M329960 -八、新型說明： 【新型所屬之技術領域】 本創作涉及-種用於將散熱片固定於晶片上的扣具，特別是一種 更能確健扣具完全扣合於以騎構設計。 【先前技術】 -習知《的晶片組（包括BGA、QFP及cpu等），在啟動運算 日、、會產^溫’若不能將其及時排除，則會影響其性能，甚至燒毀， 尤其運算速度愈快之晶片組所產生之熱量愈高，其影響更為顯著；因 此，任何電駐機均必須設有散熱裝置以排除晶片組所產生之轨量。 -般對於運魏度錄之^有散餘置财，主要係直接在 晶片組上設置具有複數則之散糾，甚至於該散熱片上設置風扇， 該晶片崎算時所產生之大部份熱量乃由該散刻所吸收，而該晶片 組在運异時同時啟動風扇運轉而吹襲散熱片而達到散熱作用。 較早期將散熱片組合料片組上之方式，主要係·金屬彈片將散 熱片扣固於晶片基座（俗稱s〇CKET)(如中華民國專利公告第3麵7 號）。然而’傳統用以將散熱片扣固於晶片組之金屬彈片结構較為複 雜，組裝時較不便’製造成本較高，錄易雜疲乏，使得電腦在運 輸起卸貨時容易因振動而脫落’若操作不慎以致於施力過大時即很容 易傷及精密且脆弱的晶片組；若是晶片組與主機板之結合沒有基座 (SOCKET )’而係採BG A基座或直接焊上時，則根本沒有任何地方 可扣住彈片。 M329960 -一般的晶片組接崎接設於主機板上時，該晶片組與主機板之間僅 約0.25mm高度，由於空料分有限，故讀從未有任何廠商思考如何 _該有限的空間去改良晶片的散熱問題，岐僅採用黏膠式把散熱 膠布貼於散熱>;底部再黏於晶片上面，或是以螺絲鎖於主機板（如中 2民國補公舍第257346號）；但由於膠布遇S溫後極易老化而脫 :’因而乃有廠商請主機婦造商在域板上_孔位贱用螺絲固 疋:其效果雖然較散熱膠布佳，但預留孔位乃有實際的困難，因為並 |非每種線路佈局均能如願，且並非每家主機板製造商均能配合預留孔 位’又其組裝成本高且費時，因而預留螺絲孔於主機板上與上述型式 之散熱片之流通性實有困難。 /此’中華關中請第87217射請案乃針對上述傳統晶片組 與散熱片在組裝上所具有之缺失加以改良，使其能適用於任何型式之 主機板裝設。該前專利案所提供的散熱片固定座係在中央設有一洞 孔’其下面各端邊分別向下延設有一侧板（财四侧板），並於侧 板刀別叹有朝向内側之扣鉤；使散熱片由下往上穿過該固定座之洞 =，並使散熱片之板體擋住於該洞孔之邊緣，再使棚定座之扣釣迫 合扣住該晶片組之相對二侧邊緣，以防止散熱片與固定座之間滑動而 能組合固定。 雖然前述前專職_定座可將散熱片與晶片做結合固定，但由於 2熱片在製成過程中難免有些誤差，以致於造成其底面並非十分平 整’因而在與晶片接觸時健無法完全密切地貼合，造成晶片所產生 的熱量無法快速地傳導至散熱片而影響散熱效率。再者，由於該前專 M329960 •利案的固定座在四邊均設有側板，但僅藉由其中的相對兩侧板扣住晶 片的兩侧邊且同時阻擋散熱片的兩邊，其餘的兩邊則跨在散熱片上 面，故必須在散熱片上的鰭片開設横貫兩側的槽道，以供該相對的兩 侧板跨置在該槽道内；但是，又由於該固定座的四側板均為相同高度， 以致於在組裝散熱片與固定座時，必須在該散熱片的槽道上先開設能 '讓侧板穿過的槽孔，使得具有扣鉤的側板扣住晶片的兩側時，亦同時 -讓另外兩側板穿過該槽孔而將固定座完全地與散熱片組合。但如此一 籲來，散熱片在開設槽孔後將會減少傳熱面積，因而降低散熱效果。 中華民國公告第880248號專利案所提供的設計則是針對前述的缺 失加以改良者，其結構如第九圖所示，包括有一矩形框體丨，該矩形 框體的相對兩侧下方分別向下垂直延設有一侧板u，該二侧板的相對 内侧面下邊分別形成有二個突出的扣鉤111，該矩形框體的另外相對 兩侧的下方分勘下延設有雜，又霞矩雜體的_設有複數 彈性桿，轉性桿的下方設有突部。在組麟，係將散熱片的鰭片由 •下在上穿過該矩形框體的洞孔，再使該矩形框體相對二侧之扣釣迫合 扣住曰曰片組之相對二側雜，而該些凸柱則穿過預先鑽設於散熱片之 牙孔’並使轉性桿下方的突部壓掣於散熱片上而固定。 【新型内容】 則述A告第88G248號專利案的缺點在於：其設在矩形框體相對兩 側之扣鉤共有四個，因此，在安裝時，該些扣釣很容易和周邊的電子 牛產生干#或因組t時壓力的問題而造成「假扣」，亦即沒有將所 M329960 -有扣鉤均完成扣固。因此，本創 88_號專利案的扣具所存在的缺失。的即在於解決該公告第 亀，梅嚼亀_糊境而改變 -0=Γ 側的位置，使在利用扣具將散熱片安裝於晶片組 …避免扣鱗騎的電子元件造成干涉與假扣的問題。 '基於此，本創作所提供之散熱片扣具，其具有-矩形框體，該矩 -形框體的相對兩側下方分別向下垂直延設有一侧板，該二側板的相對 内側面下邊分卿成有突㈣扣釣，該扣鉤可以在該二侧板的下邊對 稱位置或對角位置分別設置—個，也可以在—側板設置—個扣釣，而 另-側板設置二個扣鉤，使三個扣鉤從俯視投影面上呈等腰三角形； 該矩形框_另外姆_的下方分勘下有凸柱又於該矩形 框體的内儀設核數雜桿’該雅桿的下方設有突部，藉由前述 的扣具結構，其在進行扣固操作時更能確保完全扣合。 •【實施方式】 以下配合圖式對本創作的實施例做更詳細的說明，俾使任何熟習 該項技藝者在研讀本專利說明書後能據以實施。 如第一圖及第二圖所示，本創作所提供之散熱片扣具，其中一實 施例的結構包括有一矩形框體1，該矩形框體1中央形成有一矩形洞 孔10，該矩形框體1的相對兩侧分別向下垂直延設有一側板Η，其中 一側板的下邊設置一個扣鉤111，另一側板的下邊設置二個扣鉤111， 該三個扣鉤111在所述矩形框體1的俯視投影平面上呈等腰三角形分 M329960 _佈（如第三圖所示）。該矩形框體的另外相對兩側的下方分別向下延設 有圓形的凸柱12 ’且該凸柱12的長度不短於上述侧板u的高度，又 於該矩形框__壁設錢數彈性桿13，該彈性桿13的下=設有 突部m。在本創作的實施例中’該彈性桿13係設於未設置侧板“ 的矩形框體1另外相對兩内側邊，且使該彈性桿13垂直於該洞孔 -的内侧壁。 如第四圖所示，本創作，用以配合在本創作之扣具之散熱片2係 •設有-較上述洞孔1〇為大的矩形板體2卜該板體21上面延設有複數 鰭片22，該鰭片22並切割出有可容納扣具之矩形框體Ί £度的槽道 24。另外，一般的晶片組3係組裝於電路板4上，由於焊接在電路板 4上之晶片組3接腳具有一定高度（約〇25刪），因而使得該晶片組 3與電路板4之間具有適當高度之空間（〇 25mm );在組裝時，只要 將散熱片2的鰭片由下往上穿過矩形框體丨之洞孔1〇，並使散熱片2 之板體21播住於該洞孔之邊緣，再使該矩形框體丨相對二側之扣 •鉤111迫合扣住該晶片組3之相對二側邊緣3卜而該些凸柱12則穿 過預先鑽設於散熱片2之槽道24上之穿孔23，並使該彈性桿13下方 的犬部131 >1掣於散熱片2上即可快速地組合固定（如第五圖及第六 圖所不），相反地’當欲卸下散熱片2時，則只要將矩雜體j往上 施力拔起，以令扣鉤111脫離對晶片組3之卡掣即可。 第七_顯示本創作扣具的另—實關，其結構基本上相同於第 -圖及第二圖所示的實補，惟，第七_示的實施例僅包含有二個 扣鉤111，該二個扣鉤11丨分別設於該矩形框體丨兩二側板的中央相 M329960 .對稱的位置。 第八圖為顯示本創作扣具的再—實施例，其結構基本上相同於第 -圖、第二圖及第七圖所示的實施例，惟，第八圖所示包含有二個扣 鉤111的實施例，是將結合於兩侧板u的二個扣釣⑴分別設於該矩 形框體1的對角位置。 ’本創作可贿各種餘模⑽要絲的環境預先設計該些扣釣的 -分佈位置’崎供選取使用，避免安斜對其它電子元件造成干涉； #且藉由前述矩雜體兩侧總數為二個或三個扣釣的設計，使得矩形框 體在組扣於晶片時，能盡可祕將各個扣釣ln完全地扣住晶片邊 緣’因為-旦有一個扣鉤未能扣固時，安裝者可以輕易地感覺到搖晃， 從而再將其穩固地安裝。 以上所述者僅為用以解釋本創狀較佳實施例，並非企圖據以對 本創作作任何形壯之_，是以，凡有在相同之_精神下所作有 關本創作之任何修飾或變更，皆仍應包括在本創作意圖保護之範轉。 