M296纖 doc/r 八、新型說明： 【新型所屬之技術領域】 本創作是有關於-種散熱板片 別是有關於一種可以平敕丄 板配置’且特 片，以及财此散熱板W電路減置。^的散熱板 【先前技術】M296 fiber doc/r VIII, new description: [New technology field] This creation is related to - kind of heat sink plate is related to a kind of flat plate configuration 'and special film, and the heat sink W circuit Subtraction. ^ heat sink [prior art]
Ik著現7科技產品的體積傾向於輕薄 技產品_軸件也_著料财 : 一般常見的電子裝置如筆記型電腦而十，==進1 ::體積之下，將許多不同功能的電子元:及:片=二 =裝置⑽電路板配置上，以達到讓電子裝置多功能的 立J而，電子裝置的體積不斷地縮小，但電子裝置之内 部電子元件及晶片的熱功率又不斷地上升，因此為了讓電 子兀件及晶片能夠快速地散熱，通常會在電子元件及晶片 上裝設散熱板片，以增加電子元件及W的散熱面積，協 助電子元件及晶片的冷卻。 圖1A為習知一種散熱板片鎖固於基板上的上視圖， 而圖1B為圖1A之Ι-Γ線的剖面示意圖。請參考圖1A與 圖1B，習知之散熱板片1〇〇適於組裳於一基板2〇〇上，並 且接觸基板200上之一晶片210。散熱板片100包括一本 體Π0以及位於本體11〇兩侧的兩個鎖附部12〇，其中本 體110具有一適於與晶片210接觸的凹陷部112，而每一 個鎖附部120具有一鎖孔122。將散熱板片100固定於基 M296紐 板200上的方法是使散熱板片100的凹陷部112覆蓋並接 觸晶片210，然後將螺絲130穿過鎖孔122並鎖附於基板 2〇〇中’以將散熱板片1〇〇固定在基板2〇〇上。 但是’習知散熱板片1⑻之兩個鎖孔122是位在同一 轴線Α上，所以將散熱板片ι〇〇鎖固於基板2⑻上後，散 熱板片100容易以軸線A為軸心而朝逆時鐘或順時鐘方向 偏轉，因而無法平整地貼附於晶片112的表面上。此外，Ik is now 7 technology products, the volume tends to be thin and light technology products _ shaft parts also _ 料 :: generally common electronic devices such as notebook computers and ten, == into 1 :: volume, will be many different functional electronic Yuan: and: slice = two = device (10) circuit board configuration, in order to achieve the multi-function of the electronic device, the size of the electronic device is continuously reduced, but the internal electronic components of the electronic device and the thermal power of the chip are continuously As a result of the rise, in order to allow the electronic components and the wafer to dissipate heat rapidly, a heat sink sheet is usually mounted on the electronic component and the wafer to increase the heat dissipation area of the electronic component and the W, and to assist in cooling the electronic component and the wafer. 1A is a top view of a conventional heat sink sheet locked to a substrate, and FIG. 1B is a cross-sectional view of the Ι-Γ line of FIG. 1A. Referring to FIG. 1A and FIG. 1B, a conventional heat sink sheet 1 is suitable for being mounted on a substrate 2 and contacting a wafer 210 on the substrate 200. The heat sink sheet 100 includes a body Π0 and two latching portions 12〇 on both sides of the body 11b, wherein the body 110 has a recess 112 adapted to contact the wafer 210, and each of the latches 120 has a lock Hole 122. The method of fixing the heat sink sheet 100 to the base M296 board 200 is to cover the recess 112 of the heat sink sheet 100 and contact the wafer 210, and then pass the screw 130 through the lock hole 122 and lock into the substrate 2'. The heat sink sheet 1 is fixed to the substrate 2A. However, the two locking holes 122 of the conventional heat dissipating plate 1 (8) are located on the same axis, so that after the heat dissipating plate is fixed on the substrate 2 (8), the heat dissipating plate 100 is easily centered on the axis A. It is deflected toward the clock or clockwise, and thus cannot be flatly attached to the surface of the wafer 112. In addition,
