TWI396962B - Heat dissipation device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for cooling electronic components.

With the continuous advancement and wide application of large-scale integrated circuit technology, the development of the information industry has advanced by leaps and bounds. Computers are widely used in various industries, especially the application of personal computers. Basically, the application of data processing is increasing and the requirements for immediacy are increasing. The development trend will inevitably require the computer to run at an increasing speed. As we all know, the core processor is the core component of the computer system, and its performance directly determines the performance of the entire computer. Therefore, the high-frequency high-speed processor is continuously introduced. However, high-frequency high-speed operation causes the processor to generate a large amount of heat. If the heat is not removed in time, the temperature of the processor itself will rise, which has a great impact on the safety and performance of the system. At present, the heat dissipation problem has become A problem that must be solved when a new generation of high-speed processors is introduced. Generally, the industry installs a heat sink on a wafer such as a central processing unit to dissipate heat.

In order to improve the heat dissipation effect of the heat sink, the industry often uses a fan to increase the heat dissipation capability. A conventional heat sink assembly includes a heat sink and a heat sink fan mounted to one side of the heat sink. The cooling fan is provided with a screw hole at four corners thereof, and the heat sink comprises a base and a plurality of horizontally distributed heat dissipation fins extending upward from the base. One end of the outermost fin of each side of the heat sink is respectively provided with a screw thread corresponding to the screw hole of the heat dissipating fan, and the screw sequentially passes through the screw hole to cooperate with the thread to fix the heat dissipating fan on one side of the heat sink. Although the fixing method can stabilize the cooling fan on the heat sink, the operation is complicated, the installation and the disassembly are inconvenient, and the fan generated by the fan does not have a flow guiding effect on the airflow generated by the fan, and the airflow generated by the fan cannot be high. Concentrated on the radiator, and thus The airflow generated by the fan cannot be fully utilized.

In view of this, it is necessary to provide a heat sink with a simple and convenient fan installation.

A heat dissipating device for dissipating heat from an electronic component, comprising a heat sink, an air hood on a front side of the heat sink, and a fan mounted on the air hood, the heat sink including a substrate and extending upward from the substrate a plurality of heat dissipating fins, the substrate extending to the two sides with a first fixing ear, the air guiding hood includes a top plate and two side plates extending downward from both sides of the top plate, the top surface of the heat sink is provided with a buckle groove, and the top surface of the heat sink faces A positioning portion is disposed in the buckle groove, and the two side plates extend to the two sides to have a mounting flange received on the first fixing ear. Compared with the prior art, the present invention has the following advantages: the fan and the air hood are combined by direct snapping, and the air hood and the heat sink share a fixing component, and the fixed heat sink is also fixed on the circuit board. Fixing the air hood to the heat sink is easy and convenient.

10‧‧‧ radiator

12‧‧‧Substrate

14‧‧‧Heat fins

20‧‧‧wind hood

22‧‧‧ top board

24‧‧‧ side panels

26‧‧‧floor

30‧‧‧Fan

32‧‧‧Flange

120‧‧‧Contacts

122‧‧‧First fixed ear

124‧‧‧Second fixed ear

126‧‧‧ card projection

140‧‧‧ buckle groove

220‧‧‧ Positioning Department

242‧‧‧Bucks

244‧‧‧ fixed column

246‧‧‧ mounting flange

248‧‧‧ convex

249‧‧‧ gap

262‧‧‧Guidance Department

264‧‧‧Limited convex

320‧‧‧Fixed holes

1260‧‧‧ card slot

2420‧‧‧ buckle

2460‧‧‧ mounting holes

2620‧‧‧ventilation holes

1220, 1240‧‧‧ fixing holes

1 is a perspective assembled view of a preferred embodiment of a heat sink of the present invention.

2 is an exploded perspective view of the heat sink of FIG. 1.

3 is a perspective assembled view of the heat sink and the air hood of FIG. 2.

4 is an inverted combination view of another view of the heat sink of FIG. 1.

Figure 5 is an exploded perspective view of the heat sink of Figure 3.

Referring to FIG. 1 to FIG. 5, a preferred embodiment of the heat dissipation device of the present invention includes a heat sink 10, an air hood 20 fixed to one side of the heat sink 10, and a fan 30 mounted on one side of the air hood 20. .