M329960 -【圖式簡單說明】 =一圖為顯示本創作扣具之第—實施靖構之第一角 示摘作扣具結構之第二角度立體圖。體圖。 角开 三姊敗扣具，其，分佈呈等腰三 ，=為顯顺^簡散熱歸編以實施例立體 t為顯糊叙扣具晴賴⑽觸欧第-平面動 t圖為顯示本創作之扣具將散熱版合完成於^組之平面示意 ==為為_本_扣具之第二實施繼構之域圖。 ^麵顯示賴作扣具之第三魏織構之立體圖。 -體圖 圖為顯示習知扣具結構之立， 【主要元件符號說明】 洞孔 1〜〜矩形框體 10······ 側板 11...... 111······ 扣釣 12······13...... 凸柱彈性桿 M329960 .131……突部 2……散熱片 21……板體 22……鰭片 23……穿孔 24……槽道 3 ......晶片組 φ 31……邊緣 4 ......電路板M329960 - VIII, new description: [New technical field] This creation involves a kind of fastener for fixing the heat sink on the wafer, especially a more reliable buckle is fully engaged with the ride design. [Prior Art] - The "chipsets (including BGA, QFP, cpu, etc.) that are known to be "on the start of the calculation day, will produce the temperature". If it cannot be eliminated in time, it will affect its performance and even burn, especially the operation. The higher the heat generated by the faster chipset, the more significant the impact; therefore, any electric station must have a heat sink to eliminate the amount of rails generated by the chipset. Generally speaking, there is a surplus of money for the shipment of Wei Du, which is mainly set directly on the chipset with a plurality of entanglements, and even a fan is arranged on the heat sink, and most of the heat generated by the chip is rough. It is absorbed by the scatter, and the chip set simultaneously starts the fan operation to attack the heat sink to achieve heat dissipation. In the earlier way, the heat sink was combined on the chip set, mainly the metal shrapnel to fasten the heat sink to the wafer base (commonly known as s〇CKET) (such as No. 7 of No. 3 of the Republic of China Patent Notice). However, the traditional metal shrapnel used to fasten the heat sink to the chip set is complicated, and it is inconvenient to assemble. The manufacturing cost is high, and the recording is tiring and tired, so that the computer is easily detached due to vibration during transportation and unloading. Inadvertently, when the force is too strong, it is easy to damage the delicate and fragile chip set; if the combination of the chip set and the motherboard does not have a pedestal (SOCKET), and the BG A pedestal is used or directly soldered, it is fundamental. There is no place to hold the shrapnel. M329960 - When the general chipset is connected to the motherboard, the chipset is only about 0.25mm high between the motherboard. Due to the limited amount of empty materials, there has never been any manufacturer to think about how to make this limited space. To improve the heat dissipation problem of the chip, 岐 only use the adhesive type to stick the heat-dissipating adhesive tape to the heat dissipation>; the bottom is then glued to the top of the wafer, or it is screwed to the motherboard (such as Zhong 2, Guoguo Bu Gongshe No. 257346); However, because the tape is easily aging after S temperature, it is removed: 'Therefore, there are manufacturers who ask the host manufacturer to use the screw on the domain board. The effect is better than the heat-dissipating tape, but the hole is reserved. There are practical difficulties, because | and not every line layout can be achieved, and not every motherboard manufacturer can match the reserved hole position' and its assembly cost is high and time-consuming, so the screw hole is reserved on the motherboard It is difficult to communicate with the heat sink of the above type. / This 'China's Zhongguan