’M352241 ~ 八、新型說明： 【新型所屬之技術領域】 本創作涉及-種絲將散熱片固定於晶片_扣具結構。 【先前技術】 散熱模組是普遍被使黯諸如電腦主機等具有熱源的設備，藉以 將熱量排除，以避免對電子元件造成損壞。—般電腦的晶片包（包括 脱、QFP及晴），姐動運算時會產生高溫，若不能將其及時排 除’則會影響其性能，甚至燒毁，尤其運算速度愈快之晶片组所產生 之熱量愈高’其影響更為顯著；因此，任何電腦主機均必須設有散埶 裝置以排除晶片組所產生之熱量。 ‘”、 敬·連异迷度較快之晶片組均有散熱裝置設計，主要係直接 ，晶片組上設置具有複數則之散糾，甚至在該散糾上設置風 羽’遠晶片組運异時所產生之大部份熱量乃由散熱片所吸收，而曰片 組在運算的同時啟動風扇運轉而吹襲散熱片，以__作用。曰曰 =麟散熱版合料方式，主妓_金屬彈片將散 ;扣_晶片基座（俗稱贿ΕΤ )(如台灣_衫_ 號）。然而，傳統用以將散熱片扣固於晶片組之金屬彈片 雜，組絲祕，製造成本較高，且料彈性疲乏，使得電腦運 ，卸貨:容易因振動而脫落，若操作不慎以致於施力過大二很容： 每及财且脆弱的晶片組’m纟且與主機板之結合沒有 _) ’而雜BG A基座或直接烊上時，則根本沒有任何= 5 M352241 ' 可扣住彈片。 -般的晶片組接腳焊接設於主機板上時，該晶片組與主機板之間 僅、、、勺0. 25mm回度’由於空間十分有限，故之前從未有任何廠商思考如 =利用孩限的空間去改良晶#的散熱問題，而是僅_黏膠把散熱 膠布貼於散熱>{底部再黏貼於晶片上面，献以螺絲鎖於主機板（如 σ灣專利公告第257346號）；但由於膠布遇高溫後極易老化而脫落， 口而有薇商4主機板製造商在主機板上預留孔位以便用螺制定，其 籲效果軸較散熱膠布佳，但翻孔位乃有實際_難，因為並非每種 、、泉路饰局均能如願，且麟每家主機板製造商均航合顧孔位，又 其組裝成本高且費時，因而_螺絲孔於主機板上與上述型式之散熱 片之流通性實有困難。 因此，台灣專利申請第87217790號乃針對上述傳統晶片組與散熱 片在組裝上所具有之缺失加以改良，使其能適麟任何型式之主機板 裝設。該前專利案所提供的散熱片固定座係在中央設有一洞孔，其下 _各^邊刀別向下延设有一側板（共有四個侧板），並於側板分別設 有朝向内側之扣名句；使散熱片由下往上穿過該固定座之洞孔，並使散 熱片之板體擋住於細孔之邊緣，再使該固定座之扣鉤迫合扣住該晶 片組之相對二側邊緣，職止散熱片與固定座之間滑動而能組合固定。 雖然前述鱗利案的gj定座可將散制與晶肢結合狀，但由 於散熱片在製造過程中難免有些言吳差，以致於造成其底面並非十分平 ^因而在與晶片接觸時仍然無法完全密切地貼合，造成晶片所產生 的熱里無法快速地傳導至散熱片而影響散熱效率。再者，由於該前專 6 M3 52241 並組裝了更多的零件；然而，根據JEDC設計規範，設於pCB上的晶片 四周應保留各約3刪的淨空空間，以防止電訊相互干擾，以及線路承 载過密造成電路發熱，但在無錄空間情況下，好零組件只好 越來越接i〇GA晶片基底四周，因此，台灣專利M32996H虎之扣具上 的擔柱或擔片，便容易干涉而把扣具的矩形框體撐高，造成散熱片無 法緊貼在晶>；之上，或散熱片與扣具產生滑動情形。 魯【新型内容】 本創作的目的，在於解決台灣專利M32996〇號，其用來將散熱片 口疋於曰曰片組的扣具所没的擔柱或擔片，容易干涉而把扣具的矩形框 體擔回‘致政熱片無法緊貼在晶片之上，或散熱片與扣具產生滑動 的問題。 本創作的特徵，是去除習知扣具設於側邊的擋柱或擋片，而在扣 具的相對兩側設置同時具備壓掣與阻擋作用的第二側板，使得散熱片 _被扣具©定於晶片組時’能同時细扣具將晶片組阻奴位，進而獲 得有效的緊貼及固位效果。 基於此，本創作對於該扣具的技術手段，係設有一矩形框體，該 矩形框體的相對兩側分別向下垂直延設有一下端内側具有扣鉤的第一 側板，以及在該矩形框體的另外相對兩側設有至少一個向下垂直延伸 的第二侧板，該矩形框體的内徑相對兩側還設有水平延伸的彈性臂， 娜性臂設有往下方延伸的柱體；當散熱片被放置於晶片組上時，可 以將該扣具置於該散熱片上，並使扣具的兩扣鉤扣於該晶片組的主機 8 M3 52241 板相對兩侧邊，同時使兩侧的第二侧板壓掣於該晶片組上並且形成阻 擋作用，以及使彈性臂的枉體壓迫於該散熱片的基座上面，得以避免 散熱片與晶片組相對移位。 本創作設於扣具兩側的第二側板’可以是板狀，也可以是柱狀體。 【實施方式】 - 以下配合圖式對本創作的實施例做更詳細的說明，俾使任何熟習 鲁該項技藝者在研讀本專利說明書後能據以實施。 參第一圖與第五圖，本創作提供之散熱片扣具1,具有一矩形框 體ίο’該矩形框體ίο的相對兩側分別向下垂直延設有一第一側板η， 且該第一側板η的下邊内側設有扣鉤lu，該矩形框體1〇的另外相 對兩侧分別向下垂直延設有一第二側板12，該第二側板12的内侧角 端形成有斜邊12卜該斜邊m係對應下述晶片組3之晶片31周邊的 斜面311 ’虽然，该第二侧板π的内側角端亦可以不設置所述斜邊， ♦而設為直肖·，料’該娜鋪1G内徑的姉關設有水平延伸的彈 性漳13 ’該彈性臂13的自由端設有往下方延伸的柱體ι31 〇 —般用來將晶片組3所產生的熱量排除的散熱元件是如第一圖所 π的政熱>} 2 ’韻熱# 2可以是-種轉型的導熱及散熱元件，其 具有形成於基座20上面的複數彼此平行的轉片.所述晶片組3， 係晶片31與主機板32 $ έ士人乂么4* d λ U & #‘B G Α基座，或直接焊接Μ合，且 該晶片31的周緣形成有斜面311。 參閱第一、三、四圖所示，本創作所提供的前述散熱片扣具卜 M3 52241 :將政熱片2m定於晶片组3的組合方式’是直接將散熱片2放置於 、3上面，使得晶片31接觸於散熱片2之基座20底面，然後將 ^具1套於散熱片2上，使扣具（兩第一側板21的扣釣2ιι扣於晶片 、=3的主機板32相對兩邊緣’同時利用兩第二侧板12下端與斜邊121 轉於主機板32及晶片31的斜面311，讓晶片組3無法和散熱片2 產生相對滑動；此外，當扣具丨扣固於晶片組3的同時，其柱體i3i 則壓迫於散熱片2的基座2G上面，使得彈性臂13適當地彈性變形， #更藉此將彈性臂13的彈力透過柱體⑶施加於散熱片2上，讓散熱片 2與晶片31轉持密合狀態。 、々第六_示本創作之散熱片扣具的另—實施例，是將其位於兩側 的第二側板12，分職為複數個方形柱體，該兩側的方形柱體下端内 側緣形成如前所述的斜邊m，或是形成為直角職。第七圖 則,，、頁不本創作之散熱片扣具，其位於兩側的第二侧板U係設為圓柱 =’U將錄熱❻具扣合於晶片組時，糊該些柱狀體形態的 •第二側板對晶片組產生麗掣定位的效果。 M上所述者僅為肋轉本創作之健實補，鱗企圖據以對 本創作作任何形式上之限制，是以，凡有在相同之創作精神下所作有 關本創作之任何料或變更，皆減包括在賴作意圖轉之範 M352241 【圖式簡單說明】 第一圖為顯示本創作之主要元件組合關係之立體分解圖。 第二圖為顯示第一圖之元件組合後之狀態之立體圖。 第三圖為沿第二圖之A-A割線的平面剖視圖。 第四圖為沿第二圖之B-B割線的平面剖視圖。 第五圖為顯示第四圖之元件組合關係的平面剖視分解圖。 .第六®為顯示本創作之散刻扣具’其第二側板為複數方形柱狀體之 鲁實施例立體圖。 第七圖為顯示本創作之散熱片扣具，其第二側板為複數圓柱體之實施 例立體圖。 、 【主要元件符號說明】 1···· ·.扣具 10- …矩形框體 • ll·.. …第一側板 "111· .....扣鉤 12- …第二側板 121. •…·斜邊 13… …彈性臂 131· …··柱體 2…· ••散熱片 20… …基座 M3 52241 21......魚耆片 3......晶片組 31......晶片 311"·..斜面 32......