CN101707857B - PCB welding machine and welding method - Google Patents
PCB welding machine and welding method Download PDFInfo
- Publication number
- CN101707857B CN101707857B CN2009103104035A CN200910310403A CN101707857B CN 101707857 B CN101707857 B CN 101707857B CN 2009103104035 A CN2009103104035 A CN 2009103104035A CN 200910310403 A CN200910310403 A CN 200910310403A CN 101707857 B CN101707857 B CN 101707857B
- Authority
- CN
- China
- Prior art keywords
- pcb board
- conveyer
- scaling powder
- gripper
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention relates to a PCB welding machine which comprises a first conveying device for a PCB to pass through, a mechanical claw used for gripping the PCB, a three-dimensional displacement system driving the mechanical claw to realize the three-dimensional movement, a soldering flux spraying device used for spraying soldering flux on the PCB to be welded, a preheating device for preheating the PCB on which the soldering flux is sprayed, a second conveying device, a welding device and a control system, wherein the first conveying device comprises a board inlet end and a board outlet end, the second conveying device comprises a temporary storage end used for temporarily storing the PCB on which the soldering flux is sprayed, a preheating end positioned at the preheating device, and a board pushing mechanism for pushing the PCB end at the temporary storage end to the preheating end. The invention also relates to a welding method applying the PCB welding machine. The invention can realize three procedures of spraying the soldering flux, preheating and welding in same equipment, and execute the procedure of optimizing, simultaneously process three PCBs in the welding machine, thereby greatly improving the production efficiency and having small occupation area of the welding machine.
Description
Technical field
The present invention relates to the pcb board welding technology field, refer in particular to pcb board bonding machine and welding method.
Background technology
In the pcb board welding procedure, before realizing welding, generally also need be through spray scaling powder, preheating, for this reason, normally set up a flow production line, to spray scaling powder equipment, pre-heating device and welding equipment and connect successively, and grasp pcb board by gripper and between three equipment, transport in regular turn.Owing to generally only be provided with a gripper, therefore, each constantly all can only be at a device processes pcb board, and other two equipment are all by idle, for example: when gripper extracting pcb board sprays scaling powder, pre-heating device, welding equipment are all idle, and when gripper extracting pcb board welded, spray scaling powder equipment and pre-heating device also left unused, as seen, its utilization rate of equipment and installations is low, and the corresponding production efficiency that also causes is quite low.To this, some pcb board manufacturers also improve the station utilance by the mode that increases gripper quantity, but have also caused the equipment cost increase thus.In addition, existing will to spray the production line that scaling powder equipment, pre-heating device and welding equipment connect to form successively comparatively huge, higher to the factory building space requirement, is unfavorable for promoting.
Summary of the invention
Technical problem to be solved by this invention is, a kind of pcb board bonding machine is provided, and it can promptly realize spray scaling powder, preheating and welding three process in same equipment, enhance productivity.
Another technical problem to be solved of the present invention is, a kind of pcb board welding method is provided, and promptly to realize spray scaling powder, preheating and welding three process in same equipment, enhances productivity.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of pcb board bonding machine, comprise first conveyer for pcb board turnover, gripper that is used to grasp pcb board, drive gripper realize the three-dimensional three-D displacement system that moves, be used for to pcb board spraying scaling powder to be welded spray scaling powder device, be used for the pcb board that has sprayed scaling powder is carried out preheating device, second conveyer, welder and the control system of preheating.Described first conveyer comprises into plate end and ejecting plate end, and described second conveyer comprises and is positioned at the rushing board mechanism that the pcb board that is used for the temporary temporary end that has sprayed the pcb board of scaling powder, is positioned at the pre-hot junction at preheating device place and will keeps in end away from preheating device pushes to pre-hot junction.
Further, described first conveyer and second conveyer apart be arranged in parallel predeterminable range, the temporary end that advances the plate end and second conveyer of described first conveyer is positioned at same end, and the ejecting plate end of first conveyer is positioned at the identical other end with the pre-hot junction of second conveyer, advancing to be provided with spray scaling powder device between plate end and the temporary end, between ejecting plate end and pre-hot junction, be provided with welder.
Further, described second conveyer comprises two guide rails that be arranged in parallel, and the position that an end of described two guide rails that be arranged in parallel is positioned at away from preheating device forms described temporary end, and the other end is positioned at the preheating device place and forms described pre-hot junction.
Further, described rushing board mechanism comprises dynamical element and the pushing block that is driven by dynamical element, and described dynamical element is cylinder or motor.
Further, described second conveyer also is provided with and is used to detect the position transducer whether pcb board is pushed to the pre-position in pre-hot junction.
Further, described preheating device is an infrared heating device.
Further, described welder is the wave soldering device.
On the other hand, the present invention also provides a kind of pcb board welding method of using above-mentioned pcb board bonding machine, comprises the steps:
Further, spray scaling powder device is during to pcb board spraying scaling powder, and spray scaling powder device maintains static, and the three-D displacement system drives gripper and moves under control system control, make each zone to be welded of pcb board aim at spray scaling powder device successively and realize spraying.
Further, when welder welded pcb board, welder maintained static, and the three-D displacement system drives gripper and moves under control system control, made each zone to be welded of pcb board aim at welder successively and realize welding.
Beneficial effect of the present invention is as follows: the present invention is by being provided with spray scaling powder device, preheating device and welder in same bonding machine, and cooperate a gripper by the three-D displacement system drive, can in same equipment, realize spray scaling powder, preheating and welding three process, and can there be three pcb boards in bonding machine, to handle simultaneously, greatly promoted production efficiency, and the bonding machine compact conformation, floor space is little.And method of the present invention has effectively been optimized the welding procedure operation, and production efficiency is greatly improved.
Description of drawings
Fig. 1 is the stereogram of pcb board bonding machine of the present invention.
Fig. 2 is a pcb board bonding machine plane figure schematic diagram of the present invention.
Fig. 3 is the view after the invention process step 1.
Fig. 4 is the view after the invention process step 2.
Fig. 5 is that the invention process step 3 is placed on pcb board the view of keeping in after holding.
To be the invention process step 3 be pushed into view behind the pre-hot junction with pcb board from temporary end to Fig. 6.
Fig. 7 is the view after the invention process step 4.
Fig. 8 is that the invention process step 5 is placed on pcb board temporary end and grasps pcb board from preheating device the view when welding.
Fig. 9 is the view of the invention process step 6.
Embodiment
As shown in Figures 1 and 2, the invention provides a kind of pcb board bonding machine, comprise first conveyer 1 for pcb board turnover, gripper 2 that is used to grasp pcb board, drive gripper 2 and realize the three-dimensional three-D displacement system 3 that moves, spray scaling powder device 4, preheating device 5, second conveyer 6, welder 7 and control system.
Described first conveyer 1 comprises into plate end 10 and ejecting plate end 12, usually can adopt common various transfer assemblies such as belt conveyor, guide rail, transfer roller to constitute described first conveyer, can enter the precalculated position that the plate end determines that a pcb board input back is stopped by control system.
The main application of described gripper 2 is to be used to grasp pcb board, and realizes that under the driving of three-D displacement system 3 three-dimensional of pcb board moves.
Described spray scaling powder device 4 is used for pcb board spraying scaling powder to be welded; Described preheating device 5 is used for the pcb board that has sprayed scaling powder is carried out preheating, removes the moisture content in the scaling powder and allows the temperature of pcb board reach default temperature value, preferably adopts infrared heating device; Described welder 7 then is used for finally realizing the welding of pcb board, preferably adopts the wave soldering device.
The early existing a large amount of ripe application in the middle of existing welding equipment and/or plant equipment of above-mentioned described gripper 2, three-D displacement system 3, spray scaling powder device 4, preheating device 5, welder 7, the present invention just directly uses existing related system and device, system that these are single and device are not innovation emphasis of the present invention place, so seldom give unnecessary details in this concrete formation to above-mentioned individual system and device.
Described second conveyer 6 comprises two guide rails that be arranged in parallel 60, one end of described two guide rails 60 forms a temporary end 600 away from preheating device 5, and the other end is positioned at formation one pre-hot junction 602, preheating device 5 places, and described second conveyer 6 comprises that also the pcb board that will place temporary end 600 pushes to the rushing board mechanism (scheming not shown) in pre-hot junction 602.Described rushing board mechanism comprises dynamical element (scheming not shown) and the pushing block that is driven by dynamical element, and described dynamical element can adopt cylinder or motor.Described second conveyer 6 also is provided with and is used to detect the position transducer 64 whether pcb board is pushed to the pre-position in pre-hot junction 602.
Described control system is used for above-mentioned each device and gripper, three-D displacement system are controlled, so that each device can work compound, raises the efficiency, and described control system can adopt chip microcontroller control able to programme.