Zhong, please call the 87217 shot to improve the assembly of the above traditional chipset and heat sink, so that it can be applied to any type of motherboard installation. The heat sink fixing seat provided in the prior patent has a hole in the center, and one side plate is downwardly extended on each of the lower end sides thereof (the side plate of the fourth side), and the side plate knife is sighed to the inner side. a hook; the heat sink is passed through the hole of the fixing seat from bottom to top = and the plate body of the heat sink is blocked at the edge of the hole, and then the buckle of the shed seat is forced to buckle the chip set The two side edges can be combined and fixed to prevent sliding between the heat sink and the fixing seat. Although the aforementioned pre-professional _ seat can be used to fix the heat sink and the wafer, the two hot sheets are inevitably subject to some errors during the manufacturing process, so that the bottom surface is not very flat. Therefore, the contact with the wafer cannot be completely close. The ground bonding causes the heat generated by the wafer to be not quickly transmitted to the heat sink and affects the heat dissipation efficiency. Moreover, since the front seat of the former M329960 • Lee case is provided with side plates on all four sides, only the opposite side plates of the wafer are used to fasten the two sides of the wafer while blocking both sides of the heat sink, and the other two sides are Across the heat sink, the fins on the heat sink must be provided with channels across the two sides for the opposite side plates to straddle the channel; however, since the four side plates of the fixed seat are the same The height is such that when the heat sink and the fixing seat are assembled, the slot through which the side plate can be passed must be opened on the channel of the heat sink, so that when the side plate with the hook is fastened to both sides of the wafer, - Pass the other side plates through the slot to completely integrate the mount with the heat sink. However, as a result, the heat sink will reduce the heat transfer area after opening the slot, thus reducing the heat dissipation effect. The design provided by the Republic of China Announcement No. 880248 is for the improvement of the aforementioned defect. The structure is as shown in the ninth figure, and includes a rectangular frame body, and the opposite sides of the rectangular frame are respectively downwardly downward. A side plate u is vertically extended, and two protruding hooks 111 are respectively formed on the lower sides of the opposite inner side faces of the two side plates, and the lower sides of the opposite sides of the rectangular frame body are divided and arranged, and the haze is arranged. The hybrid _ has a plurality of elastic rods, and a protrusion is provided below the rotating rod. In the group Lin, the fins of the heat sink are passed through the hole of the rectangular frame, and the opposite side of the rectangular frame is buckled to the opposite sides of the set of the cymbal group. Miscellaneous, and the studs are fixed by passing through the holes of the fins pre-drilled in the heat sink and pressing the protrusions under the rotating rod against the fins. [New content] The shortcoming of A. 88G248 is that there are four hooks on opposite sides of the rectangular frame. Therefore, during