JPS63177958A - Vertically moving device for guide rail for conveying printed circuit board - Google Patents

Vertically moving device for guide rail for conveying printed circuit board

Info

Publication number
JPS63177958A
JPS63177958A JP896487A JP896487A JPS63177958A JP S63177958 A JPS63177958 A JP S63177958A JP 896487 A JP896487 A JP 896487A JP 896487 A JP896487 A JP 896487A JP S63177958 A JPS63177958 A JP S63177958A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
guide rail
heat transfer
liquid tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP896487A
Other languages
Japanese (ja)
Other versions
JPH059190B2 (en
Inventor
Kenji Kondo
近藤 権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP896487A priority Critical patent/JPS63177958A/en
Publication of JPS63177958A publication Critical patent/JPS63177958A/en
Publication of JPH059190B2 publication Critical patent/JPH059190B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor

Abstract

PURPOSE:To prevent a heat transfer liquid from being discharged to the outside of a soldering device by lowering and rising guide rails of a heating liquid tank part by means of a vertical moving device. CONSTITUTION:A hydraulic cylinder operates and a movable base 63 descends when a printed circuit board 1 comes to movable rails 70. The rails 70 are, therefore, lowered as well respectively by means of supporting bars. The printed circuit board 1 is preheated in the part upper than the boundary face 6b of the vapor 6a layer of the heat transfer liquid 6. The preheated printed circuit board descends further to enter the vapor 6a layer where the circuit board is heated and soldered. The soldered printed circuit board 1 is returned to the home position as a movable base 63 is raised by the operation of the hydraulic cylinder and the rails 70 are raised as well. The vapor of the heat transfer liquid is thereby stagnated in the heating liquid tank 8 and the discharge of the vapor of the heat transfer liquid to the outside is prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野] この発明は、プリント基板をガイドレールの係合溝に係
合して順次間欠的に搬送せしめるとともに、プリント基
板を下降、上昇させてはんだ付けを行うプリント基板搬
送用ガイドレールの上下動装置に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention engages a printed circuit board with an engagement groove of a guide rail and transports it sequentially and intermittently, and also lowers and raises the printed circuit board to perform soldering. This invention relates to a device for vertically moving a guide rail for carrying printed circuit boards.

〔従来の技術〕[Conventional technology]

第10図は従来の蒸気相はんだ付け装置の一例を示す側
断面図で、1はプリント基板、2はチップ部品、3は前
記プリント基板1にあらかじめ塗布されたはんだペース
ト、4は蒸気相はんだ付け装置、5は貯溜槽、6は熱転
移液で、−例としてフッ素系不活性液体であるフロリナ
ート(住友スリー′エム株式会社の商標名)が使用され
ている。
FIG. 10 is a side sectional view showing an example of a conventional vapor phase soldering device, in which 1 is a printed circuit board, 2 is a chip component, 3 is a solder paste applied in advance to the printed circuit board 1, and 4 is a vapor phase soldering device. In the apparatus, 5 is a storage tank, and 6 is a heat transfer liquid, for example, Fluorinert (trade name of Sumitomo 3M Co., Ltd.), which is a fluorine-based inert liquid, is used.

6aは前記熱転移液6の蒸気で、はんだペースト3の融
解点よりも高い温度を有する。7はヒータ、8は加熱液
槽、9は前記プリント基板1の搬入口、10は前記プリ
ント基板1の搬送路となる搬入側通路、10aは前記搬
入側通路10の傾斜面、11は搬出口、12は同じく搬
送路となる搬出側通路、12aは前記搬出側通路12の
傾斜面、13は冷却器、14は前記搬入口9および搬出
口11から排出された蒸気6aを回収するカバー、15
は前記プリント基板1を搬送する手段としての搬送チェ
ーンである。また、搬送チェーン15の代りにベルトコ
ンベアであってもよい。
6a is the vapor of the heat transfer liquid 6, which has a temperature higher than the melting point of the solder paste 3. 7 is a heater, 8 is a heating liquid tank, 9 is a loading port for the printed circuit board 1, 10 is a loading passage serving as a transport path for the printed circuit board 1, 10a is an inclined surface of the loading passage 10, and 11 is a loading port. , 12 is a discharge side passage which also serves as a transport path, 12a is an inclined surface of the discharge side passage 12, 13 is a cooler, 14 is a cover for collecting the steam 6a discharged from the carry-in port 9 and the carry-out port 11, 15
is a conveyance chain as a means for conveying the printed circuit board 1. As shown in FIG. Moreover, a belt conveyor may be used instead of the conveyance chain 15.

16は前記搬送チェーン15のスプロケットで、ベルト
コンベアの場合はローラが使用される。
16 is a sprocket of the conveyor chain 15, and in the case of a belt conveyor, rollers are used.

