JPH059189B2 - - Google Patents
Info
- Publication number
- JPH059189B2 JPH059189B2 JP896387A JP896387A JPH059189B2 JP H059189 B2 JPH059189 B2 JP H059189B2 JP 896387 A JP896387 A JP 896387A JP 896387 A JP896387 A JP 896387A JP H059189 B2 JPH059189 B2 JP H059189B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- guide rail
- heat transfer
- shaft body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 29
- 238000005476 soldering Methods 0.000 claims description 11
- 239000012808 vapor phase Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Reciprocating Conveyors (AREA)
- Molten Solder (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント基板をガイドレールの係
合溝に係合して順次間欠的に搬送せしめるプリン
ト基板の搬送装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed circuit board conveying device that engages a printed circuit board in an engagement groove of a guide rail and sequentially and intermittently conveys the printed circuit board.
第8図は従来の蒸気はんだ付け装置の一例を示
す側断面図で、1はプリント基板、2はチツプ部
品、3は前記プリント基板1にあらかじめ塗布さ
れたはんだペースト、4は蒸気相はんだ付け装
置、5は貯溜槽、6は熱転移液で、一例としてフ
ツ素系不活性液体であるフロリナート(住友スリ
ーエム株式会社の商標名)が使用されている。6
aは前記熱転移液6の蒸気で、はんだペースト3
の融解点よりも高い温度を有する。7はヒータ、
8は加熱液槽、9は前記プリント基板1の搬入
口、10は前記プリント基板1の搬送路となる搬
入側通路、10aは前記搬入側通路10の傾斜
面、11は搬出口、12は同じく搬送路となる搬
出側通路、12aは前記搬出側通路12の傾斜
面、13は冷却器、14は前記搬入口9および搬
出口11から排出された蒸気6aを回収するカバ
ー、15は前記プリント基板1を搬送する手段と
しての搬送チエーンである。また、搬送チエーン
15の代りにベルトコンベアであつてもよい。1
6は前記搬送チエーン15のスプロケツトで、ベ
ルトコンベアの場合はローラが使用される。
FIG. 8 is a side sectional view showing an example of a conventional steam soldering device, in which 1 is a printed circuit board, 2 is a chip component, 3 is a solder paste applied in advance to the printed circuit board 1, and 4 is a vapor phase soldering device. , 5 is a storage tank, and 6 is a heat transfer liquid, of which Fluorinert (trade name of Sumitomo 3M Ltd.), which is a fluorine-based inert liquid, is used as an example. 6
a is the vapor of the heat transfer liquid 6, and the solder paste 3
has a temperature higher than the melting point of 7 is a heater,
8 is a heating liquid tank; 9 is an entrance for carrying the printed circuit board 1; 10 is an entry passage serving as a transport path for the printed circuit board 1; 10a is an inclined surface of the entry passage 10; 11 is an exit; 12 is the same. Reference numeral 12a denotes an inclined surface of the carry-out side passage 12, 13 a cooler, 14 a cover for recovering the steam 6a discharged from the carry-in port 9 and the carry-out port 11, and 15 the printed circuit board. This is a conveyance chain as a means for conveying 1. Furthermore, the conveyor chain 15 may be replaced by a belt conveyor. 1
6 is a sprocket of the conveyance chain 15, and in the case of a belt conveyor, a roller is used.
従来の蒸気相はんだ付け装置4は上記のように
構成されているので、プリント基板1を搬送チエ
ーン15の保持爪(図示せず)に係合するか、ま
たはベルトコンベアに載置して搬送し、ヒータ7
により加熱された熱転移液6の蒸気6aによりは
んだペースト3を融解してはんだ付けを行つた
後、融解したはんだが凝固することによりチツプ
部品2がプリント基板1に固着され搬出してい
た。また、蒸気6aは冷却器13により冷却され
液体となつて回収されていた。 Since the conventional vapor phase soldering apparatus 4 is configured as described above, the printed circuit board 1 is engaged with the holding claws (not shown) of the conveyor chain 15 or placed on a belt conveyor and conveyed. , heater 7
After the solder paste 3 is melted by the vapor 6a of the heat transfer liquid 6 heated by the heat transfer liquid 6 and soldering is performed, the melted solder solidifies and the chip part 2 is fixed to the printed circuit board 1 and carried out. Further, the steam 6a was cooled by the cooler 13 and recovered as a liquid.
