CN202678482U - Waveguide duplexer device - Google Patents
Waveguide duplexer device Download PDFInfo
- Publication number
- CN202678482U CN202678482U CN 201220297778 CN201220297778U CN202678482U CN 202678482 U CN202678482 U CN 202678482U CN 201220297778 CN201220297778 CN 201220297778 CN 201220297778 U CN201220297778 U CN 201220297778U CN 202678482 U CN202678482 U CN 202678482U
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- duplexer
- aluminium
- time formed
- waveguide
- soldering
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Abstract
The utility model relates to a waveguide duplexer device, comprising an aluminium chamber body of the duplexer, a one-time formed backflow soldering tin sheet and an aluminium cover plate of the duplexer. A joint surface of the aluminium chamber of the duplexer is provided with a positioning pin, a one-time formed backflow soldering tin sheet is positioned on the joint surface of the aluminium chamber of the duplexer through the positioning pin, the joint surface is also provided with the aluminium cover plate of the duplexer fastened with a screw, and the one-time formed backflow soldering tin sheet is jointed through performing melting soldering between the aluminium chamber body of the duplexer and the aluminium cover plate of the duplexer in a backflow soldering manner. By adopting an ultrathin soldering tin sheet connection structure and the backflow soldering manner, good electrical performance and mechanical performance of a microwave device are achieved in microwave high frequency bands, the production efficiency is greatly improved, so the waveguide duplexer device is very suitable for mass production, and not only can cost be saved, but also stable product quality and electrical performance are guaranteed.
Description
Technical field
The utility model relates to a kind of waveguide duplexer device, belongs to the communication equipment technical field.
Background technology
The reflow solder technique of infrared heating mode is comparatively generally used in the eighties, it is fast to have heating, the characteristics such as energy-conservation, reliable operation, but because the PCB wiring board is kept in motion with the chain rail, in different warm areas, radiation absorptivity there is very large difference, cause the non-uniform temperature of PCB wiring board, therefore progressively eliminate.
To the nineties full hot air reflux solder technology progressively bring into use, a kind ofly to force airflow circulating by convection current jet blower or heat resisting exhauster, thereby realization reflow soldering, overcome the weak points such as non-uniform temperature of reflow soldering during the motion of PCB wiring board chain rail, for guaranteeing circulation, air-flow must possess certain pressure, causes so to a certain extent shake and the element dislocation of PCB.
Be to adopt the form of point gum machine point glue or manual spot-gluing to carry out the scolding tin laying in the market mostly, then carry out reflow soldering.
The utility model content
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of waveguide duplexer device is provided.
The purpose of this utility model is achieved through the following technical solutions:
The waveguide duplexer device, characteristics are: the aluminium cavity that comprises duplexer, the Aluminum cover of one-time formed reflow tin soldering sheet and duplexer, faying face at the aluminium cavity of duplexer is provided with alignment pin, one-time formed reflow tin soldering sheet is provided with the location hole that matches with described alignment pin, one-time formed reflow tin soldering sheet is positioned by described alignment pin on the faying face of aluminium cavity of duplexer, the Aluminum cover that duplexer is also arranged by screw fastening on its faying face, one-time formed reflow tin soldering sheet melt weldering by solder reflow between the Aluminum cover of the aluminium cavity of duplexer and duplexer is combined.
Further, above-mentioned waveguide duplexer device, wherein, the location hole on the described one-time formed reflow tin soldering sheet has two, about each one.
The substantive distinguishing features that technical solutions of the utility model are outstanding and significant progressive being mainly reflected in:
The utility model adopts ultra-thin solder plate syndeton to cooperate solder reflow, make microwave device obtain good electrical property and mechanical performance in the microwave high-frequency section, replaced tradition to utilize elargol or tin cream to toast the close contact effect that reaches at high temperature with baking oven.The contrast traditional handicraft, the utility model has improved production efficiency greatly, is highly suitable for producing in enormous quantities, not only can save cost, and guarantee stable product quality and electric property, and is simple to operate, and superior performance is very practical.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: the structural representation of one-time formed reflow tin soldering sheet.
Embodiment
The waveguide duplexer device, the aluminium cavity that comprises duplexer, the Aluminum cover of one-time formed reflow tin soldering sheet and duplexer, faying face at the aluminium cavity of duplexer is provided with alignment pin, one-time formed reflow tin soldering sheet 1 is provided with the location hole 101 that matches with alignment pin, as shown in Figure 1, location hole 101 has two, about each one, one-time formed reflow tin soldering sheet is positioned by described alignment pin on the faying face of aluminium cavity of duplexer, the Aluminum cover that duplexer is also arranged by screw fastening on its faying face, one-time formed reflow tin soldering sheet melt weldering by solder reflow between the Aluminum cover of the aluminium cavity of duplexer and duplexer is combined.
During concrete the making, adopt grinding tool and cutting technique to produce one-time formed reflow tin soldering sheet 1, by the size of solder plate, composition, thickness etc. important parameter being carried out theory and accurately design, after positioning by the alignment pin on the aluminium cavity of duplexer, directly be routed on the faying face of aluminium cavity of duplexer, cover at last the Aluminum cover of duplexer, tightly fixing with the electric screwdriver drivescrew.By reflow soldering being carried out accurately temperature control, one-time formed reflow tin soldering sheet 1 is melted and combination between waveguide duplexer cavity and cover plate fully, guarantee reliability and the consistency of welding, effectively avoided having guaranteed reliable electrical properties and the mechanical performance of microwave diplexer product because the inhomogeneous phenomenon of electromagnetic wave leakage that causes of welding occurs.
By to the accurate design of solder plate and good cutting technique, cooperate simultaneously the utilization of Reflow Soldering technology, the particularly use of infrared hot wind Reflow Soldering technology can make product obtain good electrical characteristic and mechanical property, is suitable for large-scale production in enormous quantities.
In concrete production process, solder plate is located accurately by the alignment pin on the duplexer cavity, simultaneously, because the precision that precisely reaches technique of design, the high request of cavity flatness, guaranteed the evenness that solder plate is laid, made on the solder plate solder side that has been attached to the duplexer cavity tightly.
By means of the homogeneous heating temperature of each warm area of Reflow Soldering equipment, guaranteed the uniformity that solder plate melts, thereby guaranteed the consistency of welding and the reliability of weld strength.
In sum, the utility model adopts ultra-thin solder plate syndeton to cooperate solder reflow, make microwave device obtain good electrical property and mechanical performance in the microwave high-frequency section, replaced tradition to utilize elargol or tin cream to toast the close contact effect that reaches at high temperature with baking oven.The contrast traditional handicraft, the utility model has improved production efficiency greatly, is highly suitable for producing in enormous quantities, not only can save cost, and guarantee stable product quality and electric property, and is simple to operate, and superior performance is very practical.
What need to understand is: the above only is preferred implementation of the present utility model; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (2)
1. waveguide duplexer device, it is characterized in that: the aluminium cavity that comprises duplexer, the Aluminum cover of one-time formed reflow tin soldering sheet and duplexer, faying face at the aluminium cavity of duplexer is provided with alignment pin, one-time formed reflow tin soldering sheet is provided with the location hole that matches with described alignment pin, one-time formed reflow tin soldering sheet is positioned by described alignment pin on the faying face of aluminium cavity of duplexer, the Aluminum cover that duplexer is also arranged by screw fastening on its faying face, one-time formed reflow tin soldering sheet melt weldering by solder reflow between the Aluminum cover of the aluminium cavity of duplexer and duplexer is combined.
2. waveguide duplexer device according to claim 1, it is characterized in that: the location hole on the described one-time formed reflow tin soldering sheet has two, about each one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220297778 CN202678482U (en) | 2012-06-25 | 2012-06-25 | Waveguide duplexer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220297778 CN202678482U (en) | 2012-06-25 | 2012-06-25 | Waveguide duplexer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202678482U true CN202678482U (en) | 2013-01-16 |
Family
ID=47499362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220297778 Expired - Fee Related CN202678482U (en) | 2012-06-25 | 2012-06-25 | Waveguide duplexer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202678482U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709627A (en) * | 2012-06-25 | 2012-10-03 | 世达普(苏州)通信设备有限公司 | Waveguide duplexer device |
-
2012
- 2012-06-25 CN CN 201220297778 patent/CN202678482U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709627A (en) * | 2012-06-25 | 2012-10-03 | 世达普(苏州)通信设备有限公司 | Waveguide duplexer device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130116 Termination date: 20180625 |