従来の蒸気相はんだ付け装置4は上記のように構成され
ているので、プリント基板1を搬送チェーン15の保持
爪(図示せず)に係合するか、またはベルトコンベアに
載置して搬送し、ヒータ7により加熱された熱転移液6
の蒸気6aによりはんだペースト3を融解してはんだ付
けを行った後、融解したはんだが凝固することによりチ
ップ部品2がプリント基板1に固着され搬出していた。
Since the conventional vapor phase soldering apparatus 4 is configured as described above, the printed circuit board 1 is engaged with the holding claws (not shown) of the conveyor chain 15 or placed on a belt conveyor and conveyed. , a heat transfer liquid 6 heated by a heater 7
After the solder paste 3 was melted by the steam 6a and soldering was performed, the molten solder solidified and the chip component 2 was fixed to the printed circuit board 1 and carried out.

また、蒸気6aは冷却器13により冷却され液体となっ
て回収されていた。
Further, the steam 6a was cooled by the cooler 13 and recovered as a liquid.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、従来の蒸気相はんだ付け装置4では、蒸気6
aが冷却されて液体の熱転移液6となフて搬送チェーン
(またはベルトコンベア)15に付着する。このため搬
送チェーン15の走行により熱転移液6が排出口11か
ら蒸気相はんだ付け装置4の外部へ排出されて回収が不
可能になる。したがって高価な熱転移液6の消耗が多く
、不経済であるため製品コストが上昇するという問題点
があった。
By the way, in the conventional vapor phase soldering device 4, the steam 6
a is cooled and becomes a liquid heat transfer liquid 6, which adheres to a conveying chain (or belt conveyor) 15. Therefore, as the conveyor chain 15 runs, the heat transfer liquid 6 is discharged from the discharge port 11 to the outside of the vapor phase soldering apparatus 4, making it impossible to recover it. Therefore, there is a problem in that the expensive heat transfer liquid 6 is consumed a lot, which is uneconomical and increases the product cost.

この発明は、上記問題点を解決するためになされたもの
で、搬送路内にプリント基板を係合して搬送するガイド
レールを設けるとともに、熱転移液の蒸気を貯溜槽内に
滞留させることにより熱転移液がはんだ付け装置の外部
に排出されるのを防止するために加熱液槽部分のガイド
レールを下降、上昇させるプリント基板搬送用ガイドレ
ールの上下動装置を得ることを目的とする。
This invention was made in order to solve the above-mentioned problems, and includes a guide rail that engages and transports the printed circuit board in the transport path, and also allows the vapor of the heat transfer liquid to stay in the storage tank. The object of the present invention is to provide a vertical movement device for a guide rail for carrying a printed circuit board, which lowers and raises a guide rail in a heating liquid tank portion in order to prevent heat transfer liquid from being discharged to the outside of a soldering device.

〔問題点を解決するための手段〕[Means for solving problems]

この発明にかかるプリント基板搬送用ガイドレールの上
下動装置は、プリント基板の搬送路に沿ってプリント基
板を係合する係合溝を設けたガイドレールと、このガイ
ドレールの途中の加熱液槽の上部の部分に設けた可動レ
ールと、この可動レールを上下動せしめる駆動装置と、
ガイドレールと平行に設けた長尺状の軸体と、この軸体
の長手方向に所定間隔で複数個直列に固着してプリント
基板を搬送せしめる係合片と、軸体を長手方向に所定間
隔だけ往復動作させ、かつ軸体の軸心を中心とした円周
方向に所定角度だけ正逆に回動させることにより係合片
にプリント基板が係脱してプリント基板を順次間欠搬送
せしめる駆動手段とを備えたものである。
The device for vertically moving a guide rail for conveying a printed circuit board according to the present invention includes a guide rail provided with an engagement groove for engaging a printed circuit board along a conveyance path of the printed circuit board, and a heated liquid tank in the middle of the guide rail. A movable rail provided in the upper part, a drive device that moves this movable rail up and down,
A long shaft provided parallel to the guide rail, a plurality of engagement pieces fixed in series at predetermined intervals in the longitudinal direction of the shaft to transport the printed circuit board, and a plurality of engagement pieces fixed at predetermined intervals in the longitudinal direction of the shaft, a driving means that reciprocates the printed circuit board by a predetermined angle in the circumferential direction about the axis of the shaft body and rotates it forward and backward by a predetermined angle, thereby causing the printed circuit board to engage and disengage from the engagement piece, thereby sequentially and intermittently conveying the printed circuit board; It is equipped with the following.

〔作用〕[Effect]

この発明においては、ガイドレールの係合溝に係合して
搬送されるプリント基板が加熱液槽の上部の可動レール
のところに来ると、可動レールが下降して加熱液槽内に
滞留している熱転移液の蒸気の中に浸漬される。また、
加熱液槽内にある熱転移液の蒸気やガイドレールの係合
溝内に付着した熱転移液が外部へ排出されることがほと
んどなく、加熱液槽に戻り回収される。
In this invention, when the printed circuit board that is engaged with the engagement groove of the guide rail and is conveyed reaches the movable rail at the top of the heating liquid tank, the movable rail descends and remains in the heating liquid tank. immersed in the vapor of a heat transfer liquid. Also,
The vapor of the heat transfer liquid in the heating liquid tank and the heat transfer liquid adhering to the engagement groove of the guide rail are almost never discharged to the outside and are returned to the heating liquid tank and collected.

