1289040 九、發明說明： 【發明所屬之技術領域】 筆二::為一種散熱器導熱部結構，尤其是-種應用於 tiC熱模組#，用以與—發熱元件導熱結合之 放熱裔導熱部結構。 【先前技術】 片二：π己型電腦的電路結構’以中央處理器、南橋晶 :二:：：及顯示晶片等為最主要的運算或控制單元， 些；：常高速或大量運算的結果，所以常常會產 生…4 了使相關晶片能在一正常的工作溫度下工作， 因此相關散熱問題5實為筆記型命 貝勹聿°己生屯細迫切需要克服的重要 因為葦記型電腦受到輕薄短小及内部空間的限制， 因此在電路設計及散熱偷其_的關㈣上，如何有 效的利用空間亦顯得格外的重要。 理-習己型電腦在電路設計的規劃上，習慣將中央處 & '北橋晶片或顯示晶片等都設計在主機板 上’因此該些晶片必然會位於相同的平面，也因為如此， 相關散熱裝置的設計’亦會隨之設計在同-平面’而將所 =電路或機構設置在同一平面的結果，使得筆記型電腦在 同一平面上的空間顯得播i y^ ,、于擁匕，而在垂直的空間則又顯得寬 鬆。 現代的消費者，對於筆記型電腦顯示卡的效能及升級 弹性的需求日益升高’因此顯示卡之設計，已擺脫以往只 51289040 IX. Description of the invention: [Technical field of invention] Pen 2: is a heat-conducting heat-conducting structure, especially for tiC thermal module #, for exothermic heat conduction combined with heat-emitting elements structure. [Prior Art] Chip 2: The circuit structure of the π-type computer is based on the central processing unit, the south bridge crystal: two::: and the display chip are the most important arithmetic or control units, etc.; , so it often produces ... 4 so that the relevant wafer can work at a normal working temperature, so the related heat dissipation problem 5 is really a note-type life, it is important to overcome the importance of the computer because of the Light and short, and the limitation of internal space, therefore, how to effectively use the space is particularly important in the circuit design and heat dissipation. In the planning of circuit design, it is customary to design the central office & 'North Bridge chip or display chip, etc. on the motherboard.' Therefore, the chips must be in the same plane, and because of this, related heat dissipation The design of the device will also be designed in the same plane, and the circuit or mechanism will be placed on the same plane, so that the space of the notebook computer on the same plane appears to be iy^, and in the crowd, The vertical space is loose. Modern consumers are increasingly demanding the performance and upgrade flexibility of notebook display cards. Therefore, the design of display cards has been freed from the past.
構 其包括：一導熱板及一扣合彈片 1289040 j计在主機板的概念而趨向於和桌上型電腦 卡設計成為可插拔之卡式設計，因 將頌不 與中央處理器、南橋晶片或北橋晶片等：於同會 由:筆記型電腦薄型化的特性，為了縮小丄 不卡之空間，其插卡方式之設計，與桌上型電腦以垂 入主機板㈣之方式列’而是时平插人 之插槽，因此如何解決顯示卡^ _ a μ 又於主枝板 也就成為-必須克服的課題。」、、不曰曰之散熱的問題， 中央要設置的位置，係設置於主機板之 资的二：：頒不晶片上’藉由將散熱裝置之導熱板，緊 中央處理器或顯示晶片之熱表面上，以達 入面：及ί熱之功效，然而現在的筆記型電腦，有關顯示 ^ ^❸十，趨向於插卡式之設計後，使得習知之散熱 衣置，热法適用於插卡式顯示卡之機型。 【發明内容】 月之主要目的，係要提供一種散熱器導熱部結 - ^可應用於一電子褒置之散熱模組中，用以與一發熱 一—導熱U ’其可使介面卡與導熱板穩固的導熱結合為 上不^ 口筆"己型電腦之攜帶或移動而損壞，且能將介 之顯示晶片或繪圖晶片[其工作時所產 能有 效的導出。 為達上述之目的’本發明提供一種散熱器導熱部結 甘· 冶丄、. · 6The structure includes: a heat conducting plate and a snap-in spring 1289040 j in the concept of the motherboard and tends to be a pluggable card design with the desktop card, because it will not be with the central processor, the south bridge chip Or Northbridge wafers, etc.: At the same time: the characteristics of thin-film notebooks, in order to reduce the space of the card, the design of the card, and the desktop computer into the motherboard (four) way When plugging in the slot, how to solve the display card ^ _ a μ and the main branch board becomes a problem that must be overcome. The problem of heat dissipation is that the location to be set by the central unit is set on the motherboard: 2: on the wafer, by using the heat-dissipating plate of the heat sink, close to the central processing unit or the display chip. On the hot surface, to achieve the effect of the surface: and the heat, but now the notebook computer, the display ^ ^ ❸ 10, tends to insert the card design, so that the conventional heat sink, thermal method for inserting The card type of the card. SUMMARY OF THE INVENTION The main purpose of the month is to provide a heat sink junction of the heat sink - which can be applied to a heat sink of an electronic device for use with a heat-heating U' which enables the interface card to be thermally conductive. The stable thermal conduction of the board is damaged by the carrying or moving of the computer, and can be effectively derived from the display wafer or the drawing chip. In order to achieve the above purpose, the present invention provides a heat transfer portion of a heat sink, and is provided.