品からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることができる。 Since the lid is grounded to the first printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed. When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink. As a result, even in a configuration in which the second printed circuit board is mounted on the first printed circuit board, a lid is provided so as to cover the electronic components on the second printed circuit board, and a heat sink is provided above the lid, the electronic components can be used. Radiation noise can be appropriately suppressed and heat dissipation can be appropriately improved.
　本開示についての上記目的及びその他の目的、特徴や利点は、添付の図面を参照しながら下記の詳細な記述により、より明確になる。その図面は、
図１は、第１実施形態を示す縦断側面図であり、 図２は、第２放熱部材の平面図であり、 図３は、第２実施形態を示す縦断側面図であり、 図４は、第３実施形態を示す縦断側面図であり、 図５は、第４実施形態を示す縦断側面図であり、 図６は、第５実施形態を示す縦断側面図であり、 図７は、比較対象の縦断側面図であり、 図８は、第６実施形態を示す縦断側面図であり、 図９は、比較対象の縦断側面図であり、 図１０は、第７実施形態を示す縦断側面図である。 The above objectives and other objectives, features and advantages of the present disclosure will be clarified by the following detailed description with reference to the accompanying drawings. The drawing is
FIG. 1 is a vertical sectional side view showing the first embodiment. FIG. 2 is a plan view of the second heat radiating member. FIG. 3 is a vertical sectional side view showing the second embodiment. FIG. 4 is a vertical sectional side view showing the third embodiment. FIG. 5 is a vertical sectional side view showing the fourth embodiment. FIG. 6 is a vertical sectional side view showing the fifth embodiment. FIG. 7 is a vertical sectional side view to be compared. FIG. 8 is a vertical sectional side view showing the sixth embodiment. FIG. 9 is a vertical sectional side view to be compared. FIG. 10 is a vertical sectional side view showing the seventh embodiment.
　以下、電子機器の幾つかの実施形態について図面を参照して説明する。以下に示す各実施形態において、先行する実施形態で説明した内容に対応する部分には同一の参照符号を付し、重複する説明を省略することがある。 Hereinafter, some embodiments of the electronic device will be described with reference to the drawings. In each of the following embodiments, the same reference numerals may be given to the parts corresponding to the contents described in the preceding embodiments, and duplicate description may be omitted.
　（第１実施形態）
　第１実施形態について図１から図２を参照して説明する。電子機器１は、例えば車両に搭載される車載用の電子機器であり、プリント基板２と、プリント基板２上に実装されている複数（本実施形態では３個）の電子部品３～５と、リッド６と、ヒートシンク７とを備える。電子部品３～５は、例えばボールグリッドアレイパッケージ型（ＢＧＡ型）の半導体素子であり、半導体チップとパッケージ基板とがボンディングワイヤにより電気的に接続され、パッケージ基板の上面側に対する樹脂モールドにより全体として薄形矩形状のパッケージとして形成されている。 (First Embodiment)
The first embodiment will be described with reference to FIGS. 1 to 2. The electronic device 1 is, for example, an in-vehicle electronic device mounted on a vehicle, and includes a printed circuit board 2, a plurality of (three in this embodiment) electronic components 3 to 5 mounted on the printed circuit board 2. A lid 6 and a heat sink 7 are provided. The electronic components 3 to 5 are, for example, ball grid array package type (BGA type) semiconductor elements, in which the semiconductor chip and the package substrate are electrically connected by bonding wires, and the resin mold on the upper surface side of the package substrate as a whole. It is formed as a thin rectangular package.
　電子部品３～５において、パッケージ基板の実装面（図１では下面）には多数のはんだボールによりはんだバンプ８～１０が設けられている。はんだボールは、例えば錫、銀、銅等の合金を用いた無鉛はんだを適用することができる。本実施形態では、例えば電子部品３はＳｏＣ（System on Chip）であり、電子部品４は電源ＩＣ（Integrated Circuit）であり、電子部品５はメモリ素子である。電子部品３と電子部品４は、プリント基板２の表面で配線（図示略）により電気的に接続されている。電子部品３と電子部品５は、プリント基板２の表面で配線（図示略）により電気的に接続されている。又、電子部品３の発熱量は、他の電子部品４，５の発熱量よりも相対的に大きい。 In the electronic components 3 to 5, solder bumps 8 to 10 are provided on the mounting surface (lower surface in FIG. 1) of the package substrate by a large number of solder balls. For the solder balls, for example, lead-free solder using an alloy such as tin, silver, or copper can be applied. In the present embodiment, for example, the electronic component 3 is a SoC (System on Chip), the electronic component 4 is a power supply IC (Integrated Circuit), and the electronic component 5 is a memory element. The electronic component 3 and the electronic component 4 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2. The electronic component 3 and the electronic component 5 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2. Further, the calorific value of the electronic component 3 is relatively larger than the calorific value of the other electronic components 4 and 5.
　プリント基板２は、例えばガラス繊維を含有したエポキシ樹脂等の絶縁基材が多層に積層されている多層基板であり、その表面及び層間に導体パターンが形成されていると共に、層間にグランドパターンが形成されている。プリント基板２の表面には、上記した電子部品３～５のはんだバンプ８～１０に対応し、電子部品３～５がはんだ接合されるための導通用のランドが設けられていると共に、リッド６が接地されるための接地用のランドが設けられている。又、プリント基板２の表面には、導通用のランド及び接地用のランドを除く部分を覆うようにソルダーレジスト層が設けられている。ソルダーレジスト層は、プリント基板２の表面において導体パターンや絶縁基材を保護すると共に、導通用のランド及び接地用のランドを露出させる最外層として形成されている。導通用のランド及び接地用のランド上には、印刷用のマスクを用いてはんだペーストが印刷されることにより印刷体が設けられている。又、接地用のランドは、ビアを介してグランドパターンと導通している。 The printed circuit board 2 is a multilayer substrate in which insulating substrates such as epoxy resin containing glass fibers are laminated in multiple layers, and a conductor pattern is formed on the surface and between layers thereof, and a ground pattern is formed between the layers. Has been done. The surface of the printed circuit board 2 is provided with a land for conduction for solder-bonding the electronic components 3 to 5 corresponding to the solder bumps 8 to 10 of the electronic components 3 to 5 described above, and the lid 6 is provided. There is a grounding land for the grounding. Further, on the surface of the printed circuit board 2, a solder resist layer is provided so as to cover a portion excluding the land for conduction and the land for grounding. The solder resist layer is formed as an outermost layer that protects the conductor pattern and the insulating base material on the surface of the printed circuit board 2 and exposes the land for conduction and the land for grounding. A printed body is provided on the land for conduction and the land for grounding by printing a solder paste using a printing mask. Further, the ground for grounding is conducting with the ground pattern via the via.
