1269630 九、發明說明： ，之散熱器結構’尤其是—種應 晶片散熱用之散熱器結構。 【發明所屬之技術領域】 本發明為一種電子裝 用於電腦中，用以對發熱 【先前技術】 隨著電腦中央處理器或顯示晶片等電 能及，度不斷的提升，該些電子元件高速或大量運算= :::伴產生了而溫的問題’然而每一電子元件其乍:: 度均有的限制，高溫對電子元件而言，除了㈣^皿 作效率外，嚴重時更可能造成電子元件損壞甚至 題，因此散熱的問題已成為產品設計上不可或缺的、：二問 為了使電腦能在一正常的溫度值以下正常工作，散熱= 使用，已成為筆§己型電腦不可或缺的必要構件。…、 如第一圖所示，係為一習知散熱裝置立體圖，其 係由一導熱模組及一風散模組所構成，其中該導埶模电係 由一導熱板（2Π)、一傳熱部（23)及一散熱鰭片組（24)所 組成’而該風散模組（30)係由一風扇及一風扇殼體所構 成。導熱模組藉由導熱板將發熱元件（例如··中央處理 器、顯示晶片…等）因工作所產生之熱能導出，並藉由傳 熱部（導熱管，Heat Pipe)將導熱板導出之熱能傳遞^遠端 之散熱鰭片組’因為散熱鰭片組之結構係由複數個鳍片平 行排列而成’因此其能將散熱面積擴大，此時藉由風扇才1 組產生之冷卻風，對該帶熱能之散熱鰭片組進行吹送 1269630 =些鰭片進行熱交換，又將熱交換後所產生的熱氣排出機 體’即可達成散熱的目的。 自知之散熱裝置主要設置的*置，係設置於位於主機 反上之中央處理器或顯示晶片上，藉由將散熱裝置之導埶 板’緊密的導熱貼合於中央處理器或顯示晶片之熱表面’、’、 ^ ’以達料熱及散熱之功效，然而現在的筆記型電腦， =示介面卡之效能要求愈來愈高，Μ了介面卡升級 ’目前有關顯示介面卡之設計，均趨向有如桌上型 2二般，改為插卡式之設計’使得習知之散熱裝置因此 +冉適用。 【發明内容】 本發明之主要目的，係要提供一種散熱器結構，其可 ;敎^0 ;丨面卡之放純組中，藉由本發明之實施，使得 月夂旲、、且不但能將介面卡穩固的固設 之攜帶哎蒋叙品4〇广 日軍‘ 1包細 ^4動而_，且能將介面卡之顯示晶片或緣圖晶 :、工作時所產生之熱能有效的散除。 j上述之目的’本發明提供一散熱器結構，其包 又^導熱部’―傳熱部以及一散熱鰭片、组，而該導埶部 又包括：一導熱板及一扣合彈片。 … 電子：之導熱板，為一導熱佳之金屬平板，其用以與 :衣二之發熱兀件導熱結合’又其與發熱元件結合之 之扣合扣環立柱及至少一鎖孔立柱。而導熱部 片係由一對壓板及一對結構板結合而成，該壓 ^69630 ‘ 、 ==二環立粒處’均設有—勾孔，鳴對應於 母鎖孔立柱處，則設有一鎖固孔。 傳熱部’其一端與該導熱板導熱 r導r熱能，進-步的傳遞至-散熱鳍片、二3 二；係：傳熱部之另一端相導熱結合，用以將傳熱部所 效的能，藉由風扇模組所提供之冷卻風，使其能有 =熱板藉由至少一扣環立柱及至少一該鎖孔立柱，以 ^才口合彈片，又藉由扣合彈月卡固且鎖固於該些立柱 結合元件’並使該發熱元件之發熱面，^ =树明之實施，至少可以達成下列所述之功效： 由本♦明之實施’使得介面卡因工作所產生之熱能， 咸有效的導出及散發。 2·::本發明之實施’可使介面卡與散熱器結構穩固的結 _ 合為一體。1269630 IX. Description of the invention: The structure of the heat sink is, in particular, a heat sink structure for heat dissipation of the wafer. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device for use in a computer for heating. [Prior Art] With the continuous improvement of power and degree of a computer central processing unit or a display chip, the electronic components are high speed or A large number of operations = ::: accompanied by the problem of temperature 'however, each electronic component has its own limit:: degree limit, high temperature for electronic components, in addition to (four) ^ dish for efficiency, more serious when it is more likely to cause electrons The component is damaged or even the problem, so the problem of heat dissipation has become indispensable in product design: Second question, in order to make the computer work normally below a normal temperature value, heat dissipation = use has become an indispensable part of the computer Necessary components. As shown in the first figure, it is a stereoscopic view of a conventional heat dissipating device, which is composed of a heat conducting module and a wind dispersing module, wherein the guiding die electric system is composed of a heat conducting plate (2Π), a The heat transfer portion (23) and a heat dissipation fin group (24) are formed. The air dispersion module (30) is composed of a fan and a fan housing. The heat conducting module derives the heat energy generated by the heating element (for example, the central processing unit, the display chip, etc.) by the heat conducting plate, and derives the heat energy of the heat conducting plate by the heat transfer portion (Heat Pipe). The heat-dissipating fin group of the remote end is transmitted because the structure of the heat-dissipating fin group is arranged by a plurality of fins arranged in parallel, so that the heat-dissipating area can be enlarged, and