CN114390802A

CN114390802A - Reflow soldering process and device for chip electronic component

Info

Publication number: CN114390802A
Application number: CN202210128760.5A
Authority: CN
Inventors: 黄潇
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-02-11
Filing date: 2022-02-11
Publication date: 2022-04-22

Abstract

The invention discloses a reflow soldering process for chip electronic components, which comprises the steps of firstly determining a plug-in component and a plug-in hole corresponding to a PCB, printing tin on the plug-in hole and a pad of a chip component on the same surface, pasting the chip component on the same surface, inserting a pin of the corresponding plug-in component into the plug-in hole, simultaneously welding the plug-in component and the chip component on the surface together with the PCB in a reflow furnace, controlling the welding temperature to be 250-285 ℃ and the welding time to be 18-28 s, then checking welding points of the plug-in component and the chip component, performing reflow cooling on extremely high-temperature gas after welding, then discharging the gas into a box body, purifying the gas, and then discharging the gas into the natural environment through a gas outlet pipe, and relates to the technical field of reflow soldering. The residue can begin the landing to the inside collecting vat of box along with the slope on filter screen surface rather than the motion and collect inside to can avoid the filter screen to filter for a long time and the jam problem that takes place, protect outside air circumstance simultaneously.

Description

Reflow soldering process and device for chip electronic component

Technical Field

The invention relates to the technical field of reflow soldering, in particular to a reflow soldering process and a reflow soldering device for a chip electronic component.

Background

Reflow soldering is the production facility of being applied to electronic product and semiconductor package field in a large number, most reflow soldering equipment adopts strong hot-blast convection technique to realize welding process in the existing market, at hot-blast heating's in-process, a large amount of scaling powder volatilizees and welded dust and residue get into the heated gas, if not get rid of volatile scaling powder in the gas and a large amount of residue and dust after reflow soldering accomplishes, harmful gas will follow the emission and get into in the natural environment, destroy the natural ecology, greatly influence the air quality, and when carrying out filtration purification through the filter screen at present, the filter screen then takes place the jam easily, need the continuous clearance of staff, the work that leads to reflow soldering receives the influence.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a reflow soldering process and a reflow soldering device for a chip electronic component, which aim to solve the problems.

In order to achieve the purpose, the invention is realized by the following technical scheme: a reflow soldering process for chip electronic components includes determining plug-in components and corresponding plug-in holes on a PCB, printing tin on the plug-in holes and bonding pads of the same surface of the chip components, pasting the same surface of the chip components, inserting pins of the corresponding plug-in components into the plug-in holes, simultaneously soldering the plug-in components and the chip components on the same surface of the PCB together with the PCB in a reflow furnace, controlling the soldering temperature to be 250-285 ℃ and the soldering time to be 18-28 s, checking soldering points of the plug-in components and the chip components, performing reflow cooling on extremely high-temperature gas after soldering is completed, discharging the discharged medium-high-temperature air into an air inlet pipe to be discharged into a box body, and purifying the air and then discharging the air into the natural environment through an air outlet pipe.

Preferably, two sides of the box body are fixedly connected with one end of the gas inlet pipe, the top of the box body is fixedly connected with one end of the gas outlet pipe, and the box body is internally provided with an automatic rotating and shaking-off mechanism;

automatic rotatory mechanism of shaking off includes gas storage tank, air duct, slip magnetic path, oblique shape lifting groove, the fixed frame of filter screen, elasticity rope, filter screen, bull stick, magnetic path, the gas storage tank is seted up inside the box, the air duct is seted up inside the box, slip magnetic path outer wall and oblique shape lifting groove inner wall sliding connection, oblique shape lifting groove is seted up inside the box, the fixed frame inner wall of filter screen and bull stick outer wall fixed connection, the bull stick both ends are openly passed through the bearing with the box inner wall, the back and are rotated and be connected, the fixed frame outer wall fixed connection of elasticity rope one end and filter screen, the elasticity rope other end and box inner wall fixed connection, the fixed frame inner wall fixed connection of filter screen outer wall and filter screen, the filter screen outer wall is provided with the clean mechanism of centrifugal scraping.