the installation, the buckles are easy and the surrounding electronic cattle The problem of pressure caused by the dry # or the group t caused a "fake buckle", that is, the M329960 - the hook was not fastened. Therefore, there is a lack of fasteners in the patent application No. 88_. That is to solve the third bulletin of the announcement, the change of the position of the -0=Γ side, so that the heat sink is mounted on the wafer set by the use of the buckle... The problem. Based on this, the heat sink clip provided by the present invention has a rectangular frame body, and a side plate is vertically extended downwardly on opposite sides of the rectangular frame body, and the opposite inner side faces of the two side plates are below The splitting is made into a sudden (four) buckle fishing, and the hooks may be respectively set at the symmetrical position or the diagonal position of the lower side of the two side panels, or may be provided in the side panel - one buckle fishing, and the other side panel is provided with two buckles Hook, so that the three hooks are isosceles triangles from the top view projection surface; the rectangular frame _ other _ below the lower part of the survey has a convex column and the inner frame of the rectangular frame is equipped with a number of miscellaneous rods The lower portion is provided with a protrusion, and by the above-mentioned fastener structure, it is more sure to fully buckle when performing the fastening operation. • [Embodiment] The embodiment of the present invention will be described in more detail below with reference to the drawings, so that any skilled person can implement the patent specification after the study. As shown in the first and second figures, the structure of the heat sink fastener provided by the present invention includes a rectangular frame 1 having a rectangular hole 10 formed in the center thereof, and the rectangular frame is formed. The opposite sides of the body 1 are respectively vertically downwardly provided with one side panel, wherein one side of the one side plate is provided with one hook 111, and the lower side of the other side board is provided with two hooks 111, and the three hooks 111 are in the rectangular frame The plane 1 of the body 1 has an isosceles triangle M329960 _ cloth (as shown in the third figure). A circular protrusion 12 ′ is respectively extended downwardly on the opposite sides of the opposite sides of the rectangular frame body, and the length of the protrusion 12 is not shorter than the height of the side plate u, and is also disposed on the rectangular frame __ The number of the elastic rods 13 is the lower portion of the elastic rods 13 = the projections m are provided. In the embodiment of the present invention, the elastic member 13 is disposed on the opposite side of the rectangular frame 1 in which the side plates are not provided, and the elastic rod 13 is perpendicular to the inner side wall of the hole. As shown in the four figures, this creation is used to match the heat sink 2 of the clip of this creation. • It is provided with a rectangular plate body 2 which is larger than the above-mentioned hole 1 卜. The plate body 21 is provided with a plurality of fins. The sheet 22, the fin 22 is cut out with a channel 24 for accommodating the rectangular frame of the clip. In addition, the general chip set 3 is assembled on the circuit