On the plane distribution of each assembly, layout is as shown in Figure 2 preferably: described first conveyer 1 and second conveyer 6 apart be arranged in parallel certain distance, and distance between the two can hold spray scaling powder device 4, welder 7 gets final product.The temporary end 20 that advances the plate end 10 and second conveyer 2 of described first conveyer 1 is positioned at same end, and the ejecting plate end 12 of first conveyer 1 is positioned at the identical other end with the pre-hot junction 22 of second conveyer 2, advancing to be provided with spray scaling powder device 4 between plate end 10 and the temporary end 20, between ejecting plate end 12 and pre-hot junction 22, be provided with welder 7.Thus, pcb board can have optimized mobile route, thereby can enhance productivity.
Based on above-mentioned pcb board bonding machine, the present invention also provides a kind of pcb board welding method, comprises the steps:
In above-mentioned welding method, during 4 pairs of pcb board sprayings of spray scaling powder device scaling powder, spray scaling powder device 4 maintains static, three-D displacement system 3 grabs the gripper 2 of pcb board 8 in drive under the control system control and moves above spray scaling powder device 4, make each zone to be welded of pcb board 8 aim at spray scaling powder device 4 successively and realize spraying, liquid soldering flux can be coated on equably determine each good position in advance.
And 7 pairs of pcb boards 8 of welder are when welding, welder 7 maintains static, three-D displacement system 3 drives the gripper 2 of grabbing pcb board 8 and moves above welder 7 under control system control, make each zone to be welded of pcb board 8 aim at welder 7 successively and make each zone that pre-determines and be sprayed with scaling powder realize welding.
The coordinate figure that only needs to import each welding region in advance can realize that above-mentioned three-D displacement system 3 drives the gripper 2 of grabbing pcb board 8 and moves under control system control by Single-chip Controlling above spray scaling powder device 4 and welder 7.
Claims (10)
1. pcb board bonding machine, it is characterized in that: it comprises first conveyer for the pcb board turnover, a gripper that is used to grasp pcb board, drive gripper and realize the three-dimensional three-D displacement system that moves, be used for spray scaling powder device to pcb board spraying scaling powder to be welded, be used for the pcb board that has sprayed scaling powder is carried out the preheating device of preheating, second conveyer, welder and control system, described first conveyer comprises into plate end and ejecting plate end, and described second conveyer comprises the temporary end that is used for keeping in the pcb board that has sprayed scaling powder away from preheating device, the pcb board that is positioned at the pre-hot junction at preheating device place and will keeps in end pushes to the rushing board mechanism in pre-hot junction.
2. pcb board bonding machine as claimed in claim 1, it is characterized in that: described first conveyer and second conveyer apart be arranged in parallel predeterminable range, the temporary end that advances the plate end and second conveyer of described first conveyer is positioned at same end, and the ejecting plate end of first conveyer is positioned at the identical other end with the pre-hot junction of second conveyer, advancing to be provided with spray scaling powder device between plate end and the temporary end, between ejecting plate end and pre-hot junction, be provided with welder.
3. pcb board bonding machine as claimed in claim 2, it is characterized in that: described second conveyer comprises two guide rails that be arranged in parallel, the position that one end of described two guide rails that be arranged in parallel is positioned at away from preheating device forms described temporary end, and the other end is positioned at the preheating device place and forms described pre-hot junction.
4. pcb board bonding machine as claimed in claim 1 is characterized in that: described rushing board mechanism comprises dynamical element and the pushing block that is driven by dynamical element, and described dynamical element is cylinder or motor.
5. pcb board bonding machine as claimed in claim 1 is characterized in that: described second conveyer also is provided with and is used to detect the position transducer whether pcb board is pushed to the pre-position in pre-hot junction.
6. pcb board bonding machine as claimed in claim 1 is characterized in that: described preheating device is an infrared heating device.
7. pcb board bonding machine as claimed in claim 1 is characterized in that: described welder is the wave soldering device.