若，顆螺絲鎖固的力量不同，則會使散熱板片1〇〇朝鎖固 力量較大的一邊傾斜（如圖2示），而無法平整地貼附於 晶片210的表面上。 圖3為習知另一種散熱板片鎖固於基板上的上視圖。 由圖3可知，散熱板片1〇〇,與散熱板片1〇〇不同的地方在 於·放熱板片100’具有位於四個角落的四個鎖附部。 利用四顆螺絲穿過四個鎖附部12G，的鎖孔122，並鎖附於基 板200上，可將此散熱板片100,固定於基板200上，如二 100(^®1 a 朝逆4½或順時鐘方向偏轉的問題。 然而，當圖3中左邊兩顆螺絲與右邊兩顆螺絲（或上 “顆螺絲與下扣卿絲）顧的力量 =陶然會朝鎖固力量較大的 ，而= 貼附於晶片2H)表面上。糾，散熱板片⑽，2 = 鹿^ 122 ’所以在基板上需設置四個與鎖孔122,相對 =鎖附部12〇,，如此將佔據基板 多 ， 成其他元件树_少。另 6 M296涵 flUc/r 絲將此散熱板片100’固定於基板2⑻上，所以會增加螺絲 的材料成本以及組裝工時。 【新型内容】 本創作的目的就是在提供一種可平整地接觸基板上 之晶片的散熱板片。 本創作的再一目的是提供一種電路板配置，其散熱板 片可平整地賴基板上H且可縮短將散熱板片組裝 於基板上的工時。 本創作提出一種散熱板片，其包括一本體、一第一固 „及—第二蚊端。本體具有-第-端以及-第二 端。第-固定端具有—第_懸臂以及—第二懸臂，而第一 懸臂及第二懸臂分別連接於本體之第-端，且第-固定端 ^形成有-第-鎖孔。第二固定端具有—第三懸臂以及一 第四懸臂’且第三懸臂及第四懸臂分別連接於本體之第二 立而，且弟一固定端更形成一第二鎖孔。 在本創作一實施例中，上述之本體形成有一凹陷部。 在本創作-實施例中’第i孔以及第二鎖孔連線通 過凹陷部。 在本創作一實施例中，第一懸臂、第二懸臂、第三懸 臂以及第四懸臂分別具有-f折部，使第_固定端以及第 二固定端分別與本體形成一段差。 在本創作一實施例中，本體為矩形。 本創作另提出一種電路板配置，其包括一基板、一晶 片以及上述之散熱板片。晶片及散熱板片皆配置於基板 7 M296^Qfdoc/r 上，其中散熱板片覆蓋並接觸晶片。 在本創作一實施例中，電路板配置更包括一熱擴散板 板(heat spread)，且熱擴散配置於本體之凹陷部與晶片之 間。 / 在本創作一實施例中，電路板配置更包括二鎖固件， 为別牙過第一鎖孔以及第二鎖孔以將散熱板片鎖固於基板 上。 在本創作中’散熱板片所受到的局部應力會集中於各 個懸臂’因此只要使用兩個鎖固件來將散熱板片鎖固於基 板上，便能達到使用四個鎖固件鎖固散熱板片之功效。如 此，不僅可節省電路板配置的組裝工時及基板上的空間， 還可節省鎖固件的材料成本。 為讓本創作之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 差二實施例 圖4A為本創作第一實施例之電路板配置的剖面示意 圖，而圖4B為圖4A之散熱板片的立體圖。請參考圖4A 與圖4B，電路板配置4〇〇包括一基板410、一晶片"ο以 及政熱板片300。晶片420及散熱板片300皆配置於基 板410上，其中散熱板片3〇〇用以覆蓋並接觸晶片42〇, 以移除晶片420的熱。另外，散熱板片300包括一本體 310、一第一固定端320以及一第二固定端330。本體31〇If the force of locking the screws is different, the heat sink sheet 1 is tilted toward the side with a larger locking force (as shown in Fig. 2), and cannot be flatly attached to the surface of the wafer 210. 3 is a top view of another conventional heat sink sheet locked to a substrate. As is apparent from Fig. 3, the heat radiating plate piece 1 is different from the heat radiating plate piece 1', and the heat releasing plate piece 100' has four locking portions at four corners. The four heat-dissipating plates 100 are fixed on the substrate 200 by using four screws to pass through the locking holes 122 of the four locking portions 12G, and are fixed on the substrate 200, such as two 100 (^®1 a reverse) 41⁄2 or the problem of deflection in the clockwise direction. However, when the two screws on the left side of Figure 3 and the two screws on the right side (or the "screws and the lower buckles"), the force of the ceramics will be greater toward the locking force. And = attached to the surface of the wafer 2H). Correction, heat sink plate (10), 2 = deer ^ 122 ' So four holes and lock holes 122 are required on the substrate, opposite = lock portion 12〇, which will occupy the substrate More, into other component trees _ less. Another 6 M296 han flUc / r wire fixed this heat sink sheet 100' on the substrate 2 (8), so will increase the material cost of the screw and assembly man-hours. [New content] The purpose of this creation It is to provide a heat dissipating sheet which can smoothly contact the wafer on the substrate. A further object of the present invention is to provide a circuit board configuration in which the heat dissipating plate can be flatly placed on the substrate H and the heat dissipating plate can be shortened. Working hours on the substrate. The present application proposes a heat sink sheet, which includes A body, a first solid and a second mosquito. The body has a - end - and a second end. The first fixed end has a -th cantilever and a second cantilever, and