　電子部品３～５をプリント基板２に実装する工程では、電子部品３～５のはんだバンプ８～１０を導通用のランドに対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。この加熱は、図示しないリフロー炉を通して行う。はんだペーストである印刷体とはんだバンプ８～１０とが溶融されて一体化され、その後に冷却され、はんだが固化してはんだ接合部が形成されることで、電子部品３～５がプリント基板２に対してはんだバンプ８～１０を介して電気的及び物理的に接続される。 In the process of mounting the electronic components 3 to 5 on the printed circuit board 2, the solder bumps 8 to 10 of the electronic components 3 to 5 are aligned and overlapped with respect to the land for conduction, and heated while controlling the temperature to perform solder bonding. conduct. This heating is performed through a reflow oven (not shown). The printed matter, which is a solder paste, and the solder bumps 8 to 10 are melted and integrated, and then cooled to solidify the solder to form a solder joint, whereby the electronic components 3 to 5 are formed on the printed circuit board 2. It is electrically and physically connected to the solder bumps 8 to 10 via solder bumps 8 to 10.
　リッド６は、電子部品３～５を上方から覆うように設けられている。リッド６は、例えばアルミニウムや銅等の金属材料から構成され、天井面部１１と側面部１２とから形成される中空部１３を有する凹形状である。電子部品３の上面３ａとリッド６の天井面部１１の下面１１ａとの間には第１放熱部材１４が設けられている。第１放熱部材１４は、例えばシート状に成形されている放熱ゲルである。第１放熱部材１４が設けられていることで、電子部品３から発せられた熱の殆どは、第１放熱部材１４に直接伝わり、第１放熱部材１４からリッド６の天井面部１１に伝わる。即ち、本実施形態では、電子部品３～５の中で発熱量が最大である電子部品３とリッド６との間に第１放熱部材１４が設けられている構成である。 The lid 6 is provided so as to cover the electronic components 3 to 5 from above. The lid 6 is made of a metal material such as aluminum or copper, and has a concave shape having a hollow portion 13 formed of a ceiling surface portion 11 and a side surface portion 12. A first heat radiating member 14 is provided between the upper surface 3a of the electronic component 3 and the lower surface 11a of the ceiling surface 11 of the lid 6. The first heat radiating member 14 is, for example, a heat radiating gel formed in a sheet shape. By providing the first heat radiating member 14, most of the heat generated from the electronic component 3 is directly transferred to the first heat radiating member 14, and is transferred from the first heat radiating member 14 to the ceiling surface portion 11 of the lid 6. That is, in the present embodiment, the first heat radiating member 14 is provided between the electronic component 3 and the lid 6, which have the largest heat generation amount among the electronic components 3 to 5.
　リッド６をプリント基板２に実装する工程では、リッド６の側面部１１の下端部を接地用のランドに対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。はんだが固化してはんだ接合部が形成されることで、リッド６がプリント基板２に対して物理的に接続されると共に接地される。リッド６がプリント基板２に実装された状態では、リッド６の天井面部１１の面方向とプリント基板２の面方向とが略平行となる。 In the process of mounting the lid 6 on the printed circuit board 2, the lower end of the side surface portion 11 of the lid 6 is aligned with the ground for grounding, overlapped, heated while controlling the temperature, and solder-bonded. When the solder solidifies to form a solder joint, the lid 6 is physically connected to the printed circuit board 2 and grounded. When the lid 6 is mounted on the printed circuit board 2, the surface direction of the ceiling surface portion 11 of the lid 6 and the surface direction of the printed circuit board 2 are substantially parallel.
　ヒートシンク７は、リッド６の上方に設けられている。ヒートシンク７は、例えばアルミニウムや銅等の金属材料から構成され、ベースプレート１５と、複数枚の放熱フィン１６とを有する。ベースプレート１５は、リッド６の天井面部１１の面方向に広がる平板形状である。放熱フィン１６は、それぞれ薄板形状の放熱板であり、ベースプレート１５の上面１５ｂから垂直方向に立設されて相互に略平行に配列されており、隣接する同士の間に通気路を区画形成している。 The heat sink 7 is provided above the lid 6. The heat sink 7 is made of a metal material such as aluminum or copper, and has a base plate 15 and a plurality of heat radiation fins 16. The base plate 15 has a flat plate shape that extends in the plane direction of the ceiling surface portion 11 of the lid 6. The heat radiating fins 16 are thin plate-shaped heat radiating plates, which are erected vertically from the upper surface 15b of the base plate 15 and arranged substantially parallel to each other, and a ventilation path is formed between adjacent heat radiating fins 16. There is.
　リッド６の天井面部１１の上面１１ｂとベースプレート１５の下面１５ａとの間には第２放熱部材１７が設けられている。第２放熱部材１７は、第１放熱部材１５と同様に、例えばシート状に成形されている放熱ゲルである。第２放熱部材１７が設けられていることで、電子部品３から第１放熱部材１４を介してリッド６に伝わった熱の殆どは、第２放熱部材１７に直接伝わり、第２放熱部材１７からベースプレート１５に伝わる。そして、ベースプレート１５に伝わった熱の殆どは、放熱フィン１６に伝わり、放熱フィン１６から拡散される。 A second heat radiating member 17 is provided between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 15a of the base plate 15. Like the first heat radiating member 15, the second heat radiating member 17 is, for example, a heat radiating gel formed in a sheet shape. Since the second heat radiating member 17 is provided, most of the heat transferred from the electronic component 3 to the lid 6 via the first heat radiating member 14 is directly transferred to the second heat radiating member 17 and from the second heat radiating member 17. It is transmitted to the base plate 15. Then, most of the heat transferred to the base plate 15 is transferred to the heat radiation fins 16 and diffused from the heat radiation fins 16.