ところで、従来の蒸気相はんだ付け装置4では
蒸気6aが冷却されて液体の熱転移液6となつ
て、搬送チエーン(またはベルトコンベア)15
に付着する。このため、搬送チエーン15の走行
により熱転移液6が搬出口11から蒸気相はんだ
付け装置4の外部へ排出され、回収が不可能にな
る。したがつて、高価な熱転移液6の消耗が多
く、不経済であるため製品コストが上昇するとい
う問題点があつた。
By the way, in the conventional vapor phase soldering device 4, the vapor 6a is cooled to become a liquid heat transfer liquid 6, and then transferred to a conveyor chain (or belt conveyor) 15.
Attach to. Therefore, as the conveyance chain 15 runs, the heat transfer liquid 6 is discharged from the outlet 11 to the outside of the vapor phase soldering apparatus 4, making it impossible to recover it. Therefore, there is a problem that the expensive heat transfer liquid 6 is consumed a lot, which is uneconomical and increases the product cost.
この発明は、上記問題点を解決するためになさ
れたもので、搬送路内にプリント基板を係合して
搬送するガイドレールを設けることにより熱転移
液が蒸気相はんだ付け装置の外部に排出されるの
を防止するプリント基板の搬送装置を得ることを
目的とする。 This invention was made to solve the above problems, and by providing a guide rail in the conveyance path that engages and conveys the printed circuit board, the heat transfer liquid is discharged to the outside of the vapor phase soldering apparatus. An object of the present invention is to provide a printed circuit board conveyance device that prevents the occurrence of
この発明にかかるプリント基板の搬送装置は、
プリント基板の搬送路に沿つてプリント基板を係
合する係合溝を設けたガイドレールと、このガイ
ドレールと平行に設けた長尺状の軸体と、この軸
体の長手方向に所定間隔で複数個直列に固着して
プリント基板を搬送せしめる係合片と、軸体を長
手方向に所定距離だけ往復動作させ、かつ軸体の
軸心を中心とした円周方向に所定角度だけ正逆に
回動させることにより係合片にプリント基板が係
脱してプリント基板を順次間欠搬送せしめる駆動
手段とを備えたものである。
The printed circuit board conveyance device according to the present invention includes:
A guide rail provided with an engagement groove for engaging the printed circuit board along the conveyance path of the printed circuit board, an elongated shaft body provided parallel to the guide rail, and a shaft body arranged at predetermined intervals in the longitudinal direction of the shaft body. A plurality of engaging pieces are fixed in series to transport the printed circuit board, and the shaft body is reciprocated by a predetermined distance in the longitudinal direction, and also rotates forward and backward by a predetermined angle in the circumferential direction around the axis of the shaft body. The device is equipped with a driving means that engages and disengages the printed circuit board from the engagement piece by rotating it, thereby sequentially and intermittently conveying the printed circuit board.
この発明においては、搬送路内に設けれたガイ
ドレールの係合溝にプリント基板が係合して搬送
されるので、係合溝内に付着した熱転移液は外部
へ排出されることなく搬送路内に滴下され加熱液
槽に戻り回収される。
In this invention, since the printed circuit board is engaged with the engagement groove of the guide rail provided in the conveyance path and conveyed, the heat transfer liquid adhering to the engagement groove is conveyed without being discharged to the outside. It is dripped into the channel and returned to the heated liquid tank where it is collected.
第1図はこの発明の一実施例の概略を示す側断
面図、第2図は第1図の要部を拡大して示す平面
図、第3図は第2図の−線による側断面図、
第4図は第2図のプリント基板搬出口側から見た
図、第5図はプリント基板送り出し装置の一部を
さらに拡大して示す側面図、第6図は第5図の
−線による断面図、第7図はガイドレールの詳
細を示す側面図である。これらの図において、第
8図と同一符号は同一部分を示し、1aは前記プ
リント基板1の搬送方向(矢印A方向)の前端
部、1bは後端部を示す。21は蒸気相はんだ付
け装置の全体を示す。22は前記プリント基板1
を搬送する固定側と可動側のガイドレール、23
は前記プリント基板1を係合する係合溝、24は
前記プリント基板1を係合溝23内で載置して円
滑に搬送させるために設けた車輪、25は前記固
定側のガイドレール22を装着した固定台、26
は前記可動側のガイドレール22を装着した可動
軸受、27は前記プリント基板1の保持幅を設定
するため可動軸受26を螺合した回転可能のねじ
桿、28は前記固定台25を固着し、可動軸受2
6と摺動可能に嵌合した固定軸、29は前記ねじ
桿27を回転せしめるハンドル、30は前記ねじ
桿27に固着されたスプロケツト、31は前記ガ
イドレール22に係合されたプリント基板1を間
欠的に送り出すプリント基板送り出し装置で、第
5図、第6図にその詳細を示す。32は前記プリ
ント基板送り出し装置31の台座で、33は前記
プリント基板1の保持幅に応じて台座32をプリ
ント基板1の搬送方向(矢印A方向)と直角方向
に移動させるねじ桿、34,35は前記ねじ桿3
3に固着されたスプロケツト、36は前記各スプ
ロケツト30,34を連絡するローラチエーン、
37は前記プリント基板送り出し装置31の基
板、38は前記台座32と基板37とを連結して
固定する連結板、39は長尺状の軸体で、その軸
心方向はガイドレール22およびプリント基板1
の搬送方向(矢印A方向)と平行に設けられてい
る。40は前記軸体39の外周に設けた円筒で、
第5図にその詳細を示す。軸体39は第6図に示
すように、軸体39の稜線が円筒40の内周と接
触しないようになつている。41は前記円筒40
の両端に形成されたフランジ、42は前記円筒4
0の長手方向に形成された切欠部で、軸体39の
移動により後述の係合片46の通過を可能にして
いる。43は前記円筒40のフランジ41に固着
された軸受、44は前記軸受43に設けられ、軸
体39上を走行する車輪、45は前記台座32に
取り付けられ、円筒40の外周上を走行する車
輪、係合片46は軸体39に複数個直列に所定間
隔(ピツチP)で取り付けられ、係合時はプリン
ト基板1の後端部1bを押して搬送する。47は
前記軸体39の端部に取り付けられた連結板、4
8は前記連結板47に固着された軸受、49は前
記軸受48に嵌合され軸心方向に対して自在にス
ライドする軸である。そして、連結板47、軸受
48、軸49により軸体39と基板37とを連結
する連結手段が形成される。50は前記軸49の
一端を回動自在に取り付けた軸受、51はローラ
チエーンで、軸受50を取り付けてある。52は
スプロケツトで、52Aは駆動用のスプロケツ
ト、52B,52C,52Dは従動用のスプロケ
ツトである。53は前記基板37に取り付けられ
ローラチエーン51を走行させる駆動手段として
のモータ、54は台車、55は前記台車54の車
輪、56は前記台車54が走行するガイドレー
ル、57は前記基板37と台車54とを連結する
連結棒、58はローラチエーンである。
FIG. 1 is a side sectional view schematically showing an embodiment of the present invention, FIG. 2 is a plan view showing an enlarged main part of FIG. 1, and FIG. 3 is a side sectional view taken along the - line in FIG. ,
Fig. 4 is a view seen from the printed circuit board exit side in Fig. 2, Fig. 5 is a side view showing a further enlarged part of the printed circuit board delivery device, and Fig. 6 is a cross section taken along the - line in Fig. 5. 7 are side views showing details of the guide rail. In these figures, the same reference numerals as in FIG. 8 indicate the same parts, 1a indicates the front end of the printed circuit board 1 in the transport direction (direction of arrow A), and 1b indicates the rear end. 21 shows the entire vapor phase soldering device. 22 is the printed circuit board 1
Fixed side and movable side guide rails for transporting
24 is a wheel provided to place the printed circuit board 1 in the engagement groove 23 and transport it smoothly; 25 is a wheel provided to engage the fixed side guide rail 22; Fixed base attached, 26
27 is a rotatable screw rod to which the movable bearing 26 is screwed to set the holding width of the printed circuit board 1; 28 is a rotatable screw rod to which the fixed base 25 is fixed; Movable bearing 2
6 and a fixed shaft slidably fitted together; 29 a handle for rotating the screw rod 27; 30 a sprocket fixed to the screw rod 27; 31 a printed circuit board 1 engaged with the guide rail 22; This is a printed circuit board feeding device that feeds out printed circuit boards intermittently, and its details are shown in FIGS. 5 and 6. 32 is a pedestal of the printed circuit board feeding device 31; 33 is a screw rod for moving the pedestal 32 in a direction perpendicular to the conveyance direction (arrow A direction) of the printed circuit board 1 according to the holding width of the printed circuit board 1; 34, 35; is the screw rod 3
