CN210325852U

CN210325852U - Maintenance device for LED chip

Info

Publication number: CN210325852U
Application number: CN201921332219.6U
Authority: CN
Inventors: 李漫铁; 谢玲; 屠孟龙; 余亮; 俞苗
Original assignee: Ledman Optoelectronic Co Ltd
Current assignee: Ledman Optoelectronic Co Ltd
Priority date: 2019-08-16
Filing date: 2019-08-16
Publication date: 2020-04-14
Anticipated expiration: 2029-08-16

Abstract

The utility model relates to a maintenance device of LED chip, including solid brilliant machine, still include first suction nozzle, heating mechanism and air feed mechanism. The first suction nozzle is provided with a heat conduction structure, and the heat conduction structure is a heat conduction layer at least partially wrapping the first suction nozzle; the heat conduction structure is used for heat conduction and melting the first welding flux of the failure point of the chip substrate; the heating mechanism is connected with the heat conducting structure; the gas supply mechanism has a gas supply end for being adjacent to and facing the failure point of the chip substrate. Foretell maintenance device of LED chip for the rejection of the point of failure of chip base plate is simple, quick, high-efficient, need not to use professional equipment, and is with low costs, can reject the chip that became invalid and first solder totally, has guaranteed follow-up solid brilliant quality, especially is fit for using in the maintenance of COB flip chip class booth apart from LED product. In the crystal supplementing process, the phenomenon that the adhesion degree of the second welding flux is reduced to influence the stability of welding between the LED chip and the chip substrate is avoided.

Description

Maintenance device for LED chip

Technical Field

The utility model relates to a LED encapsulates technical field, especially relates to a maintenance device of LED chip.

Background

The existing small-interval LED display screen can be realized in two modes of lamp bead patch realization and COB technology, and a damaged lamp bead detected by SMD packaging does not need to be repaired and is directly reported to be abandoned. The lamp beads which fail in the test after the SMT process can be repaired and replaced, and the module with high failure rate can be replaced.

The defective unit board which is not tested before COB packaging can be repaired by returning to die bonding or returning to bonding wires, so that the yield reaches 100%. The failure point is observed manually, and after the position is memorized, the trace is scraped off by proper thrust, and then the crystal and the welding line are compensated again. If the chip fails, the photoresist is removed by drilling holes, the defective points are removed by laser, and the chip is placed and then sealed again and ground. The positive negative pole of LED chip is connected to the PCB circuit through silver thick liquid and bonding wire in the COB encapsulation, and the maintenance needs to go on under the professional equipment, causes the degree of difficulty increase, and the cost increases. The flip chip is damaged by being knocked off by means of thrust or laser, so that the chip or the first welding flux is left, and the quality of subsequent die bonding is influenced; and the tin paste is easy to be oxidized during the crystal solidification, so that the adhesion degree is reduced.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is necessary to provide a maintenance device for LED chips, which is not easy to remove the LED chips after failure and is easy to oxidize solder paste.

The utility model provides a maintenance device of LED chip, includes solid brilliant machine, still includes:

a first nozzle having a thermally conductive structure that is a thermally conductive layer at least partially surrounding the first nozzle; the heat conduction structure is used for heat conduction and melting a first welding flux of a failure point of the chip substrate;

the heating mechanism is connected with the heat conduction structure and is used for heating the heat conduction structure;

the gas supply mechanism is used for providing protective gas, the gas supply mechanism is provided with a gas supply end, and the gas supply end is used for being adjacent to and facing the failure point of the chip substrate.

In one embodiment, the thermally conductive structure entirely surrounds the first nozzle.

In one embodiment, the maintenance device for the LED chip further comprises a second suction nozzle, and the second suction nozzle is used for sucking the first solder or the failed LED chip located at the failure point of the chip substrate.

In one embodiment, the second suction nozzle has a heat conducting portion, which is connected to the heating mechanism.