the cooling wind generated by the fan group is The heat-dissipating fin group is blown 1269630 = some fins are exchanged for heat, and the hot air generated after heat exchange is discharged to the body to achieve heat dissipation. The main arrangement of the self-contained heat sink is disposed on the central processing unit or the display chip on the reverse side of the main unit, and is closely attached to the central processing unit or the display chip by the heat conduction of the heat guiding device. The hot surface ', ', ^ ' to achieve the heat and heat dissipation effect, but now the notebook computer, = interface card performance requirements are getting higher and higher, Μ interface card upgrade 'currently related to the design of the display interface card, Both tend to be like the desktop type 2, and the plug-in design is made to make the conventional heat sink suitable for use. SUMMARY OF THE INVENTION The main object of the present invention is to provide a heat sink structure, which can be used in the pure group of the face card, and the implementation of the present invention enables the moon, and not only The interface card is firmly fixed and carried by 哎 叙 叙 〇 〇 〇 〇 〇 〇 〇 ' ' 1 1 1 1 1 1 1 1 1 1 1 1 1 1 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介 介The purpose of the present invention is as follows: The present invention provides a heat sink structure, which comprises a heat conducting portion, a heat transfer portion, and a heat dissipating fin, the group, and the guiding portion further comprises: a heat conducting plate and a snapping elastic piece. ... Electronic: The heat conducting plate is a metal plate with good heat conduction, which is used for heat-conducting bonding with the heat-generating component of the second coat, and a snap-fit buckle column and at least one keyhole column combined with the heat-generating component. The heat conducting portion is formed by a combination of a pair of pressing plates and a pair of structural plates, and the pressing holes 69630', == two ring-shaped granules are provided with hook holes, and the sounds corresponding to the female locking hole columns are provided. There is a locking hole. The heat transfer portion has a heat conduction between the one end and the heat conducting plate, and the heat is transferred to the heat sink fin, and the heat transfer portion is thermally coupled to the other end of the heat transfer portion for the heat transfer portion. Effectively, the cooling air provided by the fan module enables the hot plate to be combined with at least one of the buckled posts and at least one of the keyhole posts to form a shrapnel and a snap The card is fastened and locked to the column-binding elements 'and the heat-generating surface of the heating element, and the implementation of the tree can at least achieve the following effects: The implementation of the present invention enables the interface card to work. Heat, salty and effective export and distribution. 2::: The implementation of the present invention enables the interface card to be integrated with the structure of the heat sink structure.