Preferably, the clean mechanism of centrifugal scraping includes connecting block, little elastic cord, scraper blade, elastic plate, articulated board of wiping, connecting block outer wall and filter screen outer wall fixed connection, connecting block outer wall and little elastic cord one end fixed connection, little elastic cord other end and scraper blade outer wall fixed connection, scraper blade outer wall and filter screen outer wall fixed connection, scraper blade outer wall and elastic plate one end fixed connection, the elastic plate other end wipes board outer wall fixed connection with the articulated, articulated board one end of wiping is articulated with the scraper blade outer wall.

Preferably, the inside of the air storage tank is communicated with the inside of the vent groove, the inside of the vent groove is communicated with the inside of the oblique lifting groove, and the inside of the oblique lifting groove is communicated with the outside of the box body, so that air is communicated.

Preferably, the magnetic property of the side of the sliding magnetic block opposite to the magnetic block is opposite polarity, so that opposite polarity attraction is performed.

Preferably, a collecting tank is arranged in the box body, so that the box body can be collected and cleaned in a centralized manner.

Preferably, the elastic pulling force of the elastic rope is smaller than the magnetic attraction force between the magnetic block and the sliding magnetic block, so that the elastic rope cannot be pulled back under the normal magnetic attraction state of the magnetic block and the sliding magnetic block.

The invention provides a reflow soldering process and a reflow soldering device for chip electronic components. The method has the following beneficial effects:

(1) a chip electronic component reflow soldering process and device, through setting up the automatic rotary shaking-off mechanism, the expanded air enters the inclined lifting groove through the air channel, and promote the sliding magnetic block to rise in the inclined lifting groove, the sliding magnetic block drives the magnetic block to rise synchronously through the magnetic attraction between the magnetic blocks when rising, the magnetic block drives the fixed frame of the filter screen and the rotating rod to rotate synchronously, thereby the fixed frame of the filter screen and the filter screen start to rotate, the magnetic attraction between the sliding magnetic block and the magnetic block is larger than the elastic tension of the elastic rope pulling the fixed frame of the filter screen, the fixed frame of the filter screen can be driven to rotate, through the rotary motion of the fixed frame of the filter screen, a large amount of residue filtered at the bottom of the filter screen is inclined, the residue can start to slide to the inside of the collecting tank inside the box body along with the inclination of the surface of the filter screen and the motion thereof for collection, thereby can avoid the filter screen to filter the jam problem that takes place for a long time, protect external air environment simultaneously.

(2) The utility model provides a chip electronic components reflow soldering welding process and device, shakes off the mechanism through setting up the autogiration to can shake off through the quick rotation of filter screen, and with the quick shake off of filter screen surface adhesion's residue, and drop to the collecting vat along with the inclined plane of filter screen self in, accomplish the high-efficient collection to the residue dust, made things convenient for the cleanness after the exhaust-gas purification, makeed air purification efficiency promote.

(3) The utility model provides a piece formula electronic components reflow soldering welding process and device, shake off the mechanism through setting up the autogiration, after the slip magnetic path lasts to rise, the slip magnetic path rises to the top in the oblique lifting groove when, distance between slip magnetic path and the magnetic path is then the limit far away, magnetic attraction between magnetic path and the slip magnetic path this moment then is less than the elastic tension of elastic rope to the fixed frame of filter screen, the fixed frame inside magnetic path of filter screen then breaks away from in the twinkling of an eye and the magnetic attraction between the slip magnetic path, the fixed frame of filter screen is also pulled back by the elasticity that the elastic rope tightened in the twinkling of an eye, make the fixed frame of filter screen carry out a quick rotation, and shake under the elasticity of elastic rope, make the further clean effect of shaking off of promotion filter screen, the problem appearance of the unable landing of intractable residue adhesion in the filter screen surface has been avoided greatly.

(4) The utility model provides a piece formula electronic components reflow soldering welding process and device, through setting up the clean mechanism of centrifugal scraping, carry out quick rotation in the twinkling of an eye at the fixed frame of filter screen, because the rotation rate of the fixed frame of filter screen is very fast, the scraper blade on filter screen surface is outwards thrown away along with rotatory centrifugal force, two scraper blades of filter screen bottom then carry out opposite direction's slip scraping at the filter screen outer wall fast, it is clean to carry out once comprehensive scraping to the filter screen surface, the inside residue that shakes out of filter screen when shaking off with the filter screen carries out the efficient and scrapes, the high efficiency has promoted the anti-clogging effect of filter screen, efficiency and stability when having guaranteed the filter screen and filtering.

(5) The utility model provides a piece formula electronic components reflow soldering welding process and device, through setting up the clean mechanism of centrifugal scraping, after the scraper blade is stopped by little elastic cord pulling, articulated wiping board is again through self continuation forward inertia this moment, also begin the bounce-back in step by extruded elastic plate, shake rotatory opening and shutting rapidly with articulated wiping board, make articulated wiping board carry out quick release to a large amount of residues that filter screen surface scraped, after that carry out quick vibrations automatically cleaning to articulated wiping board self, push away the collection vat of box inside with the more concentrated efficient of residue dust, avoid scattered, clean articulated wiping board self simultaneously, guarantee the clear quick high efficiency of filtration every.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

FIG. 3 is an enlarged view taken at A of FIG. 2 according to the present invention;

fig. 4 is an enlarged view of fig. 3 at B according to the present invention.

In the figure: the device comprises an air inlet pipe 1, a box body 2, an automatic rotary shaking-off mechanism 3, an air storage groove 301, an air vent groove 302, a sliding magnetic block 303, an inclined lifting groove 304, a filter screen fixing frame 305, an elastic rope 306, a filter screen 307, a rotating rod 308, a magnetic block 309, a centrifugal scraping cleaning mechanism 4, a connecting block 401, a small elastic rope 402, a scraping plate 403, an elastic plate 404, a hinged scraping plate 405 and an air outlet pipe 5.

Detailed Description

Referring to fig. 1-4, the present invention provides a technical solution: a reflow soldering process for chip electronic components comprises the steps of firstly determining plug-in components and plug-in holes corresponding to plug-in holes in a PCB, printing tin on the plug-in holes and bonding pads of the same-surface chip components together, pasting the same-surface chip components, inserting pins of the corresponding plug-in components into the plug-in holes, simultaneously enabling the plug-in components and the chip components on the same surfaces to pass through a reflow furnace along with the PCB for soldering, controlling the soldering temperature to be 250-285 ℃ and the soldering time to be 18-28 s, then checking soldering points of the plug-in components and the chip components, carrying out reflow cooling on extremely high-temperature gas after soldering is completed, then discharging the extremely high-temperature gas, introducing the discharged medium-high-temperature air into an air inlet pipe 1 and discharging the air into a box body 2, arranging a collecting groove in the box body 2, and discharging the air into the natural environment through an air outlet pipe 5 after the air is purified.

Two sides of the box body 2 are fixedly connected with one end of the gas inlet pipe 1, the top of the box body 2 is fixedly connected with one end of the gas outlet pipe 5, and the automatic rotating and shaking-off mechanism 3 is arranged in the box body 2;

the automatic rotary shaking-off mechanism 3 comprises an air storage tank 301, the interior of the air storage tank 301 is communicated with the interior of an air channel 302, the interior of the air channel 302 is communicated with the interior of an inclined lifting groove 304, the interior of the inclined lifting groove 304 is communicated with the exterior of the box body 2, the air channel 302 and a sliding magnetic block 303, the magnetism of one side, opposite to the magnetic block 309, of the sliding magnetic block 303 is heteropolar, the inclined lifting groove 304, a filter screen fixing frame 305 and an elastic rope 306, the elastic pulling force of the elastic rope 306 is smaller than the magnetic attraction force between the magnetic block 309 and the sliding magnetic block 303, a filter screen 307, a rotating rod 308 and the magnetic block 309 are arranged in the box body 2, the air channel 302 is arranged in the box body 2, the outer wall of the sliding magnetic block 303 is connected with the inner wall of the inclined lifting groove 304 in a sliding manner, the inner wall of the filter screen fixing frame 305 is fixedly connected with the outer wall of the rotating rod 308, and the two ends of the rotating rod 308 are rotatably connected with the front and the back of the inner wall of the box body 2 through bearings, elastic rope 306 one end and the fixed frame 305 outer wall fixed connection of filter screen, the elastic rope 306 other end and the 2 inner wall fixed connection of box, filter screen 307 outer wall and the fixed frame 305 inner wall fixed connection of filter screen, magnet 309 outer wall fixed connection is inside the fixed frame 305 of filter screen, and filter screen 307 outer wall is provided with the clean mechanism 4 of centrifugal scraping.

Centrifugal scraping cleaning mechanism 4 includes connecting block 401, little elastic cord 402, scraper blade 403, elastic plate 404, articulated board 405 of wiping, connecting block 401 outer wall and filter screen 307 outer wall fixed connection, connecting block 401 outer wall and little elastic cord 402 one end fixed connection, little elastic cord 402 other end and scraper blade 403 outer wall fixed connection, scraper blade 403 outer wall and filter screen 307 outer wall fixed connection, scraper blade 403 outer wall and elastic plate 404 one end fixed connection, the elastic plate 404 other end and articulated board 405 outer wall fixed connection of wiping, articulated board 405 one end of wiping is articulated with scraper blade 403 outer wall.

When in use, during reflow soldering, the generated high-temperature air with residues is discharged into the air inlet pipes 1 at two sides of the box body 2, then enters the box body 2, is discharged through the air outlet pipe 5 at the top of the box body 2, and is filtered and cleaned for one time through the filter screen 307 in the filter screen fixing frame 305, meanwhile, when entering the box body 2 for discharging, the temperature in the box body 2 starts to rise rapidly, so that the air in the air storage tank 301 starts to expand, the expanded air enters the oblique lifting tank 304 through the air vent groove 302, and pushes the sliding magnetic block 303 to rise in the oblique lifting tank 304, when the sliding magnetic block 303 rises, the magnetic block 309 is synchronously driven to rise through the magnetic attraction between the magnetic block 309, the magnetic block 309 drives the filter screen fixing frame 305 and the rotating rod 308 to synchronously and selectively rotate, so that the filter screen fixing frame 305 and the filter screen 307 start to rotate, the magnetic attraction force between the sliding magnetic block 303 and the magnetic block 309 is greater than the elastic attraction force of the elastic rope 306 for pulling the filter screen fixing frame 305, the filter screen fixing frame 305 can be driven to rotate, a large amount of residues filtered at the bottom of the filter screen 307 can be inclined through the rotating motion of the filter screen fixing frame 305, the residues can begin to slide down to the inside of a collecting tank inside the box body 2 along with the inclination and the motion of the surface of the filter screen 307, so that the large amount of residues collected inside the collecting tank can be intensively cleaned by opening a box door, the automatic cleaning of the filter screen 307 itself is realized, the collection of the residues is completed, meanwhile, after the sliding magnetic block 303 continuously ascends, when the sliding magnetic block 303 ascends to the top in the inclined lifting tank 304, the distance between the sliding magnetic block 303 and the magnetic block 309 is far away, at the moment, the magnetic attraction force between the magnetic block 309 and the sliding magnetic block 303 is less than the elastic attraction force of the elastic rope 306 for pulling the filter screen fixing frame 305, the magnet 309 inside the filter screen fixing frame 305 is separated from the magnetic attraction between the sliding magnet 303 instantly, the filter screen fixing frame 305 is pulled back by the elastic force tightened by the elastic rope 306 instantly, so that the filter screen fixing frame 305 rotates rapidly once and vibrates under the elastic force of the elastic rope 306, the further rotating and shaking cleaning effect of the filter screen 307 is improved, the problem that refractory residues are adhered to the surface of the filter screen 307 and cannot slide is greatly solved, meanwhile, when the filter screen fixing frame 305 rotates rapidly instantly, because the rotating speed of the filter screen fixing frame 305 is high, the scraping plates 403 on the surface of the filter screen 307 are thrown outwards along with the rotating centrifugal force, the two scraping plates 403 at the bottom of the filter screen 307 rapidly perform sliding scraping in opposite directions on the outer wall of the filter screen 307, the surface of the filter screen 307 is scraped and cleaned comprehensively, and the residues shaken out from the inside of the filter screen 307 when the filter screen 307 shakes and shakes are scraped off efficiently, high efficiency has promoted the anti-clogging effect of filter screen 307, efficiency and stability when filter screen 307 filters have been guaranteed, simultaneously after scraper blade 403 is stopped by little elastic rope 402 pulling, articulated wiping board 405 continues forward inertia through self equally this moment, also begin the bounce-back in step by extruded elastic plate 404, shake rotatory opening and shutting rapidly articulated wiping board 405, make articulated wiping board 405 carry out quick release to a large amount of residues of filter screen 307 surface scraping, shake automatically cleaning fast articulated wiping board 405 self after that, push away the collection vat of box 2 inside with the more concentrated efficient of residue dust, avoid scattered, clean articulated wiping board 405 self simultaneously, guarantee the clear quick high efficiency of filtration each time.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. A reflow soldering process for chip electronic components is characterized in that: firstly, determining a plug-in component and a plug-in hole on a corresponding PCB, printing tin on the plug-in hole and a bonding pad of a surface-mounted component on the same surface together, mounting the surface-mounted component on the same surface, inserting a pin of the corresponding plug-in component into the plug-in hole, simultaneously welding the plug-in component and the mounting component on the surface together with the PCB in a reflow furnace, controlling the welding temperature to be 250-285 ℃, the welding time to be 18-28 s, then checking welding spots of the plug-in component and the mounting component, performing reflow cooling and then discharging the extremely high temperature gas after welding, introducing the discharged medium and high temperature air into an air pipe (1), discharging the air into a box body (2), purifying the air, and then discharging the air into the natural environment through an air outlet pipe (5).

