JP2001057491A - Heat dissipation device for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat dissipating performance and reduce manufacturing cost with a heat sink consisting a part of a wall of a duct and no gap, by easily and positively installing a CPU and the heat sink on the side wall of a duct disposed in the housing of an electronic apparatus. SOLUTION: A heat dissipating device for an electronic apparatus is provided with a heat sink 10 connected to a CPU 2, frame member 20 for installing thereof, and a square cylindrical duct 30. The frame member 20 is fitted in the heat sink 10, engaging projections 25 and 25 of the frame member 20 are pressed inside and deformed so as to close the both right and left ends of recessed grooves 13 of the heat dissipating substrate 11 to connect the heat sink 10 with the frame member 20, the heat sink 10 and the frame member 20 are fitted with an opening face 31 on the top side face of the square cylindrical duct 30 with the heat dissipating fins 12 inside the duct 30, and engaging hooks 24 of the frame member 20 are engaged with engaging holes 34 of the duct 30. Thus, the heat sink is fixed on the duct 30 via the frame member 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating device for an electronic device which radiates heat generated from a CPU provided in a desktop electronic device to the outside of a housing.

[0002]

2. Description of the Related Art Conventionally, a heat sink made of, for example, aluminum is attached to a CPU device in order to radiate heat generated from a CPU device disposed in a housing of an electronic device to the outside of the housing. As a coupling device of the CPU device and the heat sink, for example, utility model registration No. 3054
No. 704 is known. In the housing, a duct is fitted over a heat sink coupled to the CPU device, but no special fixing is performed.

[0003]

However, in the conventional heat radiating device for electronic equipment, there is a problem that the shape of the fastener for connecting the CPU device and the heat sink is complicated and the mounting strength is low. Further, conventionally, since a fastener is fitted on the heat radiation fin side of the heat sink, there is a problem that the number of heat radiation fins is small and heat radiation performance is inferior. In addition, the duct is simply fitted over the heat sink, and since the heat sink does not form a part of the wall of the duct, there are many gaps between the heat sink and the duct, and wind is sucked from the gap However, there has been a problem that sufficient air does not flow into the heat sink and performance is deteriorated.

An object of the present invention is to solve the above-mentioned problems of the prior art, and a heat sink coupled to a CPU device can be securely attached to a side surface of a duct provided in a housing of an electronic device. Because there is no gap between the heat sink and the duct, a sufficient flow of air flows into the heat sink, so that the heat sink has excellent heat dissipation performance and when the heat sink is attached to the side of the duct. The equipment can be simple,
It is another object of the present invention to provide a heat radiating device for electronic equipment whose manufacturing cost is low.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is a heat radiating device for radiating heat generated from a CPU device provided in a housing of an electronic apparatus to outside the housing. A heat sink coupled to the CPU device and having heat radiation fins, a heat sink mounting frame member to be fitted to the heat radiation substrate of the heat sink, and a heat sink fitting opening disposed at a required location in the housing and on the upper surface. A rectangular grooved duct is provided, and a concave groove extending in the left and right direction is provided on the heat sink of the heat sink, and the left and right ends of the concave groove of the heat sink are provided on the upper edges of the left and right side walls of the mounting frame member. Engaging projections for closing are provided in an upwardly projecting shape, and engaging claws are provided on one of the left and right side walls of the mounting frame member and the left and right side walls of the duct opening opposed thereto. The other end is provided with an engagement hole for fitting an engagement claw, the mounting frame member is fitted to the heat sink, and the engagement projections on the upper edges of the left and right side walls of the mounting frame member are With the left and right ends of the concave groove of the heat sink heat-dissipating board closed, each is pushed inward and deformed, and a part of the engaging protrusion enters the left and right ends of the concave groove,
A heat sink and a mounting frame-like member are fitted into openings on the upper side surface of the rectangular tubular duct with radiation fins inside the duct, and left and right side walls of the mounting frame-like member and a duct opening facing the left and right sides thereof. It is characterized in that the engaging claw of the wall portion and the engaging hole are engaged with each other, and the heat sink is fixed to the duct via the mounting frame member.

