WO2021145096A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2021145096A1
WO2021145096A1 PCT/JP2020/045477 JP2020045477W WO2021145096A1 WO 2021145096 A1 WO2021145096 A1 WO 2021145096A1 JP 2020045477 W JP2020045477 W JP 2020045477W WO 2021145096 A1 WO2021145096 A1 WO 2021145096A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
lid
electronic component
heat sink
Prior art date
Application number
PCT/JP2020/045477
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English (en)
Japanese (ja)
Inventor
岳史 石川
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Publication of WO2021145096A1 publication Critical patent/WO2021145096A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This disclosure relates to electronic devices.
  • Patent Document 1 discloses a configuration in which heat generated from an electronic component is transferred to a heat sink via a heat radiating member in order to improve the heat dissipation of the electronic component.
  • Patent Document 2 has a configuration in which a shield member is used to connect a lid for heat dissipation of an electronic component to a printed circuit board in order to achieve both EMC (Electromagnetic Compatibility) measures and improvement of heat dissipation of the electronic component. It is disclosed.
  • EMC Electromagnetic Compatibility
  • fans heat sinks, and heat dissipation members as means for improving the heat dissipation of electronic components, and it is conceivable to improve these means.
  • the fan if it is attempted to improve the cooling performance, there is a concern that the power consumption of the motor and the driving noise will increase, so it is difficult to adopt a method for improving the fan.
  • the heat sink in order to improve the heat transfer performance, it is necessary to optimize it according to the design requirements such as the area of the heat sink and the number of heat radiation fins, so there is a limit to the method for improving the heat sink.
  • the heat radiating member high thermal conductivity of the material is considered, but there are concerns about problems such as high cost and high interfacial thermal resistance with the heat sink, and it is difficult to adopt a method for improving the heat radiating member.
  • thermal resistance like electrical resistance, is proportional to the thermal conductivity and thickness of the material and inversely proportional to the area. Therefore, in order to reduce the thermal resistance, it is effective to reduce the thickness of the heat radiating member or increase the area.
  • the thickness of the heat dissipation member there is a method of reducing the thickness of the heat dissipation member by applying downward pressure to the heat sink, but in that case, stress is applied to the solder bumps of the electronic components and cracks occur. There is a concern that it may break or break. Further, regarding the area of the heat radiating member, since the size of the electronic component is fixed, there is a limit to the area that can be expanded. Therefore, a method of expanding the heat dissipation area by attaching a metal heat spreader to the electronic component is envisioned.
  • fine wiring is required as the performance and speed of electronic components increase, and wiring must be routed to the surface layer of the printed circuit board. Therefore, it is necessary not only to shield only the electronic components but also to shield the area including the electronic components and the surrounding fine wiring, and the lid covering the area including the electronic components and the surrounding fine wiring is used as a heat spreader. Is assumed. The lid must be grounded for the shield.
  • a first heat radiating member is provided between the electronic component and the lid, and a second heat radiating member is provided between the lid and the heat sink.
  • it is the thickness of the first heat radiating member and the second heat radiating member that is caused by the increase in the thermal resistance, and the thermal resistance is reduced by reducing the thickness of the first heat radiating member and the second heat radiating member. It can be reduced.
  • an electronic device in an electronic device, a printed circuit board, an electronic component mounted on the printed circuit board, a lid composed of a metal material, covering the electronic component and grounding to the printed circuit board, and an electronic component.
  • a first heat-dissipating member provided between the lid and the lid, a heat sink provided above the lid and fixed to the printed circuit board in a state where a downward pressing force acts, and the lid and the heat sink. It is provided with a second heat radiating member provided between them.
  • the configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part, and radiation noise is generated. It can be suppressed.
  • the heat sink When the heat sink is fixed to the printed circuit board, a downward pressure is applied, but the pressure applied directly above the electronic component is suppressed, so the stress applied to the solder bumps of the electronic component is suppressed.
  • the thickness of the heat radiating member can be reduced, and the thermal resistance from the electronic component to the heat sink can be reduced.
  • a lid made of a material, which covers an electronic component and is grounded to a second printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the second printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed.
  • the heat sink When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink.
