JPS62151268A - Vapor phase type soldering device - Google Patents

Vapor phase type soldering device

Info

Publication number
JPS62151268A
JPS62151268A JP29438185A JP29438185A JPS62151268A JP S62151268 A JPS62151268 A JP S62151268A JP 29438185 A JP29438185 A JP 29438185A JP 29438185 A JP29438185 A JP 29438185A JP S62151268 A JPS62151268 A JP S62151268A
Authority
JP
Japan
Prior art keywords
conveyor
carrying
opening
conveyor frame
port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29438185A
Other languages
Japanese (ja)
Inventor
Nobuhide Abe
阿部 宣英
Takao Takahashi
孝夫 高橋
Katsuyuki Kakihara
柿原 勝之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP29438185A priority Critical patent/JPS62151268A/en
Publication of JPS62151268A publication Critical patent/JPS62151268A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • B23K1/015Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To reduce an outflow leakage vapor quantity by providing a conveyor frame whose interval can be adjusted in accordance with the change of the width size of a printed circuit board, and also providing an opening/closing plate for abutting on carrying-in port and carrying-out port parts. CONSTITUTION:A carrying conveyor 33 is provided between the carrying-in part 21 and the carrying-out part 22 of the printed circuit board, and also the conveyor frame of the conveyor 33 is installed so as to be freely slidable. Also, the opening/closing plate 82 is provided integrally with the conveyor frame, on the outside opening surface 81 of the carrying-in port and carrying-out port parts 21, 22, and also the opening/closing plate 82 is opened and closed by interlocking with the change of width of the conveyor frame. By following the change of the width size of the circuit board, the interval of the conveyor frame is adjusted by operating a handle, and also, by interlocking with it, the opening/closing plate 82 is moved and adjusted, and the leakage of vapor from the opening surface 81 is reduced. Accordingly, the leakage outflow quantity of an expensive vapor can be reduced.

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は、蒸気相が有する気化潜熱を利用してはんだ付
けを行う気相式はんだf」け装置に関するものである。 〔従来の技術) 一般的に気相式はんだ付け装置は、プリント配I91阜
板を搬送しながらこのプリント配線基板と13載部品ど
の間に介在する(、1んだを、蒸気槽内に形成された。 に気組が右りる気化潜熱により加熱して溶融することに
より、プリント配!22基板に搭載部品をはんだ付けす
るようにしている。 このような気組式はんだイ4け装置は、前記プリン1−
配線阜仮の搬送方向に搬入[1部1.熱気漕、I3 J
:びtrQ出口部が順次設けられる。前記搬入口部お1
σ搬出口部は内部に冷7JIコイルが鏝けられ、この冷
7JIコイルの(J縮f1用ににり中央部にILL置装
Iる1111記蒸気槽内の蒸気相が外部に流出すること
を防止するようにしている。 (発明が解決しようとする問題点) しかし、AFr記玲IJIコイルによる蒸気槽の流出防
止作用は完全なものではなく、前記搬入口部および搬出
口部がプリント配線v板を連続的に搬入おJ:び搬出す
る関係上常に間口しているから、この間口より外部に流
出する蒸気相を完全になく1ことはでさない。しかしこ
の蒸気相は高(iIlな不活性液から生成しているため
、この不活性液のWi費吊をできるだ(j少なくする必
要がある。 本発明の目的は、気相式はんだイ]け装置において蒸気
槽に対して設(Jた搬入口部および搬出[1部から蒸気
槽が外部に流出することをできるだけ防1卜することに
ある。 (問題点を解決するための手段) 本発明は、順次設けられた搬入口部21、蒸気槽11d
3よび搬出口部22を通してFli!設された搬送]ン
ベA733によりプリント配IH板Pを搬送しながら、
このプリント配&1基板Pと搭載部品Wとの間に介在す
[Industrial Application Field] The present invention relates to a vapor phase soldering device that performs soldering using the latent heat of vaporization of the vapor phase. [Prior art] In general, a vapor phase soldering device transfers a printed wiring board and forms solder (1) between the printed wiring board and the 13 components in a steam tank. The mounted components are soldered to the printed circuit board by heating and melting the solder by the latent heat of vaporization. , said pudding 1-
Transport the wiring in the transport direction [1 part 1. Hot air tank, I3 J
: and trQ exit sections are sequentially provided. The loading entrance section 1
A cold 7JI coil is inserted inside the σ export port, and the vapor phase in the steam tank is installed in the central part of the cold 7JI coil (for J compression f1) to flow out to the outside. (Problems to be Solved by the Invention) However, the effect of the AFr IJI coil to prevent leakage from the steam tank is not perfect, and the loading inlet and outlet are connected to printed wiring. Since there is always an opening due to the continuous loading and unloading of V-boards, it is impossible to completely eliminate the vapor phase flowing out from this opening.However, this vapor phase is Since it is generated from an inert liquid, the cost of this inert liquid can be reduced (it is necessary to reduce the cost of this inert liquid). The purpose of the present invention is to prevent as much as possible the steam tank from flowing out from the loading inlet section and the unloading section. (Means for solving the problem) Mouth part 21, steam tank 11d
3 and the exit port 22 through the Fli! While conveying the printed IH board P using conveyor A733,
Interposed between this printed circuit board P and the mounted component W.

