CN101466234B - Radiating device - Google Patents

Abstract

The invention relates to a heat radiator used for heat dissipation of electronic components, comprising a radiator, a wind scooper which is positioned in front of the radiator and a fan which is arranged on the wind scooper, wherein, the radiator comprises a base plate and a plurality of radiating fins extending upwards along the base plate; the base plate is provided with a fixing lug by extending to the two sides of the base plate; the wind scooper comprises a top plate and two side plates, and the side plates extend downwards from the two sides of the top plate; the top surface of the radiator is opened with a bucking groove; the bottom surface of the top plate is downwards and convexly provided with a positioning part contained in the buckling groove; and the two side plates are extended with a mounting flange continued on the fixing lug. The fan is combined with the wind scooper in a way of direct buckling, while a fixing piece is shared by the wind scooper and the radiator; when the radiator is fixed on a circuit board, the wind scooper is also fixed on the radiator, thus reducing operational motion and having simple, convenient and fast operation.

Description

heat sink

technical field

The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components.

Background technique

With the continuous advancement and wide application of large-scale integrated circuit technology, the development of the information industry is advancing by leaps and bounds. Computers are widely used in all walks of life, especially the application of personal computers has been basically popularized. In order to adapt to the increasing amount of data processing and the improvement of real-time requirements The development trend of computer technology inevitably requires the continuous improvement of computer operating speed. As we all know, the central processing unit is the core component of the computer system, and its performance directly determines the performance of the entire computer. Therefore, high-frequency and high-speed processors are constantly being introduced. However, the high-frequency and high-speed operation makes the processor generate a lot of heat. If the heat is not removed in time, the temperature of the processor itself will rise, which will have a great impact on the safety and performance of the system. At present, the problem of heat dissipation has become a problem for every new generation. A problem that must be solved when high-speed processors are introduced. Generally, the industry installs radiators on chips such as central processing units to dissipate heat.

In order to improve the heat dissipation effect of the radiator, the industry often uses fans to increase the heat dissipation capacity at the same time. A traditional cooling device combination includes a radiator and a cooling fan installed on one side of the radiator. The cooling fan is provided with screw holes at its four corners, and the radiator includes a base and several horizontally distributed cooling fins extending upward from the base. One end of the outermost cooling fin on each side of the radiator is respectively provided with screw threads corresponding to the screw holes of the cooling fan, and the screws pass through the screw holes in turn to cooperate with the threads of the cooling fins to fix the cooling fan on one side of the radiator. Although this fixing method can stabilize the cooling fan on the radiator, it is complicated to operate and inconvenient to install and disassemble, and the fan that is fixed in this way has no guiding effect on the airflow generated by the fan, so that the airflow generated by the fan cannot be high. Concentrated blowing to the radiator, so that the airflow generated by the fan cannot be fully utilized.

Contents of the invention

The purpose of the present invention is to provide a cooling device with simple and convenient fan installation.

A heat dissipation device for dissipating heat from electronic components, comprising a heat sink, an air guide cover positioned at the front side of the heat sink and a fan mounted on the air guide cover, the heat sink includes a base plate and a base plate Several heat dissipation fins extending upwards, the base plate has first fixing ears extending to both sides, the wind guide cover includes a top plate and two side plates extending downward from both sides of the top plate, and the top surface of the radiator is provided with The buckle groove, the bottom surface of the top plate protrudes downwards and is provided with a positioning part accommodated in the buckle groove, and the two side plates extend to both sides with installation flanges that are received on the first fixing ear.

Compared with the prior art, the present invention has the following advantages: the above-mentioned fan and the air guide cover are combined together by direct buckling, and the air guide cover and the heat sink share a fixing part, which is also used when fixing the heat sink to the circuit board. Fix the air guide cover to the radiator, it can be seen that it saves operation and is simple and convenient.

Description of drawings

Fig. 1 is a three-dimensional assembled view of a preferred embodiment of the heat dissipation device of the present invention.

FIG. 2 is an exploded perspective view of the heat sink in FIG. 1 .

Fig. 3 is a three-dimensional combined view of the radiator and the air guide cover in Fig. 2 .

FIG. 4 is an upside-down composite view of another viewing angle of the heat sink in FIG. 1 .

FIG. 5 is an exploded perspective view of the heat sink in FIG. 3 .

Detailed ways

Referring to Fig. 1 to Fig. 5, a preferred embodiment of the cooling device of the present invention comprises a radiator 10, a wind guide 20 fixed on one side of the radiator 10 and a fan 30 installed on one side of the wind guide 20 .