Further, a heat radiating device for electronic equipment according to the present invention comprises:
A heat sink is coupled to the CPU device by a pair of upper and lower fasteners, and the lower fastener includes a band-shaped base and a rising portion provided upright therefrom and vertically penetrating the CPU device. The band-shaped base of the lower fastener is fitted into the concave groove, the CPU device is placed on the upper surface of the heat sink, and the rising portion of the lower fastener is inserted into a through hole provided in the CPU device, and C
An upper stopper for retaining is fixed to the upper end of the rising part of the lower fastener that penetrates the PU device, and the engaging projections on the upper edges of the right and left side walls of the mounting frame member are formed on the heat sink of the heat sink. With the left and right ends of the groove closed, they are pushed inward and deformed, respectively, and a part of the engaging protrusion enters the left and right ends of the groove, and these deformed inward protrusions lower the inside of the groove. The left and right ends of the band base of the fastener are held down, and the CP
A heat sink including the U device and a mounting frame-shaped member are fitted into the opening on the upper side surface of the rectangular duct with the radiation fins in the duct, and the heat sink and the CPU device are ducted through the mounting frame-shaped member. It is characterized by being fixed to.

[0007]

Embodiments of the present invention will now be described with reference to the drawings.

In this specification, front and rear, left and right, and up and down are based on FIG. 1, the front is the right side of FIG. 1, the rear is the same left side, and the left and right are rearward. Means the upper side and lower means the lower side.

In the following description of this specification,
The term "aluminum" shall include aluminum alloys in addition to pure aluminum.

FIG. 1 is a schematic overall view of a desktop / tower type personal computer (electronic device) provided with a heat radiating device according to the present invention, and a CPU (electronic component) is provided at an upper part in a housing (1) of the computer. A CPU device (2) including (3) is arranged.

In this embodiment, the CPU device
(2) is a so-called cartridge type, which is provided with a CPU (3) exposed on the lower surface of the CPU circuit board (4), and the upper surface of the CPU circuit board (4) has a synthetic resin cover ( 5) is covered by

An aluminum heat sink (10) is provided below the CPU device (2) so as to be in direct contact with the CPU (3).
However, two pairs of upper and lower fasteners made of spring steel plate (40) (50)
The heat sink (10) attached by the heat sink (10)
Heat sink (10) and CPU device via a heat sink mounting frame member (20) made of a metal plate fitted to
(2) is mounted on the upper side surface of the synthetic resin square tubular duct (30) in the upper inside of the housing (1).

A heat radiation opening (1a) is provided in the upper part of the rear side wall of the housing (1), and a trumpet-shaped tip (39) of the rectangular tubular duct (30) is formed in the opening (1a). One fan (8) is provided inside the trumpet-shaped tip (39) for sending out the air in the housing (1) to the outside. At the lower part of the front wall of the housing (1), a ventilation port (9) for taking in cooling air is provided.

Referring to FIGS. 2 to 4 showing the details of the heat radiating device of the present invention, the CPU circuit board (4) of the CPU device (2) will be described.
And the lower part of the cover (5)
Through hole (6) (6) for inserting the rising part (42) (42) of (0)
Are opened four in total.

The heat sink (10) is a heat-radiating substrate (11) made of a rectangular aluminum extruded member that is long before and after the plane as viewed from above.
And a tongue fin (radiation fin) (12) having a concave arc shape as viewed from the front, which is cut and raised in parallel on the lower surface thereof.

On the upper surface of the extruded aluminum heat dissipation board (11), a pair of internal enlarged grooves (13) (13) before and after the lower fasteners (40) (40) are fitted therein. It is provided in the extrusion direction of 11). These recesses (13) (13) fit the lower fasteners (4
0) and (40) to prevent displacement (lateral displacement).
Also, on the lower edges of the front and rear ends of the heat dissipation board (11), there are step portions which are engaged with the front and rear side walls of the heat sink mounting frame member (20).
(14) and (14) are provided respectively.

