JP2011134769A - 放熱部品及び電子部品装置 - Google Patents
放熱部品及び電子部品装置 Download PDFInfo
- Publication number
- JP2011134769A JP2011134769A JP2009290655A JP2009290655A JP2011134769A JP 2011134769 A JP2011134769 A JP 2011134769A JP 2009290655 A JP2009290655 A JP 2009290655A JP 2009290655 A JP2009290655 A JP 2009290655A JP 2011134769 A JP2011134769 A JP 2011134769A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- plate
- electronic component
- chip
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】放熱部品20は、配線基板12に実装された電子部品(チップ)10との間に熱インタフェース材(TIM)15を介して接合され、TIM15を介してチップ10に熱結合される板状部21と、該板状部のチップ10に対向する側の面に形成されたフット部22とを備えている。このフット部22は、板状部21の周縁から内側の部分の、チップ10の実装エリアに対応する部分の周囲の箇所に、リング状に形成されている。
【選択図】図1
Description
図1は本発明の第1の実施形態に係るヒートスプレッダ(放熱部品)を用いた半導体装置(電子部品装置)の構成を断面図の形態で示したものである。
図3は本発明の第2の実施形態に係るヒートスプレッダ(放熱部品)を用いた半導体装置(電子部品装置)の構成を断面図の形態で示したものである。
12…パッケージ(配線基板)、
15…熱インタフェース材(TIM)、
16…封止剤(シーラント)、
20(a,b,c),25(a,b,c)…ヒートスプレッダ(放熱部品)、
21,26…板状部、
21a,21b,26a,26b…突起部分、
21c,26c…孔、
22,27…フット部、
24…ヒートシンク、
30,30a…半導体装置(電子部品装置)。
Claims (6)
- 配線基板に実装された電子部品との間に熱インタフェース材を介して接合される放熱部品であって、
前記熱インタフェース材を介して前記電子部品に熱結合される板状部と、該板状部の前記電子部品に対向する側の面に形成されたフット部とを備え、
前記フット部が、前記板状部の周縁から内側の部分の、前記電子部品の実装エリアに対応する部分の周囲の箇所に、リング状に形成されていることを特徴とする放熱部品。 - 前記板状部において前記フット部の形成位置から外側の部分の、少なくとも前記フット部が形成されている側の面に、多数の突起部分が設けられていることを特徴とする請求項1に記載の放熱部品。
- 前記突起部分は、カーボンナノチューブからなることを特徴とする請求項2に記載の放熱部品。
- 前記板状部において前記フット部の形成位置から外側の部分に、該板状部を厚さ方向に貫通する多数の孔が設けられていることを特徴とする請求項1に記載の放熱部品。
- 配線基板に実装された電子部品が、請求項1から4のいずれか一項に記載の放熱部品によって封止された構造を有し、さらに、前記板状部において前記電子部品に対向する側と反対側の面に更なる放熱部品が搭載されていることを特徴とする電子部品装置。
- 前記更なる放熱部品は、前記板状部において前記フット部の形成位置から内側の部分に搭載され、該フット部の形成位置から外側の部分の両面に前記突起部分がそれぞれ設けられていることを特徴とする請求項5に記載の電子部品装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009290655A JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
US12/967,312 US8520388B2 (en) | 2009-12-22 | 2010-12-14 | Heat-radiating component and electronic component device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009290655A JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011134769A true JP2011134769A (ja) | 2011-07-07 |
JP2011134769A5 JP2011134769A5 (ja) | 2012-10-25 |
JP5733893B2 JP5733893B2 (ja) | 2015-06-10 |
Family
ID=44150783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009290655A Active JP5733893B2 (ja) | 2009-12-22 | 2009-12-22 | 電子部品装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8520388B2 (ja) |
JP (1) | JP5733893B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012227374A (ja) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | 電子機器の放熱構造 |
JP2015211221A (ja) * | 2014-04-23 | 2015-11-24 | オプティツ インコーポレイテッド | シリコンを使用するチップレベル熱放散 |
JP2016146427A (ja) * | 2015-02-09 | 2016-08-12 | 株式会社ジェイデバイス | 半導体装置 |
JP2019009292A (ja) * | 2017-06-26 | 2019-01-17 | 新光電気工業株式会社 | 放熱板及びその製造方法と電子部品装置 |
WO2023100480A1 (ja) * | 2021-11-30 | 2023-06-08 | 日立Astemo株式会社 | 電子制御装置 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
JP2013115083A (ja) * | 2011-11-25 | 2013-06-10 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
US20130250522A1 (en) * | 2012-03-22 | 2013-09-26 | Varian Medical Systems, Inc. | Heat sink profile for interface to thermally conductive material |
US9230896B2 (en) * | 2012-06-05 | 2016-01-05 | Stats Chippac, Ltd. | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package |