board 4, and is soldered on the circuit board 4. The chipset 3 pin has a certain height (about 删25), so that the wafer set 3 and the circuit board 4 have a suitable height space (〇25mm); when assembling, the fins of the heat sink 2 are Passing up and down through the hole of the rectangular frame, and letting the plate 21 of the heat sink 2 hang on the edge of the hole, and then engaging the rectangular frame with the hooks and hooks 111 on the opposite sides Holding the opposite side edges 3 of the wafer set 3 and the posts 12 pass through the through holes 23 pre-drilled in the channels 24 of the heat sink 2, and The dog portion 131 below the elastic rod 13 can be quickly combined and fixed on the heat sink 2 (as shown in the fifth and sixth figures). Conversely, when the heat sink 2 is to be removed, The mating body j is pulled up upwards to make the hook 111 disengage from the latch of the chip set 3. The seventh_shows the other-reality of the creation buckle, and its structure is basically the same as the first- The figure and the second figure show the actual complement, but the seventh embodiment shows only two hooks 111, and the two hooks 11 are respectively disposed at the center of the two side plates of the rectangular frame. M329960. Symmetrical position. The eighth figure shows a re-embodiment of the present invention, the structure of which is substantially the same as that of the first, second and seventh embodiments, but the eighth figure In the embodiment including the two hooks 111, two buckles (1) combined with the two side plates u are respectively disposed at diagonal positions of the rectangular frame 1. 'This creation can bribe various residual molds (10) The environment is pre-designed for the catch-distribution position of the 'salt supply' to avoid interference with other electronic components; # and by the aforementioned moment The total number of sides of the hybrid is two or three buckles, so that when the rectangular frame is fastened to the wafer, each of the buckles can be fully buckled on the edge of the wafer. When it is not fastened, the installer can easily feel the shaking and then install it securely. The above is only a preferred embodiment for explaining the creation, and it is not intended to make any shape for this creation. Therefore, any modification or modification of the creation made under the same spirit should still be included in the protection of the intention of the creation. M329960 - [Simple diagram] = a picture is displayed The first angle of the creation of the buckle is the second angle perspective view of the buckle structure. The simplified heat is compiled according to the embodiment. The stereoscopic t is the smear of the buckle. The smear of the smear is the same as the plane. The figure shows that the fasteners of this creation will be completed in the plane of the group. _ The second implementation of the buckle is a domain map. The surface shows the perspective view of the third Wei texture of the fastener. - The body diagram is for displaying the structure of the conventional fastener structure. [Description of main component symbols] Hole 1~~Rectangle frame 10······ Side plate 11... 111······ Buckle fishing 12······13... Stud elastic rod M329960 .131...... protruding part 2... heat sink 21... board body 22... fin 23... perforation 24... slot Road 3 ... chip set φ 31 ... edge 4 ... board