CN103611998A - Device for automatically marking defective welding spots of circuit board - Google Patents
Device for automatically marking defective welding spots of circuit board Download PDFInfo
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- CN103611998A CN103611998A CN201310586736.7A CN201310586736A CN103611998A CN 103611998 A CN103611998 A CN 103611998A CN 201310586736 A CN201310586736 A CN 201310586736A CN 103611998 A CN103611998 A CN 103611998A
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- slide unit
- electronic slide
- circuit board
- guide rail
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
The invention discloses a device for automatically marking defective welding spots of a circuit board. The device comprises a circuit board delivering guide rail component, a circuit board delivering push frame component, an XY coordinate positioning and marking mechanism and a control system. The circuit board delivering guide rail component is used for placing the circuit board and allowing the same to linearly move forwardly in a slide manner. The circuit board delivering push frame component is used for pushing and delivering the circuit board. The XY coordinate positioning and marking mechanism is used for adjusting XY coordinate positions for dotting. The control system is used for controlling the circuit board delivering guide rail component, the circuit board delivering push frame component and the XY coordinate positioning and marking mechanism to operate. The circuit board delivering guide rail component, the circuit board delivering push frame component and the XY coordinate positioning and marking mechanism are respectively connected with the control system. The device using the open structure is simple in structure and convenient to maintain, human participation degree during production is reduced, manual mistakes can be avoided, production stability and accuracy can be increased, efficiency and quality of enterprise production are increased, and automatic production and informatization management of enterprises are promoted.
Description
Technical field
The present invention relates to a kind of circuit board defect solder joint identity device, especially a kind of circuit board defect solder joint automatic marking device, belongs to the identification technology field of circuit board.
Background technology
The continuous progress of science and technology changes people's life style gradually, and various electronic products have incorporated people's life.Along with reform and opening-up, China, due to the preferential policy at aspects such as human resources, market, investments, has attracted American-European manufacturing extensive transfer, and a large amount of electronics manufacturer are built up in China by factory.Meanwhile, household electric appliances and the consumer electronics industry of China obtain fast development, and on the streamline of e-factory, all need to produce a large amount of circuit boards every day.And the mode of production of circuit board is according to the difference of electronic component, be roughly divided into direct insertion and SMD.Because these two kinds of manufacturing process are different, for assigning of direct insertion element on circuit board, conventionally need to manually assign or machine is assigned according to the type selecting of electronic component.Assigned the circuit board of electronic component after crest welder, electronic component is just welded on circuit board.Due to technical bottleneck, this welding electronic elements mode easily causes two kinds of quality problems: rosin joint, solder skip or bridge joint may appear in (1) solder joint; (2) shake of advancing in process due to circuit board, adds the relativity power of the scolding tin on pin and crest welder, easily causes the distance between Component Displacement or element bottom and circuit board excessive.From current research situation, for problem (1), there is product utilization machine vision to detect the solder joint on circuit board.
But the solution of most remains the mode that adopts hand inspection, then problematic solder joint or electronic component is revised.Under normal conditions, be that an electric-controlled plate is divided into some regions, workpeople checks and repairs for the region being assigned to separately.
In the process research and practice process of said method, find too to rely on people's experience, especially for quality of welding spot problem, need to there is the skilled worker of certain experiences to take on this position, common laborer is on duty to be needed through special training, and under high-intensity work, people's eyes easily produce fatigue, the product control of causing can not be effectively guaranteed.Under the overall situation of the continuous rising of labor cost at present and recruitment famine in recent years, the method for hand inspection not only increases the cost of enterprise, and inefficiency, increases management difficulty, does not also meet the main trend of modern enterprise information system management simultaneously.
Summary of the invention
The object of the invention is, in order to solve the defect of above-mentioned prior art, provides a kind of dependence that can greatly reduce people, improves the effect and quality that enterprise produces, the circuit board defect solder joint automatic marking device of the automated production of Promoting Enterprise and information system management.
Object of the present invention can be by taking following technical scheme to reach:
Circuit board defect solder joint automatic marking device, is characterized in that: comprise for place circuit board and make circuit board that circuit board advances along linear slide transmit guide assembly, for the circuit board that circuit board is pushed transmit push away frame component, for regulate XY coordinate setting identification mechanism that XY coordinate position gets ready and for control circuit board transmit guide assembly, circuit board transmits the control system that pushes away frame component and the work of XY coordinate setting identification mechanism; Described circuit board transmits guide assembly, circuit board transmission pushes away frame component and is connected respectively and is connected with control system with XY coordinate setting identification mechanism.
As a kind of preferred version, described circuit board transmits guide assembly and comprises adjustable frames, firm banking, the first electric pushrod, the second electric pushrod, the first rail support plate, the second rail support plate, the first guide rail and the second guide rail, described the first rail support plate and the second rail support plate lay respectively at the right and left, described the first rail support plate is fixed on adjustable frames, described the second rail support plate is fixed on firm banking, between described the first rail support plate and the second rail support plate, form can containment circuit board space, described the first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate, the inner side of described the first rail support plate and the second rail support plate is fixed with respectively at least two lever bearings, described each lever bearing is provided with a lever being rotatably connected with the axle of lever bearing, each lever in described the first rail support plate is connected with the first electric pushrod, each lever in described the second rail support plate is connected with the second electric pushrod, described circuit board transmission pushes away frame component and is arranged in the space forming between the first rail support plate and the second rail support plate, described XY coordinate setting identification mechanism is arranged on the first rail support plate and the second guide supporting postlaminar part.