8. the pcb board welding method of any described pcb board bonding machine in application such as the claim 1 ~ 7 is characterized in that, comprises the steps:
Step 1, first conveyer will be inputed to the precalculated position and realize into plate operation from advancing the plate end by the pcb board to be welded that provide for panel assembly of outside;
Step 2, gripper grasps pcb board to be welded from the precalculated position of first conveyer, and move to spray scaling powder device place and pcb board is sprayed scaling powder by spray scaling powder device, after gripper grasped pcb board to be welded and leaves the first conveyer precalculated position, first conveyer plate that advances of implementation step one was once more operated;
Step 3, after scaling powder spraying was finished, the pcb board that will spray scaling powder by gripper was placed on the temporary end of second conveyer, and the pcb board that will be placed on its temporary end by second conveyer is delivered to pre-hot junction and carries out preheating by preheating device;
Step 4, gripper grasps pcb board to be welded from the precalculated position of first conveyer once more, and move to spray scaling powder device place pcb board is sprayed scaling powder, grasp pcb board to be welded once more and left the first conveyer precalculated position and control system and do not sent when stopping into partitioned signal at gripper, first conveyer also once more implementation step one advance the plate operation;
Step 5, the pcb board that gripper will spray scaling powder once more is placed on the temporary end of second conveyer, gripper grasps the pcb board that preheating finishes again and moves to welder and by welder pcb board welded from pre-hot junction then, grasp the pcb board that preheating finishes and left preheating device and temporary end when still being placed with pcb board from preheating device at gripper, second conveyer is delivered to pre-hot junction with pcb board of its temporary end once more and carries out preheating by preheating device;
Step 6, gripper will the pcb board through welding be positioned over the ejecting plate end of first conveyer, will weld good pcb board output by first conveyer;
Step 7, whether the pcb board that is put down by gripper in the control system determining step six is second from the bottom pcb board that needs welding, if not, then beginning circulation from step 4 again carries out, if, then gripper directly grasps pcb board that preheating finishes and moves to welder and weld from pre-hot junction, is positioned over the welding process that whole pcb boards are promptly finished in the output of first conveyer after welding is good.
9. pcb board welding method as claimed in claim 8, it is characterized in that: when spray scaling powder device sprays scaling powder to pcb board, spray scaling powder device maintains static, the three-D displacement system drives gripper and moves under control system control, make each zone to be welded of pcb board aim at spray scaling powder device successively and realize spraying.
10. pcb board welding method as claimed in claim 8, it is characterized in that: when welder welds pcb board, welder maintains static, and the three-D displacement system drives gripper and moves under control system control, makes each zone to be welded of pcb board aim at welder successively and realize welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103104035A CN101707857B (en) | 2009-11-25 | 2009-11-25 | PCB welding machine and welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103104035A CN101707857B (en) | 2009-11-25 | 2009-11-25 | PCB welding machine and welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101707857A CN101707857A (en) | 2010-05-12 |
| CN101707857B true CN101707857B (en) | 2011-05-04 |
Family
ID=42378012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103104035A Expired - Fee Related CN101707857B (en) | 2009-11-25 | 2009-11-25 | PCB welding machine and welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101707857B (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925263B (en) * | 2010-08-01 | 2012-06-13 | 苏州佳世达电通有限公司 | Wave-soldering device and wave-soldering method |
| CN102485406A (en) * | 2010-12-01 | 2012-06-06 | 天威新能源控股有限公司 | Welding production line of crystalline silicon solar module |
| CN102485400A (en) * | 2010-12-06 | 2012-06-06 | 西安中科麦特电子技术设备有限公司 | Crest welder cooling device |
| TWI435674B (en) * | 2011-01-28 | 2014-04-21 | Wistron Corp | Method of soldering a dip component on a circuit board and soldering system |
| CN102689071B (en) * | 2012-06-18 | 2016-07-06 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
| CN103687328A (en) * | 2012-09-26 | 2014-03-26 | 光宝电子(广州)有限公司 | A soldering tin detecting and automatically-repairing system and a method thereof |