It發明之實施’可使介面卡與散熱蒸結構結合的作 業、欠得更為簡單且有效率。 :對本發明之特徵、目的及功能有進一步的認知與瞭 解’餘配合圖式詳細說明如下： 【實施方式】 :第：圖所示，係為本實施例之散熱器結構立體圖， 於一電子裝置中’對其發熱元件（顯示晶片或繪 7 1269630 圖晶片）進行散熱用，其包括：一導熱部⑵），一傳熱部 (23)以及月欠熱轉片組㈣，而導熱部又包括—導熱 板(211)及一扣合彈片（216)。 V熱邛（21)之導熱板(211)為一導熱佳之金屬平板，其 用以與-電子裝置中之發熱元件⑸）導熱結合，用以將該 毛熱元件（51)因工作所產生之熱能，透過導熱板(211)其面 t接觸而有效的導出，而該發熱元件係為—顯示晶片或一 繪圖晶片。為了有效的傳導熱能，導熱板(2⑴一般以銅或 鋁材質加以製作，其導熱效果較佳。 為了忐緊密的結合該發熱元件（51)，因此導熱板(211) 其與該發熱元件（51)結合之一面，設有至少一扣環立柱 (212)及至少一鎖孔立柱（214)。該些立柱係以即接的方式， —即接於該導熱板(211)上，以使其能穩固的與導熱板(211)結 合。而其中扣環立柱(212)於其立柱接近上緣處，設有一水 平的裱型凹槽（213);而鎖孔立柱（214)則於其立柱之頂端設 镛有一螺孔⑵5)。 扣合彈片（216)，係由一對壓板(217)及一對結構板(222) 結合而成，結構板(222)係用以支撐及固定該壓板(217)，而 壓板(217)係為一中間低而兩側高之金屬彈片，又壓板(217) 其對應於每一扣環立柱(212)處，均設有一勾孔（219)，而對 應於每一鎖孔立柱(214)處，則設有一鎖固孔（218)，又為 了使扣合彈片（216)與扣環立柱(212)能更方便的結合，故將 勾孔（219)設計成包括有一勾孔部（22〇)及 一延伸孔部（221)。 傳熱部（23) ’其一端係與該導熱板(211)導熱結合，其 1269630 、、 用以將導熱板(211)所導出的熱能進—步的傳遞至—散敎妹 片組（24) ’又該傳熱部⑽係以一熱導管（細咖）為最‘曰 佳。 散熱鰭片組（24)，其係與傳熱部（23)之另一端相導執 結合，該散熱鰭片組（24)係由複數個垂直於該傳熱部⑽ 且相互平行排列之縛片所構成，且每一鰭片均為一薄 狀。 、 如第三圖係為一風扇模組及散熱器支撐板結構之立體 圖，如第四圖所示，係為本實施例之散熱器結構結合於風 扇模組及散熱器支撐板結構之立體圖，由以上之圖示得 ，本貝把例之放熱為結構（20)使用時，係藉由散熱器支 .撐板結構⑽之支撐，使得導熱板（211)能穩固的與發熱 .兀件（51)結合，又藉由風扇模組（30)提供散熱用之冷卻 風，使集中於散熱鰭片組（24)之熱能，能有效的排出。 如第五圖所示，係為本實施例之散熱器結構與一介面 鲁卡之立體分解圖，又第六圖所示，係為本實施例之散熱器 結構與一介面卡之立體結合圖。其中該介面卡（50)係例如 一顯不介面卡（VGA卡）或一繪圖介面卡（MXM卡）等，且該 介面卡（50)之顯示晶片或繪圖晶片係位於該介面卡（5〇)之 下方。该介面卡（50)係藉由一設於主機板（6〇)上之插槽 (Slot)(61)與主機板（60)相連接，接著又藉由設於該介面 卡（50)上之穿孔（52)，使得設於導熱板（211)上之扣環立柱 (212)及鎖孔立柱(214)，能穿過該些穿孔（52)，之後再藉由 一扣合彈片（216)之勾孔（219)，套設於扣環立柱（212)之環型 9 1269630 凹槽（213)處而結合，且又將扣合彈片（216)之鎖固孔（2i8)， 對準鎖孔立柱（214)之螺孔（215)，並藉由螺絲予以鎖固結 合。 當扣合彈片（216)欲結合扣環立柱(212)之環型凹槽（213) 時，因為勾孔（219)係包括一勾孔部（22〇)及一延伸孔部 (221)，因此能藉由延伸孔部（221)的空間，使勾孔（219)對準 扣環立柱(212)之作業更為方便。又因為扣合彈片（2ι6)之壓 板(217) ’係為一中間低而兩側高之彈片，因次當扣合彈片 (216)立而勾合於環立柱(212)後，而另一端又藉由螺絲鎖固 於一鎖孔立柱(214)時，此時彈片被壓迫而會產生張力，藉 由該張力可使介面卡（50)非常穩固的被固設。 ^ 如第七圖所示，係為本實施例散熱器結構與顯示卡結 .合日守之A-A剖視圖，藉由本實施例之散熱器結構，可使設 於該介面卡（50)上發熱元件（51)之發熱面，與該導熱板 (211)緊密的導熱結合。 • 唯以上所述，僅為本發明之較佳實施例，當不能以之 限制本發明的範圍。即大凡依本發明申請專利範圍所做之 均等變化及修飾，仍將不失本發明之要義所在，亦不脫離 本發明之精神及範圍，故都應視為本發明之進一步實施狀 況。 【圖式簡單說明】 第一圖係為一習知散熱裝置立體分解圖。 第二圖係為本實施例之散熱器結構立體圖。 10 1269630 ‘ 第三圖係為一風扇模組及散熱器支撐板結構之立體圖。 第四圖係為本實施例之散熱器結構結合於風扇模組及散 熱器支撐板結構之立體圖。 第五圖係為本實施例之散熱器結構與一介面卡之立體分 解圖。 第六圖係為本實施例之散熱器結構與—介面卡之立體結 合圖。 魯第七圖係為本實施例散熱器結構與顯示卡結合時之A] 剖視圖所示。 【主要元件符號說明】 20 散熱器結構 21導熱部 23傳熱部 24 散熱鰭片組 • 211導熱板 212扣環立柱 213環型凹槽 214鎖孔立柱 215螺孔 216扣合彈片 217壓板 218鎖固孔 219勾孔 11 1269630 220 勾孔部 221延伸孔部 222結構板 30 風扇模組 40 散熱器支撐板結構 50 介面卡 51 發熱元件 52 穿孔 60 主機板 61 插槽The implementation of the invention of invention can make the interface card and the heat-dissipating structure more difficult and efficient. Further understanding and understanding of the features, objects and functions of the present invention will be described in detail as follows: [Embodiment]: Fig.: is a perspective view of a heat sink structure of the present embodiment, in an electronic device In the middle of 'heating element (display wafer or drawing 7 1269630 wafer) for heat dissipation, comprising: a heat conducting portion (2)), a heat transfer portion (23) and a monthly heat transfer film group (4), and the heat transfer portion includes - a heat conducting plate (211) and a snap tab (216). The heat conducting plate (211) of the V heat sink (21) is a heat conducting metal plate for thermally conducting the heat generating component (5) in the electronic device for generating the thermal element (51) due to work. The heat energy is effectively extracted through the surface t contact of the heat conducting