the first cantilever and the second cantilever are respectively connected to the first end of the body, and the first fixed end ^ is formed with a -th lock hole. The second fixed end has a third cantilever and a fourth cantilever, and the third cantilever and the fourth cantilever are respectively connected to the second body of the body, and the fixed end of the second body further forms a second locking hole. In an embodiment of the present invention, the body is formed with a recess. In the present creation-embodiment, the 'i-th hole and the second keyhole line pass through the recess. In an embodiment of the present invention, the first cantilever, the second cantilever, the third cantilever, and the fourth cantilever respectively have a -f fold so that the first fixed end and the second fixed end respectively form a difference from the body. In an embodiment of the present creation, the body is rectangular. The present invention further provides a circuit board configuration including a substrate, a wafer, and the above-described heat dissipation plate. Both the wafer and the heat sink are disposed on the substrate 7 M296^Qfdoc/r, wherein the heat sink covers and contacts the wafer. In an embodiment of the present invention, the circuit board configuration further includes a heat spread, and the thermal diffusion is disposed between the recess of the body and the wafer. In an embodiment of the present invention, the circuit board configuration further includes two locking fasteners for the teeth to pass through the first locking hole and the second locking hole to lock the heat dissipation plate to the substrate. In this creation, the local stress on the heat sink plate will be concentrated on each cantilever. Therefore, as long as two fasteners are used to lock the heat sink plate to the substrate, it is possible to lock the heat sink plate with four locks. The effect. As a result, not only the assembly man-hours of the board configuration and the space on the substrate can be saved, but also the material cost of the lock can be saved. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] Embodiment 2 FIG. 4A is a schematic cross-sectional view showing a circuit board configuration of the first embodiment, and FIG. 4B is a perspective view of the heat dissipation plate of FIG. 4A. Referring to FIG. 4A and FIG. 4B, the circuit board configuration 4 includes a substrate 410, a wafer, and a thermal sheet 300. The wafer 420 and the heat sink sheet 300 are disposed on the substrate 410, wherein the heat sink sheet 3 is used to cover and contact the wafer 42A to remove the heat of the wafer 420. In addition, the heat dissipation plate 300 includes a body 310, a first fixed end 320, and a second fixed end 330. Ontology 31〇