主機板</M352241 ~ VIII, new description: [New technical field] This creation involves the fixing of the heat sink to the wafer _ buckle structure. [Prior Art] A heat dissipating module is generally used as a heat source device such as a computer main body to remove heat to avoid damage to electronic components. General computer chip package (including off, QFP and sunny), the high temperature generated by the sister operation, if it can not be eliminated in time, it will affect its performance, even burned, especially the faster the faster operation of the chipset The higher the heat, the more significant the impact; therefore, any computer host must have a dilation device to eliminate the heat generated by the chipset. '', 敬································································································· Most of the heat generated by the heat sink is absorbed by the heat sink, and the scorpion group starts the fan operation and blows the heat sink at the same time as the operation, so as to act as a __. The metal shrapnel will be scattered; the buckle _ wafer base (commonly known as bribe ΕΤ) (such as Taiwan _ _ _ _). However, the traditional use of the heat sink to the chipset of the metal shrapnel miscellaneous, group silk secret, high manufacturing costs And the elasticity of the material is too tired, so that the computer is shipped, unloading: it is easy to fall off due to vibration. If the operation is careless, the force is too large. The chipset of each and every fragile is 'm纟 and the combination with the motherboard is not _ 'When the hybrid BG A base is directly attached, there is no = 5 M352241 ' can hold the shrapnel. - When the chip set is soldered on the motherboard, between the chipset and the motherboard Only, ,, spoon, 0. 25mm, the degree of return 'Because the space is very limited, so before No manufacturer has thought about using the space of the child to improve the heat dissipation problem of the crystal #, but only the adhesive tape is applied to the heat sink. For example, σ Bay Patent Announcement No. 257346); however, because the tape is easily aging due to high temperature, the manufacturer has a hole in the motherboard to make a hole in the motherboard for the purpose of using the screw. The heat-dissipating adhesive tape is good, but the turning hole is practical _ difficult, because not every one, the spring road decoration bureau can achieve the wish, and each of the motherboard manufacturers of the Lin is able to meet the hole position, and its assembly cost is high and time-consuming. Therefore, the screw hole is difficult to flow on the motherboard and the heat sink of the above type. Therefore, Taiwan Patent Application No. 87217790 improves the assembly of the conventional wafer set and the heat sink. It can be equipped with any type of main board. The heat sink fixing seat provided in the prior patent has a hole in the center, and the lower side of each side has a side plate (four sides) Board), and on the side panel Having a buckle toward the inner side; the fin is passed through the hole of the fixing seat from bottom to top, and the plate of the heat sink is blocked at the edge of the hole, and then the hook of the fixing seat is forced to buckle The opposite side edges of the wafer set can be combined and fixed by sliding between the heat sink and the fixed seat. Although the gj seat of the aforementioned scale can combine the bulk with the crystal limb, the heat sink is in the manufacturing process. It is inevitable that there is some difference, so that the bottom surface is not very flat. Therefore, it cannot be completely closely attached when it is in contact with the wafer, so that the heat generated by the wafer cannot be quickly transmitted to the heat sink and affects the heat dissipation efficiency. Because of the pre-special 6 M3 52241 and assembled more parts; however, according to the JEDC design specification, each of the wafers placed on the