【まんだSを前記、紫気槽11内に形成された蒸気相
15aの気化潜熱により加熱して溶融することにJ:リ
ブリント配線!! & Pに搭載部品Wをはんだ(−J
 IJりる気相式はんだ(]1ノ装置に関するしのであ
って、前記搬送コンベヤ33は、平行に配設されプリン
ト配P2X、1板Pの幅寸法の変更に応じて間隔調整可
能の両側の]ンベA7フレーム43.44と、この両側
の′:】ンベヤフレームに設けられ同期駆′!#される
一対の無端チェン61と、この一対の無端チェンに全長
(こわたって設けられプリント配線基板Pの両側部を直
接支持Jる支持部75とにより構成され、前記搬入口部
21および搬出口部22の外側間口面81にて前記:]
コンベヤフレーム4344に一体的に取(=Jけられた
開閉JEt82が前記搬入口部21および搬出口部22
の外側間口面81に当接した状態で開閉自在に設ijら
れたものである。 〔作用〕 本発明は、プリン1〜配線基板Pが小形の場合は前記一
対のコンベヤフレーム43.44を相互に近付け、前記
一対の無端71261間の間隔を狭めるように調整する
が、その際に前記コンベヤフレーム43、44に一体的
に設けられた開閉板82もコンベヤフレーム43.44
とともに相互に近付く方向に移動し、前記搬入口部21
および搬出口部22の外側間口面81の一部を閉じ、こ
の間口面81から外部へ流出する然気の流出量を減らす
。 (実施例) 以下、本発明を図面に示ず一実施例を参照して2TaI
に説明する。 第1図は気相式lまんだ付(ブ装置を示し、装置本体1
0の内部に蒸気槽11を5Ωけ、この、二へ気槽11の
下部に内(f912を設(1、口の内槽12の周囲に外
槽13を1;νす、この外槽13の内部にヒータ14を
設(フ、そして前記内槽12にフッ素糸不活fI溶剤1
5を収容するとと6に、前記外槽13にグリピリン、A
イル、は/しだ秀の(入熱媒体16を収°合する。この
」:うに伝熱jI!体1Gを介して114記溶剤庖・間
接加熱づるようにしたのは溶剤15の加熱むらを防11
シて溶剤15を全体的tこ均一に加51チリ−るためで
あり、仮に前記ヒータ14を溶剤15中に設りた場合は
このに−ク14に四埃等が付着して加熱むらが生じたと
きに集中的な加熱を受けた溶剤部分から有毒ガス、金属
腐蝕物質が発生するので、それを防止するためにこのよ
うな間1g加熱方式とした。 さらに前記蒸気槽11の一側部に搬入口部21を設置プ
るとともに他側部に搬出口部22を設(ノ、この搬入出
口部21.22の内壁および蒸気槽11の上部内壁に冷
却コイル23を設け、蒸気槽を凝縮ざけるようにする。 また装置本体10の内部に、前記搬入出口部21゜22
の開口から外部に流出しようとりる溶剤蒸気槽を強制的
に吸引して溶剤を回収し前記内槽12に戻す回収ユニッ
ト24と、溶剤を濾過して前記内IF’!’2に戻すフ
ィルタリングユニツ1〜25と、コント1]−ルボック
ス26と、4基の1リヒータ27とを配置役する。 第2図に示されるように前記Hn本体10の両端部の上
面を切欠いてプリンミル配線基板搬入部31とプリン1
〜配線基板搬出部32とを設り、この搬入部31から搬
出部32にわたってプリン1〜配線基板を搬送するm送
コンベA733を設ける。この搬送コンベヤ33は第1
図に示されるように上下に配置された前記ブリヒータ2
7間を通し、さらに前記搬入口部21、蒸気槽11およ
び搬出口部22を通して配設する。 第3図に示されるように前記搬送コンペへ733は、固
定設置されたスライドガイド41に対してスライド部4
2を介して左右のコンベヤフレーム43.44をそれぞ
れ接離方向に活動自在に設け、このコンベヤフレーム4
3.44の端部に一対の軸受45により回転自イ1に支
持された駆動軸46を回転自在かつ軸方向に摺動自在に
挿通する。そしてこの駆動軸46に各コンベヤフレーム
43.44の端部内で一体的に回動する一対の駆動スプ
ロケット47を設ける。この各駆動スプロケット41は
前記駆動軸46に対し軸方向にはコンベヤフレーム43
.44とともに移動する。 そうして前記駆動軸46の一端部に駆動モータ48の回
転をチェン伝動機構49を介し伝達する。 さらに図示しない軸受ににり回転自在に支1,1された
一方のねじ棒51を一側のコンベヤフレーム43のめね
じ部52に螺合するととしに他側のコンベヤフレーム4
4の挿通穴53を通しで引出し、またFノI示しない軸
受により回転白(j、に支持された他方のねじ棒54を
他側のコンベヤフレーム44のめねじ部55に螺合(J
る。そして名士]しに51.!i4にに1217に11
当合するギヤ56.57を一体的にbji i L/、
 13のねじ俸51に設けたハンドル58により一方の
bじ俸1)1を一方向に回転するととしに他方のねじ棒
54を他方向に回lll7iケることにより、左右のコ
ンベヤフレーム43、44はお亙いに接近する方向かま
たは耐量する方向に移動し、コンペN?フレーム43.
44間の幅調整がなされる。 この2本のねじ棒51.54を主とする=1ンベ■1フ
レーム43.44の一端側部の幅調整は構はコンベヤフ
レーム43.44の図示しない11!! 端側部にも設
け、そしてその両端側部のねじ棒54の回転をヂ1ン伝
動機構59により連動することにより、コンベヤフレー
ム43.44の両端部を等しく幅1渭整し、コンベヤフ
レーム43.44の平行を常に保つようにする。 このような幅調整可能の左右一対のコンベヤフレーム4
3.44の内部に同期して回行駆動される左右一対の無
端ヂエン61を平行に設ける。この無端チェンG1は、
前記駆動スプロケット47から第1図に示される従動ス
プロケット62にわたって巻掛けるとともに、前記蒸気
槽11内の搬送に対応する下側中間部をスプロケット6
3.64により上側部に接近さけるようにする。 第4図に示されるように前記左右一対の無端チェン61
は、前記コンベヤフレーム43.4.’Iおよびこのフ
レームに取付番ノだアングル材71に設けたガイドレー
ル12によって移動案内されるローラチfンCあり、ビ
ン13により順次連結された各リンクプレー1−74の
上部に支持部75を一体成形してなり、そして左右両側
に位lする複数の支持部75の先端7Gの上面にてプリ
ント配線基板Pの左右両側部を直接支持し、さらに各支
持部75に螺着して突設したねじ11によりプリント配
線基板1〕の左右両々ス:面を規制する。 このプリント配I!i1基板Pの上面および下面には面
実装型集積回路等の搭載部品Wが装着されている。この
搭載部品Wは本体パッケージを接着剤によりプリント配
FA CL板Pに回前され、そのリードしと基板Pとの
闇にはディスペンサにより基板面に塗布されたクリーム
はんだSが介在されている。 さらに第1図および第2図に示されるように前記搬入口
部21および搬出口部22の外側間口面81に開閉板8
2がそれぞれ、:Ωけられている。 この開閉板82は第3図に示されるようにこの開閉板8
2に溶接付【ノされた取付板83を介して111■記コ
ンベヤフレーム113.44に一体的に取f=Jけられ
、そして第5図に示されるにうにこの開閉板82は前記
搬入口部21(搬出口部22)の外側間口面81に当接
した状(、Q: ′ciij記コンペ!フレーム43.
44の幅調整とともに間開移動される。 次にこの実施例の作用を説明ずろと、前記榮入部31に
て左G無端ヂ1ン61の支持部75上かつねじ77間に
部品搭戎阜板Pを供給すると、この部品搭載jJ医Pは
、無端ヂエン61の搬送(り用にJ:り装置本体10の
内部に搬入され、先ずブリヒータ27により子加熱され
、次に前記2L気槽11内で前記間接加熱方式により1
14記溶l′11115上に気化形成されたフッ累系不
活性溶剤急気相+5aの内部を通過され、この段階で・
この蒸気槽15aの気化潜熱によりほぼ215°Cに加
熱され、この加熱によりi)を記クリーム(ユんだS 
/JX溶融され、プリント配ffAu板Pに搭載部品W
のリードL /)(はんだ付けされる。この部品1ハ戎
B、t IfIpが搬出部32に現れたらその基板Pを
取出す。 この気相式はんだ付(プ装置に供給されるプリン1〜配
線阜板Pの幅寸法が変更されたら、装置本体10の外側
にある前記ハンドル58を回動して前記左右のコンベヤ
フレーム43.44J3よび無端チェン61を同「、′
Iに幅方向に移動調整し、左右の無端ブー1261間の
間隔を角変調整する。 前記コンベヤフレーム43.44が幅方向に移動される
と、前記搬入口部21.T3よび搬出口部22の外側開
口面81に設けられた4枚の開閉板82も同時に移動さ
れ、例えば前記コンベヤフレーム43.44の間隔が狭
められると、前記開閉板82が前記外側開口面81の両
側部を閉じ、この開口面81の開口面積が小さくなるの
で、ごの搬入口部21および搬出口部22の外側11′
I口而81から外部に流出する蒸気量ら少なくなる。 〔発明の効果〕 本発明によれば、熱気槽の両側部に位首すろ搬入口部a
3よび搬出口部の外側開口面にてコンベヤフレームに一
体的に取付【ノられた開閉板が前記搬入口部43よび搬
出口部の外側開口面に当接した状態で間開自在に設けら
れたから、前記コンベヤフレームの幅調整に応じて前記
開口面の開口面積を小さくでき、蒸気槽内で発生した高
価な蒸気の外部への逃出し吊を少なくできる。
[J: Ribrint wiring! ! Solder the mounted parts W to &P (-J
This is related to the IJ Riru vapor phase soldering (1) device, in which the conveyor 33 is arranged in parallel and has a printed distribution P2 ] A7 conveyor frame 43, 44, a pair of endless chains 61 provided on both sides of the conveyor frame and driven synchronously, and a support part 75 that directly supports both sides, and the above-mentioned:]
The opening/closing JEt 82 integrally attached to the conveyor frame 4344 is connected to
It is installed so that it can be opened and closed freely while in contact with the outer frontage surface 81 of the door. [Function] In the present invention, when the printer 1 to the wiring board P are small, the pair of conveyor frames 43, 44 are moved closer to each other, and the distance between the pair of endless 71261 is adjusted to be narrowed. The opening/closing plate 82 provided integrally with the conveyor frames 43 and 44 is also connected to the conveyor frames 43 and 44.
and move toward each other, and the entrance portion 21
Then, a part of the outer frontage surface 81 of the outlet section 22 is closed to reduce the amount of air flowing out from the frontage surface 81 to the outside. (Example) The present invention is not shown in the drawings, but with reference to an example, 2TaI
Explain. Figure 1 shows a gas-phase type mandrel device.
A steam tank 11 of 5Ω is installed inside the 0, and an inner (f912) is installed at the bottom of the second air tank 11. A heater 14 is installed inside the tank (F), and a fluorine fiber inert fI solvent 1 is installed in the inner tank 12.
5 and 6, glypirin and A are stored in the outer tank 13.
114 The reason why the heat input medium 16 is combined with the heat input medium 16 is due to the uneven heating of the solvent 15. Prevent 11
This is to uniformly apply the solvent 15 to the entire surface, and if the heater 14 is installed in the solvent 15, dust etc. may adhere to the heater 14, causing uneven heating. When this happens, toxic gas and metal corrosive substances are generated from the solvent portion that is heated intensively, so in order to prevent this, a 1 g heating method was used. Further, a carry-in port 21 is installed on one side of the steam tank 11, and a carry-in port 22 is provided on the other side. A coil 23 is provided to condense the steam tank. Also, inside the device body 10, the loading/unloading/exit portion 21° 22
a recovery unit 24 that forcibly sucks the solvent vapor tank that flows out from the opening of the inner tank 12, recovers the solvent, and returns it to the inner tank 12; The filtering units 1 to 25 that return to 2, the control box 26, and the four 1-reheaters 27 are arranged. As shown in FIG. 2, the upper surface of both ends of the Hn main body 10 is cut out to form a pudding mill wiring board loading section 31 and a pudding 1.
- a wiring board carry-out section 32, and an m-transfer conveyor A733 for conveying the pudding 1 - wiring boards from the carrying-in section 31 to the carrying-out section 32. This conveyor 33 is the first
The pre-heater 2 is arranged vertically as shown in the figure.
7, and further through the carrying-in port 21, the steam tank 11, and the carrying-out port 22. As shown in FIG. 3, the slide portion 4 is moved to the conveyance competition 733 with respect to the fixedly installed slide guide 41.
2, the left and right conveyor frames 43 and 44 are provided so as to be movable in the approaching and separating directions, respectively.
A drive shaft 46 supported by the rotatable body 1 by a pair of bearings 45 is inserted into the end of the shaft 3.44 so as to be rotatable and slidable in the axial direction. The drive shaft 46 is provided with a pair of drive sprockets 47 that rotate integrally within the ends of each conveyor frame 43,44. Each drive sprocket 41 is connected to a conveyor frame 43 in the axial direction with respect to the drive shaft 46.
.. Move with 44. The rotation of the drive motor 48 is then transmitted to one end of the drive shaft 46 via the chain transmission mechanism 49. Further, one threaded rod 51 rotatably supported by bearings (not shown) is screwed into the female threaded portion 52 of the conveyor frame 43 on one side, and then the conveyor frame 4 on the other side is screwed.
4 through the insertion hole 53, and screw the other threaded rod 54 supported by the rotating shaft (j) into the female threaded portion 55 of the conveyor frame 44 on the other side by means of a bearing (not shown).
Ru. and celebrity] Shini 51. ! i4 to 1217 to 11
The matching gears 56 and 57 are integrally bji i L/,
The left and right conveyor frames 43, 44 are rotated by rotating one screw rod 1) 1 in one direction and turning the other screw rod 54 in the other direction using the handle 58 provided on the screw rod 51 of No. 13. moves in the direction approaching or in the direction of resistance, and competition N? Frame 43.
44 width adjustment is made. The width adjustment of one end side of the conveyor frame 43.44 is performed mainly by the two threaded rods 51.54. ! By interlocking the rotation of the threaded rods 54 on both end sides with the jin transmission mechanism 59, both ends of the conveyor frames 43 and 44 are equally spaced by one width, and the conveyor frame 43 .44 should always be kept parallel. Such a pair of left and right conveyor frames 4 whose width is adjustable
A pair of left and right endless chains 61 which are rotated in synchronization with each other are provided in parallel inside the 3.44. This endless chain G1 is
It is wound from the driving sprocket 47 to the driven sprocket 62 shown in FIG.
3. Avoid approaching the upper part by 64. As shown in FIG. 4, the pair of left and right endless chains 61
is the conveyor frame 43.4. There is a roller chain C whose movement is guided by a guide rail 12 provided on an angle member 71 with a mounting number on this frame. It is integrally molded, and directly supports the left and right sides of the printed wiring board P on the upper surface of the tips 7G of the plurality of support parts 75 located on both the left and right sides, and is further screwed onto each support part 75 to protrude. Both the left and right sides of the printed wiring board 1] are regulated by the screws 11 that have been set. This print arrangement I! Mounting components W such as surface-mounted integrated circuits are mounted on the upper and lower surfaces of the i1 board P. This mounting component W has its main package mounted on a printed FA CL board P using an adhesive, and cream solder S applied to the board surface by a dispenser is interposed between the leads and the board P. Furthermore, as shown in FIGS. 1 and 2, opening and closing plates 8
