JP3101998U - Heat sink fixing mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink fixing mechanism in which an electronic device is not loosened or displaced from a desired position.
A heat sink has a plurality of vertically extending fins spaced apart, and a pair of fixing members are attached to outermost fins of the heat sink. Each fixing member 30 includes a horizontal plate 30a, a pair of arms 32 extending from two opposite sides of the horizontal plate 30a, and a vertical plate 30b extending vertically from one end of the horizontal plate 30a. It has a pair of wings 31 extending from two opposite sides of the vertical plate 30b, and a pair of elastic flaps 34 extending from the upper end of the wing 31. The fixing member 30 further has a loop 23 on the board 20, and a hook 32 a provided at an end of the arm 32 is engaged with the loop 23, and the heat sink 10 is connected to the heat generating device 21 on the board 20. Fixed to.
[Selection diagram] Fig. 1

Description

  The present invention relates to a heat sink fixing mechanism, and more particularly, to a mechanism for preventing a heat sink from being loosened or displaced.

  With regard to the operating speed of electronic devices such as computers, the faster the support of personal data, the higher the internal temperature of the electronic devices. In an electronic device, a heat sink and a heat dissipation device are indispensable devices for effectively dissipating generated heat and maintaining operating states of various components of the electronic device under an acceptable temperature. Generally, a heat sink is attached to a heat generating device such as a chip on a motherboard of an electronic device or a central processing unit by a fixing mechanism. When the heat sink is attached stably, the heat generated from the electronic device is efficiently dissipated and the electronic device can operate normally.

  However, when the electronic device is loosened or displaced from a desired position, it becomes difficult to assemble the electronic device, and a problem of power loss also occurs. Further, although various types of fixing mechanisms and fixing methods are used for different types of heat sinks, a standard design fixing mechanism has not been developed at present. In this case, the degree of freedom in designing the fixing mechanism is very limited.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat sink fixing mechanism in which an electronic device is not loosened or displaced from a desired position.

  The present invention provides a fixing mechanism for fixing a heat sink to a device that generates heat on a board, thereby preventing the heat sink from being loosened or separated from the heat generating device.

  The heat sink has a plurality of vertically extending fins spaced apart from each other, and the fixing mechanism is constituted by a pair of fixing members.

  The fixing member includes a horizontal plate, a pair of arms extending from both sides of the horizontal plate, a vertical plate extending at a right angle from one end of the horizontal plate, and a pair of wings extending from the vertical plate to both sides. And a pair of elastic flaps extending from the upper end of the wing.

  The arm has a hook at the end, and the fixing member further has a pair of loops formed on the board. By engaging the hooks with the loops, the heat sink is connected to the heat generating device on the board. Fixed to.

The fixing mechanism provided by the present invention has at least the following effects.
1. The heat sink is prevented from loosening and displacing away from the heat generating device.
2. The fixing mechanism can be easily detached from the heat sink.
3. The fixing mechanism can be applied to heat sinks having various shapes.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, common members are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 1 to 4, the present invention provides a fixing mechanism for preventing the heat sink from loosening or moving. The heat sink 10 is made of a material having good thermal conductivity (for example, aluminum or copper). The heat sink 10 is attached to a heat generating device 21 (for example, a chip or a central processing unit) on a motherboard 20 (see FIG. 2) of the electronic product with a heat conductive paste or an adhesive applied to the bottom surface of the heat sink 10. Is preferred.

  The heat sink 10 has a plurality of fins 11 separated from each other by a first gap. As shown, each fin 11 has a rectangular shape extending vertically. In the present embodiment, both outermost fins 11 are divided into two rectangular members with a second gap therebetween, and the vertically extending inner surfaces of each rectangular member further include an upper inner surface and a lower inner surface. And the lower inner surface protrudes from the upper inner surface. The lower inner surface has an upper end portion 12 that gradually descends in a gap between the rectangular members.

  The fixing mechanism has a pair of fixing members 30 for holding or fixing the heat sink between the outermost fins 11. As shown in FIG. 1, each fixing member 30 has a horizontal plate 30a and a vertical plate 30b extending vertically from one end of the horizontal plate 30a. The arm 32 extending from both sides of the horizontal plate 30a has a hook portion 32a at an end. In order to fix the fixing member 30 to the motherboard 20 to which the heat generating device 21 is attached, the motherboard 20 is provided with a pair of loops 23 with which the hook portions 32a engage.

  The vertical plate 30b of each fixing member 30 has a rectangular central portion, a pair of wing portions 31 provided facing each other on the side of the central portion, and a pair of elastic members extending from the upper end of the central portion. And a flap 34. As shown, the rectangular central portion and the wings 31 are substantially flat. On the other hand, the elastic flap 34 is slightly inclined toward the horizontal plate 30a. The lower end of the wing part 31 is gradually descending from the central part.

