WO2023090102A1 - Carte de montage et équipement électrique ayant une carte de montage installée sur celui-ci - Google Patents

Carte de montage et équipement électrique ayant une carte de montage installée sur celui-ci Download PDF

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Publication number
WO2023090102A1
WO2023090102A1 PCT/JP2022/039981 JP2022039981W WO2023090102A1 WO 2023090102 A1 WO2023090102 A1 WO 2023090102A1 JP 2022039981 W JP2022039981 W JP 2022039981W WO 2023090102 A1 WO2023090102 A1 WO 2023090102A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
electrode
inlay
electronic component
pad
Prior art date
Application number
PCT/JP2022/039981
Other languages
English (en)
Japanese (ja)
Inventor
淳也 三嶋
智 松永
晋平 浦田
紀元 野坂
聡 岩井
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2023090102A1 publication Critical patent/WO2023090102A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a mounting board and an electrical device on which the mounting board is mounted.
  • the semiconductor device includes an electronic component, a substrate on which the electronic component is mounted, a lower housing on which the substrate is mounted, and a heat spreader to which the electronic component is metal-bonded to the first surface via a bonding material.
  • the lower housing has an opening for engaging the heat spreader, and the heat spreader is bonded to the opening via a bonding material.
  • the heat spreader has a second surface facing the first surface exposed from the lower housing (see Patent Document 1, for example).
  • the circuit module includes a circuit board having a heating element mounted on one main surface, a housing for supporting the circuit board, and a heat dissipation sheet arranged on the other main surface of the circuit board for diffusing heat in the in-plane direction, a heat conducting portion that conducts heat generated by the heating element to the housing (see Patent Document 2, for example).
  • a copper inlay press-fitted into an opening of a printed circuit board and a heat radiation pad of a high frequency device are connected by a solder layer.
  • the heat generated from the high frequency device is transmitted through the copper inlay and dissipated from the printed circuit board.
  • the size of the area of the copper inlay relative to the area of the heat dissipation pad is unclear. Considering the fact that increasing the area of the inlay increases the difficulty of manufacturing the printed circuit board, there may be cases where the area of the copper inlay must be equal to the area of the heat dissipation pad. If the area of the heat dissipation pad and the area of the copper inlay are the same, the heat cannot be efficiently dissipated from the printed circuit board.
  • the present invention has been made in view of the above-described problems, and provides a mounting board capable of improving the heat dissipation property of heat generated in an electronic component without deteriorating electrical performance, and the mounting board.
  • the final purpose is to provide electrical equipment equipped with and a printed circuit board used for them.
  • An electronic component including an electronic element and having a heat dissipation pad having heat dissipation properties; a printed circuit board on which an inlay containing metal as a main component is arranged inside, the heat dissipation pad and the inlay are connected, and the electronic component is mounted;
  • the electronic component has a first electrode that has the same potential as the heat dissipation pad or is an unused electrode,
  • the inlay includes a mounting substrate in contact with the first electrode.
  • the first electrode has the same potential as the heat dissipation pad or is an unused electrode, so even if the inlay connected to the heat dissipation pad contacts the first electrode, a short circuit will occur. never.
  • the inlay may come into contact with the electrodes of the electronic component, causing a short circuit.
  • the mounting substrate may further include a cooling structure portion having heat dissipation properties and to which the printed circuit board is bonded via a bonding material. According to this, the heat absorbed from the heat dissipation pad can also be diffused from the cooling structure.
  • the electronic component may be a mounting board characterized by having a second electrode having a potential different from that of the heat radiation pad, in addition to the first electrode. According to this, since the inlay does not come into contact with the second electrode, it is possible to prevent the occurrence of a short circuit.
  • the mounting substrate may be characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, the heat absorbed by the inlay from the heat radiation pad is easily diffused not only from the cooling structure but also from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
  • the inlay is connected to the heat radiation pad of each of the plurality of electronic components, and is in contact with the first electrode of each of the electronic components. good. According to this, it is possible to mount a plurality of electronic components on the printed circuit board with high density, and it is possible to reduce the size of the mounting substrate.
  • an electrical device that performs power conversion of power supplied from a power supply device may be an electrical device on which the mounting board described above is mounted. According to this, the heat generated from the cooling structure can be diffused into the air outside the electrical equipment, and the electrical equipment can be cooled by the outside air. Moreover, the circuit pattern of the printed circuit board can be mounted on the electrical equipment.
  • a printed circuit board capable of mounting an electronic component in which an inlay mainly composed of metal is arranged inside and a heat dissipation pad having heat dissipation is arranged inside,
  • the inlay is connected to the heat dissipation pad when the electronic component is mounted, and is in contact with a first electrode of the electronic component that has the same potential as the heat dissipation pad or is an unused electrode. It is good also as a printed circuit board characterized by doing.
  • the present invention even if the inlay comes into contact with the first electrode due to the large area of the inlay after the electronic component is mounted on the printed circuit board, it is possible to prevent a short circuit from occurring. Also, the heat absorbed from the thermal pad can be diffused through the cooling structure.
  • an electrode pad for connecting a second electrode having a potential different from that of the heat radiation pad provided on the electronic component is provided, and the electrode pad is connected to the electrode pad of the second electrode of the electronic component.
  • the printed circuit board may be characterized in that the inlay is arranged at a position so as to be connected to the heat dissipation pad and to be in contact with the first electrode when the electrode of the inlay is connected. According to this, after the electronic component is mounted on the printed circuit board, the inlay does not come into contact with the second electrode, so it is possible to prevent the occurrence of a short circuit.
  • a printed circuit board may be used, characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, after the electronic component is mounted on the printed circuit board, the heat absorbed by the inlay from the heat radiation pad is easily diffused from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
  • the inlay is connected to the heat radiation pad of each of the plurality of electronic components when mounting the plurality of electronic components, and is in contact with each of the first electrodes.
  • a printed circuit board may be used. According to this, a plurality of electronic components can be mounted on the printed circuit board with high density.
  • the mounting board can be mounted on an electric device.
  • FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate according to an embodiment of the present invention.
  • FIG. 2A is a plan view of the bottom surface of the electronic component shown in FIG. 1 as viewed in the direction of the arrow.
  • FIG. 2B is a perspective view of the electronic component shown in FIG. 2A.
  • FIG. 3 is a plan view showing an example of a portion of a printed circuit board on which copper inlays are arranged according to an embodiment of the present invention.
  • 4A, 4B, and 4C are the results of comparative evaluation showing differences in measured values of heat dissipation (thermal resistance) due to differences in copper inlay area.
  • FIG. 5 is a cross-sectional schematic diagram showing an example of a power conditioner on which a mounting board according to an embodiment of the present invention is mounted.
  • the present invention can be applied to a mounting board 1 as shown in FIG. Moreover, by mounting the mounting substrate 1 as shown in FIG. 1, the present invention can also be applied to a power conditioner 7 as an example of an electric device as shown in FIG.
  • FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate 1 to which the present invention is applicable.
  • a mounting substrate 1 in this application example includes an electronic component 2, a printed circuit board 3, a heat sink 4, and the like.
  • the electronic component 2 is, for example, a semiconductor component such as an ASIC (Application Specific Integrated Circuit) or a power semiconductor such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and includes an electronic element (not shown).
  • the electronic component 2 generates heat by applying a current to the electronic element.
  • the mounting board 1 includes electronic components other than the electronic component 2 (for example, a capacitor, etc.), but the electronic component 2 generates a larger amount of heat than the other electronic components.
  • a heat dissipation pad 21 having heat dissipation is arranged inside the electronic component 2 .
  • the heat dissipation pad 21 is formed integrally with a lead frame (not shown) on which a semiconductor chip using gallium nitride (GaN) is mounted.
  • the heat dissipation pad 21 is connected to a copper inlay 31, which will be described later, via a solder layer 5 printed, for example, by a solder printer.
  • the electronic component 2 is mounted on the printed circuit board 3 by connecting the heat radiation pad 21 and the copper inlay 31 .
  • the printed board 3 is, for example, a build-up printed wiring board that has a multilayer structure and uses a thermosetting epoxy resin as a base material.
  • the printed circuit board 3 has an opening (not shown), and a columnar copper inlay 31 mainly composed of copper with high thermal conductivity is press-fitted into the opening.
  • the thickness of the printed circuit board 3 in this application example is 1.6 mm, and the copper inlay 31 is formed to have the same thickness as the printed circuit board 3 .
  • an inlay whose main component is a metal other than copper may be used as long as the metal has high thermal conductivity.
  • the copper inlay 31 corresponds to the inlay in the present invention.
  • the thermal pad 21 and the copper inlay 31 are connected via the solder layer 5 as described above.
  • a circuit board other than the printed board 3 may be used as long as an electric circuit is formed thereon.
  • the heat sink 4 is mainly composed of metal with high thermal conductivity and has the property of diffusing the absorbed heat to the surroundings.
  • the printed circuit board 3 is joined to the heat sink 4 via the heat dissipation sheet 6 .
  • the heat transmitted from the electronic component 2 to the copper inlay 31 through the heat radiation pad 21 and the solder layer 5 is further transmitted through the copper inlay 31 and diffused from the printed circuit board 3 (detailed in FIGS. 2A and 2B of the following embodiment). ), it is also diffused from the heat sink 4 via the heat radiation sheet 6 .
  • the heat dissipation sheet 6 contains a filler such as boron nitride or alumina and has high thermal conductivity.
  • the thickness of the heat dissipation sheet 6 in this application example is 30 to 40 ⁇ m.
  • the heat sink 4 is hard and does not easily deform even when pressurized, whereas the heat dissipation sheet 6 also has properties as a cushioning material and easily deforms when pressurized. Therefore, compared to the case where the printed circuit board 3 is directly bonded to the heat sink 4 , the printed circuit board 3 is in contact with the heat dissipation sheet 6 , so that the printed circuit board 3 is easily brought into close contact with the copper inlay 31 inside the printed circuit board 3 . Almost absorbs heat. As a result, the amount of heat diffused by the heat sink 4 to the surroundings also increases.
  • the heat dissipation sheet 6 may be adhesive, or holes for passing screws through the printed circuit board 3 and the heat sink 4 may be used to tighten the screws. holes may be formed and fixed with screws.
  • the heat sink 4 corresponds to the cooling structure in the present invention.
  • the heat dissipation sheet 6 corresponds to the bonding material in the present invention.
  • FIG. 2A is a plan view of the bottom surface of the electronic component 2 shown in FIG. 1, viewed from the direction of the arrow.
  • FIG. 2B is a perspective view of the electronic component 2 shown in FIG. 2A.
  • the area corresponding to the copper inlay 31 is indicated by broken lines.
  • the copper inlay 31 is arranged on the surface above the electronic component 2 in the orientation of FIGS. 2A and 2B.
  • the electronic component 2 has a plurality of first electrodes 22 and second electrodes 23 on the same surface as the heat dissipation pads 21 are arranged.
  • a copper inlay 31 connected with the heat dissipation pad 21 contacts the two first electrodes 22 .
  • the first electrode 22 is either at the same potential as the thermal pad 21 or is an unused electrode.
  • the first electrode 22 has the same potential as the heat radiation pad 21, the heat radiation pad 21 and the first electrode 22 are connected inside the electronic component 2, and the first electrode 22 is grounded, for example. there is As a result, even if the copper inlay 31 contacts the first electrode 22, no short circuit occurs.
  • the second electrode 23 has a different potential than the heat dissipation pad 21 , and the copper inlay 31 does not contact the second electrode 23 .
  • the numbers and positions of the first electrodes 22 and the second electrodes 23 included in the electronic component 2 in this application example are not limited to those shown in FIGS. 2A and 2B.
  • the first electrode 22 and the second electrode 23 are electrically connected to terminals (not shown).
  • the first electrode 22 and the second electrode 23 are not necessarily provided on the bottom surface of the electronic component 2 as shown in FIGS. may be formed.
  • the copper inlay 31 may be shared with a plurality of electronic components 2 .
  • the copper inlay 31 may be connected to the thermal pad 21 of each of the electronic components 2 and may be in contact with the first electrode 22 of each.
  • FIG. 3 is a plan view showing an example of a portion of the printed circuit board 3 according to the embodiment of the present invention where the copper inlay 31 is arranged.
  • areas corresponding to the electronic component 2 and the heat radiation pad 21 are indicated by dashed lines.
  • the printed circuit board 3 is provided with electrode pads 32 at locations where the copper inlays 31 are not arranged. connected with At the same time, the copper inlay 31 is connected to the heat dissipation pad 21 and positioned to contact the first electrode 22 .
  • FIGS. 4A, 4B, and 4C are comparative evaluation results showing differences in measured values of heat dissipation (thermal resistance) due to differences in the areas of the copper inlays 31, 31a, and 31b.
  • FIG. 4A, 4B and 4C the components are the same except for the copper inlays 31, 31a and 31b.
  • FIG. 4A shows a copper inlay 31 in this embodiment.
  • the area of the copper inlay 31a shown in FIG. 4B is larger than the area of the heat radiation pad 21, as in the present embodiment, but the copper inlay 31a does not contact the first electrode 22.
  • the copper inlay 31b does not contact the first electrode 22.
  • the measured thermal resistance values of the copper inlays 31, 31a, and 31b were 3.2 K/W, 4.1 K/W, and 4.5 K/W, respectively, and the heat dissipation amount of the copper inlay 31 was the largest. From the results of the above comparative evaluation, the copper inlay 31 is in contact with the first electrode 22, and by increasing the area of the copper inlay 31 compared to the area of the heat dissipation pad 21, the electrical power of the copper inlay 31 is reduced. It is possible to improve the heat dissipation of the printed circuit board 3 without deteriorating the general performance.
  • FIG. 5 is a cross-sectional schematic diagram showing an example of the power conditioner 7 on which the mounting board 1 according to the embodiment of the present invention is mounted.
  • the mounting board 1 may be mounted on an electric device, and the electric device may be, for example, a power conversion device such as the power conditioner 7, a motor drive device, a power source device, or the like.
  • the power conditioner 7 is connected to a power supply device (not shown) such as a solar cell, boosts the voltage of the power supplied from the power supply device, converts it to alternating current, removes noise, and adjusts the waveform.
  • AC power is supplied to a load (not shown) and an interconnected power system (not shown).
  • a thermally conductive metal base 72 is installed on one side of the housing 71 of the power conditioner 7 .
  • the heat sink 4 to which the printed circuit board 3 is connected is screwed to the metal base 72 with screws 8 . After absorbing the heat generated from the electronic component 2 in this way, the heat sink 4 easily transfers the heat to the outside air.
  • the heat transferred to the metal base 72 is further transferred to the housing 71 and cooled by the outside air.
  • the printed circuit board 3 is screwed to the heat sink 4 via spacers 73 .
  • a terminal block 77 is fixedly attached to a base 76 whose one end is screwed to the printed circuit board 3 via a spacer 74 and whose other end is screwed to the metal base 72 via a spacer 75 .
  • a control circuit board (not shown) may be attached to the surface of the printed circuit board 3 opposite to the front surface through a connector (not shown).
  • the circuit pattern on the printed circuit board 3 is connected to the metal base 72 .
  • An electronic component (2) including an electronic element and having a heat dissipation pad (21) having heat dissipation properties; a printed circuit board (3) in which an inlay (31) mainly composed of metal is arranged, the heat radiation pad and the inlay are connected, and the electronic component is mounted;
  • the electronic component has a first electrode (22) that has the same potential as the heat dissipation pad or is an unused electrode,
  • a mounting substrate (1) characterized in that said inlay is in contact with said first electrode.
  • a printed circuit board (3) on which an electronic component (2) can be mounted in which an inlay (31) mainly made of metal is arranged inside and a heat dissipation pad (21) having heat dissipation properties is arranged inside,
  • the inlay is connected to the heat radiation pad when the electronic component is mounted, and the first electrode (22) of the electronic component has the same potential as the heat radiation pad or is an unused electrode ), characterized in that it is in contact with the printed circuit board (3).
  • Mounting board 2 Electronic component 21: Heat dissipation pad 22: First electrode 23: Second electrode 3: Printed circuit board 31, 31a, 31b: Copper inlay 32: Electrode pad 4: Heat sink 5: Solder layer 6: Heat dissipation Sheet 7 : Power conditioner 71 : Housing 72 : Metal base 73-75 : Spacer 76 : Base 77 : Terminal block 8 : Screw

Abstract

L'invention concerne : une carte de montage qui peut améliorer les propriétés de dissipation de chaleur d'une carte imprimée sans provoquer de détérioration de performance électrique ; et un équipement électrique ayant ladite carte de montage installée sur celui-ci. Cette carte de montage est caractérisée en ce qu'elle comprend : un composant électronique qui a disposé à l'intérieur de celui-ci un plot de dissipation de chaleur ayant des propriétés de dissipation de chaleur ; une carte de circuit imprimé qui a disposé à l'intérieur de celle-ci, une incrustation ayant un métal ayant des propriétés de conduction de chaleur en tant que composant principal de celle-ci et dans laquelle le plot de dissipation de chaleur et l'incrustation sont connectés et le composant électronique est monté sur celui-ci ; et une partie de structure de refroidissement qui a la carte imprimée jointe à celle-ci, le composant électronique ayant une première électrode sur la même surface que la surface où le tampon de dissipation de chaleur est disposé, la première électrode ayant le même potentiel électrique que le plot de dissipation de chaleur ou étant une électrode non utilisée, et l'incrustation étant connectée à la première électrode.
PCT/JP2022/039981 2021-11-19 2022-10-26 Carte de montage et équipement électrique ayant une carte de montage installée sur celui-ci WO2023090102A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-188729 2021-11-19
JP2021188729A JP2023075677A (ja) 2021-11-19 2021-11-19 実装基板、及び実装基板を搭載した電気機器

Publications (1)

Publication Number Publication Date
WO2023090102A1 true WO2023090102A1 (fr) 2023-05-25

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PCT/JP2022/039981 WO2023090102A1 (fr) 2021-11-19 2022-10-26 Carte de montage et équipement électrique ayant une carte de montage installée sur celui-ci

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WO (1) WO2023090102A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076215A (ja) * 2000-08-29 2002-03-15 Sony Corp 半導体装置パッケージ及びその作製方法
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
JP2009231729A (ja) * 2008-03-25 2009-10-08 Nec Corp 半導体装置
JP2017520902A (ja) * 2014-06-23 2017-07-27 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板及び回路基板組立体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076215A (ja) * 2000-08-29 2002-03-15 Sony Corp 半導体装置パッケージ及びその作製方法
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
JP2009231729A (ja) * 2008-03-25 2009-10-08 Nec Corp 半導体装置
JP2017520902A (ja) * 2014-06-23 2017-07-27 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板及び回路基板組立体

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