CN103442524B - Patch module assembly and disassembly methods - Google Patents
Patch module assembly and disassembly methods Download PDFInfo
- Publication number
- CN103442524B CN103442524B CN201310371742.0A CN201310371742A CN103442524B CN 103442524 B CN103442524 B CN 103442524B CN 201310371742 A CN201310371742 A CN 201310371742A CN 103442524 B CN103442524 B CN 103442524B
- Authority
- CN
- China
- Prior art keywords
- patch module
- circuit board
- stannum
- stove
- slicker solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 241000500888 Lepisma saccharina Species 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 239000000155 melt Substances 0.000 claims abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 238000005755 formation reaction Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 230000001737 promoting Effects 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000875 corresponding Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 208000002925 Dental Caries Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001702 transmitter Effects 0.000 description 1
Abstract
The present invention provides a kind of patch module assembly and disassembly methods, comprises the following steps, and step A, is preheated to required molten stannum temperature without slicker solder stove；Step B, by formation thermal insulation layer bonded to each other for the high temperature gummed tapes of 3 to 5 layers；Step C, the pin at the back side of the fitting part of circuit board correspondence patch module is cut short；Step D, it is put in stannum panel surface by parallel for high temperature gummed tape, circuit board is positioned on described high temperature gummed tape and by circuit board being heated without slicker solder stove, after the stannum of patch module both sides all melts, promotes patch module gently with tweezers tip.Step E, new patch module need to be assembled in circuit board；The patch module assembly and disassembly methods of the present invention uses practicality high, can all melt and the stannum point bottom patch module without dry joint phenomenon, easily positions and without increasing scaling powder.
Description
Technical field
The present invention relates to a kind of patch module assembly and disassembly methods.
Background technology
In prior art, generally use hot blast plate rifle that the stannum on circuit board is heated so that it is after fusing, to be easy to the dismounting of patch module.This kind of method is suitable only for when the module of required paster is small chip or BGA package.When the module of required paster is paster IC or during for volume bigger module, needs owing to element is excessive heat gun long-play with molten stannum, be easily caused the damage of local element and circuit board, small chip or BGA package are positioned also operating difficulties.Easily cause dry joint, blow afloat copper sheet by problems such as component wear, and use hot blast plate rifle to need when dismounting to use scaling powder.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the present invention provides a kind of patch module assembly and disassembly methods, comprises the following steps:
Step A, it is preheated to required molten stannum temperature without slicker solder stove；
Step B, by formation thermal insulation layer bonded to each other for the high temperature gummed tapes of 3 to 5 layers；
Step C, the pin at the back side of the fitting part of circuit board correspondence patch module is cut short；
Step D, it is put in stannum panel surface by parallel for thermal insulation layer, circuit board is positioned on described high temperature gummed tape and by circuit board being heated without slicker solder stove, by tweezers tip promotion patch module gently after the stannum of patch module both sides all melts
Step E, new patch module need to be assembled in circuit board；New patch module leg is added stannum by unleaded brazier；Circuit board, patch module are put in stannum stone or metal plate for standing a stove on as a precaution against fire heated baking, and patch module and silk-screen position on circuit board are to good；After stannum to be seen all melts, board pads and patch module is allowed to be fully contacted to cooling with tweezers by tight patch module.
Further, in described step A, 450 degrees Celsius will be set to without slicker solder furnace temperature and be held open 15 minutes or more than 15 minutes.
Further, in described step B, the size of the thermal insulation layer that described high temperature gummed tape is made is more than the molten stannum cavity size of described stove without slicker solder.
Further, in described step D, during promoting patch module, patch module is promoted towards circuit board edge direction.
Further, in described step A to E, described stove without slicker solder keeps being horizontally disposed with.
Further, in described step A to E, the thermal insulation layer that described stove without slicker solder is made by high temperature gummed tape with circuit board keeps isolation.
Compared to prior art, the patch module assembly and disassembly methods of the present invention uses practicality high, can all melt and the stannum point bottom patch module without dry joint phenomenon, easily positions and without increasing scaling powder.
Accompanying drawing explanation
Fig. 1 is the flow chart of steps of the patch module assembly and disassembly methods of the present invention.
Detailed description of the invention
The present invention is further described for explanation and detailed description of the invention below in conjunction with the accompanying drawings.
Refer to Fig. 1, the invention provides a kind of patch module assembly and disassembly methods, for carrying out assembling, dismantling by corresponding for the patch module such as bluetooth module, transmitter module circuit board.Described patch module assembly and disassembly methods comprises the following steps:
Stove without slicker solder is preheated to required molten stannum temperature.First will heat without slicker solder stove before dismounting patch module, be provided with molten stannum cavity without slicker solder stove, and the temperature gear without slicker solder stove be transferred to about 450 degree and open the temperature holding of 15 minutes or more than 15 minutes stannum cavitys fusion stably.
Make thermal insulation layer.By formation thermal insulation layer bonded to each other for the high temperature gummed tapes of 3 to 5 layers, the shape of high temperature gummed tape is consistent with the stone or metal plate for standing a stove on as a precaution against fire shape without slicker solder stove.The size of the thermal insulation layer that high temperature gummed tape is made is more than the molten stannum cavity size without slicker solder stove, thus prevents circuit board from directly contacting and cause damage without slicker solder stove to without slicker solder stove.