The heat sink 10 is integrally formed of a metal material having good thermal conductivity such as aluminum, copper, or the like, and includes a rectangular substrate 12 attached to an electronic component such as a central processing unit (not shown) and a top surface of the substrate 12. A plurality of fins 14 extending vertically upward. Referring to FIG. 4 and FIG. 5, the bottom portion of the substrate 12 is downwardly protruded from a contact portion 120 of the central processing unit. The contact portion 120 is inclined to form a triangular head near the front side of the fan 30 to form a triangular head. The airflow of the fan 30 is directed to the electronic components on the two sides of the heat sink 10. The front ends of the two sides of the substrate 12 are respectively horizontally extended to the front side of the first fixed ear 122. A second fixing lug 124 is defined on the two sides. A fixing hole 1220 and 1240 are defined in the first fixing lug 122 and the second fixing lug 124. The fixing holes 1220 and 1240 are provided for fixing parts (not shown). The heat sink is fixed to the central processing unit. The thickness of the first fixing lug 122 is about one half of the second fixing lug 124, and the bottom surface thereof is flush with the bottom surface of the bottom plate 12. Two opposite sides of the first fixing lug 122 on the two sides of the substrate 12 protrude from the two sides to form a latching protrusion 126. The thickness of the latching protrusion 126 is the same as the thickness of the substrate 12 and is opened toward the first fixing. The elongated opening of the ear 122 is a slot 1260. The heat dissipation fins 14 are rectangular and are parallel to each other and perpendicular to the front and rear sides of the substrate 12. The top ends of the heat dissipation fins 14 are flush with each other and close to the outermost portions of the heat dissipation fins 140 near the front side. A buckle groove 140 is opened for the windshield cover 20 to be locked.

The air hood 20 is integrally formed of a plastic material, and includes a top plate 22, two side plates 24 extending vertically downward from opposite left and right sides of the top plate 22, and a bottom plate 26 connecting the bottom ends of the two side plates 24. The front end portion of the top plate 22 is inclined upwardly and upwardly to cover the upper end portion of the fan 30. The top end 22, the side plates 24, and the front end of the bottom plate 26 are all on a flat surface, and a mounting surface for mounting the fan 30 is formed. The bottom surface of the top plate 22 has a positioning portion 220 (shown in FIG. 5 ) protruding perpendicularly downward from the side edge of the top plate 22 , and the positioning portion 220 has a rectangular parallelepiped shape and is adjacent to and perpendicular to the two side plates 24 . The positioning portion 220 is sized to fit within the buckle groove 140 on the top surface of the heat sink 10 to define the air hood 20 in an appropriate position. A fastening piece 242 is disposed along the side plate 24 at the near end of the right side panel 24 and the lower end of the left side panel 26 . The two fastening pieces 242 are substantially at the mounting facing angle position, and the ends of the two fastening pieces 242 are opposite to each other. A hook 2420 protrudes inwardly. A fixing post 244 protrudes forwardly from the joint between the two side plates 24 and the top plate 22 and the bottom plate 26, and the two fixing posts 244 are located on the mounting surface of the two fastening pieces 242. The diagonal portion is used to fix the fan 30 to the mounting surface of the front side of the air hood 20 together with the second fastening piece 242. The lower rear end corners of the two side panels 24 are provided with rectangular convex portions 248 projecting to both sides to enhance the strength here. A mounting flange 246 is formed on the one side of the front end portion of the convex portion 248 at a proximal end to the first fixing lug 122 of the base 12 of the heat sink 10, and a heat sink is formed under the mounting flange 246. 10 a notch 249 of the first fixed lug 122. The bottom end of the rear side portion of the convex portion 248 extends downward beyond the bottom surface of the mounting flange 246 to be inserted into the locking groove 1260 on both sides of the heat sink 10. The mounting flange 246 has the same shape as the first fixing lug 122 , and has a mounting hole 2460 defined therein. When the mounting flange 122 is placed on the first fixing lug 122 , the mounting hole 2460 and the first fixing lug 122 are disposed. The fixing holes 1220 are correspondingly connected, and the mounting flange 246 is superposed with the first fixing ears 122 to have a thickness equal to the thickness of the second fixing ears 124. The bottom plate 26 is parallel to the top plate 22 and vertically connects the bottom ends of the front side portions of the two side plates 24. An air guiding portion 262 is defined on the front side of the bottom plate 26, and the air guiding portion 262 defines a venting hole 2620 through which the airflow generated by the fan 30 passes. The rear side edge of the bottom plate 26 extends upwardly with a plurality of limiting protrusions 264. The limiting protrusions 264 are used to abut the front side of the substrate 12 of the heat sink 10 (as shown in FIG. 3) to define the air hood 20 in place.

The fan 30 includes a rectangular frame. Each corner of the frame is provided with two spaced flanges 32. The flange 32 defines a fixing hole 320 through which the air guiding cover 20 is fixed.

When the heat dissipating device is assembled, the air guiding cover 20 is sleeved on the front side of the heat sink 10, so that the positioning portion 220 at the rear end of the top plate 22 is correspondingly received in the card slot 140 at the top of the heat sink 10; the bottom end of the two side plates 24 The notch 249 is corresponding to the fixing ear 122 on both sides of the front end of the heat sink 10; at the same time, the mounting flange 246 at the bottom end of the two side plates 24 is received on the first fixing ear 122; Mounting flange 246 and first securing lug 122 and additional second securing lug 124 secure the heat sink to the circuit board while also securing air deflector 20 to heat sink 10. Then, the fan 30 is placed on the mounting surface of the front side of the air hood 20, and the air hood 20 is mounted on the fixing column 244 facing the corner corresponding to the fixing hole 320 on the opposite corners of the fan 30, and then the fan 30 is guided to the wind. The cover 20 is pressed on the mounting surface to fix it The post 244 is inserted into the fixing hole 320, and the hook 2420 of the end of the second buckle 242 which is elastically deformed at the opposite corner of the mounting surface of the air hood 20 is slid over the flange 32 of the fan 30 and is caught on the front side of the flange 32. fixed. It can be understood that the installation order of the fan 30 can be changed. The fan 30 and the air hood 20 can be combined first, and the air hood 20 connected to the fan 30 can be mounted on the heat sink 10.

