JP3017577U - Heat sink with built-in fan - Google Patents

Abstract

(57) [Abstract] [Purpose] A heat dissipation device with a built-in fan that has a good heat dissipation effect and is easy to attach to electronic parts. [Structure] A plurality of fins are provided on the upper surface and one fin-free area is provided at the center of the top surface, and one heatsink is installed on the surface of a semiconductor chip or other electronic component. It has a corresponding shape, it has shoulders on the top, and it is installed on the heat sink, and a large number of fixing elastic hooks are provided on the periphery. By using an elastic hook for fixing, one fixing frame used for fixing the heat sink on the semiconductor chip, and one opening provided for accommodating the blade component in the center are provided. It is installed on the top end of the fin piece, and the blade part is rotatably accommodated in the no fin piece area, and it has multiple fixing elastic hooks on the bottom surface, and the fixing elastic hooks on the bottom end are on the heat sink. Fix the fan on the heat dissipation plate by utilizing the engagement in the recess And one support plate.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a kind of heat dissipation device with a built-in fan, especially one having a simple structure and easy to assemble, which is particularly suitable for heat dissipation of a large integrated circuit or a semiconductor chip such as a central processing unit.

[0002]

[Prior art]

 With the development of microelectronics, most electronic devices, which consisted of many parts, are now replaced by semiconductor chips or large integrated circuits. Each of these semiconductor chips or large integrated circuits contains a large number of electronic logic components, and as a result, a considerable amount of heat is generated in operation, and if this heat is not properly dissipated, semiconductors must be released. This will affect the performance of the chip or large integrated circuit. In order to solve this problem, generally, a semiconductor chip or a large-scale integrated circuit is additionally provided with a device such as a heat radiating piece to radiate heat by using the principle of heat radiation. In addition, some of them add a fan and forcibly generate heat convection using the air flow generated by the fan to radiate heat.

By the way, there are two types of conventional heat dissipation devices for integrated circuit chips. That is, there are a pressure type and a stopper type. Generally, the elastic structure is that the S-shaped spring rod is installed horizontally in the groove on the heat sink, and the frame is combined to sandwich the semiconductor chip. It is something that is fixed. In the case of the stopper type, the heat sink is directly placed on the upper surface of the chip, and the heat sink is fixed on the chip by the C-shaped stopper. Each of these two types of heat dissipation devices has a problem that the heat dissipation effect is poor, and there are some inconveniences in mounting and using them.

[0004]

[Problems to be solved by the device]

 An object of the present invention is to provide a kind of heat dissipation device for electronic parts, which has a good heat dissipation effect and is easy to install and use.

[0005]

[Means for Solving the Problems]

 The heat dissipation device with a built-in fan according to the present invention includes one heat dissipation plate installed on the surface of one semiconductor chip or a large-scale integrated circuit, one fixing frame mounted on the heat dissipation plate, and fixed on the heat dissipation plate. A fan, a plurality of fins are provided on the heat sink, a fin-free area is formed in the central portion, and the fixing frame has a shape corresponding to that of the heat sink. A shoulder part is formed on the heat dissipation plate, and the heat dissipation plate is sewn onto the heat dissipation plate. A plurality of fixing elastic funks are provided on the periphery of the heat dissipation plate. Grasp the rim and fix the heat sink on the semiconductor chip.The fan has one support plate, which has a hole in its center and is used to install the blade part in it. The support plate is installed on the top end of the heat radiating fin piece so that the blade parts can be rotated, and the heat radiating plate has no fin. A plurality of elastic hooks for fixing are provided on the bottom surface of the support plate, and the fan is placed on the heat dissipation plate by utilizing the engagement of the hook part on the bottom end of the hook part inside the heat dissipation plate. Fixed. Further, on the bottom surface of the support plate of the fan, an annular convex edge is provided along the center hole to effectively guide the airflow and pass through the center hole of the support plate.