The tongue-shaped fin (12) is connected to the heat dissipation board (1).
On the lower surface of 1), cut-and-raised portions are provided in a direction perpendicular to the concave grooves (13) (13), in other words, in a direction perpendicular to the extrusion direction of the heat radiation substrate (11). According to such a tongue fin (12), the fin pitch can be set freely, and the tongue fins (12) can be arranged at a narrow interval,
The heat radiation efficiency is excellent. In addition, there is an advantage that the direction of the tongue-shaped fins (12) can be freely set regardless of the pushing direction of the heat radiation substrate (11).

Such a heat sink (10) is provided with a pair of upper and lower and two sets of front and rear spring steel plate fasteners (40) and (50).
It is connected to the U device (2).

Here, the lower fastener (40) is connected to the heat dissipation board (11).
A band-shaped base (41) to be fitted into the internal enlarged groove (13),
At a portion near the left and right ends of the band-shaped base (41), the band-shaped base (41) is cut and raised at the center in the width direction, provided in a rising shape, and
The upright portions (42) (42) penetrate vertically through the through holes (6) (6) of the U device (2). And each rising part
(42) has a rectangular cross section and has a shape that is long in the width direction of the band-shaped base (41), and a top portion of the head is provided with a neck portion (44) narrower than the thickness of the rising portion (42). (43) is provided.

On the other hand, each of the upper fasteners (50) is in the form of a strip, and has a central horizontal portion (50a) and front and rear inclined portions (10a) connected to the front and rear end portions thereof and inclined forward and upward, respectively. 50b) and (50c). And the front slope
The portion near the tip of (50b) is provided with a rectangular elongated hole (51) as viewed from a plane into which the head (43) of the rising portion (42) of the lower fastener (40) can be inserted. This rectangular slot (5
1) is wider in the width direction of the upper fastener (50), that is, in the left-right direction, and has a slightly wider eye width than the narrow neck portion (44) of the rising portion (42). A notch (52) is provided in the rear inclined portion (50c) near the tip, and the notch (52)
Is narrower inward than the narrow neck (44) of the rising portion (42) and gradually narrows inward from the wide opening (52a), 52b).

The heat sink mounting frame member (20) made of a metal plate has an opening (21) into which the lower half of the heat radiating substrate (11) of the heat sink (10) fits. On the upper edge of the vertical side walls (22) (23), the heat dissipation board (10)
A total of four engaging projections (25) and (25) for closing the left and right ends of the concave grooves (13) and (13) are provided so as to protrude upward.

Engaging claws (24) and (24) are provided on the left and right side walls (22) and (23) of the heat sink mounting frame member (20), respectively, just below the engaging convex portions (25) and (25). Is provided in a cut-and-raised shape so as to be located at

On the other hand, an opening (31) for fitting a heat sink (10) is provided on the upper side surface of the duct (30), and vertical side walls (32) (32) on both the left and right sides of the opening (31). A swinging piece (36) (36) that can swing by the elastic force of the duct material is formed between the pair of upper opening cutouts (35) and (35) at the upper edge of the 33). , These rocking pieces (36), (36)
(24) Rectangular engagement holes (34) and (34) for engaging (24) are provided respectively. Left and right vertical side walls of duct (30) (3
2) On the inner surface of (33), steps (37) and (37) are provided, respectively, which engage with the left and right lower edges of the heat dissipation board (11) of the heat sink (10).

The CPU device (2), the heat sink (10),
Heat sink mounting frame member (20) and square tube duct
In order to combine (30), first, as shown in FIG. 5, two internal enlarged grooves (13) and (13) on the front and back of the heat dissipation board (11) of the heat sink (10) each have two sets of fasteners. Lower bracket (4
0) The base strips (41) and (41) of (40) are inserted by sliding from one ends of the concave grooves (13) and (13). Then, the heat dissipation board (11) of the heat sink (10) with the lower fasteners (40) (40) is
It is fitted into the opening (21) of the heat sink mounting frame member (20) from above. Thereby, the steps (14) and (14) of the lower edges of the front and rear ends of the heat dissipation board (11) are engaged with the front and rear side walls (26) and (27) of the mounting frame member (20). In addition, the mounting frame-shaped member (20) and the vertical side walls (22) (23) on both the left and right sides. (13) The left and right ends of (13) are closed, and the front and rear lower fasteners (40)
Escape of (40) in the left-right direction is prevented.