As a kind of preferred version, described the first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate by straight pin, and the two ends of the two ends of described the first guide rail and the second guide rail all adopt rounding to process.
As a kind of preferred version, described adjustable frames and firm banking are all at least provided with two; Described each adjustable frames is provided with the slide block that can move on adjustable frames and the bolt matching with slide block, and described the first rail support plate is fixed on slide block, and the position after described the first rail support plate moves is fixing by bolting on.
As a kind of preferred version, described the first rail support plate and the second edge, rail support plate upper end are protruding outside to inside except front end, and described the first rail support plate and the second inwardly protruded part in edge, rail support plate upper end form groove shape with the first guide rail and the second guide rail respectively.
As a kind of preferred version, one end of each lever in described the first rail support plate is flat, the other end is connected with the first electric pushrod by the first rectangular connecting rod, described the first rectangular connecting rod seesaws under the push-and-pull of the first electric pushrod, drives lever in the first rail support plate axle in lever bearing to rotate back and forth; One end of each lever in described the second rail support plate is flat, the other end is connected with the second electric pushrod by the second rectangular connecting rod, described the second rectangular connecting rod seesaws under the push-and-pull of the second electric pushrod, drives lever in the second rail support plate axle in lever bearing to rotate back and forth.
As a kind of preferred version, described circuit board transmission pushes away frame component and comprises the 3rd electric pushrod, pushes away frame, pushes away the electronic slide unit of frame, pushes away the electronic slide unit guide rail of frame and push away the electronic slide unit motor of frame, the described frame that pushes away is connected with the 3rd electric pushrod, and tie point is the focus point that pushes away frame; Described the 3rd electric pushrod is fixed on and pushes away on the electronic slide unit of frame, drives and pushes away frame rising or decline; The described electronic slide unit of frame that pushes away is slidably connected at and pushes away on the electronic slide unit guide rail of frame, described in push away the electronic slide unit motor of frame by shaft coupling with push away the electronic slide unit guide rail of frame and be connected, drive to push away the electronic slide unit of frame and move pushing away on the electronic slide unit guide rail of frame; Described push away frame upper end be provided with three sections can be according to the rushing board mechanism of circuit board size adjustment width.
As a kind of preferred version, described XY coordinate setting identification mechanism comprises the electronic slide unit motor of X-axis, the electronic slide unit guide rail of X-axis, the electronic slide unit of X-axis, the electronic slide unit motor of Y-axis, the electronic slide unit guide rail of Y-axis, the electronic slide unit of Y-axis, XY bracing strut, at least one block of electromagnet and at least one closed pen container assembly; The electronic slide unit of described X-axis is slidably connected on the electronic slide unit guide rail of X-axis, and the electronic slide unit motor of described X-axis is connected by the electronic slide unit guide rail of shaft coupling and X-axis, drives the electronic slide unit of X-axis to move on the electronic slide unit guide rail of X-axis; The electronic slide unit of described Y-axis is slidably connected on the electronic slide unit guide rail of Y-axis, and the electronic slide unit motor of described Y-axis is connected by the electronic slide unit guide rail of shaft coupling and Y-axis, drives the electronic slide unit of Y-axis to move on the electronic slide unit guide rail of Y-axis; The electronic slide unit guide rail of described X-axis is fixed on XY bracing strut, and the electronic slide unit guide rail of described Y-axis is fixed on the electronic slide unit of X-axis; One side of described XY bracing strut is arranged on the left of the first guide supporting postlaminar part, and another side is arranged on the right-hand of the second guide supporting postlaminar part; Described every block of electromagnet is arranged on the electronic slide unit of Y-axis, and described each closed pen container assembly is corresponding with an electromagnet, and is arranged on corresponding electromagnet, and described each closed pen container assembly is provided with a PCB and gets pen ready;
When the electronic slide unit of described X-axis and the electronic slide unit of Y-axis are got back to the position of the origin of coordinates, if described PCB gets pen ready while being one, the nib that this PCB gets pen ready overlaps with the circuit board origin of coordinates of regulation; If it is two or when above that described PCB gets pen ready, the central point that the nib that two or above PCB get pen ready forms shape is overlapping with the circuit board origin of coordinates of regulation.
As a kind of preferred version, described each closed pen container assembly comprises upper cover, upper spring, inner sleeve, pen container, spring, pin and lower cover, described upper spring lower end is welded in inner sleeve, the upper end of upper spring is welded in upper cover, described lower cover by pin and spring fitting in pen container bottom, make pen container under nature in closed state; Described every PCB gets pen ready and by inner sleeve, is arranged on the inside of pen container, and the push rod of described every block of electromagnet embeds in upper cover.
As a kind of preferred version, described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers; In described six limit switches, two are arranged on the two ends that push away the electronic slide unit guide rail of frame, two two ends that are arranged on the electronic slide unit guide rail of X-axis, two two ends that are arranged on the electronic slide unit guide rail of Y-axis; Described three photoelectric sensors are arranged on respectively and push away the close position of the origin of coordinates separately of the electronic slide unit guide rail of frame, the electronic slide unit guide rail of X-axis and the electronic slide unit guide rail of Y-axis; Described electromagnet, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, described three stepper motor drivers respectively with push away the electronic slide unit motor of frame, the electronic slide unit motor of X-axis and the electronic slide unit motor of Y-axis and be connected, described three DC motor drivers are connected with the first electric pushrod, the second electric pushrod and the 3rd electric pushrod, and described single-chip microcomputer is connected with host computer by serial communication modular.