plate (211), and the heat generating component is a display wafer or a drawing wafer. In order to effectively conduct heat energy, the heat conducting plate (2(1) is generally made of copper or aluminum, and its heat conducting effect is better. In order to tightly bond the heat generating component (51), the heat conducting plate (211) and the heat generating component (51) Combining one side with at least one buckle post (212) and at least one keyhole post (214). The posts are connected in a snap-on manner, ie, connected to the heat conducting plate (211) It can be firmly combined with the heat conducting plate (211), wherein the buckle column (212) is provided with a horizontal 裱-shaped groove (213) near the upper edge of the column, and the keyhole column (214) is at the column The top end is provided with a screw hole (2) 5). The snap-in elastic piece (216) is formed by combining a pair of pressing plates (217) and a pair of structural plates (222) for supporting and fixing the pressing plate (217), and the pressing plate (217) is The metal shrapnel is low in the middle and high on both sides, and the pressing plate (217) corresponding to each of the buckle pillars (212) is provided with a hook hole (219) corresponding to each of the keyhole columns (214). Wherein, a locking hole (218) is provided, and in order to make the fastening elastic piece (216) and the buckle ring column (212) more conveniently combined, the hook hole (219) is designed to include a hook hole portion (22) 〇) and an extension hole (221). The heat transfer portion (23) 'haves one end of which is thermally coupled to the heat conducting plate (211), and the 1269630 thereof is used to transfer the heat energy derived from the heat conducting plate (211) to the heat sink plate group (24). ) 'The heat transfer part (10) is also the best one with a heat pipe (fine coffee). a heat dissipating fin set (24) coupled to the other end of the heat transfer portion (23), the heat dissipating fin set (24) being bound by a plurality of parallel to the heat transfer portion (10) and arranged in parallel with each other The sheet is constructed, and each fin is a thin shape. The third figure is a perspective view of a fan module and a heat sink support plate structure. As shown in the fourth figure, the heat sink structure of the embodiment is coupled to the fan module and the heat sink support plate structure. From the above illustration, the exothermic heat of the embodiment is the support of the structure (20), which is supported by the radiator support plate structure (10), so that the heat conduction plate (211) can be stabilized and heated. 51) In combination, the fan module (30) provides cooling air for heat dissipation, so that the heat energy concentrated on the heat dissipation fin group (24) can be effectively discharged. As shown in the fifth figure, it is an exploded perspective view of the heat sink structure and a interface Luca of the present embodiment, and the sixth figure is a perspective view of the heat sink structure and an interface card of the present embodiment. . The interface card (50) is, for example, a display interface card (VGA card) or a graphics interface card (MXM card), and the display chip or the graphics chip of the interface card (50) is located on the interface card (5〇). Below). The interface card (50) is connected to the motherboard (60) by a slot (61) disposed on the motherboard (6), and then is disposed on the interface card (50). The perforation (52) enables the buckle post (212) and the keyhole post (214) disposed on the heat conducting plate (211) to pass through the through holes (52), and then by a snapping elastic piece (216) The hook hole (219) is sleeved on the ring type 9 1269630 groove (213) of the buckle column (212), and the locking hole (2i8) of the snap spring (216) is aligned. The screw hole (215) of the keyhole column (214) is locked and coupled by a screw. When the snapping elastic piece (216) is to be combined with the annular groove (213) of the buckle ring column (212), since the hook hole (219) includes a hook hole portion (22〇) and an extending hole portion (221), Therefore, it is more convenient to align the hook hole (219) with the buckle post (212) by extending the space of the hole portion (221). And because the pressing plate (217) of the snapping elastic piece (2ι6) is a piece of the middle piece which is low in the middle and high in both sides, the second piece of the locking piece (216) is hooked to the ring column (212), and the other end is When the screw is locked to a lock hole column (214), the spring piece is pressed to generate tension, and the tension card enables the interface card (50) to be firmly fixed. As shown in the seventh embodiment, it is a cross-sectional view of the heat sink structure and the display card of the present embodiment. The heat sink structure of the interface card (50) can be used for the heat generating component of the interface card (50). 51) The heat generating surface is combined with the heat conduction of the heat conducting plate (211). The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited to the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention. [Simple description of the drawing] The first figure is an exploded view of a conventional heat sink. The second figure is a perspective view of the heat sink structure of the present embodiment. 10 1269630 ‘The third picture is a perspective view of a fan module and a radiator support plate structure. The fourth figure is a perspective view of the heat sink structure of the embodiment coupled to the fan module and the heat sink support plate structure. The fifth figure is a three-dimensional decomposition diagram of the heat sink structure and an interface card of the present embodiment. The sixth figure is a perspective view of the heat sink structure and the interface card of the present embodiment. The seventh diagram of Lu is shown in a cross-sectional view of the heat sink structure of the embodiment in combination with the display card. [Main component symbol description] 20 Heat sink structure 21 Heat transfer part 23 Heat transfer part 24 Heat sink fin set • 211 Heat transfer plate 212 Buckle column 213 Ring groove 214 Keyhole column 215 Screw hole 216 Buckle shrapnel 217 Platen 218 lock Solid hole 219 hook hole 11 1269630 220 hook hole portion 221 extension hole portion 222 structural plate 30 fan module 40 heat sink support plate structure 50 interface card 51 heating element 52 perforation 60 motherboard 61 slot