Next, as shown in FIG.
The CPU device (2) is placed on the upper surface of (10). At this time, C
A total of four through holes (6) (6) provided in the PU device (2)
A total of four rising parts (42) (4
2) is inserted from below. And the CPU device
The head (43) (4) of the rising part (42) (42)
At 3), secure the retaining upper fastener (50) as follows.

That is, for example, with respect to the head (43) of the right rising portion (42) of the front lower fastener (40) penetrating the CPU device (2) upward, the first upper fastener (50). ) Front slope
In order to fit the long hole (51) near the tip of (50b),
The upper fastener (50) is arranged so that the longitudinal direction thereof is in the left-right direction so that the longitudinal direction of the long hole (51) and the longitudinal direction of the head (43) coincide with each other. Insert the head (43) of (42) into the long hole (51) of the first upper fastener (50). The upper fastener (50) is attached to the narrow neck (4) below the head (43).
When at the level of 4), hold the rear end of the upper fastener (50) and rotate it in the horizontal plane. The long hole (51) of the upper fastener (50) has a slightly wider eye width than the narrow neck (44) of the rising part (42), so that the upper fastener (50) has the neck (44). )
And the center of the upper clasp (50) near the tip of the front inclined portion (50b) is the head of the rising portion (42).
(43). Also, at this time, when holding the rear end portion of the upper fastener (50) and rotating it in a horizontal plane by pressing it downward, the upper fastener (50) is made of a spring steel plate. The front inclined portion (50b) and the rear inclined portion (50c) of (50) are deformed so as to be nearly horizontal, and the resilient force of the restoring force presses the CPU device (2) against the upper surface of the heat sink (10). (See FIG. 2).

Next, when the upper fastener (50) is rotated by about 90 ° and disposed in the front-rear direction, the upper fastener (50) is rotated.
In the notch (52) near the rear end, the right-side rising part (42) of the rear lower fastener (40) protruding above the CPU device (2)
Fit the narrow neck (44). At this time, the neck portion (44) enters through the wide opening (52a) of the notch (52) and reaches into the narrow inner portion (52b).

In this state, the portion of the first upper fastener (50) near the front end of the front inclined portion (50b) is formed by the long hole (5).
Right side rising part (42) of the front lower fastener (40) that passed through 1)
Of the notch (52) of the upper fastener (50) near the front end of the rear inclined portion (50c). Rear lower clasp (40) penetrating
The upper head (4) of the narrow neck (44) of the right riser (42)
Involve in 3).

The depth of the internal enlarged concave grooves (13) and (13) on the upper surface of the heat radiating substrate (11) of the heat sink (10) is determined by the band-shaped bases (41) and (41) of the lower fasteners (40) and (40). 41)
It has a depth deeper than these heights, and the lower fastener (4
0) (40) strip base (41) (41), the concave groove (13) of the heat dissipation board (11)
(13) As a result, the heat dissipation board (11) of the heat sink (10)
And the CPU (3) exposed on the lower surface of the CPU device (2)
Is to be brought into close contact.

Next, similarly to the above case, the second upper fastener (50) is moved upward through the CPU device (2), for example, to the left rising portion (42) of the front lower fastener (40). ) Head (43)
After rotating in a horizontal plane, the notch (52) near the rear end of the upper fastener (50) is inserted into the CPU device.
The narrow neck (44) below the head (43) of the left rising part (42) of the rear lower fastener (40) penetrating upward through (2) is fitted. Thus, the CPU device (2) is connected to the heat sink (11) of the heat sink (10) by these two upper fasteners (50) (50).
It is to be securely attached to the upper surface of.