The present invention has following beneficial effect with respect to prior art:
1, circuit board defect solder joint automatic marking device of the present invention adopts Open architecture, and simple in structure, be convenient to safeguard, reduced people's degree of participation in production process, avoid mistake, thereby improve stability and the accuracy of producing.
2, circuit board defect solder joint automatic marking device of the present invention can work long hours, and avoids staff overtired, improves output of a factory in the situation that ensuring the quality of products.
3, the circuit board that circuit board defect solder joint automatic marking device of the present invention identified, staff can directly revise, the error rate reducing a staff when raising the efficiency, and also staff can be on duty fast without giveing training.
4, circuit board defect solder joint automatic marking device of the present invention plays optimization function to the structure of production line, by machine, replaces manpower, the quantity reducing a staff, and long-term use can save production cost, thereby improves productivity effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of circuit board defect solder joint automatic marking device of the present invention.
Fig. 2 is the structural representation that the circuit board of circuit board defect solder joint automatic marking device of the present invention transmits guide assembly.
Fig. 3 is the structural representation that the circuit board of circuit board defect solder joint automatic marking device of the present invention transmits another angle of guide assembly.
Fig. 4 is that the circuit board of circuit board defect solder joint automatic marking device of the present invention transmits the structural representation that pushes away frame component.
Fig. 5 is the structural representation of the XY coordinate setting identification mechanism of circuit board defect solder joint automatic marking device of the present invention.
Fig. 6 is the structural representation of the closed pen container assembly of circuit board defect solder joint automatic marking device of the present invention.
Fig. 7 is the explosive view of the closed pen container assembly of circuit board defect solder joint automatic marking device of the present invention.
Wherein, 1-adjustable frames, 2-firm banking, 3-the first electric pushrod, 4-the second electric pushrod, 5-the first rail support plate, 6-the second rail support plate, 7-the first guide rail, 8-the second guide rail, 9-lever bearing, 10-lever, the rectangular connecting rod of 11-first, the rectangular connecting rod of 12-second, 13-the 3rd electric pushrod, 14-pushes away frame, 15-pushes away the electronic slide unit of frame, 16-pushes away the electronic slide unit guide rail of frame, 17-pushes away the electronic slide unit motor of frame, 18-rushing board mechanism, the electronic slide unit motor of 19-X axle, the electronic slide unit guide rail of 20-X axle, the electronic slide unit of 21-X axle, the electronic slide unit motor of 22-Y axle, the electronic slide unit guide rail of 23-Y axle, the electronic slide unit of 24-Y axle, 25-XY bracing strut, 26-electromagnet, the closed pen container assembly of 27-, 28-upper cover, 29-upper spring, 30-inner sleeve, 31-pen container, 32-spring, 33-pin, 34-lower cover.
The specific embodiment
Embodiment 1:
As Figure 1-Figure 5, the circuit board defect solder joint automatic marking device of the present embodiment comprises that circuit board transmits guide assembly, circuit board transmits and pushes away frame component, XY coordinate setting identification mechanism and control system;
Described circuit board transmits guide assembly and comprises adjustable frames 1, firm banking 2, the first electric pushrod 3, the second electric pushrod 4, the first rail support plate 5, the second rail support plate 6, the first guide rail 7 and the second guide rail 8, described the first rail support plate 5 and the second rail support plate 6 lay respectively at the right and left, described the first rail support plate 5 is fixed on adjustable frames 1, described the second rail support plate 6 is fixed on firm banking 2, between described the first rail support plate 5 and the second rail support plate 6, form can containment circuit board space, described the first guide rail 7 and the second guide rail 8 are separately fixed in the first rail support plate 5 and the second rail support plate 6, the inner side of described the first rail support plate 5 and the second rail support plate 6 is fixed with respectively two lever bearings 9, described each lever bearing 9 is provided with a lever 10 being rotatably connected with the axle of lever bearing 9, each lever 10 in described the first rail support plate 5 is connected with the first electric pushrod 3, each lever 10 in described the second rail support plate 6 is connected with the second electric pushrod 4, wherein:
Described the first guide rail 7 and the second guide rail 8 are separately fixed in the first rail support plate 5 and the second rail support plate 6 by straight pin, the part connecting by straight pin neither projection is not recessed yet, guarantee the first guide rail 7 and the second guide rail 8 flat side down, make circuit board in progradation, components and parts on can circuit for generating plate and the problem of the frictional impact between the first guide rail 7 and the second guide rail 8 sides, to can assist by the side face circuit board of the first guide rail 7 and the second guide rail 8 fixing, holding circuit plate moves ahead along guide rail reposefully all the time in transport process, meanwhile, the two ends of the two ends of described the first guide rail 7 and the second guide rail 8 all adopt rounding to process, and make the device of the present embodiment when docking with production line, can more treated circuit board be pushed on the conveyer belt of production line,
Distance between described the first rail support plate 5 and the second rail support plate 6 can adopt monolateral regulative mode, thereby make the space forming between the first rail support plate 5 and the second rail support plate 6 increase or reduce, to adapt to the circuit board of different in width, wherein said adjustable frames 1 and firm banking 2 are all provided with two, the bolt that described each adjustable frames 1 is provided with slide block and matches with slide block, described the first rail support plate 5 is fixed on slide block, described slide block can move freely on adjustable frames 1, after the first rail support plate 5 is moved, can fix by bolting on the current location of the first rail support plate 5, make whole width adjusting process simple and fast,
Described the first rail support plate 5 and the second rail support plate 6 edges, upper end remove front end projection outside to inside, described the first rail support plate 5 and the second rail support plate 6 inwardly protruded parts in edge, upper end form groove shape with the first guide rail 7 and the second guide rail 8 respectively, make circuit board in transport process all the time along the loading end straight ahead of the first guide rail 7 and the second guide rail 8, be not easy to occur shake up and down, for the Quick board-pushing in subsequent step provides enforceable condition, simultaneously because the front end at the first rail support plate 5 and the second rail support plate 6 edges, upper end is not done inwardly protruding processing, workman after crest welder can be directly placed on the circuit board through splitting on the first guide rail 7 and the second guide rail 8, need hardly to make any adjustments, heighten production efficiency,
One end of each lever 10 in described the first rail support plate 5 is flat, the other end is connected with the first electric pushrod 3 by the first rectangular connecting rod 11, described the first rectangular connecting rod 11 seesaws under the push-and-pull of the first electric pushrod 3, drives lever 10 in the first rail support plate 5 axle in lever bearing 9 to rotate back and forth; One end of each lever 10 in described the second rail support plate 6 is flat, the other end is connected with the second electric pushrod 4 by the second rectangular connecting rod 12, described the second rectangular connecting rod 12 seesaws under the push-and-pull of the second electric pushrod 4, drives lever 10 in the second rail support plate 6 axle in lever bearing 9 to rotate back and forth.
Described circuit board transmission pushes away frame component and is arranged in the space forming between the first rail support plate 5 and the second rail support plate 6, comprise the 3rd electric pushrod 13, push away frame 14, push away the electronic slide unit 15 of frame, push away the electronic slide unit guide rail 16 of frame and push away the electronic slide unit motor 17 of frame, the described frame 14 that pushes away is connected with the 3rd electric pushrod 13, and tie point is the focus point that pushes away frame 14; Described the 3rd electric pushrod 13 is fixed on and pushes away on the electronic slide unit 15 of frame, drives and pushes away frame 14 risings or decline; The described electronic slide unit 15 of frame that pushes away is slidably connected at and pushes away on the electronic slide unit guide rail 16 of frame, described in push away the electronic slide unit motor 17 of frame by shaft coupling with push away the electronic slide unit guide rail 16 of frame and be connected, drive to push away the electronic slide unit 15 of frame and move pushing away on the electronic slide unit guide rail 16 of frame; Described frame 14 upper ends that push away are provided with three sections of rushing board mechanisms 18, can be according to the concrete size of circuit board, by the bolt in the middle of unclamping, carry out width adjusting, adopt three sections of rushing board mechanisms 18, in production line, take and detect and these two stations of sign, make under original production beat, can guarantee the detection of circuit board and completing of sign operation, in actual production, will there be three circuit boards to move forward a station at every turn simultaneously.
Described XY coordinate setting identification mechanism comprises the electronic slide unit motor 19 of X-axis, the electronic slide unit guide rail 20 of X-axis, the electronic slide unit 21 of X-axis, the electronic slide unit motor 22 of Y-axis, the electronic slide unit guide rail 23 of Y-axis, the electronic slide unit 24 of Y-axis, XY bracing strut 25, three electromagnet 26 and three closed pen container assemblies 27; The electronic slide unit 21 of described X-axis is slidably connected on the electronic slide unit guide rail 20 of X-axis, and the electronic slide unit motor 19 of described X-axis is connected by the electronic slide unit guide rail 20 of shaft coupling and X-axis, drives the electronic slide unit 21 of X-axis to move on the electronic slide unit guide rail 20 of X-axis; The electronic slide unit 24 of described Y-axis is slidably connected on the electronic slide unit guide rail 23 of Y-axis, and the electronic slide unit motor 22 of described Y-axis is connected by the electronic slide unit guide rail 23 of shaft coupling and Y-axis, drives the electronic slide unit 24 of Y-axis to move on the electronic slide unit guide rail 23 of Y-axis; The electronic slide unit guide rail 20 of described X-axis is fixed on XY bracing strut 25, and the electronic slide unit guide rail 23 of described Y-axis is fixed on the electronic slide unit 21 of X-axis; Described every block of electromagnet is arranged on the electronic slide unit 24 of Y-axis, described each closed pen container assembly 27 is corresponding with an electromagnet 26, and be arranged on corresponding electromagnet 26, described each closed pen container assembly 27 is provided with a PCB and gets pen ready, and three PCB get an equilateral triangle of nib formation of pen ready; One side of described XY bracing strut 25 is arranged on the left at the first rail support plate 5 rear portions, another side is arranged on the right-hand of the second rail support plate 6 rear portions, XY bracing strut 25 installation sites definite guarantee when the electronic slide unit 21 of described X-axis and the electronic slide unit 24 of Y-axis are got back to the position of the origin of coordinates, and the central point of equilateral triangle and the circuit board origin of coordinates of regulation that three PCB get the nib formation of pen ready overlap;
As shown in Figure 5-Figure 7, described each closed pen container assembly 27 comprises upper cover 28, upper spring 29, inner sleeve 30, pen container 31, spring 32, pin 33 and lower cover 34, described every PCB gets pen ready and by inner sleeve 30, is arranged on the inside of pen container 31, the push rod of described every block of electromagnet 26 embeds in upper cover 28, described upper spring 29 lower ends are welded in inner sleeve 30, the upper end of upper spring 29 is welded in upper cover 28, when electromagnet 26 energising, the push rod of described electromagnet 26 will promote rapidly PCB and get ready in the works and fall and make marks, because this process dynamics is larger, if nib is directly touched on circuit board, extremely easily damage nib, or cause nib to retreat to PCB and get pen inside ready, can not continue to make marks, so add upper spring 29 in pen container 31, when PCB gets style of writing ready and encounters circuit board, can play cushioning effect, protection PCB gets the nib of pen ready, described lower cover 34 is arranged on pen container 31 bottoms by pin 33 and spring 32, make pen container 31 under nature in closed state, only at PCB, get pen ready need to make marks time, by electromagnet 26, promote PCB and get pen ready, PCB gets pen ready and then pushes lower cover 34 open, avoids PCB to get pen ready long-time exposed in air with this, causes the volatilization of ink, increase the service life, cost-saving,
For defect solder joint to be processed, conventionally there are four kinds of situations: on the not full and solder joint of bridge joint, solder skip, solder joint, have pin hole.Wherein, owing to having pin hole can be classified as same class defect on the not full and solder joint of solder joint, therefore, adopt three blocks of electromagnet 26 and three closed pen container assemblies 27, with the form of equilateral triangle, each pen container assembly is arranged on to place, equilateral triangle summit, form labelling apparatus, respectively this three classes situation is processed, the inner PCB installing of described pen container 31 gets pen ready and adopts respectively different colours, with this, distinguish different welding point defects, play the effect of mark and identification.
Described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers (as PC, industrial computer etc.), in described six limit switches, two are arranged on the two ends that push away the electronic slide unit guide rail 16 of frame, two two ends that are arranged on the electronic slide unit guide rail 20 of X-axis, two two ends that are arranged on the electronic slide unit guide rail 23 of Y-axis, Main Function is to cause that owing to preventing that maloperation or program from makeing mistakes pushing away the electronic slide unit 15 of frame crosses the boundary that pushes away the electronic slide unit guide rail of frame 16 both sides, or the electronic slide unit 21 of X-axis is crossed the boundary of the electronic slide unit guide rail of X-axis 20 both sides, or the electronic slide unit 24 of Y-axis is crossed the boundary of the electronic slide unit guide rail of Y-axis 23 both sides, cause and push away the electronic slide unit guide rail 16 of frame, the damage of the electronic slide unit guide rail 20 of X-axis or the electronic slide unit guide rail 23 of Y-axis, described three photoelectric sensors are arranged on respectively and push away the electronic slide unit guide rail 16 of frame, the close position of the origin of coordinates separately of the electronic slide unit guide rail 23 of the electronic slide unit guide rail 20 of X-axis and Y-axis, described photoelectric sensor adopts U-shaped groove shape photoelectric sensor, and pushing away the electronic slide unit 15 of frame respectively, on the electronic slide unit 21 of X-axis and the electronic slide unit 24 of Y-axis, the nontransparent card of certain length is installed, when the U-shaped groove shape photoelectric sensor of card process, U-shaped groove shape photoelectric sensor sends a signal to single-chip microcomputer, illustrate that rushing board mechanism 18 now and PCB get pen ready and arrived the position of the origin of coordinates separately, described three blocks of electromagnet 26, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, single-chip microcomputer can be worked by three DC motor drivers of I/O port controlling and three stepper motor drivers, described three stepper motor drivers respectively with push away the electronic slide unit motor 17 of frame, the electronic slide unit motor 19 of X-axis and the electronic slide unit motor 22 of Y-axis and be connected, described three DC motor drivers are connected with the 3rd electric pushrod 13 with the first electric pushrod 3, the second electric pushrod 4, the described electronic slide unit motor 17 of frame that pushes away, the electronic slide unit motor 19 of X-axis and the electronic slide unit motor 22 of Y-axis all adopt two-phase hybrid stepping motor, described the first electric pushrod 3, the second electric pushrod 4 and the 3rd electric pushrod 13 all adopt by direct current generator as power source, described single-chip microcomputer is connected with host computer by serial communication modular, wherein said single-chip microcomputer is as slave computer, the model adopting is STM32F103VET6, described serial communication modular is as the instruction and data transfer equipment of single-chip microcomputer and host computer, the chip adopting is MAX232, the groundwork of described host computer is that the circuit board to sending detects, and by testing result, it is the coordinate position of defect solder joint, by serial communication modular, be sent to single-chip microcomputer, single-chip microcomputer sends instruction to host computer by serial communication modular, require host computer to start circuit board to detect or send next coordinate position.
In actual applications, the device of the present embodiment is positioned at after crest welder, by workman the circuit board of upper complete scolding tin through cutting after the operation of pin, flanging and minute plate, circuit board solder joint is placed on to circuit board faceup to be transmitted on guide rail, the rear end of the present embodiment device joins with the conveyer belt of production line, in whole production line, taking two stations, is respectively that circuit board solder joint detects station and circuit board solder joint sign station.Therefore, realize the function of the present embodiment device, also need to install additional a supporting circuit board solder joint checkout gear, installation site is lever 10 places, place of the first rail support plate 5 and the second rail support plate 6 front ends, and circuit board solder joint sign station is place, XY coordinate setting identification mechanism place.When the device of the present embodiment operates, whenever changing primary circuit plate model, all need to regulate and setting parameter, main regulating circuit plate transmits the first guide rail 7 of guide assembly and the distance between the second guide rail 8, by unclamping the bolt on adjustable frames 1, mobile the first rail support plate 5, make the width that the distance between the first guide rail 7 and the second guide rail 8 is the circuit board of the needs detection of just can setting aside concerns, again bolt is tightened, the first guide rail 7 and the second guide rail 8 loading ends are for bearer circuit edges of boards edge, and auxiliary fixing circuit board effect is played in side.Meanwhile, by unclamping respectively the bolt in three sections of rushing board mechanisms 18 that push away on frame 14, regulate the width of each section of rushing board mechanism 18, make to be adapted at the circuit board of use, and guarantee that three sections of rushing board mechanism 18 width are consistent as far as possible; The setting of parameter is operated on host computer and completes, in upper computer software, preserve the various circuit board data that need production, the size that comprises each solder joint coordinate figure and circuit board on circuit board, for concrete circuit board, select corresponding model, after automatically being obtained a result when moving by program, send single-chip microcomputer to.
After completing above-mentioned adjusting and setting parameter, the workflow of the present embodiment device mainly comprises the following steps:
1) push away the electronic slide unit 15 of frame, the electronic slide unit 21 of X-axis and the electronic slide unit 24 of Y-axis respectively under the driving that pushes away the electronic slide unit motor 17 of frame, the electronic slide unit motor 19 of X-axis and the electronic slide unit motor 22 of Y-axis low speed move, when pushing away the electronic slide unit guide rail 16 of frame, the electronic slide unit guide rail 20 of X-axis and the electronic slide unit guide rail 23 of Y-axis, arrive the position of the origin of coordinates separately and stop; Meanwhile, two levers 10 and two levers in the second rail support plate 6 10 that push away in frame 14, the first rail support plate 5 decline; Wherein, the signal of origin of coordinates position provides by being arranged on the U-shaped groove shape photoelectric sensor pushing away on the electronic slide unit guide rail 16 of frame, the electronic slide unit guide rail 20 of X-axis and the electronic slide unit guide rail 23 of Y-axis respectively;
2) single-chip microcomputer starts timing, be the productive temp of production line time-count cycle, whenever time-count cycle, start, single-chip microcomputer starts the 3rd electric pushrod 13 at once, pushing away frame 14 rises, then drive and push away the electronic slide unit motor 17 of frame, drive and push away electronic slide unit 15 fast moving of frame, three sections of rushing board mechanisms 18 that push away on frame 14 push to next station by the circuit board between the first guide rail 7 and the second guide rail 8; Wherein, displacement is that quality of welding spot detects station and solder joint and identifies the length that distance between station deducts circuit board;
3) when pushing away the electronic slide unit motor 17 of frame, cover after the step number of setting, single-chip microcomputer starts the first electric pushrod 3 and the second electric pushrod 4, make two push rods 10 in the first rail support plate 5 and two levers 10 in the second rail support plate 6 increase simultaneously, by lever 10 with push away the common fixing circuit board of rushing board mechanism 18 on frame 14, guarantee the origin of coordinates on circuit board and the origin of coordinates position consistency of host computer procedure setting;
4) now, supposing to be pushed to the circuit board that quality of welding spot detects station is N piece circuit board, and the circuit board that is simultaneously pushed to solder joint sign station is N-1 piece plate, originally at solder joint, identifies the N-2 piece plate of station pushed to production line conveyer belt; Single-chip microcomputer sends instruction to host computer by serial communication modular, and host computer, after receiving instruction, carries out the detection of quality of welding spot to N piece circuit board, and the testing result of N-1 piece circuit board is sent to single-chip microcomputer by serial communication modular at once;
5) testing result that single-chip microcomputer receives has been passed through the processing of host computer, converts the data that slave computer can directly read to; The data that transmit comprise direction, step number and the defect solder joint Sort Code that stepper motor (being the electronic slide unit motor 19 of X-axis and the electronic slide unit motor 22 of the Y-axis) needs in XY direction rotate; Now, under the control of single-chip microcomputer, the electronic slide unit 21 of X-axis, the electronic slide unit 24 of Y-axis under the drive of the electronic slide unit motor 19 of X-axis, the electronic slide unit motor 22 of Y-axis, move quickly into corresponding coordinate position respectively;
6) loop of three blocks of electromagnet 26 of single-chip microcomputer conducting, the push rod of every block of electromagnet promotes PCB in the closed pen container assembly 27 corresponding with it and gets ready in the works and fall, and leaves point-like mark in circuit board, then disconnects the loop of electromagnet 26, and PCB gets a pen reset ready; Wherein, three PCB of employing get pen ready three kinds of different colours, when carrying out mark, is convenient to identify welding point defect classification, and the defect solder joint code that single-chip microcomputer sends according to host computer, controls an action in three blocks of electromagnet;
7) complete after a defect solder joint sign, host computer sends next coordinate position to single-chip microcomputer; The electronic slide unit motor 19 of Single-chip Controlling X-axis and the electronic slide unit motor 22 of Y-axis move quickly into next coordinate position and identify, until complete the sign of current N-1 piece circuit board;
8) after N-1 piece circuit board has identified, push away frame 14 under Single-chip Controlling, return the origin position place that pushes away the electronic slide unit guide rail 16 of frame, when returning, push away two levers 10 in frame 14, the first rail support plate 5 and two levers 10 in the second rail support plate 6 and drop to origin-location;
9) described step 2)～step 8) all within a time-count cycle, complete; When Next cycle of timing, repeating step 2)～step 8).
Embodiment 2:
The main feature of the present embodiment is: described adjustable frames 1 and firm banking 2 are all provided with more than three or three.All the other are with embodiment 1.
Embodiment 3:
The main feature of the present embodiment is: the electromagnet in described XY coordinate setting identification mechanism is one, closed pen container assembly 27 is one, a PCB is only installed on closed pen container assembly 27 and gets pen ready, therefore can not defect recognition classification, the nib that this PCB gets pen ready overlaps with the circuit board origin of coordinates of regulation.All the other are with embodiment 1.
The above; it is only patent preferred embodiment of the present invention; but the protection domain of patent of the present invention is not limited to this; anyly be familiar with those skilled in the art in the disclosed scope of patent of the present invention; according to the present invention, the technical scheme of patent and patent of invention design thereof are equal to replacement or are changed, and all belong to the protection domain of patent of the present invention.
Claims (10)
1. circuit board defect solder joint automatic marking device, is characterized in that: comprise for place circuit board and make circuit board that circuit board advances along linear slide transmit guide assembly, for the circuit board that circuit board is pushed transmit push away frame component, for regulate XY coordinate setting identification mechanism that XY coordinate position gets ready and for control circuit board transmit guide assembly, circuit board transmits the control system that pushes away frame component and the work of XY coordinate setting identification mechanism; Described circuit board transmits guide assembly, circuit board transmission pushes away frame component and is connected respectively and is connected with control system with XY coordinate setting identification mechanism.
2. circuit board defect solder joint automatic marking device according to claim 1, it is characterized in that: described circuit board transmits guide assembly and comprises adjustable frames, firm banking, the first electric pushrod, the second electric pushrod, the first rail support plate, the second rail support plate, the first guide rail and the second guide rail, described the first rail support plate and the second rail support plate lay respectively at the right and left, described the first rail support plate is fixed on adjustable frames, described the second rail support plate is fixed on firm banking, between described the first rail support plate and the second rail support plate, form can containment circuit board space, described the first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate, the inner side of described the first rail support plate and the second rail support plate is fixed with respectively at least two lever bearings, described each lever bearing is provided with a lever being rotatably connected with the axle of lever bearing, each lever in described the first rail support plate is connected with the first electric pushrod, each lever in described the second rail support plate is connected with the second electric pushrod, described circuit board transmission pushes away frame component and is arranged in the space forming between the first rail support plate and the second rail support plate, described XY coordinate setting identification mechanism is arranged on the first rail support plate and the second guide supporting postlaminar part.
3. circuit board defect solder joint automatic marking device according to claim 2, it is characterized in that: described the first guide rail and the second guide rail are separately fixed in the first rail support plate and the second rail support plate by straight pin, the two ends of the two ends of described the first guide rail and the second guide rail all adopt rounding to process.
4. circuit board defect solder joint automatic marking device according to claim 2, is characterized in that: described adjustable frames and firm banking are all at least provided with two; Described each adjustable frames is provided with the slide block that can move on adjustable frames and the bolt matching with slide block, and described the first rail support plate is fixed on slide block, and the position after described the first rail support plate moves is fixing by bolting on.
5. circuit board defect solder joint automatic marking device according to claim 2, it is characterized in that: described the first rail support plate and the second edge, rail support plate upper end are protruding outside to inside except front end, and described the first rail support plate and the second inwardly protruded part in edge, rail support plate upper end form groove shape with the first guide rail and the second guide rail respectively.
6. circuit board defect solder joint automatic marking device according to claim 2, it is characterized in that: one end of each lever in described the first rail support plate is flat, the other end is connected with the first electric pushrod by the first rectangular connecting rod, described the first rectangular connecting rod seesaws under the push-and-pull of the first electric pushrod, drives lever in the first rail support plate axle in lever bearing to rotate back and forth; One end of each lever in described the second rail support plate is flat, the other end is connected with the second electric pushrod by the second rectangular connecting rod, described the second rectangular connecting rod seesaws under the push-and-pull of the second electric pushrod, drives lever in the second rail support plate axle in lever bearing to rotate back and forth.
7. circuit board defect solder joint automatic marking device according to claim 2, it is characterized in that: described circuit board transmission pushes away frame component and comprises the 3rd electric pushrod, pushes away frame, pushes away the electronic slide unit of frame, pushes away the electronic slide unit guide rail of frame and push away the electronic slide unit motor of frame, the described frame that pushes away is connected with the 3rd electric pushrod, and tie point is the focus point that pushes away frame; Described the 3rd electric pushrod is fixed on and pushes away on the electronic slide unit of frame, drives and pushes away frame rising or decline; The described electronic slide unit of frame that pushes away is slidably connected at and pushes away on the electronic slide unit guide rail of frame, described in push away the electronic slide unit motor of frame by shaft coupling with push away the electronic slide unit guide rail of frame and be connected, drive to push away the electronic slide unit of frame and move pushing away on the electronic slide unit guide rail of frame; Described push away frame upper end be provided with three sections can be according to the rushing board mechanism of circuit board size adjustment width.
8. circuit board defect solder joint automatic marking device according to claim 7, is characterized in that: described XY coordinate setting identification mechanism comprises the electronic slide unit motor of X-axis, the electronic slide unit guide rail of X-axis, the electronic slide unit of X-axis, the electronic slide unit motor of Y-axis, the electronic slide unit guide rail of Y-axis, the electronic slide unit of Y-axis, XY bracing strut, at least one block of electromagnet and at least one closed pen container assembly; The electronic slide unit of described X-axis is slidably connected on the electronic slide unit guide rail of X-axis, and the electronic slide unit motor of described X-axis is connected by the electronic slide unit guide rail of shaft coupling and X-axis, drives the electronic slide unit of X-axis to move on the electronic slide unit guide rail of X-axis; The electronic slide unit of described Y-axis is slidably connected on the electronic slide unit guide rail of Y-axis, and the electronic slide unit motor of described Y-axis is connected by the electronic slide unit guide rail of shaft coupling and Y-axis, drives the electronic slide unit of Y-axis to move on the electronic slide unit guide rail of Y-axis; The electronic slide unit guide rail of described X-axis is fixed on XY bracing strut, and the electronic slide unit guide rail of described Y-axis is fixed on the electronic slide unit of X-axis; One side of described XY bracing strut is arranged on the left of the first guide supporting postlaminar part, and another side is arranged on the right-hand of the second guide supporting postlaminar part; Described every block of electromagnet is arranged on the electronic slide unit of Y-axis, and described each closed pen container assembly is corresponding with an electromagnet, and is arranged on corresponding electromagnet, and described each closed pen container assembly is provided with a PCB and gets pen ready;
When the electronic slide unit of described X-axis and the electronic slide unit of Y-axis are got back to the position of the origin of coordinates, if described PCB gets pen ready while being one, the nib that this PCB gets pen ready overlaps with the circuit board origin of coordinates of regulation; If it is two or when above that described PCB gets pen ready, the central point that the nib that two or above PCB get pen ready forms shape is overlapping with the circuit board origin of coordinates of regulation.
9. circuit board defect solder joint automatic marking device according to claim 8, it is characterized in that: described each closed pen container assembly comprises upper cover, upper spring, inner sleeve, pen container, spring, pin and lower cover, described upper spring lower end is welded in inner sleeve, the upper end of upper spring is welded in upper cover, described lower cover by pin and spring fitting in pen container bottom, make pen container under nature in closed state; Described every PCB gets pen ready and by inner sleeve, is arranged on the inside of pen container, and the push rod of described every block of electromagnet embeds in upper cover.
10. circuit board defect solder joint automatic marking device according to claim 8, is characterized in that: described control system comprises six limit switches, three photoelectric sensors, three DC motor drivers, three stepper motor drivers, serial communication modular, single-chip microcomputer and host computers; In described six limit switches, two are arranged on the two ends that push away the electronic slide unit guide rail of frame, two two ends that are arranged on the electronic slide unit guide rail of X-axis, two two ends that are arranged on the electronic slide unit guide rail of Y-axis; Described three photoelectric sensors are arranged on respectively and push away the close position of the origin of coordinates separately of the electronic slide unit guide rail of frame, the electronic slide unit guide rail of X-axis and the electronic slide unit guide rail of Y-axis; Described electromagnet, three DC motor drivers are connected with the I/O port of single-chip microcomputer respectively with three stepper motor drivers, described three stepper motor drivers respectively with push away the electronic slide unit motor of frame, the electronic slide unit motor of X-axis and the electronic slide unit motor of Y-axis and be connected, described three DC motor drivers are connected with the first electric pushrod, the second electric pushrod and the 3rd electric pushrod, and described single-chip microcomputer is connected with host computer by serial communication modular.
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| CN201310586736.7A CN103611998B (en) | 2013-11-19 | 2013-11-19 | Circuit board defect solder joint automatic marking device |
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| CN201310586736.7A CN103611998B (en) | 2013-11-19 | 2013-11-19 | Circuit board defect solder joint automatic marking device |
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| CN104890372A (en) * | 2015-05-29 | 2015-09-09 | 歌尔声学股份有限公司 | Scrapped PCB marking device and marking method thereof |
| CN105059317A (en) * | 2015-07-16 | 2015-11-18 | 苏州金牛精密机械有限公司 | Movable quality detecting mechanism with track |
| CN106501173A (en) * | 2016-10-19 | 2017-03-15 | 大族激光科技产业集团股份有限公司 | A kind of solder joint detects pen |
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| CN112203435A (en) * | 2020-11-11 | 2021-01-08 | 东莞市合易自动化科技有限公司 | Method and device for processing electronic components with defects on PCB |
| CN112504782A (en) * | 2020-11-18 | 2021-03-16 | 山东科技大学 | Device and method for controlling repetitive speckle field in numerical control lattice mode |
| CN114980551A (en) * | 2022-04-15 | 2022-08-30 | 广东木几智能装备有限公司 | Buffer device of chip mounter and chip mounter |
| CN114980551B (en) * | 2022-04-15 | 2023-11-03 | 广州莱伦智能机械有限公司 | Buffer device of chip mounter and chip mounter |
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