pCB should retain about 3 blank space to prevent mutual interference of telecommunication, and line bearing Excessive density causes the circuit to heat up, but in the case of no recording space, good components have to be connected more and more around the base of the i〇GA wafer. Therefore, the load-bearing or supporting sheet on the Taiwanese patent M32996H tiger buckle is easy. BUCKLE involved and the rectangular frame stays high, resulting in close contact with the heat sink on the crystal can not >;, or the heat sink and the clip slip case. Lu [New Content] The purpose of this creation is to solve the Taiwan patent M32996 nickname, which is used to place the heat sink on the struts of the cymbal group. The frame is responsible for the problem that the heat film cannot be placed on the wafer or the heat sink and the buckle are slipped. The feature of the present invention is to remove the retaining bar or the baffle provided on the side of the conventional buckle, and to provide the second side plate with the pressing and blocking functions on the opposite sides of the buckle, so that the heat sink _ is buckled © When it is set in the chipset, it can be used to pinch the chipset at the same time to obtain an effective adhesion and retention effect. Based on this, the technical means of the clip is provided with a rectangular frame body, and opposite sides of the rectangular frame body are vertically extended downwardly with a first side plate having a hook on the inner side of the lower end, and the rectangular frame is The other opposite sides of the body are provided with at least one second side plate extending vertically downwards, the rectangular frame body further having horizontally extending elastic arms on opposite sides of the inner diameter, and the narcotic arm is provided with a column extending downward When the heat sink is placed on the chip set, the buckle can be placed on the heat sink, and the two hooks of the buckle are fastened to the opposite sides of the host 8 M3 52241 of the chip set, and two The second side panel of the side is pressed against the wafer set and forms a barrier, and the body of the resilient arm is pressed against the base of the heat sink to avoid relative displacement of the heat sink and the wafer set. The second side panel 's provided on both sides of the buckle may be a plate shape or a columnar body. [Embodiment] - The embodiment of the present invention will be described in more detail below with reference to the drawings, so that any skilled person can implement the patent specification after studying the patent specification. Referring to the first and fifth figures, the heat sink clip 1 provided by the present invention has a rectangular frame ίο', and opposite sides of the rectangular frame ίο are respectively vertically extended with a first side plate η, and the first A buckle hook lu is disposed on the inner side of the lower side of the one side panel η, and a second side panel 12 is vertically extended from the opposite sides of the rectangular frame body ,, and the inner side corner end of the second side panel 12 is formed with a beveled edge 12 The oblique side m corresponds to the inclined surface 311 ' around the wafer 31 of the wafer group 3 described below. Although the inner corner end of the second side plate π may not be provided with the oblique side, ♦ The inner diameter of the 1G inner diameter is provided with a horizontally extending elastic cymbal 13'. The free end of the elastic arm 13 is provided with a column ι31 延伸 extending downward to remove the heat generated by the wafer group 3 The element