It should be noted that the two deformed upper fasteners (50) are urged to restore by the spring action of the CPU device, respectively.
(2) is strongly pressed against the upper surface of the heat sink (11) of the heat sink (10), and the CPU (3) on the lower surface of the CPU device (2) is directly and directly on the upper surface of the heat sink (11) of the heat sink (10). It can be firmly contacted.

Further, the heat dissipation board (11) of the heat sink (10)
A total of four engaging projections (25) (25) on both the left and right sides of the mounting frame member (20) closing the left and right ends of the front and rear concave grooves (13) (13) 13) Pushing and deforming (caulking) inside the left and right ends of the left and right ends, a part of the engaging projections (25) and (25) becomes concave grooves (13).
(13) so that it goes into the left and right ends. The left and right ends of the band-shaped bases (41) and (41) of the lower fasteners (40) and (40) in the concave grooves (13) and (13) are held down by the deformed inward convex portions (25a) and (25a). Can be

As described above, the heat sink (10) having the CPU device (2) and the mounting frame member (20) are connected to the rectangular cylindrical duct.
(30) The tongue fin (12) is fitted to the opening (31) on the upper side face so that the tongue fin (12) is fitted into the duct (30). Then, a total of four sets of engaging claws (24) of the left and right side walls (22) and (23) of the mounting frame member (20) and the left and right side walls (32) and (33) of the duct opening opposed thereto. And the engagement hole (34), the heat sink (1
0) and the CPU device (2) are fixed to the duct (30) via the mounting frame member (20).

A connection terminal (7) is provided on the right side edge of the CPU device (2), and the heat sink (10) and the C
The duct (30) having the PU device (2) is connected to the housing (1).
By attaching it to a predetermined location inside the CPU device (2)
Terminal (7) is connected to a motherboard (15) arranged on the same side in the housing (1).

In the above, the heat radiation opening on the rear wall of the housing (1) of the desktop personal computer.
When the fan (8) provided in (1a) is operated, low-temperature air outside the housing (1) is sucked from the ventilation port (9) in the front wall. This low-temperature air is guided between the tongue fins (12) of the heat sink (10) in the duct (30), and the heat generated by the CPU (3) dissipates the heat radiation board (11) and the tongue fins (12). And the air is heated. The heated air is quickly discharged out of the housing (1) from the heat radiation opening (1a) in the rear wall of the housing (1) by the operation of the fan (8). Therefore, the heat radiation performance through the tongue-shaped fins (12) is very excellent.

The tongue-shaped fins (12) are provided on the upper surface of the heat radiating substrate (11) in a direction perpendicular to the grooves (13) and (13), in other words, in a pushing direction of the heat radiating substrate (11). It is provided in a cut-and-raised shape in a direction perpendicular to the direction. Therefore, the wind flows in the duct (30) along the tongue-shaped fins (12), that is, in the direction perpendicular to the extrusion direction of the heat radiation board (11).

According to the above embodiment, the upper and lower fasteners (40) (5)
(0), the CPU device (2) including the CPU (3) can be mounted on the upper surface of the heat radiating substrate (11) of the heat sink (10) very easily and the CPU (3) can be directly mounted on the upper surface of the heat radiating substrate (11). It is very convenient because it can be securely attached in contact. A heat sink (10) having a CPU device (2)
However, the tongue-like fin (12) faces the opening (31) on the upper surface of the rectangular tubular duct (30) with the tongue-like fin (12) facing down,
(30) Since it is fitted so that it fits inside, CP
The heat generated from U (3) is dissipated by the heat dissipating
The air in the duct (30) is discharged through the duct (30) via the (12), and the air in the duct (30) is heated, and this heated air is quickly discharged out of the housing (1) by the operation of the fan (8). And therefore the cooling performance is very good.

In particular, according to the present invention, the heat sink
Since (10) forms a part of the wall of the duct (30), there is almost no gap between the heat sink (10) and the duct (30),
Therefore, in order for sufficient wind to flow into the heat sink (10),
The heat radiation performance is very good.