　ヒートシンク７は、締結部材１８によりプリント基板２に対して固定されている。締結部材１８は、ボルト１９、スプリング２０及びナット２１等を含み、例えばヒートシンク４におけるベースプレート１５の四隅に配置されている。ベースプレート１５の四隅には、ボルト１９を挿通させる貫通孔２２が設けられている。又、プリント基板２の四隅にも、ベースプレート１５の貫通孔２２と対応し、ボルト１９を挿通させる貫通孔２３が設けられている。プリント基板２の裏面側にはボルスタープレート２４が配置されている。ボルト１９の一端側（図１では下端側）は、打ち込みネジ等の固定具２５を介してボルスタープレート２４に連結されている。ボルト１９の他端側（図１では上端側）は、ナット２１及びスプリング２０が装着されており、ナット２１が締め付けられることでスプリング２０が圧縮される。この場合、スプリング２０の復元力によりヒートシンク７がプリント基板２側に押し付けられる。即ち、ヒートシンク７がプリント基板２に対して締結部材１８により締結され、ヒートシンク７にプリント基板２側への加圧力が作用する状態で、ヒートシンク７がプリント基板２に対して固定されている。尚、ヒートシンク７からプリント基板２に向かう方向（図１中矢印Ａにて示す方向）を下方向と称する。 The heat sink 7 is fixed to the printed circuit board 2 by the fastening member 18. The fastening member 18 includes a bolt 19, a spring 20, a nut 21, and the like, and is arranged at four corners of a base plate 15 in, for example, a heat sink 4. Through holes 22 through which bolts 19 are inserted are provided at the four corners of the base plate 15. Further, at the four corners of the printed circuit board 2, through holes 23 corresponding to the through holes 22 of the base plate 15 and through which the bolts 19 are inserted are provided. A bolster plate 24 is arranged on the back surface side of the printed circuit board 2. One end side (lower end side in FIG. 1) of the bolt 19 is connected to the bolster plate 24 via a fixture 25 such as a driving screw. A nut 21 and a spring 20 are mounted on the other end side (upper end side in FIG. 1) of the bolt 19, and the spring 20 is compressed by tightening the nut 21. In this case, the restoring force of the spring 20 presses the heat sink 7 against the printed circuit board 2. That is, the heat sink 7 is fastened to the printed circuit board 2 by the fastening member 18, and the heat sink 7 is fixed to the printed circuit board 2 in a state where a pressing force is applied to the printed circuit board 2 side. The direction from the heat sink 7 toward the printed circuit board 2 (the direction indicated by the arrow A in FIG. 1) is referred to as a downward direction.
　第２放熱部材１７は、図２に示すように、中空を有する形状に成形されており、中空部２６と、中空部２６の周囲であってリッド６の天井面部１１の上面１１ｂに接すると共にヒートシンク７のベースプレート１５の下面１５ａに接する接触部２７とを有する。リッド６とヒートシンク７との間に第２放熱部材１７が設けられている状態では、中空部２６が電子部品３の直上に配置され、接触部２７が電子部品３の直上から外れて配置される。即ち、第２放熱部材１７は、リッド６の天井面部１１の上面１１ｂに部分的に接すると共に、ヒートシンク７のベースプレート１５の下面１５ａに部分的に接している。電子部品３の直上から外れた部位には第２放熱部材１７が存在するが、電子部品３の直上には第２放熱部材１７が省略されている。 As shown in FIG. 2, the second heat radiating member 17 is formed into a shape having a hollow portion, and is in contact with the hollow portion 26 and the upper surface 11b of the ceiling surface portion 11 of the lid 6 around the hollow portion 26 and a heat sink. It has a contact portion 27 in contact with the lower surface 15a of the base plate 15 of 7. In a state where the second heat radiating member 17 is provided between the lid 6 and the heat sink 7, the hollow portion 26 is arranged directly above the electronic component 3, and the contact portion 27 is arranged away from directly above the electronic component 3. .. That is, the second heat radiating member 17 is partially in contact with the upper surface 11b of the ceiling surface portion 11 of the lid 6 and is partially in contact with the lower surface 15a of the base plate 15 of the heat sink 7. The second heat radiating member 17 is present at a portion detached from directly above the electronic component 3, but the second heat radiating member 17 is omitted directly above the electronic component 3.
　上記した構成では、ヒートシンク７がプリント基板２に対して固定される際には、締結部材１８により締結されることで、ヒートシンク７に下方向への加圧力が作用する。ヒートシンク７に下方向への加圧力が作用することで、第２放熱部材１７が押し付けられ、第２放熱部材１７の厚さがある程度まで小さくなる。又、ヒートシンク７に作用する下方向への加圧力が第２放熱部材１７を介してリッド６に伝達され、リッド６に下方向への加圧力が作用する。リッド６に下方向への加圧力が作用することで、第１放熱部材１４が押し付けられ、第１放熱部材１４の厚さがある程度まで小さくなる。 In the above configuration, when the heat sink 7 is fixed to the printed circuit board 2, the heat sink 7 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 7. When a downward pressing force acts on the heat sink 7, the second heat radiating member 17 is pressed against the heat sink 7, and the thickness of the second heat radiating member 17 is reduced to some extent. Further, the downward pressing force acting on the heat sink 7 is transmitted to the lid 6 via the second heat radiating member 17, and the downward pressing force acts on the lid 6. When a downward pressing force acts on the lid 6, the first heat radiating member 14 is pressed against the lid 6, and the thickness of the first heat radiating member 14 is reduced to some extent.
　この場合、ヒートシンク７とリッド６との間では電子部品３の直上で第２放熱部材１７が省略されているので、ヒートシンク７に作用する下方向への加圧力の殆どが第２放熱部材１７を介してリッド６の天井面部１１の上面１１ｂにおいて電子部品３の直上から外れた部位に作用する。そのため、電子部品３の直上に作用するヒートシンク７からの下方向への加圧力が低減されるので、リッド６から第１放熱部材１４を介して電子部品３に伝達される加圧力が低減され、電子部品３のはんだバンプ８に加わる応力が低減される。その結果、はんだバンプ８に加わる応力に起因するクラックの発生や破断が未然に回避される。 In this case, since the second heat radiating member 17 is omitted directly above the electronic component 3 between the heat sink 7 and the lid 6, most of the downward pressing force acting on the heat sink 7 causes the second heat radiating member 17. It acts on a portion of the upper surface 11b of the ceiling surface portion 11 of the lid 6 that is detached from directly above the electronic component 3. Therefore, the downward pressing force from the heat sink 7 acting directly above the electronic component 3 is reduced, so that the pressing force transmitted from the lid 6 to the electronic component 3 via the first heat radiating member 14 is reduced. The stress applied to the solder bump 8 of the electronic component 3 is reduced. As a result, the generation and breakage of cracks due to the stress applied to the solder bump 8 can be avoided.