In one embodiment, the maintenance device for the LED chip further includes an air blowing assembly, the air blowing assembly has an air blowing end, the second suction nozzle has an accommodating cavity, one end of the second suction nozzle has a suction nozzle port, the other end of the second suction nozzle has an air vent, the suction nozzle port, the accommodating cavity and the air vent are sequentially communicated, and the air blowing end is communicated with the air vent.

In one embodiment, the heating mechanism has a heat-conducting connector, and one end of the heat-conducting connector, which is far away from the heating mechanism, is connected with the heat-conducting structure.

In one embodiment, the gas supply mechanism comprises a mechanism body and a connecting pipe body, one end of the connecting pipe body is communicated with the inner space of the mechanism body, and the other end of the connecting pipe body forms the gas supply end.

In one embodiment, the connecting tube body is a flexible tube structure.

In one embodiment, the maintenance device for the LED chip further comprises a driving mechanism, and the driving mechanism is connected to the first suction nozzle.

In one embodiment, the soldering machine further comprises a solder supply mechanism connected with the die bonder, wherein the solder supply mechanism is used for supplying second solder for soldering the effective LED chip.

The maintenance device of the LED chip is characterized in that when the LED chip fails, the heat conduction structure of the first suction nozzle is heated to the preset temperature by the heating mechanism, the first welding flux is used for melting and connecting the failed LED chip and the chip substrate, after the first welding flux is melted, the failed chip is sucked, and the melted first welding flux on the chip substrate is sucked and removed, so that the elimination of the failure point of the chip substrate is simple, quick and efficient by the maintenance device of the LED chip, professional equipment is not needed, the cost is low, in addition, the failed chip and the first welding flux can be completely eliminated, the subsequent die bonding quality is ensured, and the maintenance device is particularly suitable for the maintenance and use of small-spacing LED products such as COB flip chips and the like. For example, the first suction nozzle is in contact with the failed LED chip to heat the failed LED chip, heat is transferred to the first welding flux through the failed LED chip to melt the first welding flux, and the first welding flux is located between the failed LED chip and the chip substrate and is not easy to directly contact the first suction nozzle, so that the first welding flux can be indirectly melted through contacting the failed LED chip, the failed LED chip and the first welding flux can be removed at fixed points, and other chips are not affected. The failed LED chip can be sucked away through the first suction nozzle, and then the first solder is sucked away through the first suction nozzle. In the process of crystal supplement, effective LED chips need to be replenished at failure points of the chip substrate, the gas supply mechanism is used for providing protective gas, the protective gas is blown to second welding fluxes on the chip substrate through the gas supply mechanism, and when the effective LED chips are placed on the second welding fluxes on the chip substrate by the first suction nozzle, the protective gas is blown to the second welding fluxes, so that the second welding fluxes can be prevented from being oxidized, and the adhesion degree of the second welding fluxes is prevented from being reduced to influence the stability degree of welding between the newly replenished effective LED chips and the chip substrate.

Drawings

Fig. 1 is a schematic structural diagram of a maintenance device for an LED chip according to an embodiment;

FIG. 2 is a schematic structural diagram of a first nozzle according to an embodiment;

FIG. 3 is a schematic diagram of a maintenance process of an LED chip according to an embodiment;

FIG. 4 is another schematic diagram of a maintenance process of an LED chip according to an embodiment;

FIG. 5 is another schematic diagram of a repair process for an LED chip according to an embodiment;

FIG. 6 is another schematic diagram of a repair process for an LED chip according to an embodiment;

FIG. 7 is another schematic diagram of a repair process for an LED chip according to an embodiment;

FIG. 8 is another schematic diagram of a repair process for an LED chip according to an embodiment;

FIG. 9 is a schematic structural diagram of a second nozzle according to an embodiment.