In the above, the CPU unit (2), the heat sink (10), the frame member (20) for attaching the heat sink, and the rectangular tubular duct (30) are combined by lowering each of the two sets of fasteners. Attach the band-shaped bases (41) and (41) of the fasteners (40) and (40) to the internal expansion groove (13) on the upper surface of the heat sink (11) of the heat sink (10).
(13) After inserting the heat sink (10) into the mounting frame member
(20) is fitted into the opening (21) from above, and the CPU device (2) is placed on the upper surface of the heat sink (10).
The rising portions (42) and (42) of the lower fasteners (40) and (40) were inserted into the through holes (6) and (6) of the PU device (2) from below, and passed through the CPU device (2) upward. Fix the upper retaining clip (50) to the heads (43) and (43) of the rising portions (42) and (42).
0) front and rear concave grooves (13), (13), the engaging projections (25) and (25) on the side of the mounting frame member (20) that close the left and right ends of the concave grooves (13), respectively.
(13) is deformed so as to penetrate the inside of the end, and the lower fasteners (40) (40) are formed by these deformed inward projections (25a) (25a).
Finally, the heat sink (10) including the CPU device (2) and the mounting frame member (20) are attached to the opening (31) on the upper surface of the rectangular duct (30). Tongue fins (1
2) is fitted into the duct (30), and the engaging claw (24) on the mounting frame member (20) side and the duct (20) side is engaged with the engaging hole (34). It is very easy to combine the CPU device (2), the heat sink (10), the frame member (20) for attaching the heat sink, and the rectangular duct (30).

In this embodiment, the upper and lower fasteners (40) (5)
Since the shape and structure of 0) are simple, only the minimum required processing is required, and the manufacturing cost of parts is very low.

Then, the concave grooves (13) and (13) of the heat sink (10)
When holding down the left and right ends of the lower fasteners (40) and (40) inserted in the fitting protrusions (25) and (25) on the mounting frame member (20) side
Are deformed so as to enter inside the ends of the concave grooves (13) and (13) at portions away from the tongue-shaped fins (12), respectively. However, there is an advantage that the equipment cost is low and the equipment cost is low.

In the above embodiment, the heat sink
(10) is connected to the CPU device (2) by a pair of upper and lower fasteners and two sets of front and rear fasteners (40) and (50).
Is a CPU device by a pair of upper and lower fasteners (40) (50).
It may be combined with (2). In addition, upper and lower fasteners (40) (5
0) The means for fixing each other is not limited to the one shown in the figure, but may be other methods.

In the above embodiment, the heat sink (10)
The grooves (13) and (13) provided on the upper surface of the heat dissipation board (11) are internal enlarged grooves, but the lower fasteners inserted in the grooves (13) and (13) of the heat sink (10). The left and right ends of (40) and (40) are provided with engaging protrusions (25) and (25) on the side of the mounting frame member (20), respectively.
3) Since the groove 13 is pressed down by being deformed so as to enter the inside of the end of (13), the concave grooves (13) and (13) need not be an internal enlarged concave groove, but have a normal U-shaped concave section. It may be a groove. The concave grooves (13) and (13) may be provided on any one of the upper and lower surfaces of the heat sink (11) of the heat sink (10), and the tongue-shaped fin (12) may be provided on the other. . Also,
The radiating fins provided on the radiating substrate (11) are tongue-shaped fins as shown, but may be radiating fins of other shapes such as a comb-shaped fin or a pin-shaped fin made of extruded material. good.

In the above embodiment, the engaging claws (24) (2) are attached to the left and right side walls (22) (23) of the heat sink mounting frame member (20).
4) are provided with engaging holes (34) and (34) at the upper edges of the vertical side walls (32) and (33) on both the left and right sides of the duct (30).
4) and the engagement hole (34) are relative to each other, and conversely, the engagement hole (34) is formed in the left and right side wall portions (22) (23) of the heat sink mounting frame member (20). The engagement claws (24) and (24) may be provided on the vertical side wall portions (32) and (33) on the left and right sides of the duct (30).