2. The utility model provides a chip electronic components reflow soldering welding device which characterized in that: the two sides of the box body (2) are fixedly connected with one end of the gas inlet pipe (1), the top of the box body (2) is fixedly connected with one end of the gas outlet pipe (5), and the automatic rotating and shaking-off mechanism (3) is arranged in the box body (2);

the automatic rotating and shaking-off mechanism (3) comprises an air storage tank (301), an air vent groove (302), a sliding magnetic block (303), an inclined lifting groove (304), a filter screen fixing frame (305), an elastic rope (306), a filter screen (307), a rotating rod (308) and a magnetic block (309), wherein the air storage tank (301) is arranged inside the box body (2), the air vent groove (302) is arranged inside the box body (2), the outer wall of the sliding magnetic block (303) is in sliding connection with the inner wall of the inclined lifting groove (304), the inclined lifting groove (304) is arranged inside the box body (2), the inner wall of the filter screen fixing frame (305) is fixedly connected with the outer wall of the rotating rod (308), the two ends of the rotating rod (308) are connected with the front surface and the back surface of the inner wall of the box body (2) through the bearing in a rotating manner, one end of the elastic rope (306) is fixedly connected with the outer wall of the filter screen fixing frame (305), and the other end of the elastic rope (306) is fixedly connected with the inner wall of the box body (2), the utility model discloses a filter screen cleaning mechanism, including filter screen (307), magnet block (309), filter screen (307) outer wall and the fixed frame of filter screen (305) inner wall fixed connection, magnet block (309) outer wall fixed connection is inside the fixed frame of filter screen (305), filter screen (307) outer wall is provided with the clean mechanism of centrifugal scraping (4).

3. The reflow soldering apparatus for chip electronic components as claimed in claim 2, wherein: clean mechanism (4) of centrifugal scraping include connecting block (401), little elasticity rope (402), scraper blade (403), elastic plate (404), articulated wiping board (405), connecting block (401) outer wall and filter screen (307) outer wall fixed connection, connecting block (401) outer wall and little elasticity rope (402) one end fixed connection, little elasticity rope (402) other end and scraper blade (403) outer wall fixed connection, scraper blade (403) outer wall and filter screen (307) outer wall fixed connection, scraper blade (403) outer wall and elastic plate (404) one end fixed connection, elastic plate (404) other end and articulated wiping board (405) outer wall fixed connection, articulated wiping board (405) one end is articulated with scraper blade (403) outer wall.

4. The reflow soldering apparatus for chip electronic components as claimed in claim 3, wherein: the inside of the air storage groove (301) is communicated with the inside of a vent groove (302), the inside of the vent groove (302) is communicated with the inside of an inclined lifting groove (304), and the inside of the inclined lifting groove (304) is communicated with the outside of the box body (2).

5. The reflow soldering apparatus for chip electronic components as claimed in claim 4, wherein: the magnetism of one side of the sliding magnetic block (303) opposite to the magnetic block (309) is opposite.

6. The reflow soldering apparatus for chip electronic components as claimed in claim 5, wherein: the box body (2) is internally provided with a collecting tank.

7. The reflow soldering apparatus for chip electronic components as claimed in claim 6, wherein: the elastic pulling force of the elastic rope (306) is smaller than the magnetic attraction force between the magnetic block (309) and the sliding magnetic block (303).