200845328 九、發明說明： 【發明所屬之技術領域】 本發#係涉吸散熱裝置的技術領域，尤其指一 作、組裝簡單、結合牢固、穩定及散熱效果較佳二記憶體 核組及其具備單片/雙片型式連接片之散熱裝置者。。 【先前技術】 請參閱台灣專利公告第1273688號所示係為一種 體模組整合結構。其僅刺用_導熱Μ _於該全緩衝^ 線記憶體模組之進階記憶_晶#上，賴錄熱裝置再 藉由夾接部的兩夾片夾設於該導熱片上端，使達到將全緩 衝雙線記憶體模與所產生的熱量傳導至該散熱置之目的'。 然而，該兩夾片與散熱裝置的第二板體呈垂直狀，所以該 兩夾片夾接於該導熱片上端時，其結合效果係較為不牢固 而易晃動，並因此易導玫散熱效果不佳之問題。 請參閱台灣專利公告第Μ265763號所示係為一種用於 記憶體之散熱裝置。其主要係於記憶體之兩側各蓋設有一 片散熱板，然後藉由一扣件夾設於該兩散熱板外側，以利 用該兩散熱板將該記憶體之熱量導出。然而，當該記憶體 的熱里傳導至該散熱板後，由於該散熱板係貼靠於該記憶 體之兩側Φ 亥具有南溫之散熱板仍會對該記憶體造 成相當的影響。因此其所達到的散熱效果亦非常不好。 【發明内容】 200845328 之主要目的係提供—種製作、組裝簡單、妹人 ===及散熱效果佳之記憶趙模丄'二 早月/雙片型式連接片之散熱裝置者。 組包括複數記憶體及一散熱裝置。每一記200845328 IX. Description of the invention: [Technical field of invention] The present invention relates to the technical field of heat sinking devices, in particular, a simple assembly, a firm combination, a stable and a heat-dissipating effect, and a memory core set and a single The heat sink of the sheet/two-piece type connecting piece. . [Prior Art] Please refer to Taiwan Patent Publication No. 1273688 for a body module integration structure. It is only used for the _thermal conduction Μ _ on the advanced memory _ crystal # of the full-buffered memory module, and the thermal recording device is clamped on the upper end of the thermal conductive sheet by the two clips of the nip portion, so that The purpose of transferring the fully buffered two-wire memory phantom and the generated heat to the heat dissipation is achieved. However, the two clips are perpendicular to the second plate body of the heat dissipating device, so when the two clips are clamped to the upper end of the heat conducting sheet, the combined effect is relatively weak and easy to shake, and thus the heat dissipation effect of the guide vane is easy. Bad question. Please refer to Taiwan Patent Publication No. 265763 for a heat sink for memory. The heat sink is mainly disposed on each of the two sides of the memory, and is then disposed on the outside of the two heat sinks by a fastener to derive the heat of the memory. However, when the heat of the memory is conducted to the heat sink, the heat sink is affixed to the sides of the memory, and the heat sink having a south temperature still has a considerable influence on the memory. Therefore, the heat dissipation effect achieved by it is also very bad. [Summary of the Invention] The main purpose of 200845328 is to provide a kind of heat-dissipating device for making a simple assembly, a simple assembly, a sister === and a good heat dissipation effect. The group includes a plurality of memories and a heat sink. Every note
數導熱部:每—導孰部包括置包括-散熱片及祓 片孫姓人认…卩括一基片及一第一連接片。該基 且兮政熱片。該連接片係延伸自該基片一侧邊， 片與該基片間形成一非九十度的夾角，並使 導至接觸該記憶體的熱源，供將該熱源的熱量傳 i=l:在另一個例子中每一導熱部更包括有-第 :ίΐ=基片的另一侧邊’且該第-、二連接片 二基片之間的夾角皆大於九十度。使該第_、二連接片呈 ==二兩相鄰之記憶體的熱源，供將該熱源的 由於本發明之結構簡單所以料、組裝上較為The number of heat conduction parts: each of the guide parts includes a heat sink and a heat sink and a chip. The base is also a hot film. The connecting sheet extends from one side of the substrate, and forms a non-ninety-degree angle between the sheet and the substrate, and leads to a heat source contacting the memory for transmitting heat of the heat source i=l: In another example, each of the thermally conductive portions further includes - the other side of the substrate and the angle between the first and second connecting sheets is greater than ninety degrees. The first and second connecting sheets are made to have a heat source of the adjacent two adjacent memory, and the heat source is simple in structure and assembly according to the structure of the present invention.
月ί接μ』且該散熱裝置之導熱部係可藉由其單片或雙 埶旦值墓$ -接觸於該記憶體之熱源上，以供將該熱源的 的^=該，面積的散熱片，所以該散熱裝置可結合 、乂 穩疋’而且散熱的效果亦較佳。 【實施方式】 第__、一 一圖係顯示本發明所述之記憶體模组的第一實 施例^括複數記憶體2及一散熱裝置4。、、 、每一記憶體2各具有複複記憶體顆粒β、一晶片8及 兩導”、、片1〇。該晶片8係設於其中一記憶體顆粒6上。該 200845328 兩導熱片1G錢於兩侧面，且貼靠於該晶片8上 8之熱量導出。 予曰曰月 該散熱裝置4係包括一散熱片12及 每一導熱部14包括一基#16、_第 二4 連接片20。該基片16係結合於該散熱片12。該第_ = 片18及第二連接片20係延伸自該基片㈣兩相對側邊接 該第-連接片18及第二連接片2G與基片16間的 ^ 大於九十度’使該第一連接片18及第二連接片2〇呈夕二 狀’且分別頂於兩相鄰之記憶體2的導熱片1()，而可供將 該導熱片10的熱量傳導至該散熱片U。 、 第三、四圖係顯示本發明之第二實施例，其結構係大 致與第-實施例相同’而差別在於該二實施例之每一個 熱部14僅具有-第—連接片18延伸自該基片16的 邊。該第—連接片18與基片間係具有-大於九十度的夾 角，且該第一連接片18接觸該記憶體2的一導熱片W， 使可供將該導熱片10的熱量傳導至該散熱片1〇'。' ， 第五、六圖係顯示本發明之第三實施例，其結構係 致與第-實施例相同，而差別在於該三實施例之每一個 ^部14僅具有-第—連接片18延伸自該基片16的^ ，。該第-連接片18與基片間係具有—小於九十度^ 角，且該第一連接片18接觸該記憶體2的一 使可供將該導熱片1〇的熱量傳導至該散熱片 在上述實施例中該導熱片1〇係貼靠於該晶片8上 所以該導熱片10係為該記憶體2之埶 源。綠、、、.卩14便連接鮮散熱片12，以供 200845328 將該導熱片10之熱量傳導至散熱片10。而當該記憶體2 未設有導熱片10時，則該晶片8便為該記憶體2之熱源。 該導熱部14便直接連接該晶片8與該散熱片12，以供將 該導熱片10之熱量傳導至散熱片12。 又上述散熱裝置4之導熱部14與散熱片12的結合方 式係可以插接、鉚接、鎖設、焊接或一體成型等方式為之。 以下茲舉一插接方式結合之最佳實施例說明之： 請參閱第七、八圖所示，係指出該散熱裝置4更包括 有兩風扇22。該散熱片12上係設於該些記憶體2的上方， 且具有複數個插槽24及兩個散熱孔26。該導熱部14的第 一連接片18及第二連接片20係分別插設於相對應的插槽 24中，使該基片16底面與散熱片12頂面緊密的貼合。於 該第一連接片18及第二連接片20上各具有兩個扣片28。 該些扣片28皆係分別由該第一連接片18或第二連接片20 上向外沖壓成型而呈一傾斜角度，使該些扣片28的頂端可 彈性頂於該散熱片12的底部。而該兩風扇22係分別以複 數固定螺絲30將其螺鎖於該散熱片12上，使該風扇22所 產生之氣流可經該些散熱孔26吹向該記憶體2。 由於本發明之導熱部14係具有兩呈外擴狀的第一連 接片18及第二考接片20供分別彈性頂於兩相鄰之記憶體 2 —侧的導熱片10上，或是具有一第一連接片18供彈性 接觸於一記憶體2—侧的導熱片10上。所以於製作、組裝 上係非常的簡單方便，該散熱裝置的結合效果亦較為牢 固、穩定。而且，該散熱裝置4之導熱部14係可將該記憶 體2之熱源所產生的熱量直接傳導至該較大面積的散熱片 200845328 12，以使該熱量可快速散發，所以亦可使其具有較佳之散 熱效果。 無論如何，任何人都可以從上述例子的說明獲得足夠 教導，並據而了知本發明確實有產業上之利用性。又，未 、 見與本發明相同的技術，所以本發明有新穎性。又，未見 ^ 與本發明類似的技術，所以本發明有進步性。於是，本發 明確已符合發明專利要件，爰依法提出申請。 200845328 【圖式簡單說明】 第一圖係本發明第-實施例之剖面分解示意圖C 第二圖係本發明第-實施例之剖㈣合示意圖。 第三圖係本發明第二實施例之剖面分解示意圖。 第四圖係本發明第二實施例之剖面組合示意圖。 帛五圖係本發㈣二實_之剖面分解示意圖。 第六圖係本發明第二實施例之剖面組合示意圖。 第圖係本备0月最佳實施例之立體分解圖。 帛人圖係本發明最佳實施例之剖面組合示意圖。 【主要元件符號說明】 4散熱裝置 8晶片 12散熱片 16基片 20第二連接片 24插槽 28扣片 2記憶體 6記憶體顆粒 導熱片 14導熱部 18第一連接片 22風扇 26散熱孔 30固定螺絲 11The heat transfer portion of the heat sink can be contacted with the heat source of the memory by its monolithic or double-density tomb for the heat source of the heat source. The film, so the heat sink can be combined and sturdy, and the heat dissipation effect is also better. [Embodiment] The first embodiment shows a first embodiment of the memory module of the present invention, including a plurality of memories 2 and a heat sink 4. Each memory 2 has a complex memory particle β, a wafer 8 and two leads, and a chip. The wafer 8 is disposed on one of the memory particles 6. The 200845328 two thermal conductive sheets 1G The heat is discharged from the two sides, and the heat is applied to the wafer 8. The heat sink 4 includes a heat sink 12 and each of the heat conducting portions 14 includes a base #16, a second 4 connecting piece. 