(実施例〕 第1図はこの発明の一実施例の概略を示す側断面図、第
2図は、第1図のプリント基板の搬送装置の部分を拡大
して示す平面図、第3図は第2図のI−I線による側断
面図、第4図は第2図のプリント基板搬出口側から見た
図、第5図はプリント基板送り出し装置の一部をさらに
拡大して示す側面図、第6図は第5図のII −II線
による断面図、第7図はガイドレールの詳細を示す側面
図、第8図はこの発明のプリント基板搬送用ガイドレー
ルの上下動装置を示す斜視図、第9図は第8図の動作を
示す説明図である。
(Embodiment) FIG. 1 is a side cross-sectional view schematically showing an embodiment of the present invention, FIG. 2 is a plan view showing an enlarged portion of the printed circuit board conveying device in FIG. 1, and FIG. FIG. 4 is a side sectional view taken along line I-I in FIG. 2, FIG. 4 is a view seen from the printed circuit board exit side in FIG. 2, and FIG. 5 is a side view showing a further enlarged part of the printed circuit board delivery device. , FIG. 6 is a sectional view taken along the line II--II in FIG. 5, FIG. 7 is a side view showing details of the guide rail, and FIG. 8 is a perspective view showing the vertical movement device for the guide rail for conveying printed circuit boards of the present invention. 9 are explanatory diagrams showing the operation of FIG. 8.

これらの図において、第10図と同一符号は同一部分を
示し、1aは前記プリント基板1の搬送方向(矢印A方
向)の前端部、1bは後端部を示す。21は蒸気相はん
だ付け装置の全体を示す。
In these figures, the same reference numerals as in FIG. 10 indicate the same parts, 1a indicates the front end of the printed circuit board 1 in the transport direction (direction of arrow A), and 1b indicates the rear end. 21 shows the entire vapor phase soldering device.

22は前記プリント基板1を搬送する固定側と可動側の
ガイドレール、23は前記プリント基板1を係合する係
合溝、24は前記プリント基板1を係合溝23内で載置
して円滑に搬送させるために設けた車輪、25は前記固
定側のガイドレール22を装着した固定台、26は前記
可動側のガイドレール22を装着した可動軸受、27は
前記プリント基板1の保持幅を設定するため可動軸受2
6を螺合した回転可能のねじ桿、28は前記固定台25
を固着し、可動軸受26と摺動可能に嵌合した固定軸、
29は前記ねじ桿27を回転せしめるハンドル、30は
前記ねじ桿27に固着されたスプロケット、31は前記
ガイドレール22に係合されたプリント基板1を間欠的
に送り出すプリント基板送り出し装置で、第5図、第6
図にその詳細を示す。32は前記プリント基板送出し装
置31の台座で、33は前記プリント基板1の保持幅に
応じて台座32をプリント基板1の搬送方向(矢印六方
向)と直角方向に移動させるねじ桿、34.35は前記
ねじ桿33に固着されたスプロケット、36は前記各ス
プロケット30゜34を連結するローラチェーン、37
は前記プリント基板送出し装置31の基板、38は前記
台座32と基板37とを連結して固定する連結板、39
は長尺状の軸体で、その軸心方向はガイドレール22お
よびおよびプリント基板1の搬送方向(矢印A方向)と
平行に設けられている。4oは前記軸体39の外周に設
けた円筒で、第5図にその詳細を示す。軸体39は第6
図に示すように、軸体39の稜線が円筒4oの内周と接
触しないようになっている。41は前記円筒40の両端
に形成されたフランジ、42は前記円筒40の長手方向
に形成された切欠部で軸体39の移動により後述の係合
片46の通過を可能にしている。43は前記円筒40の
フランジ41に固着された軸受、44は前記軸受43に
設けられ、軸体39上を走行する車輪、45は前記台座
32に取り付けられ、円筒40の外周上を走行する車輪
、係合片46は軸体39に複数個直列に所定間隔(ピッ
チP)で取り付けられ、係合時はプリント基板1の後端
部1bを押して搬送する。47は前記軸体39の端部に
取り付けられた連結板、48は前記連結板47に固着さ
れた軸受、49は前記軸受48に嵌合され軸心方向に対
して自在にスライドする軸である。そして、連結板47
.軸受48゜軸49により軸体39と基板37とを連結
する連結手段が形成される。50は前記軸49の一端を
回動自在に取り付けた軸受、51はローラチェーンで、
軸受50を取り付けである。52はスプロケットで、5
2Aは駆動用のスプロケット、52B、52c、52D
は従動用のスプロケットである。53は前記基板37に
取り付けられローラチェーン51を走行させる駆動手段
としてのモータ、54は台車、55は前記台車54の車
輪、56は前記台車54が走行するガイドレール、57
は前記基板37と台車54とを連結する連結棒、5日は
ローラチェーンである。
22 is a guide rail on the fixed side and a movable side for transporting the printed circuit board 1; 23 is an engagement groove for engaging the printed circuit board 1; and 24 is a guide rail for smoothly placing the printed circuit board 1 in the engagement groove 23. 25 is a fixed base on which the fixed side guide rail 22 is attached, 26 is a movable bearing on which the movable side guide rail 22 is attached, and 27 is a setting for the holding width of the printed circuit board 1. Movable bearing 2
6 is screwed into a rotatable screw rod; 28 is the fixed base 25;
a fixed shaft fixedly fixed to the movable bearing 26 and slidably fitted to the movable bearing 26;
29 is a handle for rotating the screw rod 27; 30 is a sprocket fixed to the screw rod 27; 31 is a printed circuit board feeding device for intermittently feeding the printed circuit board 1 engaged with the guide rail 22; Figure, 6th
The details are shown in the figure. 32 is a pedestal of the printed circuit board delivery device 31; 33 is a screw rod for moving the pedestal 32 in a direction perpendicular to the conveying direction (six directions of arrows) of the printed circuit board 1 according to the holding width of the printed circuit board 1; 34. 35 is a sprocket fixed to the threaded rod 33; 36 is a roller chain connecting each sprocket 30° 34; 37
38 is a board of the printed circuit board delivery device 31; 38 is a connecting plate that connects and fixes the base 32 and the board 37; 39;
is an elongated shaft body, and its axial direction is provided parallel to the guide rail 22 and the conveyance direction (direction of arrow A) of the printed circuit board 1. 4o is a cylinder provided on the outer periphery of the shaft body 39, the details of which are shown in FIG. The shaft body 39 is the sixth
As shown in the figure, the ridgeline of the shaft body 39 does not come into contact with the inner circumference of the cylinder 4o. 41 is a flange formed at both ends of the cylinder 40, and 42 is a notch formed in the longitudinal direction of the cylinder 40, which allows an engagement piece 46 (described later) to pass through by movement of the shaft body 39. 43 is a bearing fixed to the flange 41 of the cylinder 40; 44 is a wheel provided on the bearing 43 and runs on the shaft body 39; 45 is a wheel attached to the pedestal 32 and runs on the outer periphery of the cylinder 40. A plurality of engaging pieces 46 are attached to the shaft body 39 in series at a predetermined interval (pitch P), and when engaged, push the rear end portion 1b of the printed circuit board 1 and transport it. 47 is a connecting plate attached to the end of the shaft body 39, 48 is a bearing fixed to the connecting plate 47, and 49 is a shaft that is fitted into the bearing 48 and freely slides in the axial direction. . And the connecting plate 47
.. The bearing 48° shaft 49 forms a connecting means for connecting the shaft body 39 and the substrate 37. 50 is a bearing rotatably attached to one end of the shaft 49, 51 is a roller chain,
The bearing 50 is now installed. 52 is a sprocket, 5
2A is the driving sprocket, 52B, 52c, 52D
is a driven sprocket. 53 is a motor attached to the substrate 37 and serves as a driving means for driving the roller chain 51; 54 is a truck; 55 is a wheel of the truck 54; 56 is a guide rail on which the truck 54 runs; 57
5 is a connecting rod that connects the board 37 and the trolley 54, and 5 is a roller chain.

61は前記ガイドレール22に係合されたプリント基板
1を上下動させるプリント基板搬送用ガイドレールの上
下動装置、62は固定台、63は可動台、64は前記可
動台63の案内軸、65は前記可動台63を上下すφた
めの駆動装置としての油圧シリンダ、66は前記油圧シ
リンダ65のロッド、67は前記可動台63に固着され
た支持棒、68は前記プリント基板1の搬送方向(矢印
A方向)と直角方向に移動可能の支持棒、69は前記支
持棒68をスライド可能に垂下して嵌合せしめる案内孔
、7oは前記加熱液槽8の上部の部分に設けられ、かつ
上下動する可動レールで、それぞれ支持棒67.68に
支持されている。71は前記可動レール70の係合部、
72は前記各支持棒67.68の案内板、73は前記支
持棒68をスライド自在に嵌合した可動軸受で、矢印A
方向と直角方向に移動可能となっている。74は固定軸
受、75は前記可動軸受73を移動させるねじ桿、76
は前記可動軸受73の案内軸、77は前記可動レール7
0の案内軸、78は前記可動レール70に取り付けられ
た案内板で、案内軸77とスライド可能に嵌合されてい
る。79は前記ねじ桿27のスプロケット、80は前記
ねじ桿75のスプロケット、81はローラチェーンであ
る。
Reference numeral 61 denotes a vertical movement device for a printed circuit board conveying guide rail that moves the printed circuit board 1 engaged with the guide rail 22 up and down, 62 a fixed base, 63 a movable base, 64 a guide shaft of the movable base 63, and 65 66 is a rod of the hydraulic cylinder 65, 67 is a support rod fixed to the movable table 63, and 68 is the direction of conveyance of the printed circuit board 1 ( A support rod movable in a direction perpendicular to the direction of arrow A); 69 is a guide hole into which the support rod 68 is slidably suspended; 7o is provided in the upper part of the heated liquid tank 8; These are movable rails that move and are supported by support rods 67 and 68, respectively. 71 is an engaging portion of the movable rail 70;
72 is a guide plate for each of the support rods 67 and 68; 73 is a movable bearing into which the support rod 68 is slidably fitted;
It is possible to move in the direction perpendicular to the direction. 74 is a fixed bearing; 75 is a screw rod for moving the movable bearing 73; 76
77 is the guide shaft of the movable bearing 73, and the movable rail 7.
A guide shaft 78 is a guide plate attached to the movable rail 70, and is slidably fitted to the guide shaft 77. 79 is a sprocket of the screw rod 27, 80 is a sprocket of the screw rod 75, and 81 is a roller chain.