  • a lid made of a material, which covers an electronic component and is grounded to a first printed circuit board, a first heat radiating member provided between the electronic component and the lid, and a downward addition provided above the lid. It includes a heat sink fixed to the first printed circuit board in a state where pressure is applied, and a second heat radiating member provided between the lid and the heat sink. The configuration is such that the action of pressing force directly above the electronic component is suppressed.
  • the lid Since the lid is grounded to the first printed circuit board, even if a noise current is induced in the lid by electromagnetic waves radiated from electronic components, the induced noise current is discharged to the grounded part to radiate. Noise can be suppressed.
  • the heat sink When the heat sink is fixed to the first printed circuit board, a downward pressure is applied, but the stress applied to the solder bumps of the electronic component is suppressed because the pressure is suppressed directly above the electronic component. It is possible to reduce the thickness of the heat radiating member while suppressing the heat resistance from the electronic component to the heat sink.
  • FIG. 1 is a vertical sectional side view showing the first embodiment.
  • FIG. 2 is a plan view of the second heat radiating member.
  • FIG. 3 is a vertical sectional side view showing the second embodiment.
  • FIG. 4 is a vertical sectional side view showing the third embodiment.
  • FIG. 5 is a vertical sectional side view showing the fourth embodiment.
  • FIG. 6 is a vertical sectional side view showing the fifth embodiment.
  • FIG. 7 is a vertical sectional side view to be compared.
  • FIG. 8 is a vertical sectional side view showing the sixth embodiment.
  • FIG. 9 is a vertical sectional side view to be compared.
  • FIG. 10 is a vertical sectional side view showing the seventh embodiment.
  • the electronic device 1 is, for example, an in-vehicle electronic device mounted on a vehicle, and includes a printed circuit board 2, a plurality of (three in this embodiment) electronic components 3 to 5 mounted on the printed circuit board 2.
  • a lid 6 and a heat sink 7 are provided.
  • the electronic components 3 to 5 are, for example, ball grid array package type (BGA type) semiconductor elements, in which the semiconductor chip and the package substrate are electrically connected by bonding wires, and the resin mold on the upper surface side of the package substrate as a whole. It is formed as a thin rectangular package.
  • BGA type ball grid array package type
  • solder bumps 8 to 10 are provided on the mounting surface (lower surface in FIG. 1) of the package substrate by a large number of solder balls.
  • solder balls for example, lead-free solder using an alloy such as tin, silver, or copper can be applied.
  • the electronic component 3 is a SoC (System on Chip)
  • the electronic component 4 is a power supply IC (Integrated Circuit)
  • the electronic component 5 is a memory element.
  • the electronic component 3 and the electronic component 4 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2.
  • the electronic component 3 and the electronic component 5 are electrically connected by wiring (not shown) on the surface of the printed circuit board 2.
  • the calorific value of the electronic component 3 is relatively larger than the calorific value of the other electronic components 4 and 5.
  • the printed circuit board 2 is a multilayer substrate in which insulating substrates such as epoxy resin containing glass fibers are laminated in multiple layers, and a conductor pattern is formed on the surface and between layers thereof, and a ground pattern is formed between the layers. Has been done.
  • the surface of the printed circuit board 2 is provided with a land for conduction for solder-bonding the electronic components 3 to 5 corresponding to the solder bumps 8 to 10 of the electronic components 3 to 5 described above, and the lid 6 is provided. There is a grounding land for the grounding. Further, on the surface of the printed circuit board 2, a solder resist layer is provided so as to cover a portion excluding the land for conduction and the land for grounding.
  • the solder resist layer is formed as an outermost layer that protects the conductor pattern and the insulating base material on the surface of the printed circuit board 2 and exposes the land for conduction and the land for grounding.
  • a printed body is provided on the land for conduction and the land for grounding by printing a solder paste using a printing mask. Further, the ground for grounding is conducting with the ground pattern via the via.
  • solder bumps 8 to 10 of the electronic components 3 to 5 are aligned and overlapped with respect to the land for conduction, and heated while controlling the temperature to perform solder bonding. conduct. This heating is performed through a reflow oven (not shown).
  • the printed matter, which is a solder paste, and the solder bumps 8 to 10 are melted and integrated, and then cooled to solidify the solder to form a solder joint, whereby the electronic components 3 to 5 are formed on the printed circuit board 2. It is electrically and physically connected to the solder bumps 8 to 10 via solder bumps 8 to 10.