3 is a sprocket fixed to the sprocket; 36 is a roller chain connecting the sprockets 30 and 34;
37 is a board of the printed circuit board feeding device 31, 38 is a connecting plate that connects and fixes the base 32 and the board 37, and 39 is a long shaft whose axial direction extends toward the guide rail 22 and the printed circuit board. 1
It is provided parallel to the conveyance direction (direction of arrow A). 40 is a cylinder provided on the outer periphery of the shaft body 39;
Figure 5 shows the details. As shown in FIG. 6, the shaft 39 is designed so that the ridgeline of the shaft 39 does not come into contact with the inner circumference of the cylinder 40. 41 is the cylinder 40
Flanges 42 formed at both ends of the cylinder 4
A notch formed in the longitudinal direction of the shaft body 39 allows an engagement piece 46 (described later) to pass therethrough by movement of the shaft body 39. 43 is a bearing fixed to the flange 41 of the cylinder 40; 44 is a wheel provided on the bearing 43 and runs on the shaft body 39; 45 is a wheel attached to the pedestal 32 and runs on the outer periphery of the cylinder 40. A plurality of engaging pieces 46 are attached to the shaft body 39 in series at predetermined intervals (pitch P), and when engaged, push the rear end portion 1b of the printed circuit board 1 and transport it. 47 is a connecting plate attached to the end of the shaft body 39;
8 is a bearing fixed to the connecting plate 47, and 49 is a shaft that is fitted into the bearing 48 and freely slides in the axial direction. The connecting plate 47, the bearing 48, and the shaft 49 form a connecting means for connecting the shaft body 39 and the substrate 37. 50 is a bearing rotatably attached to one end of the shaft 49, and 51 is a roller chain to which the bearing 50 is attached. 52 is a sprocket, 52A is a driving sprocket, and 52B, 52C, and 52D are driven sprockets. 53 is a motor attached to the base plate 37 and serves as a driving means for driving the roller chain 51; 54 is a truck; 55 is a wheel of the truck 54; 56 is a guide rail on which the truck 54 runs; 57 is the base plate 37 and the truck A connecting rod 58 is a roller chain.
上記のように構成されたプリント基板送り出し
装置3では、まず、ハンドル29を回してねじ桿
27を回転させ可動軸受26を移動してガイドレ
ール22をプリント基板1の保持幅に合わせる。
また、ねじ桿27のスプロケツト30も回転する
ので、ローラチエーン36、スプロケツト34を
介してねじ桿33が回転し、台座32と基板37
が可動軸受26と同時に移動する。 In the printed circuit board feeding device 3 configured as described above, first, the handle 29 is turned to rotate the screw rod 27 and the movable bearing 26 is moved to adjust the guide rail 22 to the holding width of the printed circuit board 1.
Furthermore, since the sprocket 30 of the screw rod 27 also rotates, the screw rod 33 rotates via the roller chain 36 and sprocket 34, and the base 32 and the base plate 37 are rotated.
moves simultaneously with the movable bearing 26.
さらに、スプロケツト35の回転によりローラ
チエーン58を介して第1図に示す搬入側通路1
0および搬出側通路12内に設けられた各可動軸
受26(第1図では4個)を同時に移動する。 Further, due to the rotation of the sprocket 35, the loading side passage 1 shown in FIG. 1 is opened via the roller chain 58.
0 and the respective movable bearings 26 (four in FIG. 1) provided in the discharge side passage 12 are moved simultaneously.
次に軸受50が第3図に示すように駆動用のス
プロケツト52Aの位置にある場合は、モータ5
3を駆動し、ローラチエーン51を時計回りに走
行させると、軸受50が矢印A方向に走行する。
そして、スプロケツト52Bのところでモータ5
3を停止させると、係合片46は1ピツチPだけ
矢印A方向に走行する。 Next, when the bearing 50 is in the position of the driving sprocket 52A as shown in FIG.