　第１実施形態によれば、以下に示す作用効果を得ることができる。電子装置１において、プリント基板２にリッド６が接地する構成としたので、電子部品３～５から放射された電磁波によりリッド６にノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンク７がプリント基板２に対して固定される際に下方向への加圧力が作用するが、電子部品３の直上で第２放熱部材１７を省略し、電子部品３の直上に対する加圧力の作用が抑えられる構成としたので、電子部品３のはんだバンプ８に加わる応力を抑えつつ第１放熱部材１４及び第２放熱部材１７の厚さを小さくし、電子部品３からヒートシンク７までの熱抵抗を低減させることができる。これにより、電子部品３～５からの輻射ノイズを適切に抑制すると共に、放熱性を適切に向上させることができる。 According to the first embodiment, the following effects can be obtained. Since the lid 6 is grounded to the printed circuit board 2 in the electronic device 1, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is grounded. Radiation noise can be suppressed by being discharged to the portion. When the heat sink 7 is fixed to the printed circuit board 2, a downward pressing force acts, but the second heat radiating member 17 is omitted directly above the electronic component 3, and the pressing force acts directly above the electronic component 3. Therefore, the thickness of the first heat radiating member 14 and the second heat radiating member 17 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the thermal resistance from the electronic component 3 to the heat sink 7 is reduced. It can be reduced. As a result, radiation noise from the electronic components 3 to 5 can be appropriately suppressed, and heat dissipation can be appropriately improved.
　本実施形態では、電子部品３～５の中で発熱量が最大である電子部品３とリッド６との間に第１放熱部材１４が設けられている構成を例示しているが、他の電子部品４，５とリッド６との間にも放熱部材が設けられている構成でも良い。その場合でも、ヒートシンク７がプリント基板２に対して固定される際に下方向への加圧力が作用するが、上記したように電子部品３の直上で第２放熱部材１７が省略されているので、電子部品３の直上に対する加圧力の作用が抑えられる。 In the present embodiment, the configuration in which the first heat radiating member 14 is provided between the electronic component 3 and the lid 6 having the largest heat generation among the electronic components 3 to 5 is illustrated, but other electronic components are illustrated. A heat radiating member may be provided between the components 4 and 5 and the lid 6. Even in that case, a downward pressing force acts when the heat sink 7 is fixed to the printed circuit board 2, but since the second heat radiating member 17 is omitted directly above the electronic component 3 as described above. , The action of the pressing force directly above the electronic component 3 is suppressed.
　（第２実施形態）
　第２実施形態について図３を参照して説明する。第２実施形態は、リッドの天井面部の上面の形状が前述した第１実施形態と異なる。電子機器３１において、リッド３２は、その天井面部３３の上面３３ｂにおいて電子部品３の直上が下方に凹んでいる形状である。即ち、リッド３２の天井面部３３の上面３３ｂは、基準面３３ｃと、基準面３３ｃから下方に凹む凹面３３ｄとが連なっている。又、リッド３２は、プリント基板２に対して物理的に接続されていると共に接地されている。第２放熱部材３４は、ヒートシンク７のベースプレート１５の下面１５ａの全体に接すると共に、リッド３２の天井面部３３の上面３３ｂの全体に接している。 (Second Embodiment)
The second embodiment will be described with reference to FIG. In the second embodiment, the shape of the upper surface of the ceiling surface portion of the lid is different from that of the first embodiment described above. In the electronic device 31, the lid 32 has a shape in which directly above the electronic component 3 is recessed downward on the upper surface 33b of the ceiling surface portion 33. That is, the upper surface 33b of the ceiling surface 33 of the lid 32 has a reference surface 33c and a concave surface 33d recessed downward from the reference surface 33c. Further, the lid 32 is physically connected to the printed circuit board 2 and is grounded. The second heat radiating member 34 is in contact with the entire lower surface 15a of the base plate 15 of the heat sink 7, and is in contact with the entire upper surface 33b of the ceiling surface 33 of the lid 32.
　上記した構成では、ヒートシンク７がプリント基板２に対して固定される際には、締結部材１８により締結されることで、ヒートシンク７に下方向への加圧力が作用する。ヒートシンク７に下方向への加圧力が作用することで、第２放熱部材３４が押し付けられ、第２放熱部材３４の厚さがある程度まで小さくなる。又、ヒートシンク７に作用する下方向への加圧力が第２放熱部材３４を介してリッド３２に伝達され、リッド３２に下方向への加圧力が作用する。リッド３２に下方向への加圧力が作用することで、第１放熱部材１４が押し付けられ、第１放熱部材１４の厚さがある程度まで小さくなる。 In the above configuration, when the heat sink 7 is fixed to the printed circuit board 2, the heat sink 7 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 7. When a downward pressing force acts on the heat sink 7, the second heat radiating member 34 is pressed against the heat sink 7, and the thickness of the second heat radiating member 34 is reduced to some extent. Further, the downward pressing force acting on the heat sink 7 is transmitted to the lid 32 via the second heat radiating member 34, and the downward pressing force acts on the lid 32. When a downward pressing force acts on the lid 32, the first heat radiating member 14 is pressed against the lid 32, and the thickness of the first heat radiating member 14 is reduced to some extent.
　この場合、リッド３２の天井面部３３の上面３３ｂにおいて電子部品３の直上が下方に凹んでいるので、第１実施形態と同様に、ヒートシンク７に作用する下方向への加圧力の殆どが第２放熱部材３４を介してリッド３２の天井面部３３の上面３３ｂにおいて電子部品３の直上から外れた部位に作用する。そのため、電子部品３の直上に作用するヒートシンク７からの下方向への加圧力が低減されるので、リッド３２から第１放熱部材１４を介して電子部品３に伝達される加圧力が低減され、電子部品３のはんだバンプ８に加わる応力が低減される。その結果、はんだバンプ８に加わる応力に起因するクラックの発生や破断が未然に回避される。 In this case, since the upper surface 33b of the ceiling surface 33 of the lid 32 is recessed directly above the electronic component 3, most of the downward pressing force acting on the heat sink 7 is the second, as in the first embodiment. It acts on a portion of the upper surface 33b of the ceiling surface portion 33 of the lid 32 that is detached from directly above the electronic component 3 via the heat radiating member 34. Therefore, the downward pressing force from the heat sink 7 acting directly above the electronic component 3 is reduced, so that the pressing force transmitted from the lid 32 to the electronic component 3 via the first heat radiating member 14 is reduced. The stress applied to the solder bump 8 of the electronic component 3 is reduced. As a result, the generation and breakage of cracks due to the stress applied to the solder bump 8 can be avoided.