It can be seen that the fan 30 and the air hood 20 are combined by direct snapping, and the air hood 20 and the heat sink 10 share a fixing member, and the air hood is fixed while fixing the heat sink 10 to the circuit board. On the heat sink 10, it can be seen that saving operation is simple and convenient. In addition, the air hood 20 seals the space between the heat sink 10 and the fan 30 well, and the airflow generated by the fan 30 is concentratedly blown toward the heat sink 10. The triangular head portion of the contact portion 120 on the bottom surface of the substrate 12 of the heat sink 10 faces the air guiding portion 262 of the air guiding cover 20, and a part of the airflow generated by the fan 30 is blown toward the contact portion 120 through the air guiding hole 262 of the air guiding portion 262. Further, the head of the contact portion 120 is turned to the electronic components on both sides of the central processing unit, so that the heat dissipation problem of the electronic components around the central processing unit can be solved.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

12‧‧‧Substrate

14‧‧‧Heat fins

22‧‧‧ top board

24‧‧‧ side panels

30‧‧‧Fan

32‧‧‧Flange

122‧‧‧First fixed ear

124‧‧‧Second fixed ear

126‧‧‧ card projection

242‧‧‧Bucks

246‧‧‧ mounting flange

248‧‧‧ convex

1260‧‧‧Fixed holes

2460‧‧‧ mounting holes

Claims (12)

A heat dissipating device for dissipating heat from an electronic component, comprising: an air guiding cover; a heat sink on one side of the air guiding cover; and a fan mounted on the other side of the air guiding cover, the air guiding cover including a top plate And a heat sink fin extending from the substrate, the heat sink fins extending from the substrate a fastening groove is formed on the bottom surface of the top plate, and a positioning portion is disposed on the bottom surface of the top plate. The two side plates extend to the two sides to extend a mounting flange, and the air guiding cover is further disposed on the first fixing ear. The utility model comprises a bottom plate which is connected to the two side plates and is opposite to the top plate. The bottom plate extends downwardly from the fan side to form a wind guiding portion. After the air guiding cover is assembled with the heat sink, the air guiding portion extends below the heat sink substrate. A portion of the airflow generated by the fan is directed below the substrate. The heat dissipating device of claim 1, wherein the mounting flange and the first fixing ear respectively have mounting holes and fixing holes that communicate with each other and accommodate the fixing members. The heat dissipating device of claim 2, wherein a side edge of the side plate adjacent to the side of the heat sink protrudes to form a convex portion on a side thereof, and the mounting flange is near the bottom of the convex portion near the side of the fan. The end extends to the sides and forms a gap under the mounting flange to receive the first fixing lug of the heat sink. The heat dissipating device of claim 3, wherein the two sides of the substrate are protruded from opposite sides of the first fixing ear to form a latching protrusion, and the latching convex portion is open to face the first fixing ear. The slit of the opening is provided with a groove, and a portion of the bottom end of the side plate convex portion near the heat sink side extends downward beyond the bottom surface of the mounting flange and is caught in the locking groove. The heat dissipating device of any one of claims 1 to 4, wherein the first fixing ear extends outwardly from a side of the substrate near one end of the fan, and the other end of the side plate extends outwardly with a second fixing. The second fixing ear is provided with a fixing hole for accommodating the fixing member. The heat sink of claim 5, wherein the mounting flange is superposed with the first fixing ear to have a thickness equal to a thickness of the second fixing ear. The heat sink according to any one of claims 1 to 4, wherein the front end portion of the top plate is inclined upwardly and obliquely. The heat dissipating device of claim 1, wherein the side plate is a vertical top plate, and the bottom plate is vertically connected to the side plate. The heat dissipation device of claim 8, wherein the bottom plate extends away from the other side edge of the fan and has a plurality of limiting protrusions on the front side of the substrate, and the air guiding portion is provided with a plurality of air guiding holes. The heat dissipating device of claim 9, wherein a contact portion of the bottom surface of the substrate protrudes downwardly from the bottom of the substrate, and the contact portion forms a triangular head near one end of the fan, and the tip of the head refers to the guide Windshield of the windshield. The heat dissipating device of claim 8, wherein the connection between the one side plate and the top plate and the other side plate and the bottom plate are respectively protruded toward the fan and a fixing post inserted in the fixing hole on the diagonal of the fan. The heat dissipating device of claim 8, wherein a side plate is adjacent to the bottom plate and the other side plate is adjacent to the top plate, and a buckle is protruded toward the fan, and the end of the buckle protrudes inwardly with the fan. The side edge snaps the clasp.