JP5733893B2 - 電子部品装置 - Google Patents
電子部品装置 Download PDFInfo
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- JP5733893B2 JP5733893B2 JP2009290655A JP2009290655A JP5733893B2 JP 5733893 B2 JP5733893 B2 JP 5733893B2 JP 2009290655 A JP2009290655 A JP 2009290655A JP 2009290655 A JP2009290655 A JP 2009290655A JP 5733893 B2 JP5733893 B2 JP 5733893B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図1は本発明の第1の実施形態に係るヒートスプレッダ(放熱部品)を用いた半導体装置(電子部品装置)の構成を断面図の形態で示したものである。
第1の実施形態の図2(a)及び(b)とその発明の詳細な説明の部分は、「参考例」として記載されている。
第2の実施形態の図3とその発明の詳細な説明の部分は、「参考例」として記載されている。
図3は本発明の第2の実施形態に係るヒートスプレッダ(放熱部品)を用いた半導体装置(電子部品装置)の構成を断面図の形態で示したものである。
12…パッケージ(配線基板)、
15…熱インタフェース材(TIM)、
16…封止剤(シーラント)、
20(a,b,c),25(a,b,c)…ヒートスプレッダ(放熱部品)、
21,26…板状部、
21a,21b,26a,26b…突起部分、
21c,26c…孔、
22,27…フット部、
24…ヒートシンク、
30,30a…半導体装置(電子部品装置)。
Claims (4)
- 配線基板と、
前記配線基板上の中央部の実装エリアに搭載されたチップ状の半導体素子と、
前記配線基板及び前記半導体素子の上に配置され、前記半導体素子の上面に熱インタフェース材を介して熱結合される板状部と、前記板状部の下面にリング状に設けられ、前記板状部と一体的に形成されたフット部とを備えた第1の放熱部品であって、前記フット部が、前記配線基板上の前記半導体素子の実装エリアの周囲の箇所に接合された前記第1の放熱部品と、
前記フット部より外側の領域の前記配線基板の上に搭載されたチップ状の受動素子と、
前記フット部より内側の領域の前記第1の放熱部品の上に配置された第2の放熱部品とを有し、
前記フット部の形成位置から外側の領域の前記板状部の両面に多数の突起部分がそれぞれ設けられていることを特徴とする電子部品装置。 - 前記突起部分は、カーボンナノチューブからなることを特徴とする請求項1に記載の電子部品装置。
- 配線基板と、
前記配線基板上の中央部の実装エリアに搭載されたチップ状の半導体素子と、
前記配線基板及び前記半導体素子の上に配置され、前記半導体素子の上面に熱インタフェース材を介して熱結合される板状部と、前記板状部の下面にリング状に設けられ、前記板状部と一体的に形成されたフット部とを備えた第1の放熱部品であって、前記フット部が、前記配線基板上の前記半導体素子の実装エリアの周囲の箇所に接合された前記第1の放熱部品と、
前記フット部より外側の領域の前記配線基板の上に搭載されたチップ状の受動素子と、
前記フット部より内側の領域の前記第1の放熱部品の上に配置された第2の放熱部品とを有し、
前記フット部の形成位置から外側の領域の前記板状部に、前記板状部を厚さ方向に貫通する多数の孔が設けられていることを特徴とする電子部品装置。 - 前記第1の放熱部品は銅から形成され、前記第2の放熱部品はアルミニウム又はアルミニウム合金から形成されることを特徴とする請求項1乃至3のいずれか一項に記載の電子部品装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009290655A JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
US12/967,312 US8520388B2 (en) | 2009-12-22 | 2010-12-14 | Heat-radiating component and electronic component device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009290655A JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011134769A JP2011134769A (ja) | 2011-07-07 |
JP2011134769A5 JP2011134769A5 (ja) | 2012-10-25 |
JP5733893B2 true JP5733893B2 (ja) | 2015-06-10 |
Family
ID=44150783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009290655A Active JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
Country Status (2)
Country | Link |
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US (1) | US8520388B2 (ja) |
JP (1) | JP5733893B2 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012227374A (ja) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | 電子機器の放熱構造 |
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
JP2013115083A (ja) * | 2011-11-25 | 2013-06-10 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
US20130250522A1 (en) * | 2012-03-22 | 2013-09-26 | Varian Medical Systems, Inc. | Heat sink profile for interface to thermally conductive material |
US9230896B2 (en) * | 2012-06-05 | 2016-01-05 | Stats Chippac, Ltd. | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package |
US8941994B2 (en) * | 2012-09-13 | 2015-01-27 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
US10506719B2 (en) * | 2013-01-15 | 2019-12-10 | Blackberry Limited | Thermal dissipater apparatus for use with electronic devices |
TWI478479B (zh) * | 2013-01-17 | 2015-03-21 | Delta Electronics Inc | 整合功率模組封裝結構 |
US10914539B2 (en) * | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
US20150098191A1 (en) * | 2013-10-06 | 2015-04-09 | Gerald Ho Kim | Silicon Heat-Dissipation Package For Compact Electronic Devices |
KR102173141B1 (ko) | 2014-02-04 | 2020-11-02 | 삼성전자주식회사 | 히트 파이프를 포함하는 휴대 장치 |