In the drawing, the CP is exposed on the lower surface of the circuit board (4) of the cartridge type CPU device (2).
U (3), but the CPU (3)
In some cases, the lower surface of the circuit board (4) of the CPU device (2) is placed on the upper surface of the heat radiation substrate (11) of the heat sink (10). You can make direct contact.

[0046]

According to the present invention, a heat radiating device for electronic equipment is provided.
As described above, the heat sink coupled to the CPU device and having the heat dissipating fins, the heat sink mounting frame member to be fitted to the heat dissipating substrate of the heat sink, and the heat sink fitting on the upper surface disposed at a required position in the housing. A rectangular duct having an opening, and a concave groove extending in the left-right direction is provided on the heat-radiating substrate of the heat sink, and a concave groove of the heat-radiating substrate is provided at upper edges of the left and right side walls of the mounting frame member. Engagement projections for closing the left and right ends of the mounting frame are provided in an upwardly projecting shape, and engagement claws are provided on one of the left and right side walls of the mounting frame member and the duct opening facing the left and right side walls. The other end is provided with an engagement hole for fitting an engagement claw, the mounting frame member is fitted to the heat sink, and the engagement projections on the upper edges of the left and right side walls of the mounting frame member are Heat sink With the left and right ends of the concave groove of the thermal board closed, each is pushed inward and deformed, and a part of the engaging protrusion enters the left and right end portions of the concave groove, and the heat sink and the mounting frame-like member are square cylindrical. Radiation fins are fitted into the opening on the upper surface of the duct inside the duct, and the engaging claws and the engaging holes on the left and right side walls of the mounting frame-like member and the duct opening facing the left and right sides. And the heat sink is fixed to the duct via the mounting frame member. According to the present invention,
Since the heat sink combined with the device can be securely attached to the side of the duct arranged in the housing of the electronic device, and the heat sink forms a part of the wall of the duct,
Since there is no gap between the heat sink and the duct, and thus sufficient air flows into the heat sink, the heat radiation performance is excellent. In addition, when the heat sink is attached to the side of the duct, the equipment can be simple, and the production cost can be reduced.

Further, in the heat radiating device for electronic equipment according to the present invention, the heat sink is connected to the CPU device by a pair of upper and lower fasteners, and the lower fastener is provided in a band-like base portion and a rising shape from the belt-like base portion. And a band-shaped base of the lower fastener is fitted into the concave groove of the heat sink of the heat sink, the CPU device is mounted on the upper surface of the heat sink, and a through hole provided in the CPU device is provided. The rising portion of the lower fastener is inserted into the hole, and the upper retaining fastener is fixed to the upper end of the rising portion of the lower fastener that has penetrated the CPU device, and is located on the left and right side walls of the mounting frame member. The engaging protrusions of the edge are pushed inwardly and deformed while closing the left and right ends of the concave groove of the heat sink of the heat sink, and a part of the engaging protrusion enters the left and right ends of the concave groove. The left and right ends of the band-shaped base of the lower fastener in the concave groove are pressed down by the deformed inward convex portions, and the heat sink provided with the CPU device and the mounting frame-shaped member are opened on the upper surface of the rectangular duct. A heat sink and a CPU device are fixed to the duct via a mounting frame member, and the heat sink and the CPU device are fixed to the duct via a mounting frame member. And the heat sink can be firmly connected, and the shape of the fastener is simple and easy to manufacture.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing an entire desktop / tower type personal computer (electronic device) provided with a heat dissipation device according to the present invention.

FIG. 2 is a partially cutaway enlarged side view of the heat radiating device for an electronic device of FIG. 1;

FIG. 3 is an enlarged cross-sectional view of the same.

FIG. 4 is an enlarged plan view of the partial cutout.

FIG. 5 is an exploded perspective view showing a heat sink, a heat sink mounting frame member, a CPU device, and a fastener in the heat radiating device for an electronic device of the present invention.