| CN103203511A (en) * | 2013-04-24 | 2013-07-17 | 无锡市崇安区科技创业服务中心 | Intelligent wave soldering system |
| CN103611998B (en) * | 2013-11-19 | 2015-09-30 | 华南农业大学 | Circuit board defect solder joint automatic marking device |
| CN103894696B (en) * | 2014-03-19 | 2018-05-01 | 深圳市浩宝自动化设备有限公司 | A kind of flukeless segmentation transmission Wave soldering apparatus |
| CN104668691A (en) * | 2015-01-31 | 2015-06-03 | 孙华 | Full-automatic PCB tin dipping equipment |
| CN105108260B (en) * | 2015-07-21 | 2017-03-01 | 杭州西力电能表制造有限公司 | The double inserted sheet wave crest welding device of ammeter pcb board |
| CN105346922A (en) * | 2015-11-27 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | Single-track conveyor |
| CN106041391B (en) * | 2016-05-30 | 2017-08-15 | 武汉电信器件有限公司 | A kind of BOX packagings are sintered to fix fixture |
| CN106112168B (en) * | 2016-08-22 | 2019-02-22 | 朗微士光电（苏州）有限公司 | A kind of online vacuum back-flow welding machine |
| CN106425001A (en) * | 2016-09-02 | 2017-02-22 | 深圳市新益昌自动化设备有限公司 | Rail-type welding device and LED (Light Emitting Diode) reflow welding machine |
| CN107717152B (en) * | 2017-10-23 | 2020-06-02 | 肇庆中特能科技投资有限公司 | Spraying device for carbon fiber composite zinc net |
| CN108890063A (en) * | 2018-07-12 | 2018-11-27 | 深圳市劲拓自动化设备股份有限公司 | A kind of control method of crest welder, device, crest welder and storage medium |
| CN109302810A (en) * | 2018-09-17 | 2019-02-01 | 赖海燕 | A kind of chip-packaging structure and chip package process |
| CN109732171A (en) * | 2019-03-20 | 2019-05-10 | 河南实拓实业有限公司 | A kind of Full-automatic tin-immersion machine |
| CN112192115B (en) * | 2020-09-17 | 2023-03-17 | 武汉联特科技股份有限公司 | Height-adjustable optical assembly and flexible PCB welding fixture and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5125555A (en) * | 1989-06-23 | 1992-06-30 | Sapri S.P.A. | Automatic braze welding machine with sensor |
| CN2173493Y (en) * | 1992-12-31 | 1994-08-03 | 张亚东 | Automatic wave crest welding machine |
| CN1290122A (en) * | 1999-12-27 | 2001-04-04 | 深圳市中兴通讯股份有限公司 | Long-insertion welding method without cleaning |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
-
2009
- 2009-11-25 CN CN2009103104035A patent/CN101707857B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5125555A (en) * | 1989-06-23 | 1992-06-30 | Sapri S.P.A. | Automatic braze welding machine with sensor |
| CN2173493Y (en) * | 1992-12-31 | 1994-08-03 | 张亚东 | Automatic wave crest welding machine |
| CN1290122A (en) * | 1999-12-27 | 2001-04-04 | 深圳市中兴通讯股份有限公司 | Long-insertion welding method without cleaning |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101707857A (en) | 2010-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101707857B (en) | PCB welding machine and welding method | |
| CN103447347B (en) | Tape article continuous drawing production line and production method | |
| CN206351226U (en) | The continuous tool hand of forging press multi-station machine | |
| CN101725230B (en) | Flow line processing equipment of thermal insulating decoration board and processing flow thereof | |
| CN110228635A (en) | A kind of the pallet-free packing production line and its packaging method of brick | |
| CN101767076B (en) | Spraying production line of automobile parts | |
| CN105383896A (en) | Hook production line | |
| CN203797171U (en) | Continuous production system of thermal insulation pipe | |
| CN201579168U (en) | Automobile part spraying production line | |
| CN208377748U (en) | A kind of high flexibility fork truck arm production line | |
| CN206494485U (en) | A kind of automatic feeding | |
| CN106904421A (en) | A kind of pallet reshaping device and its control method | |
| CN103642994A (en) | Multifunctional planar quench machine tool | |
| CN104669271B (en) | Capture chuck assembly and three axle feed arrangements, loader robot, system of processing | |
| CN103551639A (en) | Full automatic malleable cast iron pipe fitting flat head machine and processing method thereof | |
| CN110116178B (en) | MES system-based cabinet workshop sheet metal blanking turnover method | |
| CN201834599U (en) | Copper-clad plate lamination system | |
| CN208732058U (en) | Collaborate stacking machine | |
| CN203804366U (en) | Automatic tin feeding and soldering system | |
| CN203639499U (en) | Multifunctional plane quenching machine tool | |
| CN102615376A (en) | Programmable atomizer and control method thereof | |
| CN203526653U (en) | Full-automatic malleable cast iron pipe fitting end-flattening machine | |
| CN202846153U (en) | Automatic binding and pressing system | |
| CN202633260U (en) | Auto-induction chip-arranging machine for package of integrated circuit chips | |
| CN204397323U (en) | A kind of buzzer automatic assembling machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20121125 |