20. The substrate 16 is bonded to the heat sink 12. The _ = 18 and the second connecting film 20 extend from the opposite sides of the substrate (four) to the first connecting piece 18 and the second connecting piece 2G Between the substrate 16 and greater than ninety degrees, the first connecting piece 18 and the second connecting piece 2 are formed in a double-shaped shape and are respectively placed on the thermally conductive sheets 1 () of the two adjacent memory bodies 2, respectively. The heat of the heat conducting sheet 10 can be conducted to the heat sink U. The third and fourth drawings show a second embodiment of the present invention, the structure of which is substantially the same as that of the first embodiment, and the difference lies in the two embodiments. Each of the heat portions 14 has only the -first connecting piece 18 extending from the side of the substrate 16. The first connecting piece 18 and the substrate have - more than ninety degrees An angle, and the first connecting piece 18 contacts a heat conducting sheet W of the memory 2, so that heat of the heat conducting sheet 10 can be conducted to the heat sink 1''. The fifth and sixth figures show the present invention. The third embodiment has the same structure as the first embodiment, except that each of the three portions of the three embodiments has only the -first connecting piece 18 extending from the substrate 16. - the connecting piece 18 and the substrate have an angle of less than ninety degrees, and the first connecting piece 18 contacts the one of the memory 2 to conduct heat to the heat conducting piece 1 to the heat sink In the embodiment, the thermal conductive sheet 1 is affixed to the wafer 8 so that the thermal conductive sheet 10 is the source of the memory 2. The green, and the 卩 14 are connected to the fresh heat sink 12 for 200845328. The heat of the heat conductive sheet 10 is conducted to the heat sink 10. When the memory 2 is not provided with the heat conductive sheet 10, the wafer 8 is the heat source of the memory 2. The heat conducting portion 14 directly connects the wafer 8 with the heat source. The heat sink 12 is configured to conduct heat of the heat conductive sheet 10 to the heat sink 12. The heat conducting portion 14 and the heat sink 12 of the heat sink 4 are further disposed. The bonding method can be plugged, riveted, locked, welded or integrally formed. The following is a description of the preferred embodiment in combination with the plugging method: Please refer to the seventh and eighth figures, indicating that The heat sink 4 further includes two fans 22. The heat sink 12 is disposed above the memory 2 and has a plurality of slots 24 and two heat dissipation holes 26. The first connecting piece 18 of the heat conducting portion 14 And the second connecting piece 20 is respectively inserted into the corresponding slot 24, so that the bottom surface of the substrate 16 is closely attached to the top surface of the heat sink 12. On the first connecting piece 18 and the second connecting piece 20 Each has two clasps 28. The buckles 28 are outwardly stamped and formed by the first connecting piece 18 or the second connecting piece 20 at an oblique angle, so that the top ends of the fastening pieces 28 can be elastically placed on the bottom of the heat sink 12 . . The two fans 22 are screwed to the heat sink 12 by a plurality of fixing screws 30, so that the airflow generated by the fan 22 can be blown to the memory 2 through the heat dissipation holes 26. Since the heat conducting portion 14 of the present invention has two first connecting pieces 18 and a second test piece 20 which are outwardly expanded, respectively, are respectively elastically placed on the heat conductive sheets 10 on the side of the two adjacent memory bodies 2, or have A first connecting piece 18 is elastically contacted on the heat conducting sheet 10 on the side of a memory 2. Therefore, it is very simple and convenient to manufacture and assemble, and the combined effect of the heat sink is relatively firm and stable. Moreover, the heat conducting portion 14 of the heat dissipating device 4 can directly transfer the heat generated by the heat source of the memory 2 to the large area heat sink 200845328 12, so that the heat can be quickly dissipated, so that it can also have Better heat dissipation. In any case, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the invention is indeed industrially usable. Further, the present invention is not the same as the technology of the present invention, and therefore the present invention is novel. Further, the technique similar to the present invention has not been seen, so the present invention is progressing. Therefore, this issue clearly meets the requirements of the invention patent and submits an application in accordance with the law. 200845328 BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic cross-sectional view of a first embodiment of the present invention. The second drawing is a cross-sectional view of a first embodiment of the present invention. The third drawing is a schematic exploded view of a second embodiment of the present invention. The fourth figure is a schematic sectional view of a second embodiment of the present invention. The fifth figure is a schematic diagram of the section decomposition of the hair (4) and the second. Figure 6 is a schematic cross-sectional view showing a second embodiment of the present invention. The figure is a perspective exploded view of the preferred embodiment of the month. The figure of the figure is a schematic view of the combination of the preferred embodiments of the present invention. [Main component symbol description] 4 heat sink 8 wafer 12 heat sink 16 substrate 20 second connecting sheet 24 slot 28 clasp 2 memory 6 memory pellet thermal sheet 14 heat conducting portion 18 first connecting sheet 22 fan 26 cooling hole 30 fixing screws 11