2 are each digitized by :Ω. This opening/closing plate 82 is as shown in FIG.
2 is integrally attached to the conveyor frame 113.44 via a welded mounting plate 83, and as shown in FIG. The frame 43.
With the width adjustment of 44, the opening is moved. Next, in order to explain the operation of this embodiment, when the component mounting plate P is supplied on the support part 75 of the left G endless chain 1 61 and between the screws 77 at the insertion part 31, this component mounting JJ doctor P is carried into the inside of the apparatus main body 10 for transporting the endless die 61, first heated by the sub-heater 27, and then heated by the indirect heating method in the 2L air tank 11.
14 The fluorine-based inert solvent vaporized and formed on the solution l'11115 passes through the inside of the rapid vapor phase +5a, and at this stage...
The steam tank 15a is heated to approximately 215°C due to the latent heat of vaporization, and as a result of this heating, i) is
/JX melted parts W mounted on printed Au board P
Lead L/) (is soldered. When this component 1 is soldered), the board P is taken out. When the width dimension of the cover plate P is changed, rotate the handle 58 on the outside of the device main body 10 to move the left and right conveyor frames 43, 44J3 and the endless chain 61 in the same direction.
I to adjust the movement in the width direction, and adjust the distance between the left and right endless boobies 1261 by changing the angle. When the conveyor frames 43 and 44 are moved in the width direction, the entrance portion 21. T3 and the four opening/closing plates 82 provided on the outer opening surface 81 of the outlet section 22 are also moved at the same time. For example, when the interval between the conveyor frames 43, 44 is narrowed, the opening/closing plates 82 move to the outer opening surface 81. Since the opening area of this opening surface 81 becomes smaller, the outer side 11' of the loading port 21 and the loading port 22 is closed.
The amount of steam flowing out from the I-port 81 is also reduced. [Effects of the Invention] According to the present invention, there is a slot loading port a on both sides of the hot air tank.
3 and is integrally attached to the conveyor frame at the outer opening surface of the carrying-in port 43 and the carrying-out port. Therefore, the opening area of the opening surface can be reduced in accordance with the width adjustment of the conveyor frame, and the amount of expensive steam generated in the steam tank escaping to the outside can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の気相式はんだイ」け装置の一実施例を
示す断面図、第2図はその平面図、第3図はそのl!!
2送コンベヤの斜視図、第4図はその断面図、第5図は
搬入口部の外側開口面部分の斜視図である。 P・・プリント配線基板、W・・搭載部品、S・・はん
だ、11・・蒸気槽、15a ・・蒸気槽、21・・搬
入口部、22・・搬出口部、33・・搬送コンベヤ、4
3.44・・コンベヤフレーム、61・・無端1− r
ン、75・・支持部、81・・外側開口面、82・・聞
1!i’l仮。
Fig. 1 is a sectional view showing an embodiment of the vapor phase soldering device of the present invention, Fig. 2 is a plan view thereof, and Fig. 3 is its l! !
FIG. 4 is a perspective view of the two-feed conveyor, FIG. 4 is a sectional view thereof, and FIG. 5 is a perspective view of the outer opening surface of the carry-in port. P...Printed wiring board, W...Mounted parts, S...Solder, 11...Steam tank, 15a...Steam tank, 21...Carry-in port, 22...Carry-out port, 33...Transport conveyor, 4
3.44...Conveyor frame, 61...Endless 1-r
75... Support part, 81... Outer opening surface, 82... 1! i'l tentative.