[0006]

[Action]

 The present invention provides a kind of heat dissipation device with a built-in fan for heat dissipation of electronic parts. The fan built-in heat dissipation device is as follows: a plurality of heat dissipation fin pieces are provided on the upper surface, and one fin area is provided at the center of the upper surface, and the heat dissipation device is installed on the surface of the semiconductor chip or other electronic parts. The heat sink has a shape corresponding to that of the above heat sink and is installed on the heat sink with a shoulder portion on the top and a large number of elastic hooks for fixing are provided on the periphery of the heat sink. By fixing one side edge of the semiconductor chip with the fixing elastic hook of, one fixing frame used for fixing the heat sink onto the semiconductor chip and the blade part in the center In addition to having one open hole to be provided, it is installed on the top end of the fin piece to rotatably accommodate the blade part in the no fin piece area, and has a plurality of fixing elastic hooks on the bottom surface. The elastic hooks for fixing on the bottom end of the heat sink mesh in the recesses on the heat sink. One support plate for fixing the fan on the heat sink is used to mount the fan.First, the heat sink is connected to the surface of the semiconductor chip using the fixing frame, and then the fan is attached. Install the fan above the radiating fin and use the lock function inside the recess on the radiating plate by the elasticity of the hook part of the fixing elastic hook 32 to fix the fan on the radiating plate. It suffices to carry out in order, and thus the heat dissipation device of the present invention is very easy to attach to electronic parts.

[0007]

【Example】

 Please refer to FIG. 1 and FIG. In these figures, the heat dissipation device 10 of the present invention is mounted on a single semiconductor chip 12. In general, the semiconductor chip 12 is fixed on one printed circuit board (not shown) by one connecting seat 14. Since the connection between the semiconductor chip 12 and the connecting seat and the structure thereof are not the gist of the present invention, this part will not be described in the text.

The heat dissipation device 10 of the present invention includes one fan 16, one fixing frame 18, and one heat dissipation plate 20. The bottom structure of the fan 16 is particularly shown in FIG. The fan 16 has a bearing plate 22 with a hole 24 in the center of the bearing plate 22 and a rib or bearing 26 for supporting a blade part 28 in the hole 24, so that It serves to generate an air flow which flows through the holes 24. In order to effectively guide the airflow so as to flow through the hole 24, one annular airflow guiding convex edge 30 is installed along the hole 24 on the bottom surface of the support plate 22. It is extended a distance below the bottom surface of the support plate 22 to form one short air passage, so that the airflow is effectively guided through the hole 24 and flows through the hole 24.

In addition, a fixing elastic hook 32 is provided on the bottom surface of the support plate 22 of the fan. In the embodiment shown in the drawing, the support plate 22 is a rectangular or square plate-shaped part, and four fixing elastic hooks 32 are provided on the bottom surface thereof so as to be located at almost four corners. These four fixing elastic hooks 32 form a pair and are installed relative to each other. Each of the fixing elastic hooks 32 extends downward from the bottom surface of the support plate 22 by one step, and the length thereof allows the fan 16 to be coupled to the heat dissipation plate 20 (which will be described later in detail). The hook portions 34 of each pair of fixing elastic hooks 32 protrude outwardly toward the same side, and the hook portions belonging to different pairs protrude in opposite directions, that is, these two pairs of fixing elastic hooks are fixed. The elastic hooks 32 are installed so as to face each other. This is shown in FIGS. 2 and 3.

Since the structure of the blade component 28 of the fan 16 belongs to the well-known structure, the description thereof will be omitted in this section. However, it should be noted that in FIGS. 1 and 2, an electric wire 36 for transmitting electric energy and a control signal to the blade component 28 is shown.