  • the lid 6 is provided so as to cover the electronic components 3 to 5 from above.
  • the lid 6 is made of a metal material such as aluminum or copper, and has a concave shape having a hollow portion 13 formed of a ceiling surface portion 11 and a side surface portion 12.
  • a first heat radiating member 14 is provided between the upper surface 3a of the electronic component 3 and the lower surface 11a of the ceiling surface 11 of the lid 6.
  • the first heat radiating member 14 is, for example, a heat radiating gel formed in a sheet shape.
  • the lower end of the side surface portion 11 of the lid 6 is aligned with the ground for grounding, overlapped, heated while controlling the temperature, and solder-bonded.
  • the lid 6 is physically connected to the printed circuit board 2 and grounded.
  • the heat sink 7 is provided above the lid 6.
  • the heat sink 7 is made of a metal material such as aluminum or copper, and has a base plate 15 and a plurality of heat radiation fins 16.
  • the base plate 15 has a flat plate shape that extends in the plane direction of the ceiling surface portion 11 of the lid 6.
  • the heat radiating fins 16 are thin plate-shaped heat radiating plates, which are erected vertically from the upper surface 15b of the base plate 15 and arranged substantially parallel to each other, and a ventilation path is formed between adjacent heat radiating fins 16. There is.
  • a second heat radiating member 17 is provided between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 15a of the base plate 15.
  • the second heat radiating member 17 is, for example, a heat radiating gel formed in a sheet shape. Since the second heat radiating member 17 is provided, most of the heat transferred from the electronic component 3 to the lid 6 via the first heat radiating member 14 is directly transferred to the second heat radiating member 17 and from the second heat radiating member 17. It is transmitted to the base plate 15. Then, most of the heat transferred to the base plate 15 is transferred to the heat radiation fins 16 and diffused from the heat radiation fins 16.
  • the heat sink 7 is fixed to the printed circuit board 2 by the fastening member 18.
  • the fastening member 18 includes a bolt 19, a spring 20, a nut 21, and the like, and is arranged at four corners of a base plate 15 in, for example, a heat sink 4. Through holes 22 through which bolts 19 are inserted are provided at the four corners of the base plate 15. Further, at the four corners of the printed circuit board 2, through holes 23 corresponding to the through holes 22 of the base plate 15 and through which the bolts 19 are inserted are provided.
  • a bolster plate 24 is arranged on the back surface side of the printed circuit board 2. One end side (lower end side in FIG. 1) of the bolt 19 is connected to the bolster plate 24 via a fixture 25 such as a driving screw.
  • a nut 21 and a spring 20 are mounted on the other end side (upper end side in FIG. 1) of the bolt 19, and the spring 20 is compressed by tightening the nut 21.
  • the restoring force of the spring 20 presses the heat sink 7 against the printed circuit board 2. That is, the heat sink 7 is fastened to the printed circuit board 2 by the fastening member 18, and the heat sink 7 is fixed to the printed circuit board 2 in a state where a pressing force is applied to the printed circuit board 2 side.
  • the direction from the heat sink 7 toward the printed circuit board 2 (the direction indicated by the arrow A in FIG. 1) is referred to as a downward direction.
  • the second heat radiating member 17 is formed into a shape having a hollow portion, and is in contact with the hollow portion 26 and the upper surface 11b of the ceiling surface portion 11 of the lid 6 around the hollow portion 26 and a heat sink. It has a contact portion 27 in contact with the lower surface 15a of the base plate 15 of 7.
  • the hollow portion 26 is arranged directly above the electronic component 3
  • the contact portion 27 is arranged away from directly above the electronic component 3. .. That is, the second heat radiating member 17 is partially in contact with the upper surface 11b of the ceiling surface portion 11 of the lid 6 and is partially in contact with the lower surface 15a of the base plate 15 of the heat sink 7.
  • the second heat radiating member 17 is present at a portion detached from directly above the electronic component 3, but the second heat radiating member 17 is omitted directly above the electronic component 3.
  • the lid 6 is grounded to the printed circuit board 2 in the electronic device 1, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is grounded. Radiation noise can be suppressed by being discharged to the portion.