上記のように構成されたプリント基板送出し装置では、
まず、ハンドル29を回してねじ桿27を回転させ可動
軸受26を移動してガイドレール22をプリント基板1
の保持暢に合わせる。また、ねじ桿27のスプロケット
30も回転するので、ローラチェーン36.スプロケッ
ト34を介してねじ桿33が回転し、台座32と基板3
7が可動軸受26と同時にB動する。
In the printed circuit board feeding device configured as above,
First, turn the handle 29 to rotate the screw rod 27, move the movable bearing 26, and move the guide rail 22 to the printed circuit board 1.
Retain fluently. Also, since the sprocket 30 of the threaded rod 27 also rotates, the roller chain 36. The screw rod 33 rotates via the sprocket 34, and the pedestal 32 and the board 3
7 moves B at the same time as the movable bearing 26.

さらに、スプロケット35の回転によりローラチェーン
58を介して第1図に示す搬入側通路1oおよび搬出側
通路12内に設けられた各可動軸受26(第1図では4
個)と、第8図に示すように、スプロケット79.80
.ローラチェーン81を介して可動軸受73も同時に移
動する。
Further, rotation of the sprocket 35 causes the movable bearings 26 (in FIG. 1, 4
) and sprocket 79.80 as shown in Figure 8.
.. The movable bearing 73 also moves at the same time via the roller chain 81.

次に軸受50が第3図に示すように駆動用のスプロケッ
ト52Aの位置にある場合は、モータ53を駆動し、ロ
ーラチェーン51を時計回りに走行させると、軸受50
が矢印A方向に走行する。そして、スプロケット52B
のところでモータ53を停止させると、係合片46は1
ピツチPだけ矢印A方向に走行する。
Next, when the bearing 50 is in the position of the driving sprocket 52A as shown in FIG. 3, when the motor 53 is driven and the roller chain 51 runs clockwise, the bearing 50
runs in the direction of arrow A. And sprocket 52B
When the motor 53 is stopped at
It travels in the direction of arrow A by pitch P.

このとき、プリント基板1の先端部1aを搬入口9側の
ガイドレール22の係合溝23に挿入して搬入口9側の
係合片46に突き当てる。次いで、再びモータ53を駆
動し、ローラチェーン51を時計回りに走行させると軸
受5Qはスプロケット52Bの位置から下降し、スプロ
ケット52Cの位置になる。このとき、第4図に示すよ
うに係合片46.連結板47.軸受48.軸49は軸体
39を中心にして、かつ軸受48が軸49にスライドし
ながら時計方向に回転し、実線の位置から二点鎖線の位
置になって、係合片46がプリント基板1を係合する位
置から離脱する。次いで、口〜ラチェーン51はさらに
走行するので、軸受50が第3図に示すように矢印A方
向と反対方向に移動し、スプロケット52Dのところの
位置になると係合片46もプリント基板1の後端部1b
の位置になる。次いで、軸受50がスプロケット52D
の位置から上昇し、スプロケット52Aの位置にくると
係合片46は第4図に示すように反時計方向に回動する
ので、プリント基板1の後端部1bに係合する。次いで
、軸受50がスプロケット52Aから上記と同様に矢印
A方向に移動することにより、係合片46がプリント基
板1の後端部1bを押してプリント基板1を矢印入方向
に搬送させる。そして上記の動作を繰り返すことにより
プリント基板1は順次挿入され、かつピッチPずつ間欠
的に搬送される。
At this time, the tip end 1a of the printed circuit board 1 is inserted into the engagement groove 23 of the guide rail 22 on the side of the loading port 9 and abuts against the engaging piece 46 on the side of the loading port 9. Next, when the motor 53 is driven again and the roller chain 51 is run clockwise, the bearing 5Q is lowered from the sprocket 52B position to the sprocket 52C position. At this time, as shown in FIG. 4, the engaging piece 46. Connecting plate 47. Bearing 48. The shaft 49 rotates clockwise around the shaft body 39 and the bearing 48 slides on the shaft 49, and the position shown by the solid line becomes the position shown by the two-dot chain line, and the engaging piece 46 engages the printed circuit board 1. move away from the matching position. Next, as the chain 51 moves further, the bearing 50 moves in the direction opposite to the arrow A direction as shown in FIG. Rear end 1b
position. Next, the bearing 50 is attached to the sprocket 52D.
When the engaging piece 46 rises from the position , and reaches the sprocket 52A position, the engaging piece 46 rotates counterclockwise as shown in FIG. 4, so that it engages with the rear end 1b of the printed circuit board 1. Next, as the bearing 50 moves from the sprocket 52A in the direction of arrow A in the same manner as described above, the engagement piece 46 pushes the rear end portion 1b of the printed circuit board 1 and transports the printed circuit board 1 in the direction of the arrow. By repeating the above operations, the printed circuit boards 1 are sequentially inserted and transported intermittently at pitches P.

また、この発明においては、加熱液槽8が従来のものよ
り深くなっているため熱転移液6がヒータ7によって加
熱されて気化した場合、温度の高い蒸気6aの層が形成
され加熱液槽8内の下方に滞留している。このため蒸気
6aの境界面6bより上方は希薄な蒸気6Cとなって加
熱液槽8の上方や各通路10.12に滞留し、蒸気6a
の層よりは低温の雰囲気が形成されている。
In addition, in this invention, since the heating liquid tank 8 is deeper than the conventional one, when the heat transfer liquid 6 is heated by the heater 7 and vaporized, a layer of high temperature steam 6a is formed and the heating liquid tank 8 It stays in the lower part of the body. Therefore, the portion above the boundary surface 6b of the steam 6a becomes diluted steam 6C, which stays above the heating liquid tank 8 and in each passage 10.12, and the steam 6a
A lower temperature atmosphere is formed than that of the layer.

次に、プリント基板1が第8図、第9図に示すように可
動レール70のところに来ると、油圧シリンダ65が作
動し、ロッド66を介して可動台63が下降する。この
ため、可動レール70もそれぞれ支持棒67.68を介
して第9図に示すように下降する。そして、プリント基
板1は熱転移液6の蒸気6aの層の境界面6bより上方
の部分で予熱され、さらに下降して蒸気6aの層の中に
入り加熱されはんだ付けされる。はんだ付けされたプリ
ント基板1は油圧リシンダ650作動により可動台63
が上昇するので、可動レール70も上昇し、当初の位置
に戻る。
Next, when the printed circuit board 1 comes to the movable rail 70 as shown in FIGS. 8 and 9, the hydraulic cylinder 65 is activated and the movable base 63 is lowered via the rod 66. Therefore, the movable rails 70 are also lowered as shown in FIG. 9 via the support rods 67 and 68, respectively. Then, the printed circuit board 1 is preheated in a portion above the boundary surface 6b of the layer of vapor 6a of the heat transfer liquid 6, and further descends into the layer of vapor 6a to be heated and soldered. The soldered printed circuit board 1 is moved to the movable table 63 by the operation of the hydraulic cylinder 650.
As the movable rail 70 rises, the movable rail 70 also rises and returns to its original position.

次いで、係合片46が再びプリント基板1の後端部1b
を押して矢印A方向へ搬送する。そして、ピッチPずつ
順次間欠的搬送を繰り返して搬出口11から取り出され
る。
Then, the engagement piece 46 is moved again to the rear end 1b of the printed circuit board 1.
Press to transport in the direction of arrow A. Then, intermittent conveyance is repeated sequentially by pitch P, and the sheet is taken out from the outlet 11.

なお、可動レール70の下降、上昇によるはんだ付けは
、係合片46がプリント基板1から解除され軸体39と
ともに矢印A方向と反対方向に戻る間、すなわち、第3
図に示すようにプリント基板送り出し装置31のローラ
チェーン51に取り付けた軸受50がスプロケット52
Bから52C,52Dを経て52Aに移動する間に行わ
れる。
Note that soldering by lowering and raising the movable rail 70 is performed while the engaging piece 46 is released from the printed circuit board 1 and returns together with the shaft body 39 in the direction opposite to the arrow A direction, that is, the third
As shown in the figure, a bearing 50 attached to a roller chain 51 of a printed circuit board feeding device 31 is attached to a sprocket 52.
This is done while moving from B to 52A via 52C and 52D.

次いで、はんだ付けが終了したプリント基板1は、搬出
口11から取り出される。
Next, the printed circuit board 1 that has been soldered is taken out from the outlet 11.

また、各搬送路10.12に滞留している蒸気6aが係
合溝23内に入って冷却され液化するが、プリント基板
1がガイドレール22の車輪24上を走行して車輪24
が回転するので、第7図に示すように係合溝23内で液
体となった熱転移液6はガイドレール22と車輪24と
の隙間22aを通って矢印Bで示すように搬出側通路1
2内に滴下して液切れが行われる。次いで、熱転移液6
は搬出側通路12の傾斜面°12a上を流れて加熱液槽
8内に入り回収される。
In addition, the steam 6a staying in each conveyance path 10.12 enters the engagement groove 23 and is cooled and liquefied, but the printed circuit board 1 runs on the wheels 24 of the guide rail 22 and the wheels 24
As shown in FIG. 7, the heat transfer liquid 6 that has become a liquid in the engagement groove 23 passes through the gap 22a between the guide rail 22 and the wheel 24 and enters the discharge side passage 1 as shown by arrow B.
The liquid is drained by dropping it into the container. Next, heat transfer liquid 6
The liquid flows on the inclined surface 12a of the discharge side passage 12, enters the heated liquid tank 8, and is collected.

(発明の効果〕 以上説明したようにこの発明は、プリント基板の搬送路
に沿ってプリント基板を係合する係合溝を設けたガイド
レールと、このガイドレールの途中の加熱液槽の上部の
部分に設けた可動レールと、この可動レールを上下動せ
しめる駆動装置と、ガイドレールと平行に設けた長尺状
の軸体と、この軸体の長手方向に所定間隔で複数個直列
に固着してプリント基板を搬送せしめる係合片と、軸体
を長手方向に所定間隔だけ往復動作させ、かつ軸体の軸
心を中心とした円周方向に所定角度だけ正逆に回動させ
ることにより係合片にプリント基板が係脱してプリント
基板を順次間欠搬送せしめる駆動手段とを備えたので、
ガイドレールの係合溝内に付着した熱転移液を外部へ排
出させることなく回収できる。また、プリント基板を加
熱液槽のところで下降させることが可能となったため、
熱転移液の蒸気を加熱液槽の内部に滞留させることがで
きるので、熱転移液の蒸気が外部へ排出されることが極
めて少なくなり熱転移液の補充をすることがほとんどな
く経済的である。また、間欠搬送されているプリント基
板の搬送が停止している間に加熱液槽上にあるプリント
基板を下降、上昇させてはんだ付けを行うので、生産性
が低下することがなく、製品のコストダウンが図れる利
点を有する。
(Effects of the Invention) As explained above, the present invention provides a guide rail provided with an engagement groove for engaging a printed circuit board along a conveyance path of the printed circuit board, and an upper part of a heated liquid tank in the middle of the guide rail. A movable rail provided on the section, a drive device that moves the movable rail up and down, a long shaft provided parallel to the guide rail, and a plurality of shafts fixed in series at predetermined intervals in the longitudinal direction. The engagement piece, which allows the printed circuit board to be conveyed by the shaft, is reciprocated in the longitudinal direction by a predetermined interval, and the shaft is rotated forward and backward by a predetermined angle in the circumferential direction around the axis of the shaft. Since it is equipped with a drive means that engages and disengages the printed circuit board from the mating piece and sequentially and intermittently transports the printed circuit board,
The heat transfer liquid adhering to the engagement groove of the guide rail can be recovered without being discharged to the outside. In addition, it became possible to lower the printed circuit board at the heating liquid tank.
Since the vapor of the heat transfer liquid can be retained inside the heating liquid tank, it is extremely rare that the vapor of the heat transfer liquid is discharged to the outside, and there is almost no need to replenish the heat transfer liquid, making it economical. . In addition, since the printed circuit board is lowered and raised above the heated liquid tank and soldered while the intermittent conveyance of the printed circuit board is stopped, productivity does not decrease and product costs are reduced. It has the advantage of being able to be lowered.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例の概略の構成を示す側断面
図、第2図は第1図の要部を拡大して示す平面図、第3
図は第2図のI−I線による側断面図、第4図は第2図
のプリント基板搬出口側から見た図、第5図はプリント
基板送り出し装置の一部をさらに拡大して示す側面図、
第6図は第5図のII −II線による断面図、第7図
はガイドレールの詳細を示す側面図、第8図はこの発明
のプリント基板搬送用ガイドレールの上下動装置を示す
斜視図、第9図は第8図の動作を示す説明図、第10図
は従来の蒸気槽はんだ付け装置の一例を示す側断面図で
ある。 図中、1はプリント基板、2はチップ部品、3ははんだ
ペースト、6は熱転移液、7はヒータ、8は加熱液槽、
10は搬入側通路、12は搬出側通路、13は冷却器、
21は蒸気相はんだ付け装置、22はガイドレール、2
3は係合溝、24は車輪、31はプリント基板送り出し
装置、32は台座、37は基板、38は連結板、39は
軸体、40は円筒、42は切欠部、46は係合片、47
は連結板、48は軸受、49は軸、50は軸受、51は
ローラチェーン、52A、52B、52C,52Dはス
プロケット、53はモータ、61は上下動装置、63は
可動台、65は油圧シリンダ、66はロッド、67.6
8は支持棒、70は可動レール、71は係合部、77は
案内軸、78は案内板である。
FIG. 1 is a side sectional view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is a plan view showing an enlarged main part of FIG. 1, and FIG.
The figure is a side sectional view taken along line I-I in Figure 2, Figure 4 is a view seen from the printed circuit board exit side in Figure 2, and Figure 5 is a further enlarged view of a part of the printed circuit board delivery device. Side view,
FIG. 6 is a sectional view taken along the line II-II in FIG. 5, FIG. 7 is a side view showing details of the guide rail, and FIG. 8 is a perspective view showing a vertical movement device for a guide rail for conveying printed circuit boards according to the present invention. , FIG. 9 is an explanatory view showing the operation of FIG. 8, and FIG. 10 is a side sectional view showing an example of a conventional steam tank soldering apparatus. In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is a solder paste, 6 is a heat transfer liquid, 7 is a heater, 8 is a heating liquid tank,
10 is a carry-in side passage, 12 is a carry-out side passage, 13 is a cooler,
21 is a vapor phase soldering device, 22 is a guide rail, 2
3 is an engagement groove, 24 is a wheel, 31 is a printed circuit board feeding device, 32 is a pedestal, 37 is a board, 38 is a connecting plate, 39 is a shaft body, 40 is a cylinder, 42 is a notch, 46 is an engagement piece, 47
is a connecting plate, 48 is a bearing, 49 is a shaft, 50 is a bearing, 51 is a roller chain, 52A, 52B, 52C, 52D are sprockets, 53 is a motor, 61 is a vertical movement device, 63 is a movable base, 65 is a hydraulic cylinder , 66 is a rod, 67.6
8 is a support rod, 70 is a movable rail, 71 is an engaging portion, 77 is a guide shaft, and 78 is a guide plate.

Claims (1)

【特許請求の範囲】[Claims]  プリント基板にあらかじめ塗布するはんだペーストの
融解点以上の沸点を有する熱転移液を貯溜し、この熱転
移液を加熱して生成された蒸気により前記プリント基板
のはんだペーストを融解する加熱液槽と、この加熱液槽
に接続され前記プリント基板の搬送路となる搬入側通路
および搬出側通路と、前記加熱液槽の上部に設けられ前
記蒸気を冷却する冷却器とからなる蒸気槽はんだ付け装
置において、前記プリント基板の搬送路に沿って前記プ
リント基板を係合する係合溝を設けたガイドレールと、
このガイドレールの途中の前記加熱液槽の上部の部分に
設けた可動レールと、この可動レールを上下動せしめる
駆動装置と、前記ガイドレールと平行に設けた長尺状の
軸体と、この軸体の長手方向に所定間隔で複数個直列に
固着して前記プリント基板を搬送せしめる係合片と、前
記軸体を長手方向に所定間隔だけ往復動作させ、かつ前
記軸体の軸心を中心とした円周方向に所定角度だけ正逆
に回動させることにより前記係合片に前記プリント基板
が係脱して前記プリント基板を順次間欠搬送せしめる駆
動手段とを備えたことを特徴とするプリント基板搬送用
ガイドレールの上下動装置。
a heating liquid tank that stores a heat transfer liquid having a boiling point higher than the melting point of the solder paste applied to the printed circuit board in advance, and melts the solder paste of the printed circuit board with the steam generated by heating the heat transfer liquid; A steam tank soldering device comprising an input side passage and an output side passage connected to the heating liquid tank and serving as a conveyance path for the printed circuit board, and a cooler provided above the heating liquid tank and cooling the steam, a guide rail provided with an engagement groove for engaging the printed circuit board along the conveyance path of the printed circuit board;
A movable rail provided in the upper part of the heated liquid tank in the middle of the guide rail, a drive device that moves this movable rail up and down, a long shaft provided parallel to the guide rail, and this shaft. A plurality of engaging pieces are fixed in series at predetermined intervals in the longitudinal direction of the body to transport the printed circuit board, and the shaft body is reciprocated at a predetermined interval in the longitudinal direction, and the shaft body is centered on the axis of the shaft body. and a driving means for sequentially and intermittently transporting the printed circuit board by engaging and disengaging the printed circuit board from the engaging piece by rotating the printed circuit board forward and backward by a predetermined angle in the circumferential direction. Vertical movement device for guide rails.
JP896487A 1987-01-20 1987-01-20 Vertically moving device for guide rail for conveying printed circuit board Granted JPS63177958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP896487A JPS63177958A (en) 1987-01-20 1987-01-20 Vertically moving device for guide rail for conveying printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP896487A JPS63177958A (en) 1987-01-20 1987-01-20 Vertically moving device for guide rail for conveying printed circuit board

Publications (2)

Publication Number Publication Date
JPS63177958A true JPS63177958A (en) 1988-07-22
JPH059190B2 JPH059190B2 (en) 1993-02-04

Family

ID=11707359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP896487A Granted JPS63177958A (en) 1987-01-20 1987-01-20 Vertically moving device for guide rail for conveying printed circuit board

Country Status (1)

Country Link
JP (1) JPS63177958A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009154225A1 (en) * 2008-06-17 2009-12-23 千住金属工業株式会社 Automatic soldering equipment
DE102021129079B3 (en) 2021-11-09 2022-11-24 Ersa Gmbh Transport system for transporting items to be soldered through a soldering system and soldering system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009154225A1 (en) * 2008-06-17 2009-12-23 千住金属工業株式会社 Automatic soldering equipment
JP5533650B2 (en) * 2008-06-17 2014-06-25 千住金属工業株式会社 Automatic soldering equipment
DE102021129079B3 (en) 2021-11-09 2022-11-24 Ersa Gmbh Transport system for transporting items to be soldered through a soldering system and soldering system

Also Published As

Publication number Publication date
JPH059190B2 (en) 1993-02-04

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