  In order to hold the heat sink 10, the horizontal plate 30 a of the fixing member 30 is inserted into a gap between the outermost fin 11 and the inner fin 11. When the wings 31 of the fixing member 30 are inserted into the upper end 12, the slightly bent elastic flaps 34 exert a force on the upper inner surface of the outermost fins 11, and the upper end 12 becomes the wings. 31 is prevented from sliding downward. Thereby, the fixing member 30 of the fixing mechanism is engaged with the heat sink 10. The heat sink 10 engaged with the fixing mechanism is fixed to the motherboard 20 by the engagement of the hook 32a and the loop 23, and is located on the device 21 that generates heat.

  Further, the horizontal plate 30a of each fixing member 30 has a through hole 33, whereby the fixing member 30 is further fixed to the motherboard 20 by fasteners 40 and 41 shown in FIGS.

  FIG. 7 shows another embodiment of the arm 32 extending from both sides of the horizontal plate 30 a of the fixing member 30. As shown in the drawing, hinges 42 are formed on both side ends of each horizontal plate 30a, and the arms 32 are rotatably engaged. As in the previous embodiment, the end of the arm 32 farthest from the horizontal plate 30a has a hook 32a at the end so as to engage with the loop 23 attached to the motherboard 20.

  The embodiments described above show typical examples of the present invention, and the scope of the present invention is not limited to these typical embodiments, and may be implemented by those skilled in the art in view of this disclosure. The resulting alterations in shape, structure, dimensions, type of material or manufacturing process are also various variants that are more clearly provided or implied by the specification.

FIG. 3 is an exploded perspective view of a heat sink fixing mechanism according to the present invention. FIG. 2 is a perspective view of an assembly of the fixing mechanism shown in FIG. 1. FIG. 3 is a sectional view of the fixing mechanism shown in FIG. 2. FIG. 3 is a sectional view of the fixing mechanism shown in FIG. 2. It is a perspective view which shows the modification of the fixing mechanism shown in FIG. It is sectional drawing of the fixing mechanism shown in FIG. It is a perspective view showing other embodiments of the present invention.

Explanation of reference numerals

10 ... heat sink,
11 ... fins,
12 ... upper end,
20 ... motherboard,
21 ... heat generator,
23 ... loop,
30 ... fixing member,
30a ... horizontal plate,
30b ... vertical plate,
31 ... wings,
32 ... arm,
32a ... hook part,
33 ... through hole,
34 ... elastic flap,
40, 41 ... fasteners.

Claims (11)

  A heat sink securing mechanism having a plurality of fins spaced apart from each other, the mechanism comprising a pair of securing members, the securing member including an elastic flap inserted into one of the fin spacings of the heat sink. A heat sink fixing mechanism having at least one heat sink.   2. The fixing member according to claim 1, wherein the fixing member has a vertical plate, the elastic flap extends from an upper end of the vertical plate, and a pair of wings extends from opposite ends of the vertical plate. 3. Fixing mechanism.   The outermost fin of the heat sink is divided into two rectangular members at a predetermined interval from each other, and the inner surface of each rectangular member further has an upper inner surface and a lower inner surface. The fixing mechanism according to claim 2, further comprising an upper end protruding from an upper inner surface and gradually descending within a space between the rectangular members.   The fixing mechanism according to claim 1, wherein each of the fixing members has a pair of hooks and a pair of loops with which the hooks are engaged. A heat sink having a plurality of vertically extending fins spaced apart from each other by a first distance, a heat sink fixing mechanism for attaching to a heat generating device on the board by a pair of fixing members, wherein each of the fixing members is
A horizontal plate,
A pair of arms extending from both sides of the horizontal plate and having a hook portion at the end,
A loop formed on the board and provided to be connectable to the hook portion;
A vertical plate extending vertically from one end of the horizontal plate,
A pair of wings extending from opposite side ends of the vertical plate;
A pair of elastic flaps extending from the upper end of the wing,
The fixing mechanism of the heat sink having the.   The heat sink fixing mechanism according to claim 5, wherein the outermost fins of the heat sink are divided into two rectangular members at a second interval from each other.   7. The heat sink fixing mechanism according to claim 6, wherein each of the rectangular members has a vertically extending inner surface, and the inner surface has an upper inner surface and a lower inner surface protruding from the upper inner surface. .   The heat sink fixing mechanism according to claim 7, wherein the lower inner surface has an upper end that gradually descends from the second interval.   9. The heat sink fixing mechanism according to claim 8, wherein each of the wings has a lower end that gradually descends from opposite ends of the vertical plate.   The heat sink according to claim 5, wherein the elastic flap exerts a force on the outermost fin when the vertical plate is inserted between the outermost fin and the inner fin. Fixing mechanism.   The heat sink fixing mechanism according to claim 5, wherein the horizontal plate has a through hole and a fastener for attaching the horizontal plate to a board.

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