3 and causes the roller chain 51 to travel clockwise, the bearing 50 travels in the direction of arrow A.
Then, connect motor 5 at sprocket 52B.
3 is stopped, the engaging piece 46 moves by one pitch P in the direction of arrow A.
このとき、プリント基板1の先端部1aを搬入
口9側のガイドレール22の係合溝23に挿入し
て搬入口9側の係合片46に突き当てる。次い
で、再びモータ53を駆動し、ローラチエーン5
1を時計回りに走行させると軸受50はスプロケ
ツト52Bの位置から下降し、スプロケツト52
Cの位置になる。このとき、第4図に示すように
係合片46、連結板47、軸受48、軸49は軸
体39を中心にして、かつ軸受48が軸49にス
ライドしながら時計方向に回転し、実線の位置か
ら二点鎖線の位置になつて、係合片46がプリン
ト基板1を係合する位置から離脱する。次いで、
ローラチエーン51はさらに走行するので軸受5
0が第3図に示すように矢印A方向と反対方向に
移動し、スプロケツト52Dのところの位置にな
ると係合片46もプリント基板1の後端部1bの
位置になる。次いで、軸受50がスプロケツト5
2Dの位置から上昇し、スプロケツト52Aの位
置にくると係合片46は第4図に示すように反時
計方向に回動するので、プリント基板1の後端部
1bに係合する。次いで、軸受50がスプロケツ
ト52Aから上記と同様に矢印A方向に移動する
ことにより、係合片46がプリント基板1の後端
部1bを押してプリント基板1を矢印A方向に搬
送させる。そして上記の動作を繰り返すことによ
りプリント基板1は順次挿入され、かつピツチP
ずつ間欠的に搬送させる。そしてはんだ付けが終
了したプリント基板1は搬出口11から取り出さ
れる。 At this time, the tip end 1a of the printed circuit board 1 is inserted into the engagement groove 23 of the guide rail 22 on the side of the loading port 9 and abuts against the engaging piece 46 on the side of the loading port 9. Next, the motor 53 is driven again, and the roller chain 5
1 is run clockwise, the bearing 50 descends from the sprocket 52B position, and the bearing 50 moves down from the sprocket 52B position.
It will be in position C. At this time, as shown in FIG. 4, the engaging piece 46, the connecting plate 47, the bearing 48, and the shaft 49 rotate clockwise around the shaft body 39, with the bearing 48 sliding on the shaft 49, and the solid line The engagement piece 46 moves away from the position where it engages the printed circuit board 1 from the position indicated by the two-dot chain line. Then,
Since the roller chain 51 moves further, the bearing 5
0 moves in the direction opposite to the direction of the arrow A and reaches the position of the sprocket 52D as shown in FIG. Next, the bearing 50 is attached to the sprocket 5.
When the engaging piece 46 rises from the position 2D and reaches the position of the sprocket 52A, the engaging piece 46 rotates counterclockwise as shown in FIG. 4, so that it engages with the rear end 1b of the printed circuit board 1. Next, as the bearing 50 moves from the sprocket 52A in the direction of arrow A in the same manner as described above, the engaging piece 46 pushes the rear end portion 1b of the printed circuit board 1 and transports the printed circuit board 1 in the direction of arrow A. By repeating the above operations, the printed circuit boards 1 are inserted one after another, and the pitch P
It is transported intermittently. The printed circuit board 1 that has been soldered is then taken out from the outlet 11.
また、熱転移液6の蒸気6aが係合溝23内に
入つて冷却され液化するが、この発明においては
プリント基板1がガイドレール22の車輪24上
を走行して車輪24が回転するので、第7図に示
すように係合溝23内で液体となつた熱転移液6
はガイドレール22と車輪24との隙間22aを
通つて矢印Bで示すように各通路10,12内に
滴下して液切れが行われる。次いで、熱転移液6
は各通路10,12の傾斜面10a,12a上を
流れて貯溜槽5内に入り回収される。 Further, the vapor 6a of the heat transfer liquid 6 enters the engagement groove 23 and is cooled and liquefied, but in this invention, the printed circuit board 1 runs on the wheels 24 of the guide rail 22 and the wheels 24 rotate. As shown in FIG. 7, the heat transfer liquid 6 becomes liquid in the engagement groove 23.
The liquid drips through the gap 22a between the guide rail 22 and the wheel 24 into each of the passages 10 and 12 as shown by arrow B, thereby draining the liquid. Next, heat transfer liquid 6
The water flows on the inclined surfaces 10a and 12a of each passage 10 and 12, enters the storage tank 5, and is collected.
以上説明したようにこの発明は、プリント基板
の搬送路に沿つてプリント基板を係合する係合溝
を設けたガイドレールと、このガイドレールと平
行に設けら長尺状の軸体と、この軸体の長手方向
に所定間隔で複数個直列に固着してプリント基板
を搬送せしめる係合片と、軸体を長手方向に所定
距離だけ往復動作させ、かつ軸体の軸心を中心と
した円周方向に所定角度だけ正逆にに回動させる
ことにより係合片にプリント基板が係脱してプリ
ント基板を順次間欠搬送せしめる駆動手段とを備
えたので、ガイドレールの係合溝内に付着した熱
転移液を外部へ排出させることなく回収でき、高
価な熱転移液を補充することがほとんどないた
め、経済的であり、製品のコストダウンが図れる
利点を有する。
As explained above, the present invention includes a guide rail provided with an engagement groove for engaging a printed circuit board along a conveyance path of the printed circuit board, an elongated shaft body provided parallel to the guide rail, and a long shaft body provided in parallel with the guide rail. A plurality of engaging pieces are fixed in series at predetermined intervals in the longitudinal direction of the shaft to allow the printed circuit board to be conveyed; By rotating the printed circuit board by a predetermined angle in the circumferential direction in the forward and reverse directions, the printed circuit board is engaged with and disengaged from the engagement piece, and the printed circuit board is sequentially and intermittently conveyed. Since the heat transfer liquid can be recovered without being discharged to the outside and there is almost no need to replenish expensive heat transfer liquid, it is economical and has the advantage of reducing the cost of the product.
第1図はこの発明の一実施例の概略の構成を示
す側断面図、第2図は第1図の要部を拡大して示
す平面図、第3図は第2図の−線による側断
面図、第4図は第2図のプリント基板搬出口側か
ら見た図、第5図はプリント基板送り出し装置の
一部をさらに拡大して示す側面図、第6図は第5
図の−線による断面図、第7図はガイドレー
ルの詳細を示す側面図、第8図は従来の蒸気相は
んだ付け装置の一例を示す側面図である。
図中、1はプリント基板、2はチツプ部品、3
ははんだペースト、5は貯溜槽、6は熱転移液、
7はヒータ、8は加熱液槽、10は搬入側通路、
12は搬出側通路、13は冷却器、21は蒸気相
はんだ付け装置、22はガイドレール、23は係
合溝、24は車輪、31はプリント基板送り出し
装置、32は台座、37は基板、38は連結板、
39は軸体、40は円筒、42は切欠部、46は
係合片、47は連結板、48は軸受、49は軸、
50は軸受、51はローラチエーン、52A,5
2B,52C,52Dはスプロケツト、53はモ
ータである。
FIG. 1 is a side sectional view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is a plan view showing an enlarged main part of FIG. 1, and FIG. 3 is a side view taken along the - line in FIG. 2. 4 is a view from the printed circuit board unloading port side in FIG. 2, FIG. 5 is a side view showing a further enlarged part of the printed circuit board feeding device, and FIG.
7 is a side view showing details of the guide rail, and FIG. 8 is a side view showing an example of a conventional vapor phase soldering apparatus. In the figure, 1 is a printed circuit board, 2 is a chip component, and 3
5 is a storage tank, 6 is a heat transfer liquid,
7 is a heater, 8 is a heating liquid tank, 10 is a carry-in side passage,
12 is a carry-out passage, 13 is a cooler, 21 is a vapor phase soldering device, 22 is a guide rail, 23 is an engagement groove, 24 is a wheel, 31 is a printed circuit board feeding device, 32 is a pedestal, 37 is a board, 38 is a connecting plate,
39 is a shaft body, 40 is a cylinder, 42 is a notch, 46 is an engaging piece, 47 is a connecting plate, 48 is a bearing, 49 is a shaft,
50 is a bearing, 51 is a roller chain, 52A, 5
2B, 52C, and 52D are sprockets, and 53 is a motor.
