CN103286405A - Method for separating elements and solder from waste printed circuit board - Google Patents
Method for separating elements and solder from waste printed circuit board Download PDFInfo
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- CN103286405A CN103286405A CN2013101808637A CN201310180863A CN103286405A CN 103286405 A CN103286405 A CN 103286405A CN 2013101808637 A CN2013101808637 A CN 2013101808637A CN 201310180863 A CN201310180863 A CN 201310180863A CN 103286405 A CN103286405 A CN 103286405A
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- printed circuit
- circuit board
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- scolder
- pcb
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Abstract
The invention discloses a method for separating elements and solder from a waste printed circuit board. The method is characterized by including: using brown fused alumina particles as heating media, and using a flat-bottom electric furnace for heating the brown fused alumina particles; and placing a welding surface of the printed circuit board downwards, flatly placing the printed circuit board on the heated brown fused alumina particles, applying vertical downward force to an element surface of the printed circuit board to enable the welding surface to be in full contact with the heated brown fused alumina particles, taking out the printed circuit board after the solder is molten completely, placing the welding surface upwards and the element surface downwards, applying vertical impact force to the welding surface, and enabling the solder and the elements to be separated from the printed circuit board. The method is low in energy consumption, low in cost, high in separating efficiency and good in separating effect.
Description
Technical field
The present invention relates to a kind of from the discarded printed circuit boards the method for resolution element and scolder.
Background technology
Printed circuit board (PCB) is called for short PCB, is the indispensable part of electric equipment products.Along with the develop rapidly of electronics industry and the continuous application of new and high technology, superseded electronic apparatus quantity is increased sharply, and has produced a large amount of discarded printed circuit boards thus, if not in addition suitable recycling will bring serious threat to environmental protection.Experiment detects and shows that the most of functions of the element on the discarded printed circuit boards are intact, still can continue to use; Simultaneously, owing to contain various poisonous, harmful substances and precious metal in the electronic component, before carrying out the circuit board recycling, if the element on it is removed, can simplify follow-up recovery technology greatly, especially reduce the cost of investment of environmental protection equipment in the subsequent treatment.Therefore, carry out separating of element and scolder at discarded printed circuit board (PCB), the one, the element that acquisition can be reused, the 2nd, simplify follow-up recovery technology.
Both at home and abroad existing from the discarded printed circuit boards the method for resolution element and scolder mainly contain:
1, air heat method: Chinese patent CN101417358A and CN1600458A, by firing equipment with air heat, hot-air is contacted with printed circuit board (PCB), utilize the temperature difference between hot-air and the printed circuit board (PCB), thereby the transmission that causes heat makes scolder reach the temperature of thawing.But the air thermal conductivity is low, and heat time heating time is long, and thermal loss is many; Element Yin Gaowen in the heating process and produce poisonous and harmful substance, contaminated environment.
2, infrared heating: US Patent No. 4270260 and US6301436B1, utilize infrared heater to give off the infrared ray of certain wavelength to printed circuit board (PCB), circuit board produces heat energy because thereby the absorption infrared-ray causes the fierce vibration of self molecular structure generation, realizes the thawing of scolder.This method complex process, firing equipment and auxiliary facility are had relatively high expectations, and in the heating process often because look quick effect and shielding phenomenon cause temperature contrast between different elements; In addition, element internal is easy to generate higher thermal stress, thereby reduces the service life of recycling member.
3, LASER HEATING method: European patent EP 13345-A as heating source, utilizes the high characteristics of laser beam good directivity and power density with laser, by optical system laser beam is assembled and direct irradiation on the solder joint of element, make the instantaneous thawing of scolder.This method needs complete set of equipments, the cost height, and complex process, and be point-to-point mode of heating, removal efficiency is low.This method only is suitable for separating the element of indivedual high values.
4, silicone oil heating: Chinese patent CN1832663A, printed circuit board (PCB) is immersed in the high-temperature fluid silicone oil, make the scolder of solder side produce thawing.This method can produce poisonous, pernicious gas in a large number, comprises the gas of liquid silicone oil volatilization generation and the gas of substrate for printed circuit board and element generation.In addition, be attached with a large amount of silicone oil on the element after the separation and the scolder, bring a lot of troubles for follow-up cleaning.
5, scolder heating: Chinese patent CN101695706A, with the tin stove solid solder is melted earlier, then the not element-cont one side of printed circuit board (PCB) is fully contacted with liquid solder,, adopt the mode of vibration that element is separated at last with the printed circuit board (PCB) solder side up.This method has two shortcomings, the one, liquid solder can produce a large amount of poisonous, harmful smoke (comprising the flue gas of heavy metal lead, board substrate and element volatilization in the scolder etc.) in heating process, the 2nd, when taking circuit board away from the liquid solder surface, solder side can be taken away expensive scolder in the tin stove, As time goes on, the scolder in the tin stove can be fewer and feweri.
Summary of the invention
The present invention is for avoiding above-mentioned existing in prior technology weak point, provides that a kind of energy consumption is low, cost is low, separative efficiency is high, the resolution element from the discarded printed circuit boards of good separating effect and the method for scolder.
The present invention adopts following technical scheme for the technical solution problem:
The characteristics of the present invention's method of resolution element and scolder from the discarded printed circuit boards are: adopt brown corundum in granules as heat medium, at first utilize flat electric furnace that brown corundum in granules is heated; Then with the solder side of printed circuit board (PCB) down, lie on the heated brown corundum in granules, and in the component side of the printed circuit board (PCB) application of force vertically downward, make solder side fully contact with the brown corundum in granules of heating, treat that scolder melts fully after, printed circuit board (PCB) is taken out, solder side up, component side applies vertical impact power to solder side down, makes scolder and element be able to separate from printed circuit board (PCB).
The characteristics of the present invention's method of resolution element and scolder from the discarded printed circuit boards also are to carry out as follows:
A, the brown corundum in granules of the different-grain diameter that mixes is put into the flat electric furnace of controllable temperature, and make its surfacing;
B, utilize the flat electric furnace of controllable temperature that brown corundum in granules is heated to 350-390 ℃, and remain on 350-390 ℃;
C, with the solder side of printed circuit board (PCB) down lies on the brown corundum in granules, and in the component side of the printed circuit board (PCB) application of force vertically downward, makes solder side fully contact with brown corundum in granules, heats the scolder of solder side to be melted fully in 3-4 minute;
D, take out printed circuit board (PCB), make its solder side up, component side down, solder side is applied vertical impact power makes its vibrations, make scolder and element be able to separate from printed circuit board (PCB).
The characteristics of the present invention's method of resolution element and scolder from the discarded printed circuit boards also are:
The brown corundum in granules composition by mass percentage of described different-grain diameter is: the 40-60% that is for 10-30%, particle diameter 1-2mm of particle diameter 2-3mm, that particle diameter is not more than 1mm is 10-40%.
Describedly solder side is applied vertical impact power refer to: adopting reciprocating type Pneumatic immpacting device that solder side is applied frequency is 5 times vertical impact power each second.
Compared with prior art, the present invention has the following advantages:
1, the inventive method energy consumption is low, and thermal loss is little.Palm fibre corundum main chemical is Al
2O
3, the coefficient of heat conduction is high more a lot of than air and liquid.Brown corundum in granules is heated, and temperature rises fast, and thermal loss is little;
2, the inventive method is with low cost.Adopt brown corundum in granules as heat transfer medium, price is very cheap, and can use repeatedly, and character and quality all can not change, and the electric furnace heating cost is also very low;
3, the inventive method generation flue gas is few.The coefficient of heat conduction height of palm fibre corundum, firing rate to scolder on the circuit board is fast, suitably control heating-up temperature and heat time heating time, circuit board can not burnt, element also is not easy to be damaged, with respect to liquid heating and air heat, the flue gas of generation will lack a lot, and follow-up smoke gas treatment expense also will be hanged down comparatively speaking;
4, the inventive method separative efficiency height.Because the whole solder side that is printed circuit board (PCB) fully contacts with brown corundum in granules, so firing rate is fast, separative efficiency is all higher than air heat, infrared heating and LASER HEATING;
5, the inventive method good separating effect.The solder side of printed circuit board (PCB) fully contacts with brown corundum in granules, and temperature rises fast, and the solder joint surface tension that solder side is molten state is little, and when imposing the vertical impact power of high frequency, element and scolder come off from circuit board rapidly, good separating effect;
6, the inventive method handling safety.Adopt solid-state granular brown corundum to carry out the heat conduction, can not produce the sputtering phenomenon of liquid heat medium in separation process, operator's safety is guaranteed.
The specific embodiment
In concrete the enforcement, the method for resolution element and scolder is to carry out as follows from the discarded printed circuit boards:
1, the brown corundum in granules of the different-grain diameter that mixes is put into the flat electric furnace of controllable temperature, and make its surfacing;
2, utilize the flat electric furnace of controllable temperature that brown corundum in granules is heated to 350-390 ℃, and remain on 350-390 ℃;
3, with the solder side of printed circuit board (PCB) down, lie on the brown corundum in granules, and in the component side of the printed circuit board (PCB) application of force vertically downward, make solder side fully contact with brown corundum in granules, heat and the scolder of solder side was melted fully in 3-4 minute;
4, take out printed circuit board (PCB), make its solder side up, component side down, solder side is applied vertical impact power makes its vibrations, make scolder and element be able to separate from printed circuit board (PCB).
In concrete the enforcement, the brown corundum in granules composition by mass percentage of different-grain diameter is: the 40-60% that is for 10-30%, particle diameter 1-2mm of particle diameter 2-3mm, particle diameter is not more than the 10-40% that is of 1mm.
Solder side is applied vertical impact power to be referred to: adopting reciprocating type Pneumatic immpacting device that solder side is applied frequency is 5 times vertical impact power each second.
Embodiment 1:
Present embodiment method of resolution element and scolder from the discarded printed circuit boards is:
By mass percentage, the brown corundum in granules of the brown corundum in granules of 10% particle diameter 2-3mm, 50% particle diameter 1-2mm and brown corundum in granules that 40% particle diameter is not more than 1mm mixed equably put into electric furnace, and make its surfacing, utilize electric furnace that brown corundum in granules is heated to 350 ℃, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the brown corundum in granules of heating down, and apply vertical force it is fully contacted with brown corundum in granules.Heat after 4 minutes, scolder melts fully on the printed circuit board (PCB), takes out printed circuit board (PCB), make its solder side up, component side down, adopting reciprocating type Pneumatic immpacting device that solder side is applied frequency is 5 times vertical impact power each second, scolder can be separated from printed circuit board (PCB) with element.In the present embodiment, particle diameter is that the shared mass percent of bulky grain palm fibre corundum of 2-3mm is less, is 10%; Particle diameter is that the shared mass percent of the following granule palm fibre corundum of 2mm reaches 90%, so the interval between the brown corundum in granules is less, the solder side of printed circuit board (PCB) can fully contact with brown corundum in granules, the thawing of scolder is effective, and the components and parts rate of recovery can reach 96%, and the scolder rate of recovery reaches 95%.
Embodiment 2:
Present embodiment method of resolution element and scolder from the discarded printed circuit boards is:
By mass percentage, the brown corundum in granules of the brown corundum in granules of 30% particle diameter 2-3mm, 50% particle diameter 1-2mm and brown corundum in granules that 20% particle diameter is not more than 1mm mixed equably put into electric furnace, and make its surfacing, utilize electric furnace that brown corundum in granules is heated to 370 ℃, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the brown corundum in granules of heating down, and apply vertical force it is fully contacted with brown corundum in granules.Heat after 3 minutes, scolder melts fully on the printed circuit board (PCB), takes out printed circuit board (PCB), makes its solder side up, and component side applies as the high frequency vertical impact power among the embodiment 1 solder side down, scolder can be separated from printed circuit board (PCB) with element.Compare with embodiment 1, in the present embodiment, the shared mass percent of bulky grain palm fibre corundum of particle diameter 2-3mm increases to 30%, cause the interval between the brown corundum in granules to increase, the printed circuit board (PCB) solder side is not too abundant with contacting of brown corundum in granules, the thawing effect of scolder relatively will variation, the components and parts rate of recovery 92%, the scolder rate of recovery 91%.
Embodiment 3:
In the present embodiment from the discarded printed circuit boards the method for resolution element and scolder be:
By mass percentage, the brown corundum in granules of the brown corundum in granules of 10% particle diameter 2-3mm, 60% particle diameter 1-2mm and brown corundum in granules that 30% particle diameter is not more than 1mm mixed equably put into electric furnace, and make its surfacing, utilize electric furnace that brown corundum in granules is heated to 380 ℃, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the brown corundum in granules of heating down, and apply vertical force it is fully contacted with brown corundum in granules.Heat after 3.5 minutes, scolder melts fully on the printed circuit board (PCB), takes out printed circuit board (PCB), makes its solder side up, and component side applies as the high frequency vertical impact power among the embodiment 1 solder side down, scolder can be separated from printed circuit board (PCB) with element.Compare with embodiment 1, in the present embodiment, the shared mass percent of brown corundum in granules of particle diameter 1-2mm increases to 60%, interval between the palm fibre corundum in granules increases slightly, the full contact of printed circuit board (PCB) solder side and brown corundum in granules is relative to be reduced to some extent, scolder melts effect and also decreases the components and parts rate of recovery 95%, the scolder rate of recovery 94% thereupon.
Embodiment 4:
Present embodiment method of resolution element and scolder from the discarded printed circuit boards is:
By mass percentage, the brown corundum in granules of the brown corundum in granules of 20% particle diameter 2-3mm, 60% particle diameter 1-2mm, brown corundum in granules that 20% particle diameter is not more than 1mm mixed equably put into electric furnace, and make its surfacing, utilize electric furnace that brown corundum in granules is heated to 390 ℃, and keep this temperature-resistant.The solder side of printed circuit board (PCB) is lain on the brown corundum in granules of heating down, and apply vertical force it is fully contacted with brown corundum in granules.Heat after 3 minutes, scolder melts fully on the printed circuit board (PCB), takes out printed circuit board (PCB), makes its solder side up, and component side applies vertical impact power as the high frequency among the embodiment 1 to solder side down, scolder can be separated from printed circuit board (PCB) with element.Compare with embodiment 3, in the present embodiment, the shared mass percent of brown corundum in granules of particle diameter 2-3mm increases to 20%, interval between the palm fibre corundum in granules increases slightly, the full contact of printed circuit board (PCB) solder side and brown corundum in granules is relative to be reduced to some extent, scolder melts effect and also decreases the components and parts rate of recovery 94%, the scolder rate of recovery 93%.
Claims (4)
1. the method for resolution element and scolder from the discarded printed circuit boards is characterized in that: adopt brown corundum in granules as heat medium, at first utilize flat electric furnace that brown corundum in granules is heated; Then with the solder side of printed circuit board (PCB) down, lie on the heated brown corundum in granules, and in the component side of the printed circuit board (PCB) application of force vertically downward, make solder side fully contact with the brown corundum in granules of heating, treat that scolder melts fully after, printed circuit board (PCB) is taken out, solder side up, component side applies vertical impact power to solder side down, makes scolder and element be able to separate from printed circuit board (PCB).
According to claim 1 from the discarded printed circuit boards the method for resolution element and scolder, it is characterized in that carrying out as follows:
A, the brown corundum in granules of the different-grain diameter that mixes is put into the flat electric furnace of controllable temperature, and make its surfacing;
B, utilize the flat electric furnace of controllable temperature that brown corundum in granules is heated to 350-390 ℃, and remain on 350-390 ℃;
C, with the solder side of printed circuit board (PCB) down lies on the brown corundum in granules, and in the component side of the printed circuit board (PCB) application of force vertically downward, makes solder side fully contact with brown corundum in granules, heats the scolder of solder side to be melted fully in 3-4 minute;
D, take out printed circuit board (PCB), make its solder side up, component side down, solder side is applied vertical impact power makes its vibrations, make scolder and element be able to separate from printed circuit board (PCB).
According to claim 1 from the discarded printed circuit boards the method for resolution element and scolder, it is characterized in that: the brown corundum in granules composition by mass percentage of described different-grain diameter is: the 40-60% that is for 10-30%, particle diameter 1-2mm of particle diameter 2-3mm, that particle diameter is not more than 1mm is 10-40%.
According to claim 1 and 2 from the discarded printed circuit boards the method for resolution element and scolder, it is characterized in that: describedly solder side is applied vertical impact power refer to: adopting reciprocating type Pneumatic immpacting device that solder side is applied frequency is 5 times vertical impact power each second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180863.7A CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180863.7A CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
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| Publication Number | Publication Date |
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| CN103286405A true CN103286405A (en) | 2013-09-11 |
| CN103286405B CN103286405B (en) | 2015-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310180863.7A Expired - Fee Related CN103286405B (en) | 2013-05-15 | 2013-05-15 | Method for separating elements and solder from waste printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025025A (en) * | 2020-09-03 | 2020-12-04 | 上海第二工业大学 | Desoldering and separating device for electronic components |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4270260A (en) * | 1978-10-10 | 1981-06-02 | Krueger Ellison F | Method for the salvage and restoration of integrated circuits from a substrate |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101695706A (en) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | Equipment capable of industrially implementing entire dismantlement of waste and old circuit board component |
| CN103372697A (en) * | 2012-04-16 | 2013-10-30 | 中国科学院化学研究所 | Sand dismantling method for removing electronic components on substrate |
-
2013
- 2013-05-15 CN CN201310180863.7A patent/CN103286405B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4270260A (en) * | 1978-10-10 | 1981-06-02 | Krueger Ellison F | Method for the salvage and restoration of integrated circuits from a substrate |
| US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
| US6301436B1 (en) * | 2000-10-12 | 2001-10-09 | Yu-Ju Hsiao | Photothermic desoldering unit |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101695706A (en) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | Equipment capable of industrially implementing entire dismantlement of waste and old circuit board component |
| CN103372697A (en) * | 2012-04-16 | 2013-10-30 | 中国科学院化学研究所 | Sand dismantling method for removing electronic components on substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025025A (en) * | 2020-09-03 | 2020-12-04 | 上海第二工业大学 | Desoldering and separating device for electronic components |
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| CN103286405B (en) | 2015-07-01 |
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