Detailed Description

In order to facilitate understanding of the present invention, the maintenance device for the LED chip will be described more fully below with reference to the accompanying drawings. The preferred embodiment of the maintenance device for the LED chip is shown in the attached drawings. However, the LED chip repair device may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure of the repair device for LED chips is more thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the repair device for LED chips is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment, the maintenance device for the LED chip comprises a die bonder, a first suction nozzle, a heating mechanism and an air supply mechanism. In one embodiment, the first nozzle has a thermally conductive structure that is a thermally conductive layer at least partially surrounding the first nozzle; in one embodiment, the heat conducting structure is used for heat conducting first welding flux for fusing a failure point of the chip substrate; in one embodiment, the heating mechanism is connected with the heat conducting structure, and the heating mechanism is used for heating the heat conducting structure; in one embodiment, the gas supply mechanism is configured to provide a shielding gas, and the gas supply mechanism has a gas supply end configured to be adjacent to and facing a failure point of the chip substrate. In one embodiment, the maintenance device for the LED chip comprises a die bonder, a first suction nozzle, a heating mechanism and an air supply mechanism. The first suction nozzle is provided with a heat conduction structure, and the heat conduction structure is a heat conduction layer at least partially wrapping the first suction nozzle; the heat conduction structure is used for heat conduction and melting a first welding flux of a failure point of the chip substrate; the heating mechanism is connected with the heat conduction structure and is used for heating the heat conduction structure; the gas supply mechanism is used for providing protective gas, the gas supply mechanism is provided with a gas supply end, and the gas supply end is used for being adjacent to and facing the failure point of the chip substrate.

As shown in fig. 1, the maintenance apparatus 10 for an LED chip according to an embodiment includes a die bonder (not shown), a first suction nozzle 100, a heating mechanism 200, and an air supply mechanism 300. As shown in FIG. 2, the first nozzle 100 has a thermally conductive structure 110 that is a thermally conductive layer that at least partially surrounds the first nozzle 100. As shown in fig. 3 to 5, the heat conductive structure is used to thermally melt the first solder 40 of the failure point of the chip substrate 30. The heating mechanism 200 is connected to the heat conducting structure 110, and the heating mechanism 200 is used for heating the heat conducting structure 110. The gas supply mechanism 300 is used to provide a protective gas, and the gas supply mechanism 300 has a gas supply end that is used adjacent to and faces the failure point of the chip substrate 30.

The maintenance device 10 for the LED chip is shown in fig. 3 to 5, which are schematic diagrams illustrating a process of removing a failure point by the maintenance device 10 for the LED chip, when the LED chip fails, the heat conduction structure 110 of the first suction nozzle 100 is heated to a preset temperature by the heating mechanism 200 to be used for melting and connecting the failed LED chip 20 and the first solder 40 of the chip substrate 30, after the first solder 40 is melted, the failed chip is sucked, and the melted first solder 40 on the chip substrate 30 is sucked and removed, so that the maintenance device 10 for the LED chip enables the removal of the failure point of the chip substrate 30 to be simple, rapid and efficient, does not need to use professional equipment, has low cost, can completely remove the failed chip and the first solder 40, ensures the quality of subsequent die bonding, and is particularly suitable for maintenance and use of small-pitch LED products such as a COB flip chip. For example, the first suction nozzle 100 is in contact with the failed LED chip 20 to heat the failed LED chip 20, heat is transferred to the first solder 40 through the failed LED chip 20 to melt the first solder 40, and since the first solder 40 is located between the failed LED chip 20 and the chip substrate 30, the first suction nozzle 100 is not easy to be directly contacted, so that the first solder 40 can be indirectly melted by contacting the failed LED chip 20, and fixed-point removal of the failed LED chip 20 and the first solder 40 can be achieved without affecting other chips. The failed LED chip 20 may be sucked away by the first suction nozzle 100, and the first solder 40 may be sucked away by the first suction nozzle 100. Fig. 6 to 8 are schematic diagrams illustrating a process of repairing a chip of the LED chip repair apparatus 10, in the process of repairing a chip, a valid LED chip 60 needs to be repaired again at a failure point of the chip substrate 30, the gas supply mechanism 300 is configured to provide a protective gas, the protective gas is blown to the second solder 50 on the chip substrate 30 through the gas supply mechanism 300, and when the first suction nozzle 100 places the valid LED chip 60 on the second solder 50 on the chip substrate 30, as shown in fig. 7, a dashed arrow indicates a flow direction of the protective gas, and the protective gas is blown to the second solder 50, the second solder 50 can be prevented from being oxidized, and the adhesion of the second solder 50 is prevented from being reduced to affect a stability of the welding between the newly repaired valid LED chip 60 and the chip substrate 30. For example, the heated shielding gas may be blown, and the heated shielding gas may ensure the effect of melting the second solder 50, so that not only the second solder 50 is not oxidized, but also the second solder 50 is heated and is not easily cooled and solidified, thereby ensuring the stability of the effective soldering between the LED chip 60 and the chip substrate 30.