Above-mentioned heat sink 10 is integrally formed by metal materials such as aluminum, copper etc. with good thermal conductivity, and it comprises a rectangular substrate 12 attached to electronic components such as a central processing unit (not shown in the figure) and extends vertically upwards from the top surface of substrate 12. Several heat sink groups 14. Please refer to Fig. 4 and Fig. 5 for the substrate 12, a contact portion 120 protruding downwards with the central processing unit in the middle of the bottom of the substrate 12, the front side of the contact portion 120 is inclined to both sides to form a triangular head, so that the fan 30 The airflow blowing to the bottom of the heat sink 10 is guided to the electronic components on both sides. The front ends of the two sides of the substrate 12 respectively extend a first fixing ear 122 horizontally to both sides, and the rear ends of the two sides of the substrate 12 extend horizontally respectively. A second fixing ear 124 extends from both sides, and the first fixing ear 122 and the second fixing ear 124 are respectively provided with a fixing hole 1220 and 1240, and the fixing holes 1220 and 1240 are used for fixing parts (not shown) to pass through. Fix the heat sink to the CPU. The thickness of the first fixing ear 122 is about half of that of the second fixing ear 124 , and its bottom surface is flush with the bottom surface of the base plate 12 . Two opposite sides of the first fixing ear 122 on both sides of the base plate 12 protrude to both sides to form locking protrusions 126. The long and narrow locking groove 1260 opened by the fixing ear 122 . The heat dissipation fins 14 are in the form of rectangular sheets, spaced apart from each other, parallel to and perpendicular to the front and rear opposite sides of the substrate 12, the tops of the heat dissipation fins 14 are flush with each other and close to the two outermost small parts of the heat dissipation fins 140 near the front side A buckle slot 140 is provided at the place for the wind guide cover 20 to be locked.

The air guide cover 20 is integrally formed of plastic material, and includes a top plate 22 , two side plates 24 vertically extending downward from the left and right opposite sides of the top plate 22 , and a bottom plate 26 connecting the bottom ends of the two side plates 24 . The front end of the top plate 22 tilts upwards and extends to cover the upper end of the fan 30 . Front ends of the top board 22 , the side boards 24 and the bottom board 26 are all on a plane, and form a mounting surface for the fan 30 to be installed on. The bottom surface of the top plate 22 protrudes vertically downwards adjacent to its rear side edge with two positioning portions 220 (as shown in FIG. 5 ). The size is just to be accommodated in the buckle groove 140 on the top surface of the radiator 10 to limit the air guide cover 20 in a proper position. The near upper end of the right side plate 24 and the near lower end of the left side plate 26 respectively extend forward along the side plate 24 with buckle pieces 242. A buckle 2420 protrudes inwardly from the end of the buckle 242 . The connection between the two side plates 24 and the top plate 22 and the bottom plate 26 protrudes forward with a fixed column 244, and the two fixed columns 244 are located at the other two opposite corners of the mounting surface where the two buckle pieces 242 are located, for connecting with the second buckle piece 242. Together, the fan 30 is fixed on the installation surface on the front side of the air guide cover 20 . Rectangular protrusions 248 protruding to both sides are provided at the lower corners near the rear of the two side plates 24 to enhance the strength here. The front part of the protrusion 248 near the bottom end is horizontally protruding to one side with a mounting flange 246 that is matched with the first fixing ear 122 of the base 12 of the radiator 10, and a heat sink is formed under the mounting flange 246. The notch 249 of the first fixing ear 122 of the device 10. The bottom end of the rear portion of the protruding portion 248 extends downward beyond the bottom surface of the mounting flange 246 to be inserted into the engaging slots 1260 on two sides of the heat sink 10 . The shape of the mounting flange 246 is consistent with that of the first fixing ear 122 , and a mounting hole 2460 is opened on it. The mounting holes 1220 communicate with each other correspondingly, and the thickness of the mounting flange 246 stacked with the first mounting ear 122 is equal to the thickness of the second mounting ear 124 . The bottom plate 26 is parallel to the top plate 22 and vertically connects the bottom ends of the front portions of the two side plates 24 . An air guide portion 262 extends downward from the front side of the bottom plate 26, and the air guide portion 262 is provided with a ventilation hole 2620 for the airflow generated by the fan 30 to pass through. These limiting protrusions 264 are used to abut against the front side of the base plate 12 of the heat sink 10 (as shown in FIG. 3 ) to limit the wind deflector 20 at a proper position.

The above-mentioned fan 30 includes a rectangular frame body, and each corner of the frame body is provided with two spaced apart flanges 32 , and the flanges 32 are provided with fixing holes 320 for passing through the fixing columns 244 of the air guide cover 20 .