M296湯 doc/r 具有=第一端312以及一第二端314。第一固定端32〇具 有-第-懸臂322以及_第二懸臂324，而第一懸臂322 及第二懸臂324分別連接於本體31Q之第一端312，且第 固定端320更形成有一第一鎖孔孤。第二固定端 具有一第二懸臂332以及一第四懸臂334，且第三懸臂332 及第四懸臂334分別連接於本體31〇之第二端314，且第 二固定端330更形成一第二鎖孔336。 此外，電路板配置400更包括兩個鎖固件440，這兩 個鎖固件440會分別穿過第一鎖孔326以及第二鎖孔 336 ’以將散熱板片3〇〇鎖固於基板41〇的鎖固部412上。 在本實施例中，鎖固件440為螺絲，但不以此為限。 承上述’散熱板片300的本體310具有一凹向晶片420 (如圖4A示）的凹陷部316，且散熱板片300的面積可略 大於晶片420的面積，以在凹陷部316接觸晶片420時， 提供晶片420較大的散熱面積，如此可更快速地移除晶片 420的熱。此外，第一鎖孔326與第二鎖孔336的連線l 會通過凹陷部316。另外，第一鎖孔326以及第二鎖孔336 可以是對稱分佈於凹陷部316的兩侧。在本實施例中，連 線L與散熱板片300的第一懸臂322、第二懸臂324、第 三懸臂332或第四懸臂334互不平行。在其他實施例中， 連線L可與散熱板片300的第一懸臂322、第二懸臂324、 第三懸臂332或第四懸臂334互相平行，如圖5所示之散 熱板片300a。 在本實施例中，鎖固件440所施加於散熱板片3⑻的 9 M296纖 doc/r 局部應力會集中在第-懸臂322、第二懸臂324、第三懸臂 332及第四懸臂334,如此即與習知技術中利用四_絲將 散熱板片100,固定於基板200上的效果相同。換古之，本 實施例之電路板配置4 〇 〇僅需藉由兩個鎖固件即可將 散熱板片300穩固地固定於基板41〇上，而不奋有習知散 熱板片100(如圖1A所示)容易以軸線A為轴心二朝逆時鐘 或順時鐘方向偏轉的問題。 由於本創作之電路板配置400僅需要兩個鎖固件44〇 便可將散熱板片300穩固地固定於基板41〇上，因此不但 可以節省鎖附鎖固件440的時間，以提高電路板配置4〇〇 的組裝效率，還可以節省鎖固件44〇的材料成本。此外， 將此政熱板片300應用於電路板配置4〇〇中，還可以使電 路板配置400的基板41 〇剩餘更多的空間來組裝其他元件％ 第二實施例 圖6A為本創作第二實施例之電路板配置的剖面示意 圖，而圖6B為圖6A之散熱板片的立體示意圖。請同時參 考圖6A及圖6B，與第一實施例不同的是，本實施例之電 路板配置400’中的散熱板片3〇〇b，其第一懸臂322,、第-懸臂324’、第三懸臂332,及第四懸臂334,分別具有一彎折 部322a，使第一固定端320,以及第二固定端33〇，分別與本 體310形成一段差。和第一實施例相同，本實施例之電路 板配置400’亦可僅藉由兩個鎖固件44〇即可將散埶 300’穩固地固定在基板41〇上。 … 圖7為圖6A之散熱板片固定於基板上時，彎折部變 10 M296ii9iQ doc/r 形的示意圖。請參考圖7，由於第一懸臂322，、篦一 324’、第三懸臂332,及第四懸臂334，分別具有彎折二 322a，因此當兩個鎖固件440鎖固的力量不當時，彎折= 322a會受力而產生形變，讓散熱板片3〇〇b的本體3 可平整地接觸晶片420，而不會影響散熱效果。 乃 圖8為本創作第二實施例之另一種電路板配置的剖面 示意圖。請參照圖8，本實施例之電路板配置4〇〇，，與圖6八 所繪示之電路板配置400,相似，不同的是為了更快速地移 _ 除晶片420的熱，在電路板配置400’’中特別於散熱板片 300b的凹陷部316以及晶片420之間配置一熱擴散板 430。當然，此熱擴散板430也同樣可以應用於第一實施例 之電路板配置400中。 雖然在散熱板片300b中，第一懸臂322,與第二懸臂 324’平行，且第三懸臂332’與第四懸臂334,平行，但在本 創作中並不限定第一懸臂322’需與第二懸臂324,平行，且 第三懸臂332,需與第四懸臂334,平行。請參照以下說明。 _ 圖9是本發明另一實施例之散熱板片的立體示意圖。 請參照圖6B與圖9,本實施例散熱板片300c與圖6B所繪 示之散熱板片300b的不同處在於改變固定端320”及330，， 之形狀以減少散熱板片300c在基板410上所佔之面積，其 中散熱板片300c之第一固定端320”的第一懸臂322”與第 二懸臂324”不平行，且第二固定端330”的第三懸臂332” 與第四懸臂334”不平行。其中，第一懸臂322”及第二懸臂 324”之間的夾角0 1與第三懸臂332”及第四懸臂334”之間M296 soup doc/r has a first end 312 and a second end 314. The first fixed end 32 has a first cantilever 322 and a second cantilever 324, and the first cantilever 322 and the second cantilever 324 are respectively connected to the first end 312 of the body 31Q, and the first fixed end 320 is further formed with a first The keyhole is isolated. The second fixed end 332 has a second cantilever 332 and a fourth cantilever 334, and the third cantilever 332 and the fourth cantilever 334 are respectively connected to the second end 314 of the body 31, and the second fixed end 330 further forms a second Keyhole 336. In addition, the circuit board configuration 400 further includes two locking members 440, which respectively pass through the first locking holes 326 and the second locking holes 336' to lock the heat dissipation plate pieces 3 to the substrate 41. On the locking portion 412. In this embodiment, the fastener 440 is a screw, but is not limited thereto. The body 310 of the above-described heat dissipating sheet 300 has a recessed portion 316 which is recessed toward the wafer 420 (as shown in FIG. 4A), and the area of the heat dissipating sheet 300 may be slightly larger than the area of the wafer 420 to contact the wafer 420 at the recess 316. At this time, the wafer 420 is provided with a larger heat dissipation area, so that the heat of the wafer 420 can be removed more quickly. In addition, the line l of the first lock hole 326 and the second lock hole 336 passes through the recess 316. In addition, the first locking hole 326 and the second locking hole 336 may be symmetrically distributed on both sides of the recessed portion 316. In the