In one embodiment, the gas supply mechanism 300 is a nitrogen supply mechanism or a helium supply mechanism.

In order to improve the heat conduction performance of the first nozzle 100, in one embodiment, as shown in fig. 2, the heat conduction structure 110 entirely wraps the first nozzle 100, so as to improve the heat conduction performance of the first nozzle 100 and improve the efficiency of melting the first solder 40.

In one embodiment, the heating mechanism 200 has a thermally conductive connector, and an end of the thermally conductive connector away from the heating mechanism 200 is connected to the thermally conductive structure 110, and the thermally conductive connector is used for transferring heat from the heating mechanism 200 to the heating structure 110 of the first nozzle 100.

In one embodiment, the gas supply mechanism comprises a mechanism body and a connecting pipe body, one end of the connecting pipe body is communicated with the inner space of the mechanism body, and the other end of the connecting pipe body forms the gas supply end. Through setting up the connecting tube body, be convenient for freely control the stroke of air feed end to conveniently blow protective gas to the point of failure of chip base plate when mending brilliant, prevent that the second solder 50 that is used for welding effective LED chip 60 is by oxidation. In one embodiment, the connecting tube body is of a flexible tube structure, so that the stroke of the gas supply end is more convenient to control.

In order to facilitate the suction of the failed LED chip 20 and the first solder 40, in one embodiment, as shown in fig. 9, a second suction nozzle 500 is further included, and the second suction nozzle 500 is used for sucking the first solder 40 or the failed LED chip 20 located at the failure point of the chip substrate 30. For example, after the first suction nozzle 100 heats the failed LED chip 20, the failed LED chip 20 may be directly sucked away by the first suction nozzle 100 without moving the first suction nozzle 100, and the melted first solder 40 may be sucked clean by the second suction nozzle 500; and the first suction nozzle 100 can suck the failed LED chip 20 and the second suction nozzle 500 can suck the first welding flux 40 at the same time, so that the time is saved, the efficiency of removing the failed LED chip 20 and the first welding flux 40 is improved, and the maintenance efficiency is improved. Or, the first suction nozzle 100 is used for sucking the melted first solder 40, and the second suction nozzle 500 is used for sucking the failed LED chip 20, so that the heated first suction nozzle 100 can be used for sucking the melted first solder 40, thereby avoiding waste of heat energy, and the second suction nozzle 500 is used for sucking the failed chip without heating, thereby saving heat energy.

In one embodiment, as shown in FIG. 9, the second suction nozzle 500 has a heat conducting portion 510, and the heat conducting portion 510 is connected to the heating mechanism 200. At this time, the failed LED chip 20 is sucked by the first suction nozzle 100, the melted first solder 40 is sucked by the heated second suction nozzle 500, and heat is continuously transferred to the first solder 40 by the heated second suction nozzle 500 so that the first solder 40 is kept in a melted state, the first solder 40 is prevented from being solidified, and the second suction nozzle 500 is facilitated to suck the first solder 40 on the chip substrate 30 cleanly.