US8941994B2 (en) | 2012-09-13 | 2015-01-27 | International Business Machines Corporation | Vapor condenser with three-dimensional folded structure |
US10506719B2 (en) * | 2013-01-15 | 2019-12-10 | Blackberry Limited | Thermal dissipater apparatus for use with electronic devices |
TWI478479B (zh) * | 2013-01-17 | 2015-03-21 | Delta Electronics Inc | 整合功率模組封裝結構 |
US10914539B2 (en) | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
US20150098191A1 (en) * | 2013-10-06 | 2015-04-09 | Gerald Ho Kim | Silicon Heat-Dissipation Package For Compact Electronic Devices |
KR102173141B1 (ko) | 2014-02-04 | 2020-11-02 | 삼성전자주식회사 | 히트 파이프를 포함하는 휴대 장치 |
JP2015216199A (ja) * | 2014-05-09 | 2015-12-03 | 新光電気工業株式会社 | 半導体装置、熱伝導部材及び半導体装置の製造方法 |
US20160021788A1 (en) * | 2014-07-16 | 2016-01-21 | General Electric Company | Electronic device assembly |
US9892990B1 (en) * | 2014-07-24 | 2018-02-13 | Amkor Technology, Inc. | Semiconductor package lid thermal interface material standoffs |
JP6283379B2 (ja) * | 2016-01-29 | 2018-02-21 | 本田技研工業株式会社 | コンデンサの配置構造 |
EP3547360A1 (de) * | 2018-03-29 | 2019-10-02 | Siemens Aktiengesellschaft | Halbleiterbaugruppe und verfahren zur herstellung der halbleiterbaugruppe |
DE112019003372T5 (de) * | 2018-07-04 | 2021-03-18 | Mitsubishi Electric Corporation | Fahrzeugleistungswandlereinrichtung |
JP7235752B2 (ja) * | 2018-08-03 | 2023-03-08 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
CN109755197A (zh) * | 2019-01-14 | 2019-05-14 | 苏州通富超威半导体有限公司 | 封装结构及其形成方法 |
CN109887891B (zh) * | 2019-03-08 | 2021-01-22 | 苏州通富超威半导体有限公司 | 封装结构及其形成方法 |
CN113133261B (zh) * | 2019-12-30 | 2022-07-22 | 华为数字能源技术有限公司 | 一种散热装置、电路板组件及电子设备 |
US11646302B2 (en) * | 2020-03-31 | 2023-05-09 | Apple Inc. | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
CN116153882A (zh) * | 2020-11-10 | 2023-05-23 | 华为技术有限公司 | 一种散热组件、电子设备及芯片封装结构 |
US11557525B2 (en) | 2021-05-25 | 2023-01-17 | Nxp Usa, Inc. | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements |
GB2611028A (en) * | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
CN115662907A (zh) * | 2022-11-08 | 2023-01-31 | 宁波施捷电子有限公司 | 一种芯片封装方法及设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195841U (ja) * | 1981-06-09 | 1982-12-11 | ||
JPH06252301A (ja) * | 1993-02-24 | 1994-09-09 | Hitachi Ltd | 電子装置 |
JP2002343910A (ja) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | ヒートシンク並びにその製造方法 |
JP2004363525A (ja) * | 2003-06-09 | 2004-12-24 | Meidensha Corp | 電子機器の冷却構造 |
JP2009260169A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | ヒートシンク及び放熱装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3830860B2 (ja) | 2001-05-31 | 2006-10-11 | 松下電器産業株式会社 | パワーモジュールとその製造方法 |
US6707671B2 (en) * | 2001-05-31 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Power module and method of manufacturing the same |
US6822867B2 (en) * | 2001-06-29 | 2004-11-23 | Intel Corporation | Electronic assembly with solderable heat sink and methods of manufacture |
JP2004119882A (ja) | 2002-09-27 | 2004-04-15 | Sony Corp | 半導体装置 |
US20050111188A1 (en) * | 2003-11-26 | 2005-05-26 | Anandaroop Bhattacharya | Thermal management device for an integrated circuit |
US7633752B2 (en) * | 2004-03-29 | 2009-12-15 | Intel Corporation | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
US20080128897A1 (en) * | 2006-12-05 | 2008-06-05 | Tong Wa Chao | Heat spreader for a multi-chip package |