The heat radiating plate 20 has a rectangular plate-shaped portion 38 shaped to be combined with the support plate 22 of one fan 16 in this embodiment. A plurality of radiating fin pieces 40 projecting upward are provided on the upper surface of the plate-like portion 38, and the radiating fin pieces 40 are arranged in rows in two mutually perpendicular directions, for example, sideways and lengthwise. It is then stretched and its installation method is such that one finless region 42 is formed on the central position of the upper surface of the plate-like portion 38 and the blade component 28 is accommodated therein. In this example, the fin-free area 42 is located in the central circular area of the upper surface of the plate-like portion 38, the blade part 28 is rotatable therein, and the surrounding air is the radiating fins installed around it. The air is sucked in along the gaps 41 between the pieces 40 and further discharged from the holes 24, thereby generating an airflow flowing through the radiating fin pieces 40, forcibly conducting heat convection, and releasing heat.

The height of the radiating fin piece 40 is combined with the length of the elastic hook 32 for fixing on the bottom surface of the support plate 22 of the fan 16, so that when the fan 16 is installed on the radiating plate 20. The bottom surface of the support plate 22 abuts on the top end of the heat dissipation fin piece 40, and the blade part 28 is rotatably installed in the finless area 42. A recess 44 for accommodating the hook portion 34 is provided on the heat dissipation plate 20 at a position facing the hook portion 34 of the fixing elastic hook 32. These recesses 44 can accommodate the hook portions 34 therein, and fix the hook portions 34 therein, thereby fixing the fan 16 on the heat dissipation plate 20. These fixing elastic hooks 32 are manufactured to have an appropriate length by using a material having an appropriate elasticity, and therefore, when they are connected to the heat sink 20, the elastic hooks 32 are locked by using an appropriate elastic deformation. The length is such that the fan 16 can be brought into contact with the top end of the radiating fin piece 40, and the blade part 28 can rotate in the finless region 42 to generate an air flow.

In the embodiment shown in the figures, as shown in FIGS. 1 and 2, the semiconductor chip 12 which radiates heat by the heat radiating device 10 of the present invention usually has one flat surface. The plate-shaped part 38 of the heat sink 20 can be installed thereon. However, it should be noted here that the semiconductor chip 12 to which the present invention can be applied is not limited to this type of structure.

The heat dissipation plate 20 of the heat dissipation device of the present invention on the semiconductor chip 12 is fixed on the semiconductor chip 12 using the fixing frame 18. The fixed frame 18 has a frame rack structure form, and in the embodiment described herein, it is a rectangular frame body having a shape to be combined with the plate-like portion 38 of one heat dissipation plate 20, and the periphery thereof is provided. A rectangular shoulder 48 is formed and is fitted over the perimeter 43 of the plate 38. In addition, a plurality of fixing elastic hooks 50 each having a hook portion 52 at the lower end are provided on the rectangular frame of the fixing frame 18, and the one side edge 54 of the semiconductor chip 12 can be grasped and fixed. In this embodiment, four fixing elastic hooks 50 are provided on the fixing frame 18, and the hook portions 52 are formed in pairs so that the two pairs are extended inward so as to correspond to each other. Grasp the edge 54 of 1 2. The fixing elastic hook 52 is manufactured by using an appropriate elastic material, so that when the fixing elastic hook 52 is bonded onto the edge of the semiconductor chip 12, the fixing elastic hook 52 is appropriately deformed and locked.

In this embodiment, the heat dissipation plate 20 is first coupled to the surface 46 of the semiconductor chip 12 using the fixing frame 18, and then the fan 16 is installed above the heat dissipation fin piece 40 and fixed. The fan 16 is fixed on the heat dissipation plate 20 by utilizing the locking action in the recess 44 on the heat dissipation plate 20 due to the elasticity of the hook portion 34 on the elastic hook 32 for use. Thus, the mounting of the heat dissipation device of the present invention on the semiconductor chip or other electronic components is completed. The removal proceeds in the reverse order. First, the inward elastic deformation of the fixing elastic hook 32 is used to remove the fan 16 from the heat sink 20, and further the outward deformation of the fixing elastic hook 52 is used. The heat sink 20 is removed from the semiconductor chip 12.