present embodiment, the wire L and the first cantilever 322, the second cantilever 324, the third cantilever 332, or the fourth cantilever 334 of the heat sink sheet 300 are not parallel to each other. In other embodiments, the wire L may be parallel to the first cantilever 322, the second cantilever 324, the third cantilever 332, or the fourth cantilever 334 of the heat sink sheet 300, such as the heat sink sheet 300a shown in FIG. In this embodiment, the 9 M296 fiber doc/r local stress applied by the fastener 440 to the heat sink sheet 3 (8) is concentrated on the first cantilever 322, the second cantilever 324, the third cantilever 332, and the fourth cantilever 334, thus The effect of fixing the heat sink sheet 100 to the substrate 200 by using the four wires is the same as in the prior art. In other words, the circuit board configuration 4 of the embodiment can securely fix the heat dissipation plate 300 to the substrate 41 by only two fasteners, without the conventional heat sink 100 (such as Fig. 1A shows a problem in that the axis A is easily deflected against the clock or clockwise. Since the circuit board configuration 400 of the present invention requires only two fasteners 44, the heat dissipation plate 300 can be firmly fixed to the substrate 41, so that the time for locking the locking firmware 440 can be saved, thereby improving the circuit board configuration. The assembly efficiency of the crucible can also save the material cost of the lock 44 。. In addition, the hot plate 300 is applied to the circuit board configuration, and the substrate 41 of the circuit board configuration 400 can be left with more space to assemble other components. The second embodiment is shown in FIG. 6A. 2 is a schematic cross-sectional view of a circuit board configuration of the second embodiment, and FIG. 6B is a perspective view of the heat dissipation plate of FIG. 6A. Referring to FIG. 6A and FIG. 6B simultaneously, different from the first embodiment, the heat dissipation plate 3〇〇b in the circuit board configuration 400′ of the embodiment, the first cantilever 322, the first-cantilever 324′, The third cantilever 332 and the fourth cantilever 334 respectively have a bent portion 322a, so that the first fixed end 320 and the second fixed end 33 are respectively formed into a difference with the body 310. As in the first embodiment, the circuit board configuration 400' of the present embodiment can securely fix the heat sink 300' to the substrate 41A by only two fasteners 44". Fig. 7 is a schematic view showing the bent portion changed to a shape of 10 M296ii9iQ doc/r when the heat dissipation plate of Fig. 6A is fixed to the substrate. Referring to FIG. 7, since the first cantilever 322, the first 324', the third cantilever 332, and the fourth cantilever 334 have a bending 322a, respectively, when the two locking members 440 are locked, the bending is not good. Folding = 322a will be deformed by force, so that the body 3 of the heat sink sheet 3〇〇b can smoothly contact the wafer 420 without affecting the heat dissipation effect. Figure 8 is a cross-sectional view showing another circuit board configuration of the second embodiment of the present invention. Referring to FIG. 8, the circuit board configuration of the present embodiment is similar to the circuit board configuration 400 illustrated in FIG. 6 , except that the heat of the wafer 420 is removed more quickly in the circuit board. A heat diffusion plate 430 is disposed between the recessed portion 316 of the heat dissipation plate piece 300b and the wafer 420 in the configuration 400''. Of course, this heat diffusion plate 430 can also be applied to the circuit board configuration 400 of the first embodiment. In the heat sink sheet 300b, the first cantilever 322 is parallel to the second cantilever 324', and the third cantilever 332' is parallel to the fourth cantilever 334, but the first cantilever 322' is not limited in this creation. The second cantilever 324 is parallel and the third cantilever 332 is parallel to the fourth cantilever 334. Please refer to the following instructions. FIG. 9 is a perspective view of a heat dissipation plate according to another embodiment of the present invention. Referring to FIG. 6B and FIG. 9 , the heat dissipation plate 300 c of the present embodiment is different from the heat dissipation plate 300 b illustrated in FIG. 6B in that the fixed ends 320 ” and 330 are changed to reduce the heat dissipation plate 300 c on the substrate 410 . The area occupied by the first cantilever 322" of the first fixed end 320" of the heat dissipation plate 300c is not parallel with the second cantilever 324", and the third cantilever 332" and the fourth cantilever of the second fixed end 330" 334" is non-parallel. The angle between the first cantilever 322" and the second cantilever 324" and the third cantilever 332" and the fourth cantilever 334"
M296S^t0d〇〇/r 的夾角0 2例如是相等。 值得注意的是，力：结 ^ ^ 在乐一貫施例中所提到的散熱板片 300、300a(如圖 4B 愈 fi < 〜 . 共圖5所示）之第一懸臂322與第二縣 臂324亦可不平行，曰货一 # 心 且昂二懸臂332與第四懸臂334亦可 、 仪^者在芩照圖9之說明後當可自行推 演’在此不另以圖式說明。 “上所述’由於料散熱板片的部分應力會集中在各 固懸臂此只要使用兩個鎖固件來將散熱板片 鎖固於基 =上’便ι達到使用四個鎖固件鎖固散熱板片之功效。此 外’因為僅需使用兩個鎖固件便能將散熱板片穩固地鎖固 於基板亡HI此不僅可節省電路板的組裝工時及基板上的 f間:還可節省鎖固件的材料成本。另外，在第二實施例 /¾鎖II件料散熱板片的力量不同時，彎折部會發生 形交’使散熱板>j的本體不會傾斜，所以凹陷部仍可平整 地與晶片接觸，而不會影響散熱效果。 正 雖然本創作已以較佳實施例揭露如上，然其並非用以 限定本創作，任何熟習此技藝者，在不脫離本創作之精神 ，内’當可作些許之更動與潤飾，因此本創作之保護 乾圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 ~ 圖1A為習知-種散熱板片鎖固於基板上的上視圖。 圖1B為圖1A之1-1，線的剖面示意圖。 圖2為圖1B之散熱板片受力不均而傾斜的示意圖。 圖3為習知另一種散熱板片鎖固於基板上的上視圖。 12 M296i§69ftdoc/r 圖4A為本創作第一實施例之電路板配置的剖面示意 圖。 圖4B為圖4A之散熱板片的立體圖。 圖5為本創作第一實施例另一種散熱板片的示意圖。 圖6A為本創作第二實施例之電路板配置的剖面示意 圖。 圖6B為圖6A之散熱板片的立體示意圖。 圖7為圖6A之散熱板片固定於基板上時，彎折部變 形的+意圖。 圖8為本創作第二實施例之另一種電路板配置的剖面 示意圖。 圖9為本創作另一實施例之散熱板片的立體示意圖。 【主要元件符號說明】 100、100’ ：散熱板片 110 :本體 112 :凹陷部 120、120’ ：鎖附部 122、122’ ：鎖孔 300、300a、300b、300c :散熱板片 310:本體 312 :第一端 314 :第二端 316 :凹陷部 320、320’、320” ：第一固定端 13 M296^tftdoc/r 322、 •322, 、322” ： 第 — 懸臂 324、 ‘324, 、324，，： 第 二 懸臂 326 第一 鎖孔 330、 •330, 、330” ： 第 二 固定端 332、 、332, 、332” ： 第 三 懸臂 334、 •334, 、334” ： 第 四 懸臂 336 ： :第二鎖孔 400、 ‘400, :電路板配 置 410 ： :基板 412 ： :鎖固部 420 ： 晶片 430 : :熱擴散板 440 ： :鎖固件The angle 0 2 of M296S^t0d〇〇/r is equal, for example. It is worth noting that the force: knot ^ ^ the first cantilever 322 and the second of the heat dissipation plate 300, 300a (as shown in Fig. 4B, Fig. 4B) The county arm 324 may also be non-parallel, and the goods may be arbitrarily placed on the