Circuit board pretreatment.The pin at the back side of the fitting part of circuit board correspondence patch module is cut short.When this step is for preventing from toasting circuit board, the scruff in stannum stove remains on circuit boards, and preferably high temperature gummed tape can be fitted in circuit board so that heat conduction.
Patch module is dismantled.Stove without slicker solder reach temperature required after, be put in stannum panel surface by parallel for the thermal insulation layer pasted；The required circuit board carrying out dismantling, assembling is positioned on high temperature gummed tape, in order to by circuit board being heated without slicker solder stove.In heating process, circuit needs the one side of laminating patch module dorsad without slicker solder stove.Whether the stannum observing patch module both sides in heating process there is fusing, by tweezers tip promotion patch module gently after the stannum of patch module both sides all melts, and patch module is taken off.During promoting patch module, need to promote patch module towards toward circuit board edge direction.This step should be noted that the pushing direction of patch module, prevent it from colliding with other elements of patch module periphery；Patch module is handled with care when taking out as far as possible, and does not promote the shell of patch module, because the chip slapper that patch module inside is minitype paster element and BGA package, when taking out, inside modules temperature is the highest simultaneously, is easily caused inside modules element and produces displacement.
Patch module assembles.This step needs new patch module is assembled in circuit board.In an assembling process, new patch module leg is added stannum by unleaded brazier；In heating process, circuit needs the one side of laminating patch module dorsad without slicker solder stove.Circuit board, patch module are put in stannum stone or metal plate for standing a stove on as a precaution against fire heated baking, and patch module and silk-screen position on circuit board are to good；After stannum to be seen all melts, board pads and patch module is allowed to be fully contacted to cooling with tweezers by tight patch module.When this step notes upper module, module corresponding with circuit board silk-screen can not have off normal, after having good positioning after stannum melts, has avoided the occurrence of shaking phenomenon with tweezers by tight module, has prevented inside modules element from occurring that displacement causes bad.
In circuit board heating process, circuit board is not directly contacted with the holding without slicker solder stove, and needs to ensure that the temperature without slicker solder stove, less than required molten stannum temperature, prevents from being scalded by circuit board without slicker solder stove in circuit board heating process.In heating process, it is horizontally disposed with without slicker solder stove, is positioned over smooth table top.Avoid rocking when taking out, assembling module causes inside modules element to shift as far as possible.The patch module assembly and disassembly methods of the present invention uses practicality high, can all melt and the stannum point bottom patch module without dry joint phenomenon, easily positions and without increasing scaling powder.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert the present invention be embodied as be confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, it is also possible to make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a patch module assembly and disassembly methods, it is characterised in that: comprise the following steps:
Step A, it is preheated to required molten stannum temperature without slicker solder stove；
Step B, by formation thermal insulation layer bonded to each other for the high temperature gummed tapes of 3 to 5 layers；
Step C, the pin at the back side of the fitting part of circuit board correspondence patch module is cut short；
Step D, it is put in stannum panel surface by parallel for thermal insulation layer, circuit board is positioned on described high temperature gummed tape and by circuit board being heated without slicker solder stove, after the stannum of patch module both sides all melts, promotes patch module gently with tweezers tip；
Step E, new patch module need to be assembled in circuit board；New patch module leg is added stannum by unleaded brazier；Circuit board, patch module are put in stannum stone or metal plate for standing a stove on as a precaution against fire heated baking, and patch module and silk-screen position on circuit board are to good；After stannum to be seen all melts, board pads and patch module is allowed to be fully contacted to cooling with tweezers by tight patch module；
In described step A, 450 degrees Celsius will be set to without slicker solder furnace temperature and be held open more than 15 minutes.
Patch module assembly and disassembly methods the most according to claim 1, it is characterised in that: in described step B, the size of the thermal insulation layer that described high temperature gummed tape is made is more than the molten stannum cavity size of described stove without slicker solder.
Patch module assembly and disassembly methods the most according to claim 1, it is characterised in that: in described step D, during promoting patch module, patch module is promoted towards circuit board edge direction.
Patch module assembly and disassembly methods the most according to claim 1, it is characterised in that: in described step A to E, described stove without slicker solder keeps being horizontally disposed with.
Patch module assembly and disassembly methods the most according to claim 1, it is characterised in that: in described step A to E, the thermal insulation layer that described stove without slicker solder is made by high temperature gummed tape with circuit board keeps isolation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310371742.0A CN103442524B (en) | 2013-08-23 | Patch module assembly and disassembly methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310371742.0A CN103442524B (en) | 2013-08-23 | Patch module assembly and disassembly methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103442524A CN103442524A (en) | 2013-12-11 |
| CN103442524B true CN103442524B (en) | 2016-11-30 |
Family
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101502903A (en) * | 2009-03-11 | 2009-08-12 | 清华大学 | Method for dissembling and processing waste and old circuit board for reuse of component |
| CN102371412A (en) * | 2011-11-16 | 2012-03-14 | 苏州伟翔电子废弃物处理技术有限公司 | Device and method for removing electronic devices/components and soldered tin from waste circuit boards |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101502903A (en) * | 2009-03-11 | 2009-08-12 | 清华大学 | Method for dissembling and processing waste and old circuit board for reuse of component |
| CN102371412A (en) * | 2011-11-16 | 2012-03-14 | 苏州伟翔电子废弃物处理技术有限公司 | Device and method for removing electronic devices/components and soldered tin from waste circuit boards |
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