Claims (1)

【特許請求の範囲】[Claims] (1)順次設けられた搬入口部、蒸気槽および搬出口部
を通して配設された搬送コンベヤによりプリント配線基
板を搬送しながら、このプリント配線基板と搭載部品と
の間に介在するはんだを前記蒸気槽内に形成された蒸気
相の気化潜熱により加熱して溶融することによりプリン
ト配線基板に搭載部品をはんだ付けする気相式はんだ付
け装置において、前記搬送コンベヤは、平行に配設され
プリント配線基板の幅寸法の変更に応じて間隔調整可能
の両側のコンベヤフレームと、この両側のコンベヤフレ
ームに設けられ同期駆動される一対の無端チェンと、こ
の一対の無端チェンに全長にわたって設けられプリント
配線基板の両側部を直接支持する支持部とにより構成さ
れ、前記搬入口部および搬出口部の外側開口面にて前記
コンベヤフレームに一体的に取付けられた開閉板が前記
搬入口部および搬出口部の外側開口面に当接した状態で
開閉自在に設けられたことを特徴とする気相式はんだ付
け装置。
(1) While the printed wiring board is being transported by a conveyor that is disposed through a loading port, a steam tank, and a loading port that are sequentially provided, the solder interposed between the printed wiring board and the mounted components is removed by the steam. In a vapor phase soldering apparatus that solders mounted components to a printed wiring board by heating and melting them using the latent heat of vaporization of a vapor phase formed in a tank, the conveyor is arranged in parallel to solder the printed wiring board. A conveyor frame on both sides whose spacing can be adjusted according to changes in the width dimension, a pair of endless chains installed on the conveyor frames on both sides and driven synchronously, and a printed wiring board installed over the entire length of the pair of endless chains. an opening/closing plate that is integrally attached to the conveyor frame at the outer opening surface of the carry-in port and the carry-out port; A vapor phase soldering device characterized by being provided so as to be able to be opened and closed while in contact with an opening surface.
JP29438185A 1985-12-26 1985-12-26 Vapor phase type soldering device Pending JPS62151268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29438185A JPS62151268A (en) 1985-12-26 1985-12-26 Vapor phase type soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29438185A JPS62151268A (en) 1985-12-26 1985-12-26 Vapor phase type soldering device