　第２実施形態によれば、第１実施形態と同様の作用効果を得ることができる。即ち、電子装置３１において、プリント基板２にリッド３２が接地する構成としたので、電子部品３～５から放射された電磁波によりリッド３２にノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンク７がプリント基板２に対して固定される際に下方向への加圧力が作用するが、リッド３２の天井面部３３の上面３３ｂにおいて電子部品３の直上を凹面３３ｄとし、電子部品３の直上に対する加圧力の作用が抑えられる構成としたので、電子部品３のはんだバンプ８に加わる応力を抑えつつ第１放熱部材１４及び第２放熱部材３４の厚さを小さくし、電子部品３からヒートシンク７までの熱抵抗を低減させることができる。 According to the second embodiment, the same effect as that of the first embodiment can be obtained. That is, since the lid 32 is grounded to the printed circuit board 2 in the electronic device 31, even if a noise current is induced in the lid 32 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is generated. Is discharged to the grounded portion, so that radiation noise can be suppressed. When the heat sink 7 is fixed to the printed circuit board 2, a downward pressing force acts, but on the upper surface 33b of the ceiling surface 33 of the lid 32, the concave surface 33d is directly above the electronic component 3, and is directly above the electronic component 3. Since the action of the pressing force on the electronic component 3 is suppressed, the thickness of the first heat radiation member 14 and the second heat radiation member 34 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 7 are used. It is possible to reduce the thermal resistance up to.
　（第３実施形態）
　第３実施形態について図４を参照して説明する。第３実施形態は、ヒートシンクのベースプレートの下面の形状が前述した第１実施形態と異なる。電子機器４１において、ヒートシンク４２は、そのベースプレート４３の下面４３ａにおいて電子部品３の直上が上方に凹んでいる。即ち、ヒートシンク４２のベースプレート４３の下面４３ａは、基準面４３ｃと、基準面４３ｃから上方に凹む凹面４３ｄとが連なっている。第２放熱部材４４は、ヒートシンク４２のベースプレート４３の下面４３ａの全体に接すると共に、リッド６の天井面部１１の上面１１ｂの全体に接している。 (Third Embodiment)
The third embodiment will be described with reference to FIG. In the third embodiment, the shape of the lower surface of the base plate of the heat sink is different from that of the first embodiment described above. In the electronic device 41, the heat sink 42 has an upper surface recessed directly above the electronic component 3 on the lower surface 43a of the base plate 43. That is, the lower surface 43a of the base plate 43 of the heat sink 42 has a reference surface 43c and a concave surface 43d recessed upward from the reference surface 43c. The second heat radiating member 44 is in contact with the entire lower surface 43a of the base plate 43 of the heat sink 42, and is in contact with the entire upper surface 11b of the ceiling surface portion 11 of the lid 6.
　上記した構成では、ヒートシンク４２がプリント基板２に対して固定される際には、締結部材１８により締結されることで、ヒートシンク４２に下方向への加圧力が作用する。ヒートシンク４２に下方向への加圧力が作用することで、第２放熱部材４４が押し付けられ、第２放熱部材４４の厚さがある程度まで小さくなる。又、ヒートシンク４２に作用する下方向への加圧力が第２放熱部材４４を介してリッド６に伝達され、リッド６に下方向への加圧力が作用する。リッド６に下方向への加圧力が作用することで、第１放熱部材１４が押し付けられ、第１放熱部材１４の厚さがある程度まで小さくなる。 In the above configuration, when the heat sink 42 is fixed to the printed circuit board 2, the heat sink 42 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 42. When a downward pressing force acts on the heat sink 42, the second heat radiating member 44 is pressed against the heat sink 42, and the thickness of the second heat radiating member 44 is reduced to some extent. Further, the downward pressing force acting on the heat sink 42 is transmitted to the lid 6 via the second heat radiating member 44, and the downward pressing force acts on the lid 6. When a downward pressing force acts on the lid 6, the first heat radiating member 14 is pressed against the lid 6, and the thickness of the first heat radiating member 14 is reduced to some extent.
　この場合、ヒートシンク４２のベースプレート４３の下面４３ａにおいて電子部品３の直上が上方に凹んでいるので、第１実施形態と同様に、ヒートシンク４２に作用する下方向への加圧力の殆どが第２放熱部材４４を介してリッド６の天井面部１１の上面１１ｂにおいて電子部品３の直上から外れた部位に作用する。そのため、電子部品３の直上に作用するヒートシンク４２からの下方向への加圧力が低減されるので、リッド６から第１放熱部材１４を介して電子部品３に伝達される加圧力が低減され、電子部品３のはんだバンプ８に加わる応力が低減される。その結果、はんだバンプ８に加わる応力に起因するクラックの発生や破断が未然に回避される。 In this case, since the lower surface 43a of the base plate 43 of the heat sink 42 is recessed directly above the electronic component 3, most of the downward pressing force acting on the heat sink 42 is the second heat dissipation, as in the first embodiment. It acts on a portion of the upper surface 11b of the ceiling surface portion 11 of the lid 6 that is detached from directly above the electronic component 3 via the member 44. Therefore, the downward pressing force from the heat sink 42 acting directly above the electronic component 3 is reduced, so that the pressing force transmitted from the lid 6 to the electronic component 3 via the first heat radiating member 14 is reduced. The stress applied to the solder bump 8 of the electronic component 3 is reduced. As a result, the generation and breakage of cracks due to the stress applied to the solder bump 8 can be avoided.
　第３実施形態によれば、第１実施形態と同様の作用効果を得ることができる。即ち、電子装置４１において、プリント基板２にリッド６が接地する構成としたので、電子部品３～５から放射された電磁波によりリッド６にノイズ電流が誘起されたとしても、その誘起されたノイズ電流が接地部分に排出されることで、輻射ノイズを抑制することができる。ヒートシンク４２がプリント基板２に対して固定される際に下方向への加圧力が作用するが、ヒートシンク４２のベースプレート４３の下面４３ａにおいて電子部品３の直上を凹面４３ｄとし、電子部品３の直上に対する加圧力の作用が抑えられる構成としたので、電子部品３のはんだバンプ８に加わる応力を抑えつつ第１放熱部材１４及び第２放熱部材４４の厚さを小さくし、電子部品３からヒートシンク４２までの熱抵抗を低減させることができる。 According to the third embodiment, the same effect as that of the first embodiment can be obtained. That is, since the lid 6 is grounded to the printed circuit board 2 in the electronic device 41, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is induced. Is discharged to the grounded portion, so that radiation noise can be suppressed. When the heat sink 42 is fixed to the printed circuit board 2, a downward pressing force acts. However, on the lower surface 43a of the base plate 43 of the heat sink 42, the concave surface 43d is formed directly above the electronic component 3, and the heat sink 42 is directly above the electronic component 3. Since the action of the pressing force is suppressed, the thickness of the first heat radiating member 14 and the second heat radiating member 44 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 42 are used. The thermal resistance of the solder can be reduced.
　（第４実施形態）
　第４実施形態について図５を参照して説明する。第４実施形態は、第１プリント基板上に第２プリント基板が実装され、第２プリント基板上に前述した第３実施形態と同等の構成が実装されている点で前述した第１実施形態と異なる。第１プリント基板はマザー基板として機能し、第２プリント基板はモジュール基板として機能する。 (Fourth Embodiment)
The fourth embodiment will be described with reference to FIG. The fourth embodiment is the same as the first embodiment described above in that the second printed circuit board is mounted on the first printed circuit board and the same configuration as that of the third embodiment described above is mounted on the second printed circuit board. different. The first printed circuit board functions as a mother board, and the second printed circuit board functions as a module board.
　電子機器５１は、平板形状の第１プリント基板５２と、第１プリント基板５２上に実装されている平板形状の第２プリント基板５３とを備える。第２プリント基板５３は、第１実施形態で説明したプリント基板２と同等であり、第２プリント基板５３上には第３実施形態で説明した電子部品３～５、リッド６、ヒートシンク４２、第１放熱部材１４及び第２放熱部材４４等が実装されている。リッド６は、第２プリント基板５３に対して物理的に接続されていると共に接地されている。又、第２プリント基板５３は、第１プリント基板５２に対してはんだバンプ５４を介して電気的及び物理的に接続されている。ヒートシンク４２は、締結部材１８により第１プリント基板５２に対して固定されている。 The electronic device 51 includes a flat plate-shaped first printed circuit board 52 and a flat plate-shaped second printed circuit board 53 mounted on the first printed circuit board 52. The second printed circuit board 53 is equivalent to the printed circuit board 2 described in the first embodiment, and the electronic components 3 to 5, the lid 6, the heat sink 42, and the second printed circuit board 53 described in the third embodiment are placed on the second printed circuit board 53. The first heat radiating member 14 and the second heat radiating member 44 and the like are mounted. The lid 6 is physically connected to and grounded to the second printed circuit board 53. Further, the second printed circuit board 53 is electrically and physically connected to the first printed circuit board 52 via the solder bumps 54. The heat sink 42 is fixed to the first printed circuit board 52 by the fastening member 18.
　第４実施形態によれば、電子装置５１において、第１プリント基板５２上に第２プリント基板５３が実装され、リッド６が第２プリント基板５３に対して物理的に接続されていると共に接地されている構成においても、第１実施形態と同様の作用効果を得ることができる。尚、リッド６が第２プリント基板５３に対して物理的に接続されていると共に接地されている構成では、第２プリント基板５３に応力が加わり、はんだバンプ５４に応力が加わるので、リッド６が第２プリント基板５３に対して物理的に接続されている部位の周辺を避けてはんだバンプ５４が設けられる構成が望ましい。 According to the fourth embodiment, in the electronic device 51, the second printed circuit board 53 is mounted on the first printed circuit board 52, and the lid 6 is physically connected to the second printed circuit board 53 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained. In a configuration in which the lid 6 is physically connected to the second printed circuit board 53 and grounded, stress is applied to the second printed circuit board 53 and stress is applied to the solder bumps 54, so that the lid 6 is installed. It is desirable that the solder bumps 54 are provided so as to avoid the periphery of the portion physically connected to the second printed circuit board 53.
　（第５実施形態）
　第５実施形態について図６を参照して説明する。第５実施形態は、リッドが第１プリント基板に接地される点で前述した第４実施形態と異なる。電子機器６１は、平板形状の第１プリント基板６２と、第１プリント基板６２上に実装されている平板形状の第２プリント基板６３とを備える。第２プリント基板６３は、リッドが物理的に接続されておらず且つ接地されていない点を除いては第４実施形態で説明したプリント基板５３と同等であり、第２プリント基板６３上には第３実施形態で説明した電子部品３～５、ヒートシンク４２、第１放熱部材１４及び第２放熱部材４４等が実装されている。リッド６４は、第１プリント基板６２に対して物理的に接続されていると共に接地されている。第２放熱部材４４は、リッド６４の天井面部６５の上面６５ｂとヒートシンク４２のベースプレート４３の下面４３ａとの間に設けられている。又、第２プリント基板６３は、第１プリント基板６２に対してはんだバンプ６６を介して電気的及び物理的に接続されている。 (Fifth Embodiment)
A fifth embodiment will be described with reference to FIG. The fifth embodiment is different from the fourth embodiment described above in that the lid is grounded to the first printed circuit board. The electronic device 61 includes a flat plate-shaped first printed circuit board 62 and a flat plate-shaped second printed circuit board 63 mounted on the first printed circuit board 62. The second printed circuit board 63 is equivalent to the printed circuit board 53 described in the fourth embodiment except that the lid is not physically connected and is not grounded, and the second printed circuit board 63 is on the second printed circuit board 63. The electronic components 3 to 5, the heat sink 42, the first heat radiating member 14, the second heat radiating member 44, and the like described in the third embodiment are mounted. The lid 64 is physically connected to and grounded to the first printed circuit board 62. The second heat radiating member 44 is provided between the upper surface 65b of the ceiling surface portion 65 of the lid 64 and the lower surface 43a of the base plate 43 of the heat sink 42. Further, the second printed circuit board 63 is electrically and physically connected to the first printed circuit board 62 via a solder bump 66.
　第５実施形態によれば、電子装置６１において、第１プリント基板６２上に第２プリント基板６３が実装され、リッド６４が第１プリント基板６２に対して物理的に接続されていると共に接地されている構成においても、第１実施形態と同様の作用効果を得ることができる。 According to the fifth embodiment, in the electronic device 61, the second printed circuit board 63 is mounted on the first printed circuit board 62, and the lid 64 is physically connected to the first printed circuit board 62 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained.
　（第６実施形態）
　第６実施形態について図７から図８を参照して説明する。第６実施形態は、第４実施形態で説明した構成において第２プリント基板５３が第１プリント基板５２に対して傾いて実装された場合の対処を示す。 (Sixth Embodiment)
The sixth embodiment will be described with reference to FIGS. 7 to 8. The sixth embodiment shows the measures to be taken when the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52 in the configuration described in the fourth embodiment.
　第４実施形態で説明した構成では第２プリント基板５３が第１プリント基板５２に対して傾いて実装される場合がある。第２プリント基板５３が第１プリント基板５２に対して傾いて実装された状態でヒートシンク４２のベースプレート４３の面方向が第１プリント基板５２の面方向に対して略平行となるようにヒートシンク４２が実装されると、図７に示すように、リッド６の天井面部１１の上面１１ｂとヒートシンク４２のベースプレート４３の下面４３ａとの隙間が一定にならず、第２放熱部材４４の厚さが不均一になり、放熱性が悪化することが懸念される。 In the configuration described in the fourth embodiment, the second printed circuit board 53 may be mounted at an angle with respect to the first printed circuit board 52. The heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the first printed circuit board 52 in a state where the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52. When mounted, as shown in FIG. 7, the gap between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 43a of the base plate 43 of the heat sink 42 is not constant, and the thickness of the second heat radiating member 44 is non-uniform. Therefore, there is a concern that the heat dissipation property will deteriorate.
　このような不具合に対し、第６実施形態では、図８に示すように、例えば締結部材１８による締結の程度が調整され、第２プリント基板５３が第１プリント基板５２に対して傾いて実装された場合でも、ヒートシンク４２のベースプレート４３の面方向がリッド６の天井面部１１の面方向に対して略平行となるようにヒートシンク４２が実装されていることで、リッド６の天井面部１１の上面１１ｂとヒートシンク４２のベースプレート４３の下面４３ａとの隙間を一定としている。 In response to such a defect, in the sixth embodiment, for example, the degree of fastening by the fastening member 18 is adjusted, and the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52, as shown in FIG. Even in this case, since the heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the ceiling surface portion 11 of the lid 6, the upper surface 11b of the ceiling surface portion 11 of the lid 6 is mounted. The gap between the heat sink 42 and the lower surface 43a of the base plate 43 of the heat sink 42 is constant.
　第６実施形態によれば、電子装置５１において、第２プリント基板５３が第１プリント基板５２に対して傾いて実装された場合であっても、ヒートシンク４２のベースプレート４３の面方向がリッド６の天井面部１１の面方向に対して略平行となるようにヒートシンク４２が実装される構成としたので、第２放熱部材４４の厚さを均一にすることができ、放熱性の悪化を未然に回避することができる。 According to the sixth embodiment, in the electronic device 51, even when the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52, the surface direction of the base plate 43 of the heat sink 42 is the lid 6. Since the heat sink 42 is mounted so as to be substantially parallel to the surface direction of the ceiling surface portion 11, the thickness of the second heat radiating member 44 can be made uniform, and deterioration of heat radiating property can be avoided. can do.
　（第７実施形態）
　第７実施形態について図９から図１０を参照して説明する。第７実施形態は、第５実施形態で説明した構成において第２プリント基板６３が第１プリント基板６２に対して傾いて実装された場合の対処を示す。 (7th Embodiment)
The seventh embodiment will be described with reference to FIGS. 9 to 10. The seventh embodiment shows the measures to be taken when the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62 in the configuration described in the fifth embodiment.
　第５実施形態で説明した構成でも第２プリント基板６３が第１プリント基板６２に対して傾いて実装される場合がある。第２プリント基板６３が第１プリント基板６２に対して傾いて実装された状態でリッド６４の天井面部６５の面方向が第１プリント基板６２の面方向に対して略平行となるようにリッド６４が実装されると、図９に示すように、リッド６４の天井面部６５の下面６５ａと電子部品３との隙間が一定にならず、第１放熱部材１４の厚さが不均一になり、放熱性が悪化することが懸念される。 Even in the configuration described in the fifth embodiment, the second printed circuit board 63 may be mounted at an angle with respect to the first printed circuit board 62. The lid 64 so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the first printed circuit board 62 in a state where the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62. When is mounted, as shown in FIG. 9, the gap between the lower surface 65a of the ceiling surface portion 65 of the lid 64 and the electronic component 3 becomes not constant, the thickness of the first heat radiating member 14 becomes non-uniform, and heat is radiated. There is concern that the sex will worsen.
　このような不具合に対し、第７実施形態では、図１０に示すように、リッド６４の側面部の一部に蛇腹部６７が設けられ、第２プリント基板６３が第１プリント基板６２に対して傾いて実装された場合でも、リッド６４の天井面部６５の面方向が電子部品３の面方向に対して略平行となるようにリッド６４が実装されていることで、リッド６４の天井面部６５の下面６５ａと電子部品３との隙間を一定としている。 In response to such a problem, in the seventh embodiment, as shown in FIG. 10, a bellows portion 67 is provided on a part of the side surface portion of the lid 64, and the second printed circuit board 63 relates to the first printed circuit board 62. Even when mounted at an angle, the lid 64 is mounted so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the electronic component 3, so that the ceiling surface portion 65 of the lid 64 is mounted. The gap between the lower surface 65a and the electronic component 3 is constant.
　第７実施形態によれば、電子機器６１において、第２プリント基板６３が第１プリント基板６２に対して傾いて実装された場合であっても、リッド６４の天井面部６５の面方向が電子部品３の面方向に対して略平行となるようにリッド６４が実装される構成としたので、第１放熱部材１４の厚さを均一にすることができ、放熱性の悪化を回避することができる。 According to the seventh embodiment, in the electronic device 61, even when the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62, the surface direction of the ceiling surface portion 65 of the lid 64 is the electronic component. Since the lid 64 is mounted so as to be substantially parallel to the surface direction of 3, the thickness of the first heat radiating member 14 can be made uniform, and deterioration of heat radiating property can be avoided. ..
　（その他の実施形態）
　本開示は、実施例に準拠して記述されたが、当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、更には、それらに一要素のみ、それ以上、或いはそれ以下を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 (Other embodiments)
The present disclosure has been described in accordance with the examples, but it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and modifications within an equal range. In addition, various combinations and forms, as well as other combinations and forms containing only one element, more or less, are also within the scope of the present disclosure.
　第１実施形態から第３実施形態において、プリント基板２に実装されている電子部品の個数や配置態様は例示した以外でも良い。第４実施形態から第７実施形態において、第１プリント基板５２，６２に実装されている第２プリント基板５３，６３の個数や配置態様、第２プリント基板５３，６３に実装されている電子部品の個数や配置態様は例示した以外でも良い。又、１つのリッドが複数の第２プリント基板５３，６３を覆う構成でも良い。 In the first to third embodiments, the number and arrangement of electronic components mounted on the printed circuit board 2 may be other than those illustrated. In the fourth to seventh embodiments, the number and arrangement of the second printed circuit boards 53 and 63 mounted on the first printed circuit boards 52 and 62, and the electronic components mounted on the second printed circuit boards 53 and 63. The number and arrangement modes of the above may be other than those illustrated. Further, one lid may cover a plurality of second printed circuit boards 53 and 63.
　リッド６，３２，６４がプリント基板２，５３，６２に対してはんだ接合により接地される構成を例示したが、リッド６，３２，６４がプリント基板２，５３，６２に対して導電性接着剤等により接地されても良いし、ヒートシンク７，４２がプリント基板２，５２，６２に対して締結される際の加圧力を利用して接地されても良い。 Although the configuration in which the lids 6, 32, 64 are grounded to the printed circuit boards 2, 53, 62 by solder bonding is illustrated, the lids 6, 32, 64 are conductive adhesives to the printed circuit boards 2, 53, 62. It may be grounded by the above, or it may be grounded by using the pressing force when the heat sinks 7 and 42 are fastened to the printed circuit boards 2, 52 and 62.

Claims (6)

  1. 　プリント基板（２）と、
    　前記プリント基板上に実装されている電子部品（３）と、
    　金属材料から構成され、前記電子部品を覆うと共に前記プリント基板に接地するリッド（６，３２）と、
    　前記電子部品と前記リッドとの間に設けられている第１放熱部材（１４）と、
    　前記リッドの上方に設けられ、下方向への加圧力が作用する状態で前記プリント基板に対して固定されるヒートシンク（７，４２）と、
    　前記リッドと前記ヒートシンクとの間に設けられている第２放熱部材（１７，３４，４４）と、を備え、
    　前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である電子機器（１，３１，４１）。     Printed circuit board (2) and
    The electronic component (3) mounted on the printed circuit board and
    A lid (6,32) made of a metal material, which covers the electronic component and is grounded to the printed circuit board.
    A first heat radiating member (14) provided between the electronic component and the lid,
    A heat sink (7, 42) provided above the lid and fixed to the printed circuit board in a state where a downward pressing force acts.
    A second heat radiating member (17, 34, 44) provided between the lid and the heat sink is provided.
    An electronic device (1,31,41) having a configuration in which the action of the pressing force directly above the electronic component is suppressed.
  2. 　第１プリント基板（５２）と、
    　前記第１プリント基板上に実装されている第２プリント基板（５３）と、
    　前記第２プリント基板上に実装されている電子部品（３）と、
    　金属材料から構成され、前記電子部品を覆うと共に前記第２プリント基板に接地するリッド（６，３２）と、
    　前記電子部品と前記リッドとの間に設けられている第１放熱部材（１４）と、
    　前記リッドの上方に設けられ、下方向への加圧力が作用する状態で前記第１プリント基板に対して固定されるヒートシンク（７，４２）と、
    　前記リッドと前記ヒートシンクとの間に設けられている第２放熱部材（１７，３４，４４）と、を備え、
    　前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である電子機器（５１）。     With the first printed circuit board (52)
    The second printed circuit board (53) mounted on the first printed circuit board and
    The electronic component (3) mounted on the second printed circuit board and
    A lid (6,32) composed of a metal material, which covers the electronic component and is grounded to the second printed circuit board,
    A first heat radiating member (14) provided between the electronic component and the lid,
    A heat sink (7, 42) provided above the lid and fixed to the first printed circuit board in a state where a downward pressing force acts.
    A second heat radiating member (17, 34, 44) provided between the lid and the heat sink is provided.
    An electronic device (51) having a configuration in which the action of the pressing force directly above the electronic component is suppressed.
  3. 　第１プリント基板（６２）と、
    　前記第１プリント基板上に実装されている第２プリント基板（６３）と、
    　前記第２プリント基板上に実装されている電子部品（３）と、
    　金属材料から構成され、前記電子部品を覆うと共に前記第１プリント基板に接地するリッド（６４）と、
    　前記電子部品と前記リッドとの間に設けられている第１放熱部材（１４）と、
    　前記リッドの上方に設けられ、下方向への加圧力が作用する状態で前記第１プリント基板に対して固定されるヒートシンク（７，４２）と、
    　前記リッドと前記ヒートシンクとの間に設けられている第２放熱部材（１７，３４，４４）と、を備え、
    　前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である電子機器（６１）。     With the first printed circuit board (62)
    The second printed circuit board (63) mounted on the first printed circuit board and
    The electronic component (3) mounted on the second printed circuit board and
    A lid (64) made of a metal material, which covers the electronic component and is grounded to the first printed circuit board.
    A first heat radiating member (14) provided between the electronic component and the lid,
    A heat sink (7, 42) provided above the lid and fixed to the first printed circuit board in a state where a downward pressing force acts.
    A second heat radiating member (17, 34, 44) provided between the lid and the heat sink is provided.
    An electronic device (61) having a configuration in which the action of the pressing force directly above the electronic component is suppressed.
  4. 　前記電子部品の直上において前記第２放熱部材が省かれていることで、前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である請求項１から３の何れか一項に記載した電子機器。 The electron according to any one of claims 1 to 3, wherein the second heat radiating member is omitted directly above the electronic component, so that the action of the pressing force directly above the electronic component is suppressed. device.
  5. 　前記リッドの上面において前記電子部品の直上が下方に凹んでいることで、前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である請求項１から３の何れか一項に記載した電子機器。 The electron according to any one of claims 1 to 3, wherein the upper surface of the lid is recessed directly above the electronic component so that the action of the pressing force on the upper surface of the electronic component is suppressed. device.
  6. 　前記ヒートシンクの下面において前記電子部品の直上が上方に凹んでいることで、前記電子部品の直上に対する前記加圧力の作用が抑えられる構成である請求項１から３の何れか一項に記載した電子機器。 The electron according to any one of claims 1 to 3, wherein the lower surface of the heat sink is recessed directly above the electronic component so that the action of the pressing force on the electronic component directly above is suppressed. device.
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