heart and the second cantilever 332 and the fourth cantilever 334 may also be deduced by the instrument after the description of FIG. 9 'which is not illustrated here. "Because of the above", due to the partial stress of the heat sink plate, it will concentrate on each fixed arm. This is as long as two fasteners are used to lock the heat sink plate to the base = upper one, so that the four locks are used to lock the heat sink. The effect of the film. In addition, because only two locks are needed, the heat sink plate can be firmly locked to the substrate. This not only saves the assembly time of the board and the f between the boards: it also saves the lock In addition, when the strength of the second embodiment/3⁄4 lock II material heat dissipation plate is different, the bending portion may be shaped to make the body of the heat dissipation plate >j not tilt, so the concave portion can still be It is in contact with the wafer in a smooth manner without affecting the heat dissipation effect. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention, and anyone skilled in the art can not deviate from the spirit of the present invention. 'When a little change and retouching can be made, the protection of this creation is defined by the scope of the patent application attached to it. [Simplified illustration] ~ Figure 1A is a conventional heat sink plate lock Upper view on the substrate. 1B is a cross-sectional view of the line 1-1 of Fig. 1A. Fig. 2 is a schematic view showing the heat sink sheet of Fig. 1B tilted unevenly. Fig. 3 is a top view of another conventional heat sink sheet locked on a substrate. 12 M296i§69ftdoc/r Figure 4A is a schematic cross-sectional view showing the configuration of the circuit board of the first embodiment of the present invention. Figure 4B is a perspective view of the heat dissipation plate of Figure 4A. Figure 5 is another heat dissipation plate of the first embodiment of the present invention. Figure 6A is a schematic cross-sectional view showing the arrangement of the circuit board of the second embodiment of the present invention. Figure 6B is a perspective view of the heat dissipation plate of Figure 6A. Figure 7 is a perspective view of the heat dissipation plate of Figure 6A when it is fixed on the substrate. Fig. 8 is a schematic cross-sectional view showing another configuration of a circuit board according to a second embodiment of the present invention. Fig. 9 is a perspective view showing a heat dissipating plate according to another embodiment of the present invention. 100': heat sink sheet 110: body 112: recessed portions 120, 120': lock portions 122, 122': lock holes 300, 300a, 300b, 300c: heat sink sheet 310: body 312: first end 314: Two ends 316: recesses 320, 320', 320": first Fixed end 13 M296^tftdoc/r 322, •322, 322": first - cantilever 324, '324, 324,,: second cantilever 326 first locking hole 330, •330, 330": second fixed Ends 332, 332, 332": third cantilever 334, • 334, 334": fourth cantilever 336: : second keyhole 400, '400, : circuit board configuration 410: : substrate 412 : : locking Portion 420: Wafer 430: : Thermal Diffuser 440 : : Locking Firmware
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