  • the heat sink 7 is fixed to the printed circuit board 2, a downward pressing force acts, but the second heat radiating member 17 is omitted directly above the electronic component 3, and the pressing force acts directly above the electronic component 3. Therefore, the thickness of the first heat radiating member 14 and the second heat radiating member 17 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the thermal resistance from the electronic component 3 to the heat sink 7 is reduced. It can be reduced. As a result, radiation noise from the electronic components 3 to 5 can be appropriately suppressed, and heat dissipation can be appropriately improved.
  • the configuration in which the first heat radiating member 14 is provided between the electronic component 3 and the lid 6 having the largest heat generation among the electronic components 3 to 5 is illustrated, but other electronic components are illustrated.
  • a heat radiating member may be provided between the components 4 and 5 and the lid 6. Even in that case, a downward pressing force acts when the heat sink 7 is fixed to the printed circuit board 2, but since the second heat radiating member 17 is omitted directly above the electronic component 3 as described above. , The action of the pressing force directly above the electronic component 3 is suppressed.
  • the shape of the upper surface of the ceiling surface portion of the lid is different from that of the first embodiment described above.
  • the lid 32 has a shape in which directly above the electronic component 3 is recessed downward on the upper surface 33b of the ceiling surface portion 33. That is, the upper surface 33b of the ceiling surface 33 of the lid 32 has a reference surface 33c and a concave surface 33d recessed downward from the reference surface 33c. Further, the lid 32 is physically connected to the printed circuit board 2 and is grounded.
  • the second heat radiating member 34 is in contact with the entire lower surface 15a of the base plate 15 of the heat sink 7, and is in contact with the entire upper surface 33b of the ceiling surface 33 of the lid 32.
  • the heat sink 7 when the heat sink 7 is fixed to the printed circuit board 2, the heat sink 7 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 7.
  • the second heat radiating member 34 When a downward pressing force acts on the heat sink 7, the second heat radiating member 34 is pressed against the heat sink 7, and the thickness of the second heat radiating member 34 is reduced to some extent.
  • the downward pressing force acting on the heat sink 7 is transmitted to the lid 32 via the second heat radiating member 34, and the downward pressing force acts on the lid 32.
  • the first heat radiating member 14 When a downward pressing force acts on the lid 32, the first heat radiating member 14 is pressed against the lid 32, and the thickness of the first heat radiating member 14 is reduced to some extent.
  • the same effect as that of the first embodiment can be obtained. That is, since the lid 32 is grounded to the printed circuit board 2 in the electronic device 31, even if a noise current is induced in the lid 32 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is generated. Is discharged to the grounded portion, so that radiation noise can be suppressed.
  • a downward pressing force acts, but on the upper surface 33b of the ceiling surface 33 of the lid 32, the concave surface 33d is directly above the electronic component 3, and is directly above the electronic component 3.
  • the thickness of the first heat radiation member 14 and the second heat radiation member 34 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 7 are used. It is possible to reduce the thermal resistance up to.
  • the third embodiment will be described with reference to FIG.
  • the shape of the lower surface of the base plate of the heat sink is different from that of the first embodiment described above.
  • the heat sink 42 has an upper surface recessed directly above the electronic component 3 on the lower surface 43a of the base plate 43. That is, the lower surface 43a of the base plate 43 of the heat sink 42 has a reference surface 43c and a concave surface 43d recessed upward from the reference surface 43c.
  • the second heat radiating member 44 is in contact with the entire lower surface 43a of the base plate 43 of the heat sink 42, and is in contact with the entire upper surface 11b of the ceiling surface portion 11 of the lid 6.
  • the heat sink 42 when the heat sink 42 is fixed to the printed circuit board 2, the heat sink 42 is fastened by the fastening member 18, so that a downward pressing force acts on the heat sink 42.
  • a downward pressing force acts on the heat sink 42
  • the second heat radiating member 44 is pressed against the heat sink 42, and the thickness of the second heat radiating member 44 is reduced to some extent.
  • the downward pressing force acting on the heat sink 42 is transmitted to the lid 6 via the second heat radiating member 44, and the downward pressing force acts on the lid 6.
  • the first heat radiating member 14 When a downward pressing force acts on the lid 6, the first heat radiating member 14 is pressed against the lid 6, and the thickness of the first heat radiating member 14 is reduced to some extent.
  • the same effect as that of the first embodiment can be obtained. That is, since the lid 6 is grounded to the printed circuit board 2 in the electronic device 41, even if a noise current is induced in the lid 6 by electromagnetic waves radiated from the electronic components 3 to 5, the induced noise current is induced. Is discharged to the grounded portion, so that radiation noise can be suppressed.
  • the heat sink 42 is fixed to the printed circuit board 2, a downward pressing force acts.
  • the concave surface 43d is formed directly above the electronic component 3, and the heat sink 42 is directly above the electronic component 3.
  • the thickness of the first heat radiating member 14 and the second heat radiating member 44 is reduced while suppressing the stress applied to the solder bump 8 of the electronic component 3, and the electronic component 3 to the heat sink 42 are used.
  • the thermal resistance of the solder can be reduced.
  • the fourth embodiment will be described with reference to FIG.
  • the fourth embodiment is the same as the first embodiment described above in that the second printed circuit board is mounted on the first printed circuit board and the same configuration as that of the third embodiment described above is mounted on the second printed circuit board. different.
  • the first printed circuit board functions as a mother board, and the second printed circuit board functions as a module board.
  • the electronic device 51 includes a flat plate-shaped first printed circuit board 52 and a flat plate-shaped second printed circuit board 53 mounted on the first printed circuit board 52.
  • the second printed circuit board 53 is equivalent to the printed circuit board 2 described in the first embodiment, and the electronic components 3 to 5, the lid 6, the heat sink 42, and the second printed circuit board 53 described in the third embodiment are placed on the second printed circuit board 53.
  • the first heat radiating member 14 and the second heat radiating member 44 and the like are mounted.
  • the lid 6 is physically connected to and grounded to the second printed circuit board 53.
  • the second printed circuit board 53 is electrically and physically connected to the first printed circuit board 52 via the solder bumps 54.
  • the heat sink 42 is fixed to the first printed circuit board 52 by the fastening member 18.
  • the second printed circuit board 53 is mounted on the first printed circuit board 52, and the lid 6 is physically connected to the second printed circuit board 53 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained.
  • the lid 6 is physically connected to the second printed circuit board 53 and grounded, stress is applied to the second printed circuit board 53 and stress is applied to the solder bumps 54, so that the lid 6 is installed. It is desirable that the solder bumps 54 are provided so as to avoid the periphery of the portion physically connected to the second printed circuit board 53.
  • the fifth embodiment is different from the fourth embodiment described above in that the lid is grounded to the first printed circuit board.
  • the electronic device 61 includes a flat plate-shaped first printed circuit board 62 and a flat plate-shaped second printed circuit board 63 mounted on the first printed circuit board 62.
  • the second printed circuit board 63 is equivalent to the printed circuit board 53 described in the fourth embodiment except that the lid is not physically connected and is not grounded, and the second printed circuit board 63 is on the second printed circuit board 63.
  • the electronic components 3 to 5, the heat sink 42, the first heat radiating member 14, the second heat radiating member 44, and the like described in the third embodiment are mounted.
  • the lid 64 is physically connected to and grounded to the first printed circuit board 62.
  • the second heat radiating member 44 is provided between the upper surface 65b of the ceiling surface portion 65 of the lid 64 and the lower surface 43a of the base plate 43 of the heat sink 42. Further, the second printed circuit board 63 is electrically and physically connected to the first printed circuit board 62 via a solder bump 66.
  • the second printed circuit board 63 is mounted on the first printed circuit board 62, and the lid 64 is physically connected to the first printed circuit board 62 and grounded. Even in this configuration, the same effect as that of the first embodiment can be obtained.
  • the sixth embodiment will be described with reference to FIGS. 7 to 8.
  • the sixth embodiment shows the measures to be taken when the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52 in the configuration described in the fourth embodiment.
  • the second printed circuit board 53 may be mounted at an angle with respect to the first printed circuit board 52.
  • the heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the first printed circuit board 52 in a state where the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52.
  • the gap between the upper surface 11b of the ceiling surface 11 of the lid 6 and the lower surface 43a of the base plate 43 of the heat sink 42 is not constant, and the thickness of the second heat radiating member 44 is non-uniform. Therefore, there is a concern that the heat dissipation property will deteriorate.
  • the degree of fastening by the fastening member 18 is adjusted, and the second printed circuit board 53 is mounted at an angle with respect to the first printed circuit board 52, as shown in FIG.
  • the heat sink 42 is mounted so that the surface direction of the base plate 43 of the heat sink 42 is substantially parallel to the surface direction of the ceiling surface portion 11 of the lid 6, the upper surface 11b of the ceiling surface portion 11 of the lid 6 is mounted.
  • the gap between the heat sink 42 and the lower surface 43a of the base plate 43 of the heat sink 42 is constant.
  • the surface direction of the base plate 43 of the heat sink 42 is the lid 6. Since the heat sink 42 is mounted so as to be substantially parallel to the surface direction of the ceiling surface portion 11, the thickness of the second heat radiating member 44 can be made uniform, and deterioration of heat radiating property can be avoided. can do.
  • the seventh embodiment will be described with reference to FIGS. 9 to 10.
  • the seventh embodiment shows the measures to be taken when the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62 in the configuration described in the fifth embodiment.
  • the second printed circuit board 63 may be mounted at an angle with respect to the first printed circuit board 62.
  • the lid 64 so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the first printed circuit board 62 in a state where the second printed circuit board 63 is mounted at an angle with respect to the first printed circuit board 62.
  • the gap between the lower surface 65a of the ceiling surface portion 65 of the lid 64 and the electronic component 3 becomes not constant, the thickness of the first heat radiating member 14 becomes non-uniform, and heat is radiated. There is concern that the sex will worsen.
  • a bellows portion 67 is provided on a part of the side surface portion of the lid 64, and the second printed circuit board 63 relates to the first printed circuit board 62.
  • the lid 64 is mounted so that the surface direction of the ceiling surface portion 65 of the lid 64 is substantially parallel to the surface direction of the electronic component 3, so that the ceiling surface portion 65 of the lid 64 is mounted.
  • the gap between the lower surface 65a and the electronic component 3 is constant.
  • the surface direction of the ceiling surface portion 65 of the lid 64 is the electronic component. Since the lid 64 is mounted so as to be substantially parallel to the surface direction of 3, the thickness of the first heat radiating member 14 can be made uniform, and deterioration of heat radiating property can be avoided. ..
  • the number and arrangement of electronic components mounted on the printed circuit board 2 may be other than those illustrated.
  • the number and arrangement modes of the above may be other than those illustrated.
  • one lid may cover a plurality of second printed circuit boards 53 and 63.
  • the lids 6, 32, 64 are grounded to the printed circuit boards 2, 53, 62 by solder bonding. It may be grounded by the above, or it may be grounded by using the pressing force when the heat sinks 7 and 42 are fastened to the printed circuit boards 2, 52 and 62.

Abstract

L'invention concerne un dispositif électronique (1) comportant : une carte de circuit imprimé (2) ; un composant électronique (3) monté sur la carte de circuit imprimé ; un couvercle (6) qui est formé d'un matériau métallique et qui recouvre le composant électronique et met à la terre le composant électronique sur la carte de circuit imprimé ; un premier élément de dissipation de chaleur (14) disposé entre le composant électronique et le couvercle ; un dissipateur thermique (7) qui est disposé au-dessus du couvercle et qui est fixé à la carte de circuit imprimé dans un état dans lequel une force de pression vers le bas agit ; et un second élément de dissipation de chaleur (17) disposé entre le couvercle et le dissipateur thermique. Dans cette configuration, l'effet d'une force de pression appliquée à la zone directement au-dessus du composant électronique est supprimé.
PCT/JP2020/045477 2020-01-16 2020-12-07 Dispositif électronique WO2021145096A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020005179A JP2021114491A (ja) 2020-01-16 2020-01-16 電子機器
JP2020-005179 2020-01-16

Publications (1)

Publication Number Publication Date
WO2021145096A1 true WO2021145096A1 (fr) 2021-07-22

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JP (1) JP2021114491A (fr)
WO (1) WO2021145096A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7179213B1 (ja) 2022-05-17 2022-11-28 株式会社フジクラ 無線モジュール

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