Publications (1)

Publication Number Publication Date
JPS62151268A true JPS62151268A (en) 1987-07-06

Family

ID=17806985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29438185A Pending JPS62151268A (en) 1985-12-26 1985-12-26 Vapor phase type soldering device

Country Status (1)

Country Link
JP (1) JPS62151268A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01210168A (en) * 1988-02-17 1989-08-23 Nippon Dennetsu Keiki Kk Printed circuit board transfer device
JPH02155565A (en) * 1988-12-09 1990-06-14 Hitachi Techno Eng Co Ltd Vapor reflow type soldering device
EP0598367A1 (en) * 1992-11-17 1994-05-25 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5973798A (en) * 1997-01-17 1999-10-26 Nec Corporation Image scanner
WO2013105149A1 (en) * 2012-01-12 2013-07-18 ヤマハ発動機株式会社 X-ray inspection device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01210168A (en) * 1988-02-17 1989-08-23 Nippon Dennetsu Keiki Kk Printed circuit board transfer device
JPH02155565A (en) * 1988-12-09 1990-06-14 Hitachi Techno Eng Co Ltd Vapor reflow type soldering device
EP0598367A1 (en) * 1992-11-17 1994-05-25 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5524812A (en) * 1992-11-17 1996-06-11 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
EP0753370A1 (en) * 1992-11-17 1997-01-15 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5715990A (en) * 1992-11-17 1998-02-10 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
EP0934792A2 (en) * 1992-11-17 1999-08-11 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
EP0934792A3 (en) * 1992-11-17 2001-09-05 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5973798A (en) * 1997-01-17 1999-10-26 Nec Corporation Image scanner
WO2013105149A1 (en) * 2012-01-12 2013-07-18 ヤマハ発動機株式会社 X-ray inspection device
JP2013142677A (en) * 2012-01-12 2013-07-22 Yamaha Motor Co Ltd X-ray inspection device
US9322790B2 (en) 2012-01-12 2016-04-26 Yamaha Hatsudoki Kabushiki Kaisha X-ray inspection device

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