Claims (1)
ーストの融解点以上の沸点を有する熱転移液を貯
溜し、この熱転移液を加熱した生成された蒸気に
より前記プリント基板のはんだペーストを融解す
る加熱液槽と、この加熱液槽に接続され前記プリ
ント基板の搬送路となる搬入側通路および搬出側
通路と、前記加熱液槽の上部に設けられ前記蒸気
を冷却する冷却器とからなる蒸気相はんだ付け装
置に用いるプリント基板の搬送装置であつて、前
記プリント基板の搬送路に沿つて前記プリント基
板を係合する係合溝を設けたガイドレールと、こ
のガイドレールと平行に設けた長尺状の軸体と、
この軸体の長手方向に所定間隔で複数個直列に固
着して前記プリント基板を搬送せしめる係合片
と、前記軸体を長手方向に所定距離だけ往復動作
させ、かつ前記軸体の軸心を中心とした円周方向
に所定角度だけ正逆に回動させることにより前記
係合片に前記プリント基板が係脱して前記プリン
ト基板を順次間欠搬送せしめる駆動手段とを備え
たことを特徴とするプリント基板の搬送装置。1. A heating liquid tank that stores a heat transfer liquid having a boiling point higher than the melting point of the solder paste applied to the printed circuit board in advance, and melts the solder paste of the printed circuit board with the generated steam by heating the heat transfer liquid; Used in a vapor phase soldering device comprising an input side passage and an output side passage connected to the heating liquid tank and serving as a conveyance path for the printed circuit board, and a cooler provided above the heating liquid tank to cool the steam. The printed circuit board conveyance device comprises a guide rail provided with an engagement groove for engaging the printed circuit board along a conveyance path of the printed circuit board, and an elongated shaft body provided parallel to the guide rail. ,
A plurality of engaging pieces are fixed in series at predetermined intervals in the longitudinal direction of the shaft body to transport the printed circuit board; The printed circuit board is characterized by comprising: a driving means for sequentially and intermittently conveying the printed circuit board by engaging and disengaging the printed circuit board from the engagement piece by rotating the printed circuit board forward and backward by a predetermined angle in a circumferential direction around the center. Board transport device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP896387A JPS63177957A (en) | 1987-01-20 | 1987-01-20 | Conveyor for printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP896387A JPS63177957A (en) | 1987-01-20 | 1987-01-20 | Conveyor for printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63177957A JPS63177957A (en) | 1988-07-22 |
JPH059189B2 true JPH059189B2 (en) | 1993-02-04 |
Family
ID=11707328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP896387A Granted JPS63177957A (en) | 1987-01-20 | 1987-01-20 | Conveyor for printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63177957A (en) |
-
1987
- 1987-01-20 JP JP896387A patent/JPS63177957A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63177957A (en) | 1988-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009186158A (en) | Conveyance section positioning method, and conveyance device | |
US10076041B2 (en) | Soldering device | |
JP2007234712A (en) | Component supplying device | |
JPH059189B2 (en) | ||
JP5533650B2 (en) | Automatic soldering equipment | |
JP2003324272A (en) | Reflow furnace | |
JPH059190B2 (en) | ||
JP2004327542A (en) | Reflow device | |
JPS62130770A (en) | Reflow type soldering device | |
KR100776262B1 (en) | Soldering apparatus | |
JP2006327723A (en) | Electro-plating treatment system | |
JPS62151268A (en) | Vapor phase type soldering device | |
JPH0214855Y2 (en) | ||
JPH09132309A (en) | Substrate conveying device | |
JP2867674B2 (en) | Reflow equipment | |
JPH064609Y2 (en) | Mounting board edge cleaning device | |
JP2003083684A (en) | Conveyor mechanism for to-be-heated objects | |
JP2004337878A (en) | Reflow device and its method | |
JPH083996Y2 (en) | Printed circuit board transfer claw for automatic soldering machine | |
JPS61282213A (en) | Heat-insulating type conveyer chain for circuit board | |
JPS6232718Y2 (en) | ||
JP2023121332A (en) | Implementation system, solder paste placement unit, flux application unit, and implementation method | |
JP2506416B2 (en) | Printed board soldering device | |
JPH03214687A (en) | Reflow soldering device and method of heating reflow soldering device | |
JPS62148084A (en) | Vapor reflow type soldering device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |