CN103611998B - Circuit board defect solder joint automatic marking device - Google Patents
Circuit board defect solder joint automatic marking device Download PDFInfo
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- CN103611998B CN103611998B CN201310586736.7A CN201310586736A CN103611998B CN 103611998 B CN103611998 B CN 103611998B CN 201310586736 A CN201310586736 A CN 201310586736A CN 103611998 B CN103611998 B CN 103611998B
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- slide unit
- electronic slide
- circuit board
- axis
- support plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The invention discloses a kind of circuit board defect solder joint automatic marking device, comprising for placing circuit board and the circuit board making circuit board linearly slide to advance transmits guide assembly, transmits push bracket assembly for the circuit board that pushes circuit board, for the XY coordinate setting identification mechanism that regulates XY coordinate position to get ready and for control circuit board transmits guide assembly, circuit board transmits push bracket assembly and the work of XY coordinate setting identification mechanism control system; Described circuit board transmits guide assembly, circuit board transmits push bracket assembly and is connected with control system respectively with XY coordinate setting identification mechanism.Circuit board defect solder joint automatic marking device of the present invention adopts Open architecture, and structure simple, be convenient to safeguard, decrease the degree of participation of people in production process, avoid mistake, thus improve the stability and accuracy of producing, to improve the effect and quality that enterprise produces, the automated production of Promoting Enterprise and information system management.
Description
Technical field
The present invention relates to a kind of circuit board defect solder joint identity device, especially a kind of circuit board defect solder joint automatic marking device, belongs to the identification technology field of circuit board.
Background technology
The continuous progress of science and technology changes the life style of people gradually, and various electronic product has incorporated the life of people.Along with reform and opening-up, China is due to the preferential policy in human resources, market, investment etc., and attracted American-European manufacturing extensive transfer, factory is built up in China by a large amount of electronics manufacturer.Meanwhile, household electric appliances and the consumer electronics industry of China obtain fast development, and on the streamline of e-factory, every day all needs to produce a large amount of circuit boards.And the mode of production of circuit board is according to the difference of electronic component, be roughly divided into direct insertion and SMD.Because these two kinds of manufacturing process are different, for assigning of element direct insertion on circuit board, usual needs manually assign according to the type selecting of electronic component or machine is assigned.Assigned the circuit board of electronic component after crest welder, electronic component just welds on circuit boards.Due to technical bottleneck, this welding electronic elements mode easily causes two kinds of quality problems: rosin joint, solder skip or bridge joint may appear in (1) solder joint; (2) due to the shake in circuit board advance process, add the opposing force of the scolding tin on pin and crest welder, easily cause Component Displacement or the distance between component base and circuit board excessive.From current research conditions, for problem (1), product utilization machine vision has been had to detect the solder joint on circuit board.
But current most solution remains the mode adopting hand inspection, then revises problematic solder joint or electronic component.Under normal conditions, be that one piece of electric-controlled plate is divided into some regions, workpeople carries out checking and repairing for the region be assigned to separately.
In the research and practice process through said method, find the experience too relying on people, especially for quality of welding spot problem, need the skilled worker of certain experiences to take on this position, common laborer is on duty, needs through special training, and under the work of high strength, the eyes of people easily produce fatigue, the product control of causing can not be effectively guaranteed.Current labor cost constantly rise and recruitment famine in recent years overall situation under, the method for hand inspection not only increases the cost of enterprise and inefficiency, increases management difficulty, does not also meet the main trend of modern enterprise information system management simultaneously.
Summary of the invention
The object of the invention is the defect in order to solve above-mentioned prior art, a kind of dependence that can greatly reduce people is provided, improve effect and quality, the automated production of Promoting Enterprise and the circuit board defect solder joint automatic marking device of information system management that enterprise produces.
Object of the present invention can reach by taking following technical scheme:
Circuit board defect solder joint automatic marking device, is characterized in that: comprise for placing circuit board and the circuit board making circuit board linearly slide to advance transmits guide assembly, transmits push bracket assembly for the circuit board that pushes circuit board, for the XY coordinate setting identification mechanism that regulates XY coordinate position to get ready and for control circuit board transmits guide assembly, circuit board transmits push bracket assembly and the work of XY coordinate setting identification mechanism control system; Described circuit board transmits guide assembly, circuit board transmits push bracket assembly and is connected with control system respectively with XY coordinate setting identification mechanism.
As a kind of preferred version, described circuit board transmits guide assembly and comprises adjustable frames, firm banking, first electric pushrod, second electric pushrod, first rail support plate, second rail support plate, first guide rail and the second guide rail, described first rail support plate and the second rail support plate lay respectively at the right and left, described first rail support plate is fixed on adjustable frames, described second rail support plate is fixed on firm banking, being formed between described first rail support plate and the second rail support plate can the space of containment circuit board, described first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate, the inner side of described first rail support plate and the second rail support plate is fixed with at least two lever bearings respectively, described each lever bearing is provided with a lever be rotatably connected with the axle of lever bearing, each lever in described first rail support plate is connected with the first electric pushrod, each lever in described second rail support plate is connected with the second electric pushrod, described circuit board transmits push bracket assembly and is arranged in the space that formed between the first rail support plate and the second rail support plate, described XY coordinate setting identification mechanism is arranged on the first rail support plate and the second guide supporting postlaminar part.
As a kind of preferred version, described first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate by straight pin, and the two ends of described first guide rail and the two ends of the second guide rail all adopt rounding process.
As a kind of preferred version, described adjustable frames and firm banking are all at least provided with two; Described each adjustable frames is provided with can the slide block of movement on adjustable frames and the bolt that matches with slide block, and described first rail support plate is fixed on slide block, and the position after described first rail support plate moves is fixing by bolting on.
As a kind of preferred version, it is protruding outside to inside that described first rail support plate and the second edge, rail support plate upper end remove front end, and described first rail support plate and the second inwardly protruded part in edge, rail support plate upper end form channel-shaped with the first guide rail and the second guide rail respectively.
As a kind of preferred version, one end of each lever in described first rail support plate is flat, the other end is connected with the first electric pushrod by the first rectangular connecting rod, described first rectangular connecting rod seesaws under the push-and-pull of the first electric pushrod, drives the axle of the lever in the first rail support plate in lever bearing to rotate back and forth; One end of each lever in described second rail support plate is flat, the other end is connected with the second electric pushrod by the second rectangular connecting rod, described second rectangular connecting rod seesaws under the push-and-pull of the second electric pushrod, drives the axle of the lever in the second rail support plate in lever bearing to rotate back and forth.
As a kind of preferred version, described circuit board transmits push bracket assembly and comprises the 3rd electric pushrod, push bracket, the electronic slide unit of push bracket, push bracket electronic slide unit guide rail and the electronic slide unit motor of push bracket, described push bracket is connected with the 3rd electric pushrod, and tie point is the focus point of push bracket; Described 3rd electric pushrod is fixed on the electronic slide unit of push bracket, drives push bracket to rise or declines; The electronic slide unit of described push bracket is slidably connected on the electronic slide unit guide rail of push bracket, and described push bracket electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and push bracket, drives the electronic slide unit of push bracket to move on the electronic slide unit guide rail of push bracket; Described push bracket upper end is provided with three sections can according to the rushing board mechanism of circuit board size adjustment width.
As a kind of preferred version, described XY coordinate setting identification mechanism comprises X-axis electronic slide unit motor, X-axis electronic slide unit guide rail, the electronic slide unit of X-axis, Y-axis electronic slide unit motor, Y-axis electronic slide unit guide rail, the electronic slide unit of Y-axis, XY bracing strut, at least one block of electromagnet and at least one closed pen container assembly; The electronic slide unit of described X-axis is slidably connected on the electronic slide unit guide rail of X-axis, and described X-axis electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and X-axis, drives the electronic slide unit of X-axis to move on the electronic slide unit guide rail of X-axis; The electronic slide unit of described Y-axis is slidably connected on the electronic slide unit guide rail of Y-axis, and described Y-axis electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and Y-axis, drives the electronic slide unit of Y-axis to move on the electronic slide unit guide rail of Y-axis; The electronic slide unit guide rail of described X-axis is fixed on XY bracing strut, and described Y-axis electronic slide unit guide rail is fixed on the electronic slide unit of X-axis; Described XY bracing strut while be arranged on the left of the first guide supporting postlaminar part, another side is arranged on the right of the second guide supporting postlaminar part; Described every block electromagnet is arranged on the electronic slide unit of Y-axis, and described each closed pen container assembly is corresponding with one block of electromagnet, and is arranged on corresponding electromagnet, and described each closed pen container assembly is provided with a PCB and gets pen ready;
When the position of the origin of coordinates got back to by the electronic slide unit of described X-axis and the electronic slide unit of Y-axis, if described PCB gets pen ready when being one, the circuit board origin of coordinates of nib and regulation that this PCB gets pen ready overlaps; If described PCB gets pen ready when being two or more, the central point that the nib that two or more PCB get pen ready forms shape is overlapping with the circuit board origin of coordinates of regulation.
As a kind of preferred version, described each closed pen container assembly comprises upper cover, upper spring, inner sleeve, pen container, spring, pin and lower cover, described upper lower spring end is welded in inner sleeve, the upper end of upper spring is welded in upper cover, described lower cover bottom pen container, makes pen container be in closed state in its natural state by pin and spring fitting; The described PCB that often props up gets pen is arranged on pen container inside by inner sleeve ready, and the push rod of described every block electromagnet embeds in upper cover.
As a kind of preferred version, described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers; In described six limit switches, two two ends being arranged on the electronic slide unit guide rail of push bracket, two two ends being arranged on the electronic slide unit guide rail of X-axis, two two ends being arranged on the electronic slide unit guide rail of Y-axis; Described three photoelectric sensors are arranged on push bracket electronic slide unit guide rail, X-axis electronic slide unit guide rail and Y-axis electronic slide unit guide rail respectively near the position of the respective origin of coordinates; Described electromagnet, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, described three stepper motor drivers respectively slide unit motor electronic with push bracket, X-axis electronic slide unit motor and the electronic slide unit motor of Y-axis are connected, described three DC motor drivers are connected with the first electric pushrod, the second electric pushrod and the 3rd electric pushrod, and described single-chip microcomputer is connected with host computer by serial communication modular.