is a thermal heat as in the first figure gt;} 2 'the rhyme heat # 2 may be a type of thermally conductive and heat dissipating element having a plurality of rotating fins formed on the susceptor 20 in parallel with each other. Group 3, system wafer 31 and motherboard 32 $ έ士人乂 4* d λ U &#'BG Α pedestal, or direct soldering The bonding is performed, and a peripheral surface of the wafer 31 is formed with a slope 311. Referring to the first, third, and fourth figures, the above-mentioned heat sink clip provided by the present invention is M3 52241: the combination of the hot sheet 2m in the wafer set 3 is to directly place the heat sink 2 on the 3 The wafer 31 is brought into contact with the bottom surface of the base 20 of the heat sink 2, and then the fixture 1 is placed on the heat sink 2, so that the buckles (the buckles of the two first side panels 21 are fastened to the wafer, and the motherboard 32 of the =3) The opposite sides ′ simultaneously use the lower ends of the second side plates 12 and the oblique sides 121 to turn to the inclined faces 311 of the motherboard 32 and the wafer 31, so that the wafer set 3 cannot slide relative to the heat sink 2; in addition, when the buckles are buckled At the same time as the wafer set 3, the cylinder i3i is pressed against the base 2G of the heat sink 2, so that the elastic arm 13 is appropriately elastically deformed, thereby further applying the elastic force of the elastic arm 13 to the heat sink through the cylinder (3). 2, the heat sink 2 and the wafer 31 are brought into close contact with each other. 々 sixth embodiment of the heat sink clip of the present invention is a second side panel 12 on both sides, divided into a plurality of square cylinders, the inner edge of the lower end of the square cylinder on the two sides forming the oblique side m as described above, or It becomes a right-angled position. The seventh picture, the page is not created by the heat sink clip, the second side plate U on both sides is set to the cylinder = 'U when the heat-receiving cooker is fastened to the wafer set, The effect of the second side plate of the columnar shape on the wafer set produces a sharp positioning effect. The above description is only a solid complement to the rib transfer, and the scale attempt is to impose any form restrictions on the creation. Therefore, any material or change related to this creation made under the same creative spirit is reduced to include the intention of turning to the M352241. [Simplified illustration] The first picture shows the main components of this creation. The second figure is a perspective view showing the state of the combination of the elements of the first figure. The third figure is a plan sectional view taken along the line AA of the second figure. The fourth picture is the sec secant along the BB of the second figure. The fifth figure is a plan sectional exploded view showing the combination relationship of the components of the fourth figure. The sixth embodiment is a diagram showing the engraved fastener of the present invention whose second side plate is a plurality of square columns. The third picture shows the creation of this Hot plate fastener, the second side plate is a perspective view of an embodiment of a plurality of cylinders. [The main component symbol description] 1···· ·.. buckle 10 - ... rectangular frame body • ll ·.. ... first side plate " ; 111· ..... clasp 12- ... second side plate 121. •...·beveled edge 13......elastic arm 131·...·column 2...·••heat sink 20...but base M3 52241 21 ...... fish fillet 3... chip set 31... wafer 311"·.. bevel 32... motherboard