US9524917B2 (en) * | 2014-04-23 | 2016-12-20 | Optiz, Inc. | Chip level heat dissipation using silicon |
JP2015216199A (ja) * | 2014-05-09 | 2015-12-03 | 新光電気工業株式会社 | 半導体装置、熱伝導部材及び半導体装置の製造方法 |
US20160021788A1 (en) * | 2014-07-16 | 2016-01-21 | General Electric Company | Electronic device assembly |
US9892990B1 (en) * | 2014-07-24 | 2018-02-13 | Amkor Technology, Inc. | Semiconductor package lid thermal interface material standoffs |
JP6421050B2 (ja) * | 2015-02-09 | 2018-11-07 | 株式会社ジェイデバイス | 半導体装置 |
JP6283379B2 (ja) * | 2016-01-29 | 2018-02-21 | 本田技研工業株式会社 | コンデンサの配置構造 |
JP6867243B2 (ja) * | 2017-06-26 | 2021-04-28 | 新光電気工業株式会社 | 放熱板及びその製造方法と電子部品装置 |
EP3547360A1 (de) * | 2018-03-29 | 2019-10-02 | Siemens Aktiengesellschaft | Halbleiterbaugruppe und verfahren zur herstellung der halbleiterbaugruppe |
JP7154296B2 (ja) * | 2018-07-04 | 2022-10-17 | 三菱電機株式会社 | 車両用電力変換装置 |
US11942495B2 (en) * | 2018-08-03 | 2024-03-26 | Sony Semiconductor Solutions Corporation | Semiconductor device, imaging apparatus, and method for manufacturing semiconductor device |
CN109755197A (zh) * | 2019-01-14 | 2019-05-14 | 苏州通富超威半导体有限公司 | 封装结构及其形成方法 |
CN109887891B (zh) | 2019-03-08 | 2021-01-22 | 苏州通富超威半导体有限公司 | 封装结构及其形成方法 |
CN113133261B (zh) * | 2019-12-30 | 2022-07-22 | 华为数字能源技术有限公司 | 一种散热装置、电路板组件及电子设备 |
US11646302B2 (en) * | 2020-03-31 | 2023-05-09 | Apple Inc. | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
CN116153882A (zh) * | 2020-11-10 | 2023-05-23 | 华为技术有限公司 | 一种散热组件、电子设备及芯片封装结构 |
US11557525B2 (en) * | 2021-05-25 | 2023-01-17 | Nxp Usa, Inc. | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements |
GB2611028A (en) * | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
JP2023080447A (ja) * | 2021-11-30 | 2023-06-09 | 日立Astemo株式会社 | 電子制御装置 |
CN115662907A (zh) * | 2022-11-08 | 2023-01-31 | 宁波施捷电子有限公司 | 一种芯片封装方法及设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195841U (ja) * | 1981-06-09 | 1982-12-11 | ||
JPH06252301A (ja) * | 1993-02-24 | 1994-09-09 | Hitachi Ltd | 電子装置 |
JP2002343910A (ja) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | ヒートシンク並びにその製造方法 |
US6707671B2 (en) * | 2001-05-31 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Power module and method of manufacturing the same |
JP3830860B2 (ja) | 2001-05-31 | 2006-10-11 | 松下電器産業株式会社 | パワーモジュールとその製造方法 |
US6822867B2 (en) * | 2001-06-29 | 2004-11-23 | Intel Corporation | Electronic assembly with solderable heat sink and methods of manufacture |
JP2004119882A (ja) | 2002-09-27 | 2004-04-15 | Sony Corp | 半導体装置 |
JP4039316B2 (ja) * | 2003-06-09 | 2008-01-30 | 株式会社明電舎 | 電子機器の冷却構造 |
US20050111188A1 (en) * | 2003-11-26 | 2005-05-26 | Anandaroop Bhattacharya | Thermal management device for an integrated circuit |
US7633752B2 (en) * | 2004-03-29 | 2009-12-15 | Intel Corporation | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
US20080128897A1 (en) * | 2006-12-05 | 2008-06-05 | Tong Wa Chao | Heat spreader for a multi-chip package |
CN101232794B (zh) * | 2007-01-24 | 2011-11-30 | 富准精密工业(深圳)有限公司 | 均热板及散热装置 |
JP2009260169A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | ヒートシンク及び放熱装置 |
-
2009
- 2009-12-22 JP JP2009290655A patent/JP5733893B2/ja active Active
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2010
- 2010-12-14 US US12/967,312 patent/US8520388B2/en active Active
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Publication number | Publication date |
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JP2011134769A (ja) | 2011-07-07 |
US8520388B2 (en) | 2013-08-27 |
US20110149537A1 (en) | 2011-06-23 |
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