FIG. 6 is an exploded perspective view in which a duct is further combined with the components of the heat radiating device of FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 CPU apparatus 3 CPU circuit board 6 Through-hole 10 Heat sink 11 Heat dissipation board 12 Tongue-shaped fin (heat-dissipation fin) 13 Concave groove 16 Lower fastener 17 Band base 18 Rise part 20 Heatsink mounting frame member 22 Left side wall part 23 Right Side Wall 24 Engagement Claw 25 Engagement Projection 25a Deformed Inward Projection 26 Upper Clamp 30 Square Duct 31 Opening for Heat Sink Fitting 32 Left Wall of Duct Opening 33 Right Wall of Duct Opening Part 34 engagement hole

Claims (2)

[Claims] 1. A heat radiating device for radiating heat generated from a CPU device (2) disposed inside a housing (1) of an electronic device to outside the housing (1), and coupled to the CPU device (2). Heat sink (10) having a radiating fin (12)
And a heat sink mounting frame member (20) fitted to the heat radiating board (11) of the heat sink (10); and a housing (1).
And a rectangular duct (30) having a heat sink fitting opening (31) on the upper surface thereof and extending in the left-right direction on the heat dissipation board (11) of the heat sink (10). A concave groove (13) is provided, and the left and right ends of the concave groove (13) of the heat dissipation board (10) are closed at the upper edges of the left and right side walls (22) and (23) of the mounting frame member (20). Engagement protrusions (25), (25) are provided in an upwardly projecting shape,
An engaging claw (24) is engaged with one of the left and right side walls (22) and (23) of the mounting frame member (20) and the duct opening and the left and right side walls (32) and (33) opposed thereto. However, the other end is provided with an engagement hole (34) into which the engagement claw (24) is fitted.
The mounting frame member (20) is fitted to (10), and the left and right side walls (22) and (23) of the mounting frame member (20) are engaged with the upper edge engaging projections (25).
(25) are pressed inward and deformed in a state where the left and right ends of the concave groove (13) of the heat sink (10) of the heat sink (10) are closed, respectively, so that one of the engaging convex portions (25) (25) is deformed. Part enters the left and right ends of the concave groove (13), and the heat sink (10) and the mounting frame member (20) insert the radiation fins (12) into the opening (31) on the upper side surface of the rectangular tubular duct (30). It is fitted in the duct (30), and the left and right side walls (22) and (23) of the mounting frame member (20) and the duct opening and the left and right side walls (32) and (33) facing these are formed. The heat dissipating device for electronic devices, wherein the engaging claw (24) and the engaging hole (34) are engaged with each other, and the heat sink (10) is fixed to the duct (30) via the mounting frame member (20). apparatus. A heat sink (10) is coupled to the CPU device (2) by a pair of upper and lower fasteners (40) (50), and a lower fastener (4).
0) is provided in the form of a band-shaped base (41) and a rising part therefrom, and a rising part (42) vertically extending through the CPU device (2).
(42), and the band-shaped base (41) of the lower fastener (40) is fitted into the concave groove (13) of the heat dissipation board (11) of the heat sink (10). The CPU device (2) is placed, and the through-hole (6) provided in the CPU device (2).
The rising portions (42) and (42) of the lower fastener (40) are inserted through (6), and the upper ends of the rising portions (42) and (42) of the lower fastener (40) penetrate the CPU device (2). The retaining upper fastener (50) is fixed to the part, and the engaging projections (25) (25) on the upper edge of the left and right side walls (22) (23) of the mounting frame member (20) are (10) Heat dissipation board (1
With the left and right ends of the groove (13) closed, they are pushed inward and deformed, and a part of the engaging projections (25) and (25) enter the left and right ends of the groove (13). The left and right ends of the band-like base (41) of the lower fastener (40) in the concave groove (13) are held down by these deformed inward convex portions (25a) (25a), and the CPU device
Heat sink (10) including (2) and mounting frame member
(20) is fitted into the opening (31) on the upper side of the rectangular tubular duct (30) with the radiation fin (12) inside the duct (30), and the heat sink (10) and the CPU device (2) are attached. Mounting frame member (2
The heat radiating device for an electronic device according to claim 1, wherein the heat radiating device is fixed to the duct (30) via the (0).