As can be seen from the above description, the structure of the heat dissipation device of the present invention is different from the conventional one and is unique to the present invention. In practice, a simpler attachment and detachment method is adopted. It has practicality and novelty.

[0017]

[Effect of device]

 The heat dissipation device of the present invention has a good heat dissipation effect, and is easy to mount and use in electronic parts.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a heat dissipation device of the present invention is mounted on one semiconductor chip, for example, a central processing unit chip of a computer.

FIG. 2 is an exploded perspective view of FIG.

FIG. 3 is a perspective view of the fan of the heat dissipation device of the present invention seen from another angle.

[Explanation of symbols]

10 ... Heat dissipation device 12 ... Semiconductor chip 14.
..Connecting seat 16 ... Fan 18 ... Fixing frame 20 ... Heat dissipation plate 22 ... Bearing plate 24 ... Hole 26 ... Bearing strip 28 ... Blade part 30 ... Annular air flow Leading convex edge 32 ... Elastic hook for fixing 34 ... Hook part 36 ... Electric wire 38 ... Plate-like part 40 ... Radiating fin piece 42 ... No fin area 41 ...
Void 44 ... Recess 48 ... Shoulder 43 ... Surrounding area 5
2 ... Hook part 50 ... Fixing elastic hook 54 ... Edge

Claims (4)

[Scope of utility model registration request] 1. A heat dissipation device with a built-in fan, which is mounted on an electronic component having one surface and is used to radiate heat generated by the electronic component, the device comprising one heat radiating plate and one fixing frame. And one fan device, wherein the heat dissipation plate has one plate-shaped portion, the plate-shaped portion has a first surface and a second surface opposite to the first surface, and the first surface is the electronic component. A plurality of radiating fin pieces is formed on the second surface and extended one step by a first distance in a direction opposite to the first surface, and a fin-free area is formed at a central position of the second surface. Is formed, the fin-free area is surrounded by the radiating fin pieces, and a gap is provided between the radiating fin pieces to allow airflow to pass through, and the fixed frame is combined with the heat radiating plate. One frame having a shape, one shoulder is formed on the periphery thereof, and is fitted on the edge of the plate-shaped portion of the heat dissipation plate, A plurality of elastic hooks are formed on the frame body and extend one step by a second distance downward from the bottom surface of the frame body, and one hook portion is formed on the bottom end of each elastic hook so that one side of the electronic component has elasticity. The radiating plate is locked on the electronic component by locking the edge, and the fan device has one supporting plate, one hole is formed on the central portion thereof, and one blade component is rotatably mounted on the central hole. Installed on the top end of the radiating fin piece,
The blade part is rotatably installed in the finless area,
Therefore, the surrounding air is sucked when the blade part is rotated, and it is made to flow into the no-fin area through the gap between the radiating fin pieces of the heat radiating plate, thereby forming an air flow passing through the center hole and forcing thermal convection. And a plurality of fixing elastic hooks are provided on the bottom surface of the supporting plate, and the fixing elastic hooks are extended downward by a third distance, and one hook portion is provided on the bottom end thereof. Is formed and is combined with the first distance of the radiating fin piece, and is meshed with a corresponding recessed hole formed on the radiating plate, so that the fan device is mounted on the radiating plate. Heat dissipation device with a built-in fan. 2. The fan built-in heat dissipation device according to claim 1, wherein the support plate of the fan device has an annular convex edge surrounding a center hole on the bottom surface. 3. The four fixing elastic hooks are provided on the bottom surface of the support plate of the fan device, and the four fixing elastic hooks form a set, and the hook portions project outward. Heat dissipation device with built-in fan. 4. The heat dissipation device with a built-in fan according to claim 1, wherein the fixing frame has four fixing elastic hooks, which are paired with each other and the hook portions project inward.