When the above-mentioned heat dissipation device is assembled, the wind guide cover 20 is sleeved on the front side of the radiator 10, so that the positioning part 220 at the rear end of the top plate 22 is correspondingly accommodated in the slot 140 at the top of the radiator 10; the bottom of the two side plates 24 The gap 249 at the end corresponds to the fixing ears 122 on both sides of the front end of the heat sink 10; meanwhile, the mounting flange 246 at the bottom of the two side plates 24 is received on the first fixing ears 122; The mounting flange 246 and the first mounting ear 122 and the additional second mounting ear 124 secure the heat sink to the circuit board while also securing the air guide 20 to the heat sink 10 . Then the fan 30 is placed on the mounting surface on the front side of the air guide cover 20, and the fixing column 244 on the corner where the air guide cover 20 is installed is corresponding to the fixing holes 320 on the two opposite corners of the fan 30, and then the fan 30 is guided toward the fan 30. The mounting surface of the windshield 20 is pressed, so that the fixing column 244 is inserted into the fixing hole 320, and at the same time, the clasp 2420 at the end of the second buckle piece 242 elastically deformed on the other opposite corner of the mounting surface of the windshield 20 slides over the flange 32 of the fan 30. The fan 30 is fixed on the front side of the flange 32 . It can be understood that the installation sequence of the above-mentioned fan 30 can be changed, the fan 30 can be combined with the air guide cover 20 first, and then the air guide cover 20 connected with the fan 30 can be installed on the radiator 10 .

It can be seen that the above-mentioned fan 30 and the air guide cover 20 are combined together by direct buckling, and the air guide cover 20 and the radiator 10 share a fixing member, and the air guide cover is also fixed when the radiator 10 is fixed to the circuit board. On the radiator 10, it can be seen that the operation is saved and simple and convenient. In addition, the air guide cover 20 well seals the space between the radiator 10 and the fan 30 , so that the airflow generated by the fan 30 is blown toward the radiator 10 in a concentrated manner. The apex of the triangular head of the contact portion 120 on the bottom surface of the substrate 12 of the heat sink 10 faces the air guide portion 262 of the air guide cover 20, and the part of the airflow generated by the fan 30 is blown to the contact portion 120 through the air guide holes 262 of the air guide portion 262. Then, the head of the contact portion 120 turns to the electronic components on both sides of the central processing unit, so that the heat dissipation problem of the electronic components around the central processing unit can be solved at the same time.

Claims (12)

1. heat abstractor; Be used for electronic component is dispelled the heat; It comprises a radiator, is positioned at a wind scooper of radiator front side and is installed in the fan on the wind scooper, and said radiator comprises a substrate and from the upwardly extending some radiating fins of substrate, and said substrate is extended with the first fixing ear to both sides; Said wind scooper comprise a top board and from the top board both sides to two side plates that extend below; It is characterized in that: said radiator end face offers catching groove, and said top board bottom surface convexes with the location division that is placed in the catching groove downwards, and said two side plates are extended with to both sides and are undertaken in this first fixing mounting flange on the ear.

2. heat abstractor according to claim 1 is characterized in that: said mounting flange and first fixedly ear offers the mutual corresponding also installing hole and the fixing hole of ccontaining fixture of being communicated with respectively.

3. heat abstractor according to claim 2; It is characterized in that: said side plate rear side bottom corners protrudes out the formation protuberance to both sides; Said mounting flange to the both sides horizontal-extending, and forms the fixedly breach of ear of ccontaining radiator first from the front part positon of near bottom of protuberance below mounting flange.

4. heat abstractor according to claim 3; It is characterized in that: said substrate both sides near first fixedly ear outwards protrude out and form the holding protuberance; Said holding protuberance is positioned at the first fixing rear side of ear; Said holding protuberance offers towards the first fixing long and narrow clamping groove of ear opening, and the bottom of the rear section of said side plate protuberance extends beyond bottom surface and the holding of mounting flange downwards in said clamping groove.

5. according to each described heat abstractor of claim 1 to 4; It is characterized in that: said first fixedly ear stretch out from substrate front end both sides; The both sides, rear end of side plate are outward extended with the second fixing ear, said second fixedly ear offer the fixing hole of ccontaining fixture.

6. heat abstractor according to claim 5 is characterized in that: said mounting flange and the first fixedly thickness that is superimposed of ear approximates the second fixing thickness of ear.

7. according to each described heat abstractor of claim 1 to 4, it is characterized in that: the said top board fore-end diagonally extending that is upturned.

8. heat abstractor according to claim 1 is characterized in that: the vertical top board of said side plate, wind scooper also comprise a base plate of the bottom of vertical connection side plate front part.

9. heat abstractor according to claim 8 is characterized in that: said base plate front side is to extending below an air dam, and the base plate posterior lateral margin extends upward the some spacing protuberance that is against the substrate front side, offers some air-guiding holes on the air dam.

10. heat abstractor according to claim 9 is characterized in that: said substrate bottom surface middle part is convexly equipped with the contact site that contact with electronic component downwards, and the contact site front end forms a leg-of-mutton head, the air-guiding hole of said head tip sensing wind scooper.

11. heat abstractor according to claim 8 is characterized in that: each protrudes out the projection that is inserted in the fixing hole on the fan diagonal angle forward said side plate and top board junction and another side plate and back plate connections.

12. heat abstractor according to claim 8 is characterized in that: with each is convexly equipped with a cramp forward with the top board adjacent on base plate adjacent and another side plate, the cramp end inwardly is convexly equipped with the clasp that fastens with the fan lateral margin on the said side plate.

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