In order to fully discharge the first solder 40 inside the second suction nozzle 500 after the second suction nozzle 500 sucks the first solder 40, in one embodiment, the maintenance apparatus 10 for LED chips further includes an air blowing assembly, the air blowing assembly has an air blowing end, as shown in fig. 9, the second suction nozzle 500 has a receiving cavity 501, one end of the second suction nozzle 500 has a nozzle opening 502, the other end has a vent 503, the nozzle opening 502, the receiving cavity 501 and the vent 503 are sequentially communicated, and the air blowing end is communicated with the vent 503, so that air can enter from the vent 503 to blow out the first solder 40 in the receiving cavity 501 of the second suction nozzle 500, and the first solder 40 is prevented from being solidified on the wall of the receiving cavity 501 of the second suction nozzle 500 to block the second suction nozzle 500, thereby ensuring that the second suction nozzle 500 can be used for multiple times; heated gas can also be introduced from the vent hole, so that the first solder 40 in the accommodating cavity 501 of the second suction nozzle 500 is in a molten state, and the gas can blow the first solder 40 out conveniently.

In order to facilitate the control of the heating of the first nozzle 100, in one embodiment, the control module 400 is further included, the control module 400 is connected to the heating mechanism 200, the control module 400 controls the heating of the first nozzle 100 by the heating mechanism in real time, and the control module 400 can control the first nozzle 100 to be heated to a preset temperature, that is, the first nozzle 100 is heated to a temperature capable of melting the first solder 40.

To facilitate controlling the air supply of the air supply mechanism 300, in one embodiment, the air supply mechanism 300 is connected to the control module 400, so that the air supply mechanism 300 can be controlled by the control module 400 to supply air in real time. In order to improve the efficiency of maintaining the LED chip, in one embodiment, the maintenance device for the LED chip further includes a driving mechanism connected to the first suction nozzle. Therefore, the movement stroke of the first suction nozzle 100 can be controlled by the driving mechanism, and the automation degree of the maintenance of the LED chip is improved, namely the efficiency of the maintenance of the LED chip is improved.

In order to provide the second solder 50, in one embodiment, a solder supply mechanism connected to the die bonder is further included for supplying the second solder 50 for bonding the active LED chips 60, i.e. for providing the second solder 50 for bonding the active LED chips 60 during the die bonding process. In one embodiment, the die bonder is provided with a dispensing mechanism, and the solder supply mechanism is connected with the dispensing mechanism.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a maintenance device of LED chip, includes solid brilliant machine, its characterized in that still includes:

2. The maintenance device of claim 1, wherein said thermally conductive structure entirely surrounds said first suction nozzle.

3. The repair device of claim 1, further comprising a second suction nozzle for sucking the first solder or a failed LED chip located at a failure point of the chip substrate.

4. The maintenance device according to claim 3, characterized in that the second suction nozzle has a heat conducting portion, which is connected with the heating mechanism.

5. The maintenance device of claim 3, further comprising an air blowing assembly, wherein the air blowing assembly has an air blowing end, the second suction nozzle has a receiving cavity, one end of the second suction nozzle has a suction nozzle port, the other end of the second suction nozzle has an air vent, the suction nozzle port, the receiving cavity and the air vent are sequentially communicated, and the air blowing end is communicated with the air vent.

6. The maintenance device of claim 1, wherein the heating mechanism has a thermally conductive connector, an end of the thermally conductive connector remote from the heating mechanism being connected to the thermally conductive structure.

7. The maintenance device according to claim 1, wherein the gas supply mechanism includes a mechanism body and a connection pipe body, one end of the connection pipe body communicates with the inner space of the mechanism body, and the other end forms the gas supply end.

8. The maintenance device of claim 7, wherein said connection tube is of a flexible tubular construction.

9. The maintenance device of claim 6, further comprising a drive mechanism coupled to the first nozzle.

10. The maintenance device of claim 1, further comprising a solder supply mechanism coupled to said die bonder, said solder supply mechanism for supplying a second solder for bonding said active LED chips.