The present invention has following beneficial effect relative to prior art:
1, circuit board defect solder joint automatic marking device of the present invention adopts Open architecture, and structure simple, be convenient to safeguard, decrease the degree of participation of people in production process, avoid mistake, thus improve the stability and accuracy of producing.
2, circuit board defect solder joint automatic marking device of the present invention can work long hours, and avoiding staff overtired, improving output of a factory when ensuring the quality of products.
3, the circuit board that circuit board defect solder joint automatic marking device of the present invention is identified, staff can directly revise, the error rate reduced a staff while raising the efficiency, and staff can be on duty fast without the need to giveing training.
4, the structure of circuit board defect solder joint automatic marking device of the present invention to production line plays optimization function, and replace manpower by machine, the quantity reduced a staff, Long-Time Service can save production cost, thus improves productivity effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of circuit board defect solder joint automatic marking device of the present invention.
Fig. 2 is the structural representation of the circuit board transmission guide assembly of circuit board defect solder joint automatic marking device of the present invention.
Fig. 3 is the structural representation of another angle of circuit board transmission guide assembly of circuit board defect solder joint automatic marking device of the present invention.
Fig. 4 is the structural representation of the circuit board transmission push bracket assembly of circuit board defect solder joint automatic marking device of the present invention.
Fig. 5 is the structural representation of the XY coordinate setting identification mechanism of circuit board defect solder joint automatic marking device of the present invention.
Fig. 6 is the structural representation of the closed pen container assembly of circuit board defect solder joint automatic marking device of the present invention.
Fig. 7 is the explosive view of the closed pen container assembly of circuit board defect solder joint automatic marking device of the present invention.
Wherein, 1-adjustable frames, 2-firm banking, 3-first electric pushrod, 4-second electric pushrod, 5-first rail support plate, 6-second rail support plate, 7-first guide rail, 8-second guide rail, 9-lever bearing, 10-lever, the rectangular connecting rod of 11-first, the rectangular connecting rod of 12-second, 13-the 3rd electric pushrod, 14-push bracket, the electronic slide unit of 15-push bracket, the electronic slide unit guide rail of 16-push bracket, the electronic slide unit motor of 17-push bracket, 18-rushing board mechanism, the electronic slide unit motor of 19-X axle, the electronic slide unit guide rail of 20-X axle, the electronic slide unit of 21-X axle, the electronic slide unit motor of 22-Y axle, the electronic slide unit guide rail of 23-Y axle, the electronic slide unit of 24-Y axle, 25-XY bracing strut, 26-electromagnet, the closed pen container assembly of 27-, 28-upper cover, the upper spring of 29-, 30-inner sleeve, 31-pen container, 32-spring, 33-sells, 34-lower cover.
Detailed description of the invention
Embodiment 1:
As Figure 1-Figure 5, the circuit board defect solder joint automatic marking device of the present embodiment comprises circuit board transmission guide assembly, circuit board transmission push bracket assembly, XY coordinate setting identification mechanism and control system;
Described circuit board transmits guide assembly and comprises adjustable frames 1, firm banking 2, first electric pushrod 3, second electric pushrod 4, first rail support plate 5, second rail support plate 6, first guide rail 7 and the second guide rail 8, described first rail support plate 5 and the second rail support plate 6 lay respectively at the right and left, described first rail support plate 5 is fixed on adjustable frames 1, described second rail support plate 6 is fixed on firm banking 2, being formed between described first rail support plate 5 and the second rail support plate 6 can the space of containment circuit board, described first guide rail 7 and the second guide rail 8 are separately fixed in the first rail support plate 5 and the second rail support plate 6, the inner side of described first rail support plate 5 and the second rail support plate 6 is fixed with two lever bearings 9 respectively, described each lever bearing 9 is provided with a lever 10 be rotatably connected with the axle of lever bearing 9, each lever 10 in described first rail support plate 5 is connected with the first electric pushrod 3, each lever 10 in described second rail support plate 6 is connected with the second electric pushrod 4, wherein:
Described first guide rail 7 and the second guide rail 8 are separately fixed in the first rail support plate 5 and the second rail support plate 6 by straight pin, the part connected by straight pin neither projection is not recessed yet, ensure the first guide rail 7 and the second guide rail 8 flat side down, make circuit board in progradation, can not the problem of the components and parts on circuit for generating plate and the frictional impact between the first guide rail 7 and the second guide rail 8 side, can carry out auxiliary fixing to circuit board by the side of the first guide rail 7 and the second guide rail 8, holding circuit plate moves ahead along guide rail reposefully all the time in transport process, meanwhile, the two ends of described first guide rail 7 and the two ends of the second guide rail 8 all adopt rounding process, making the device of the present embodiment when docking with production line, can push on the conveyer belt of production line by treated circuit board more smoothly,
Distance between described first rail support plate 5 and the second rail support plate 6 can adopt monolateral regulative mode, thus make the space formed between the first rail support plate 5 and the second rail support plate 6 increase or reduce, to adapt to the circuit board of different in width, wherein said adjustable frames 1 and firm banking 2 are all provided with two, the bolt that described each adjustable frames 1 is provided with slide block and matches with slide block, described first rail support plate 5 is fixed on slide block, described slide block can move freely on adjustable frames 1, after the first rail support plate 5 is moved, the current location of the first rail support plate 5 can be fixed by bolting on, make whole width adjusting process simple and fast,
It is protruding outside to inside that described first rail support plate 5 and the second edge, rail support plate 6 upper end remove front end, described first rail support plate 5 and the second inwardly protruded part in edge, rail support plate 6 upper end form channel-shaped with the first guide rail 7 and the second guide rail 8 respectively, make the loading end straight ahead of circuit board all the time along the first guide rail 7 and the second guide rail 8 in transport process, be less likely to occur to shake up and down, for the Quick board-pushing in subsequent step provides enforceable condition, simultaneously owing to not doing inwardly protruding process in the front end at the first rail support plate 5 and the second edge, rail support plate 6 upper end, make the workman after crest welder directly can be placed on the first guide rail 7 and the second guide rail 8 by the circuit board through splitting, need hardly to make any adjustments, heighten production efficiency,
One end of each lever 10 in described first rail support plate 5 is flat, the other end is connected with the first electric pushrod 3 by the first rectangular connecting rod 11, described first rectangular connecting rod 11 seesaws under the push-and-pull of the first electric pushrod 3, drives the axle of lever 10 in lever bearing 9 in the first rail support plate 5 to rotate back and forth; One end of each lever 10 in described second rail support plate 6 is flat, the other end is connected with the second electric pushrod 4 by the second rectangular connecting rod 12, described second rectangular connecting rod 12 seesaws under the push-and-pull of the second electric pushrod 4, drives the axle of lever 10 in lever bearing 9 in the second rail support plate 6 to rotate back and forth.
Described circuit board transmits push bracket assembly and is arranged in the space that formed between the first rail support plate 5 and the second rail support plate 6, comprise the 3rd electric pushrod 13, push bracket 14, the electronic slide unit of push bracket 15, push bracket electronic slide unit guide rail 16 and the electronic slide unit motor 17 of push bracket, described push bracket 14 is connected with the 3rd electric pushrod 13, and tie point is the focus point of push bracket 14; Described 3rd electric pushrod 13 is fixed on the electronic slide unit 15 of push bracket, drives push bracket 14 to rise or decline; The electronic slide unit of described push bracket 15 is slidably connected on the electronic slide unit guide rail 16 of push bracket, and described push bracket electronic slide unit motor 17 is connected by the electronic slide unit guide rail 16 of shaft coupling and push bracket, drives the electronic slide unit of push bracket 15 to move on the electronic slide unit guide rail 16 of push bracket; Described push bracket 14 upper end is provided with three sections of rushing board mechanisms 18, can according to the concrete size of circuit board, width adjusting is carried out by unclamping middle bolt, adopt three sections of rushing board mechanisms 18, take in production line and detect and these two stations of mark, make under original production beat, the detection of circuit board can be ensured and identify completing of operation, in actual production, three pieces of circuit boards will be had to move forward a station at every turn simultaneously.
Described XY coordinate setting identification mechanism comprises X-axis electronic slide unit motor 19, X-axis electronic slide unit guide rail 20, the electronic slide unit of X-axis 21, Y-axis electronic slide unit motor 22, Y-axis electronic slide unit guide rail 23, the electronic slide unit of Y-axis 24, XY bracing strut 25, three blocks of electromagnet 26 and three closed pen container assemblies 27; The electronic slide unit of described X-axis 21 is slidably connected on the electronic slide unit guide rail 20 of X-axis, and described X-axis electronic slide unit motor 19 is connected by the electronic slide unit guide rail 20 of shaft coupling and X-axis, drives the electronic slide unit of X-axis 21 to move on the electronic slide unit guide rail 20 of X-axis; The electronic slide unit of described Y-axis 24 is slidably connected on the electronic slide unit guide rail 23 of Y-axis, and described Y-axis electronic slide unit motor 22 is connected by the electronic slide unit guide rail 23 of shaft coupling and Y-axis, drives the electronic slide unit of Y-axis 24 to move on the electronic slide unit guide rail 23 of Y-axis; The electronic slide unit guide rail 20 of described X-axis is fixed on XY bracing strut 25, and described Y-axis electronic slide unit guide rail 23 is fixed on the electronic slide unit 21 of X-axis; Described every block electromagnet is arranged on the electronic slide unit 24 of Y-axis, described each closed pen container assembly 27 is corresponding with one block of electromagnet 26, and be arranged on corresponding electromagnet 26, described each closed pen container assembly 27 is provided with a PCB and gets pen ready, and the nib that three PCB get pen ready forms an equilateral triangle; Described XY bracing strut 25 while be arranged on the left at the first rail support plate 5 rear portion, another side is arranged on the right at the second rail support plate 6 rear portion, the determination of XY bracing strut 25 installation site ensures when the position of the origin of coordinates got back to by the electronic slide unit of described X-axis 21 and the electronic slide unit 24 of Y-axis, and the central point of equilateral triangle that three PCB get the nib formation of pen ready overlaps with the circuit board origin of coordinates of regulation;
As shown in Figure 5-Figure 7, described each closed pen container assembly 27 comprises upper cover 28, upper spring 29, inner sleeve 30, pen container 31, spring 32, pin 33 and lower cover 34, the described PCB that often props up gets pen is arranged on pen container 31 inside by inner sleeve 30 ready, the push rod of described every block electromagnet 26 embeds in upper cover 28, described upper spring 29 lower end is welded in inner sleeve 30, the upper end of upper spring 29 is welded in upper cover 28, when electromagnet 26 is energized, the push rod of described electromagnet 26 is got ready to fall in the works make marks being promoted rapidly PCB, because this process dynamics is larger, if nib is directly touched on circuit boards, extremely easily damage nib, or cause nib to retreat to PCB and get pen inside ready, can not continue to make marks, so spring 29 on adding in pen container 31, when PCB get ready style of writing encounter circuit board time, cushioning effect can be played, protection PCB gets the nib of pen ready, described lower cover 34 is arranged on bottom pen container 31 by pin 33 and spring 32, pen container 31 is made to be in closed state in its natural state, only PCB get ready pen need to make marks time, promote PCB by electromagnet 26 and get pen ready, PCB gets pen ready and then pushes lower cover 34 open, avoids PCB to get pen ready in atmosphere exposed for a long time, cause the volatilization of ink with this, increase the service life, cost-saving,
Usually four kinds of situations are had: the not full and solder joint of bridge joint, solder skip, solder joint has pin hole for defect solder joint to be processed.Wherein, because solder joint is not full and solder joint has pin hole can be classified as same class defect, therefore, three blocks of electromagnet 26 and three closed pen container assemblies 27 are adopted, with the form of equilateral triangle, each pen container assembly is arranged on equilateral triangle summit place, composition labelling apparatus, processes this three classes situation respectively, and the PCB that described pen container 31 inside is installed gets pen ready and adopts different colours respectively, distinguish different welding point defects with this, play mark and the effect identified.
Described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers (as PC, industrial computer etc.), in described six limit switches, two two ends being arranged on the electronic slide unit guide rail 16 of push bracket, two two ends being arranged on the electronic slide unit guide rail 20 of X-axis, two two ends being arranged on the electronic slide unit guide rail 23 of Y-axis, Main Function causes the electronic slide unit of push bracket 15 to cross the boundary of push bracket electronic slide unit guide rail 16 both sides owing to preventing maloperation or program from makeing mistakes, or the boundary of X-axis electronic slide unit guide rail 20 both sides crossed by the electronic slide unit of X-axis 21, or the boundary of Y-axis electronic slide unit guide rail 23 both sides crossed by the electronic slide unit of Y-axis 24, cause the electronic slide unit guide rail 16 of push bracket, the damage of X-axis electronic slide unit guide rail 20 or the electronic slide unit guide rail 23 of Y-axis, described three photoelectric sensors are arranged on the electronic slide unit guide rail 16 of push bracket respectively, X-axis electronic slide unit guide rail 20 and Y-axis electronic slide unit guide rail 23 are near the position of the respective origin of coordinates, described photoelectric sensor adopts U-type groove shape photoelectric sensor, and respectively at the electronic slide unit 15 of push bracket, the electronic slide unit of X-axis 21 and the electronic slide unit of Y-axis 24 are provided with the nontransparent card of certain length, when card is through U-type groove shape photoelectric sensor, U-type groove shape photoelectric sensor then sends a signal to single-chip microcomputer, illustrate that rushing board mechanism 18 now and PCB get the position that pen has arrived the respective origin of coordinates ready, described three blocks of electromagnet 26, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, make single-chip microcomputer by I/O port controlling three DC motor drivers and three stepper motor driver work, described three stepper motor drivers respectively slide unit motor 17 electronic with push bracket, X-axis electronic slide unit motor 19 and the electronic slide unit motor 22 of Y-axis are connected, and described three DC motor drivers are connected with the first electric pushrod 3, second electric pushrod 4 and the 3rd electric pushrod 13, the electronic slide unit motor 17 of described push bracket, X-axis electronic slide unit motor 19 and the electronic slide unit motor 22 of Y-axis all adopt two-phase hybrid stepping motor, described first electric pushrod 3, second electric pushrod 4 and the 3rd electric pushrod 13 all adopt by direct current generator as power source, described single-chip microcomputer is connected with host computer by serial communication modular, wherein said single-chip microcomputer is as slave computer, the model adopted is STM32F103VET6, described serial communication modular is as the instruction and data transfer equipment of single-chip microcomputer and host computer, the chip adopted is MAX232, the groundwork of described host computer detects the circuit board sent, and by testing result, the i.e. coordinate position of defect solder joint, single-chip microcomputer is sent to by serial communication modular, single-chip microcomputer then sends instruction to host computer by serial communication modular, require that host computer starts detect circuit board or send next coordinate position.
In actual applications, the device of the present embodiment is positioned at after crest welder, by workman the circuit board of upper complete scolding tin after the operation through cutting pin, flanging and point plate, circuit board solder joint being placed on faceup circuit board transmits on guide rail, the rear end of the present embodiment device then connects with the conveyer belt of production line, in whole production line, take two stations, be that circuit board solder joint detects station and circuit board solder joint mark station respectively.Therefore, realize the function of the present embodiment device, also need to install additional a supporting circuit board solder joint checkout gear, installation site is the lever 10 place place of the first rail support plate 5 and the second rail support plate 6 front end, and circuit board solder joint mark station and XY coordinate setting identification mechanism place place.When the device of the present embodiment operates, whenever changing primary circuit template number, all need to carry out regulating and setting parameter, main regulating circuit plate transmits the distance between the first guide rail 7 of guide assembly and the second guide rail 8, by unclamping the bolt on adjustable frames 1, mobile first rail support plate 5, the distance between the first guide rail 7 and the second guide rail 8 is made to be just can set aside concerns to need the width of the circuit board detected, again bolt is tightened, first guide rail 7 and the second guide rail 8 loading end are used for bearer circuit edges of boards edge, and auxiliary fixing circuit board effect is played in side.Meanwhile, by unclamping the bolt in three sections of rushing board mechanisms 18 in push bracket 14 respectively, regulating the width of each section of rushing board mechanism 18, make the circuit board being adapted at using, and guarantee three sections of rushing board mechanism 18 width are consistent as far as possible; The setting of parameter is operated on host computer and completes, the various circuit board data needing to produce are preserved in upper computer software, comprise the size of each solder joint coordinate value and circuit board on circuit board, for concrete circuit board, select corresponding model, after operationally automatically being obtained a result by program, send single-chip microcomputer to.
After completing above-mentioned adjustment and setting parameter, the workflow of the present embodiment device mainly comprises the following steps:
1) the electronic slide unit of push bracket 15, the electronic slide unit of X-axis 21 and the electronic slide unit of Y-axis 24 respectively under the driving of push bracket electronic slide unit motor 17, X-axis electronic slide unit motor 19 and the electronic slide unit motor 22 of Y-axis low speed move, when push bracket electronic slide unit guide rail 16, X-axis electronic slide unit guide rail 20 and Y-axis electronic slide unit guide rail 23 arrive the respective origin of coordinates position stop; Meanwhile, two levers 10 in push bracket 14, first rail support plate 5 and two levers 10 in the second rail support plate 6 decline; Wherein, the signal of origin of coordinates position is provided by the U-type groove shape photoelectric sensor be arranged on push bracket electronic slide unit guide rail 16, X-axis electronic slide unit guide rail 20 and the electronic slide unit guide rail 23 of Y-axis respectively;
2) single-chip microcomputer starts timing, time-count cycle is the productive temp of production line, start whenever time-count cycle, single-chip microcomputer starts the 3rd electric pushrod 13 at once, push bracket 14 rises, then drive the electronic slide unit motor 17 of push bracket, drive the movement fast of the electronic slide unit 15 of push bracket, the circuit board between the first guide rail 7 and the second guide rail 8 is pushed to next station by three sections of rushing board mechanisms 18 in push bracket 14; Wherein, displacement is the length that quality of welding spot detection station and the solder joint distance identified between station deduct circuit board;
3) after the step number of setting covered by the electronic slide unit motor 17 of push bracket, single-chip microcomputer starts the first electric pushrod 3 and the second electric pushrod 4, make two push rods 10 in the first rail support plate 5 and two levers 10 in the second rail support plate 6 increase simultaneously, by the common fixing circuit board of the rushing board mechanism 18 on lever 10 and push bracket 14, the origin of coordinates position consistency that the origin of coordinates on guarantee circuit board and host computer procedure set;
4) now, suppose that the circuit board being pushed to quality of welding spot detection station is N block circuit board, then the circuit board being simultaneously pushed to solder joint mark station is N-1 block plate, originally pushed to production line conveyer belt at the N-2 block plate of solder joint mark station; Single-chip microcomputer sends instruction to host computer by serial communication modular, and host computer upon receipt of the instructions, carries out the detection of quality of welding spot at once, and the testing result of N-1 block circuit board is sent to single-chip microcomputer by serial communication modular to N block circuit board;
5) testing result that receives of single-chip microcomputer is through the process of host computer, converts the data that slave computer can directly read to; The data transmitted comprise direction, step number and the defect solder joint Sort Code of stepper motor (i.e. X-axis electronic slide unit motor 19 and the electronic slide unit motor 22 of Y-axis) the needs rotation on XY direction; Now, under the control of single-chip microcomputer, the electronic slide unit of X-axis 21, the electronic slide unit of Y-axis 24, respectively under the drive of X-axis electronic slide unit motor 19, the electronic slide unit motor 22 of Y-axis, move quickly into corresponding coordinate position;
6) loop of single-chip microcomputer conducting three blocks of electromagnet 26, the push rod PCB promoted in the closed pen container assembly 27 corresponding with it of every block electromagnet gets ready and falls in the works, leave point-like mark in the circuit board, then disconnect the loop of electromagnet 26, PCB gets pen ready and resets; Wherein, three PCB of employing get pen ready three kinds of different colours, and when marking, be convenient to identify welding point defect classification, the defect solder joint code that single-chip microcomputer sends according to host computer, controls an action in three blocks of electromagnet;
7), after completing a defect solder joint mark, host computer sends next coordinate position to single-chip microcomputer; Single-chip Controlling X-axis electronic slide unit motor 19 and the electronic slide unit motor 22 of Y-axis move quickly into next coordinate position and identify, until complete the mark of current N-1 block circuit board;
8) after N-1 block circuit board has identified, push bracket 14 is under Single-chip Controlling, return the origin position place of the electronic slide unit guide rail 16 of push bracket, while returning, two levers 10 in push bracket 14, first rail support plate 5 and two levers 10 in the second rail support plate 6 drop to origin-location;
9) described step 2) ~ step 8) all complete within a time-count cycle; When the timing Next cycle, repeat step 2) ~ step 8).
Embodiment 2:
The main feature of the present embodiment is: described adjustable frames 1 and firm banking 2 are all provided with more than three or three.All the other are with embodiment 1.
Embodiment 3:
The main feature of the present embodiment is: the electromagnet in described XY coordinate setting identification mechanism is one piece, closed pen container assembly 27 is one, namely a PCB is only installed on closed pen container assembly 27 and gets pen ready, therefore can not defect recognition classification, the circuit board origin of coordinates of nib and regulation that this PCB gets pen ready overlaps.All the other are with embodiment 1.
The above; be only patent preferred embodiment of the present invention; but the protection domain of patent of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the scope disclosed in patent of the present invention; be equal to according to the technical scheme of patent of the present invention and patent of invention design thereof and replaced or change, all belonged to the protection domain of patent of the present invention.
Claims (9)
1. circuit board defect solder joint automatic marking device, is characterized in that: comprise for placing circuit board and the circuit board making circuit board linearly slide to advance transmits guide assembly, transmits push bracket assembly for the circuit board that pushes circuit board, for the XY coordinate setting identification mechanism that regulates XY coordinate position to get ready and for control circuit board transmits guide assembly, circuit board transmits push bracket assembly and the work of XY coordinate setting identification mechanism control system; Described circuit board transmits guide assembly, circuit board transmits push bracket assembly and is connected with control system respectively with XY coordinate setting identification mechanism;
Described circuit board transmits guide assembly and comprises adjustable frames, firm banking, first electric pushrod, second electric pushrod, first rail support plate, second rail support plate, first guide rail and the second guide rail, described first rail support plate and the second rail support plate lay respectively at the right and left, described first rail support plate is fixed on adjustable frames, described second rail support plate is fixed on firm banking, being formed between described first rail support plate and the second rail support plate can the space of containment circuit board, described first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate, the inner side of described first rail support plate and the second rail support plate is fixed with at least two lever bearings respectively, described each lever bearing is provided with a lever be rotatably connected with the axle of lever bearing, each lever in described first rail support plate is connected with the first electric pushrod, each lever in described second rail support plate is connected with the second electric pushrod, described circuit board transmits push bracket assembly and is arranged in the space that formed between the first rail support plate and the second rail support plate, described XY coordinate setting identification mechanism is arranged on the first rail support plate and the second guide supporting postlaminar part.
2. circuit board defect solder joint automatic marking device according to claim 1, it is characterized in that: described first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate by straight pin, and the two ends of described first guide rail and the two ends of the second guide rail all adopt rounding process.
3. circuit board defect solder joint automatic marking device according to claim 1, is characterized in that: described adjustable frames and firm banking are all at least provided with two; Described each adjustable frames is provided with can the slide block of movement on adjustable frames and the bolt that matches with slide block, and described first rail support plate is fixed on slide block, and the position after described first rail support plate moves is fixing by bolting on.
4. circuit board defect solder joint automatic marking device according to claim 1, it is characterized in that: it is protruding outside to inside that described first rail support plate and the second edge, rail support plate upper end remove front end, and described first rail support plate and the second inwardly protruded part in edge, rail support plate upper end form channel-shaped with the first guide rail and the second guide rail respectively.
5. circuit board defect solder joint automatic marking device according to claim 1, it is characterized in that: one end of each lever in described first rail support plate is flat, the other end is connected with the first electric pushrod by the first rectangular connecting rod, described first rectangular connecting rod seesaws under the push-and-pull of the first electric pushrod, drives the axle of the lever in the first rail support plate in lever bearing to rotate back and forth; One end of each lever in described second rail support plate is flat, the other end is connected with the second electric pushrod by the second rectangular connecting rod, described second rectangular connecting rod seesaws under the push-and-pull of the second electric pushrod, drives the axle of the lever in the second rail support plate in lever bearing to rotate back and forth.
6. circuit board defect solder joint automatic marking device according to claim 1, it is characterized in that: described circuit board transmits push bracket assembly and comprises the 3rd electric pushrod, push bracket, the electronic slide unit of push bracket, push bracket electronic slide unit guide rail and the electronic slide unit motor of push bracket, described push bracket is connected with the 3rd electric pushrod, and tie point is the focus point of push bracket; Described 3rd electric pushrod is fixed on the electronic slide unit of push bracket, drives push bracket to rise or declines; The electronic slide unit of described push bracket is slidably connected on the electronic slide unit guide rail of push bracket, and described push bracket electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and push bracket, drives the electronic slide unit of push bracket to move on the electronic slide unit guide rail of push bracket; Described push bracket upper end is provided with three sections can according to the rushing board mechanism of circuit board size adjustment width.
7. circuit board defect solder joint automatic marking device according to claim 6, is characterized in that: described XY coordinate setting identification mechanism comprises X-axis electronic slide unit motor, X-axis electronic slide unit guide rail, the electronic slide unit of X-axis, Y-axis electronic slide unit motor, Y-axis electronic slide unit guide rail, the electronic slide unit of Y-axis, XY bracing strut, at least one block of electromagnet and at least one closed pen container assembly; The electronic slide unit of described X-axis is slidably connected on the electronic slide unit guide rail of X-axis, and described X-axis electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and X-axis, drives the electronic slide unit of X-axis to move on the electronic slide unit guide rail of X-axis; The electronic slide unit of described Y-axis is slidably connected on the electronic slide unit guide rail of Y-axis, and described Y-axis electronic slide unit motor is connected by the electronic slide unit guide rail of shaft coupling and Y-axis, drives the electronic slide unit of Y-axis to move on the electronic slide unit guide rail of Y-axis; The electronic slide unit guide rail of described X-axis is fixed on XY bracing strut, and described Y-axis electronic slide unit guide rail is fixed on the electronic slide unit of X-axis; Described XY bracing strut while be arranged on the left of the first guide supporting postlaminar part, another side is arranged on the right of the second guide supporting postlaminar part; Described every block electromagnet is arranged on the electronic slide unit of Y-axis, and described each closed pen container assembly is corresponding with one block of electromagnet, and is arranged on corresponding electromagnet, and described each closed pen container assembly is provided with a PCB and gets pen ready;
When the position of the origin of coordinates got back to by the electronic slide unit of described X-axis and the electronic slide unit of Y-axis, if described PCB gets pen ready when being one, the circuit board origin of coordinates of nib and regulation that this PCB gets pen ready overlaps; If described PCB gets pen ready when being two or more, the central point that the nib that two or more PCB get pen ready forms shape is overlapping with the circuit board origin of coordinates of regulation.
8. circuit board defect solder joint automatic marking device according to claim 7, it is characterized in that: described each closed pen container assembly comprises upper cover, upper spring, inner sleeve, pen container, spring, pin and lower cover, described upper lower spring end is welded in inner sleeve, the upper end of upper spring is welded in upper cover, described lower cover bottom pen container, makes pen container be in closed state in its natural state by pin and spring fitting; The described PCB that often props up gets pen is arranged on pen container inside by inner sleeve ready, and the push rod of described every block electromagnet embeds in upper cover.
9. circuit board defect solder joint automatic marking device according to claim 7, is characterized in that: described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers; In described six limit switches, two two ends being arranged on the electronic slide unit guide rail of push bracket, two two ends being arranged on the electronic slide unit guide rail of X-axis, two two ends being arranged on the electronic slide unit guide rail of Y-axis; Described three photoelectric sensors are arranged on push bracket electronic slide unit guide rail, X-axis electronic slide unit guide rail and Y-axis electronic slide unit guide rail respectively near the position of the respective origin of coordinates; Described electromagnet, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, described three stepper motor drivers respectively slide unit motor electronic with push bracket, X-axis electronic slide unit motor and the electronic slide unit motor of Y-axis are connected, described three DC motor drivers are connected with the first electric pushrod, the second electric pushrod and the 3rd electric pushrod, and described single-chip microcomputer is connected with host computer by serial communication modular.
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| CN201310586736.7A CN103611998B (en) | 2013-11-19 | 2013-11-19 | Circuit board defect solder joint automatic marking device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310586736.7A CN103611998B (en) | 2013-11-19 | 2013-11-19 | Circuit board defect solder joint automatic marking device |
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| CN103611998B true CN103611998B (en) | 2015-09-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608322B (en) * | 2016-11-02 | 2017-12-11 | Printed circuit board inspection device |
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| CN104890372B (en) * | 2015-05-29 | 2017-03-29 | 歌尔股份有限公司 | The useless plate marking devices of PCB and its marking method |
| CN105059317A (en) * | 2015-07-16 | 2015-11-18 | 苏州金牛精密机械有限公司 | Movable quality detecting mechanism with track |
| CN106501173B (en) * | 2016-10-19 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of solder joint detection pen |
| CN106992763B (en) * | 2017-06-08 | 2023-11-07 | 福建省将乐县长兴电子有限公司 | Crystal oscillator pin shearing device |
| CN107610088B (en) * | 2017-07-03 | 2021-05-04 | 刘胜贤 | Circuit board identification method and system |
| CN110726735A (en) * | 2019-09-03 | 2020-01-24 | 北京精思博智科技有限公司 | Full-automatic circuit board defect detection system and method based on deep learning |
| CN112504782A (en) * | 2020-11-18 | 2021-03-16 | 山东科技大学 | Device and method for controlling repetitive speckle field in numerical control lattice mode |
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