CN101232794B (zh) * | 2007-01-24 | 2011-11-30 | 富准精密工业(深圳)有限公司 | 均热板及散热装置 |
-
2009
- 2009-12-22 JP JP2009290655A patent/JP5733893B2/ja active Active
-
2010
- 2010-12-14 US US12/967,312 patent/US8520388B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195841U (ja) * | 1981-06-09 | 1982-12-11 | ||
JPH06252301A (ja) * | 1993-02-24 | 1994-09-09 | Hitachi Ltd | 電子装置 |
JP2002343910A (ja) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | ヒートシンク並びにその製造方法 |
JP2004363525A (ja) * | 2003-06-09 | 2004-12-24 | Meidensha Corp | 電子機器の冷却構造 |
JP2009260169A (ja) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | ヒートシンク及び放熱装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012227374A (ja) * | 2011-04-20 | 2012-11-15 | Mitsubishi Electric Corp | 電子機器の放熱構造 |
JP2015211221A (ja) * | 2014-04-23 | 2015-11-24 | オプティツ インコーポレイテッド | シリコンを使用するチップレベル熱放散 |
US9524917B2 (en) | 2014-04-23 | 2016-12-20 | Optiz, Inc. | Chip level heat dissipation using silicon |
JP2016146427A (ja) * | 2015-02-09 | 2016-08-12 | 株式会社ジェイデバイス | 半導体装置 |
US11488886B2 (en) | 2015-02-09 | 2022-11-01 | Amkor Technology Japan, Inc. | Semiconductor device |
JP2019009292A (ja) * | 2017-06-26 | 2019-01-17 | 新光電気工業株式会社 | 放熱板及びその製造方法と電子部品装置 |
WO2023100480A1 (ja) * | 2021-11-30 | 2023-06-08 | 日立Astemo株式会社 | 電子制御装置 |
Also Published As
Publication number | Publication date |
---|---|
US8520388B2 (en) | 2013-08-27 |
JP5733893B2 (ja) | 2015-06-10 |
US20110149537A1 (en) | 2011-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5733893B2 (ja) | 電子部品装置 | |
TWI613774B (zh) | 功率覆蓋結構及其製造方法 | |
US8970029B2 (en) | Thermally enhanced heat spreader for flip chip packaging | |
JP5898919B2 (ja) | 半導体装置 | |
JP2006073651A (ja) | 半導体装置 | |
WO2010050087A1 (ja) | 積層型半導体装置及びその製造方法 | |
JP2011082345A (ja) | 半導体装置 | |
JP2010278281A (ja) | 電子部品装置の製造方法 | |
WO2019116828A1 (ja) | 電子制御装置 | |
JP2016092300A (ja) | 半導体装置及び半導体装置の製造方法 | |
CN102881667A (zh) | 半导体封装构造 | |
JP5885630B2 (ja) | プリント基板 | |
WO2018216627A1 (ja) | 電子機器 | |
JP4467380B2 (ja) | 半導体パッケージ、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器 | |
JP2008016653A (ja) | 半導体パッケージ、その製造方法、プリント基板及び電子機器 | |
KR102674888B1 (ko) | 인쇄회로기판 조립체 | |
JP2011035352A (ja) | 半導体装置 | |
JP4334542B2 (ja) | パッケージ構造 | |
JP2011103358A (ja) | 半導体実装構造体 | |
US7355276B1 (en) | Thermally-enhanced circuit assembly | |
JP2011171656A (ja) | 半導体パッケージおよびその製造方法 | |
JP2011077075A (ja) | 発熱性電子素子内蔵のモジュール基板及びその製造方法 | |
CN115249664A (zh) | 用于芯片封装的弹性散热盖板、封装结构及封装方法 | |
WO2021145096A1 (ja) | 電子機器 | |
JP7223639B2 (ja) | 電子制御装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120907 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120907 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130724 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130730 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130925 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140409 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140902 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140924 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150120 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150303 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150414 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5733893 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |