CN101574748A - Method and equipment for preventing formation of wave-soldering bridge - Google Patents
Method and equipment for preventing formation of wave-soldering bridge Download PDFInfo
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- CN101574748A CN101574748A CNA2008100279832A CN200810027983A CN101574748A CN 101574748 A CN101574748 A CN 101574748A CN A2008100279832 A CNA2008100279832 A CN A2008100279832A CN 200810027983 A CN200810027983 A CN 200810027983A CN 101574748 A CN101574748 A CN 101574748A
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- wave
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- circuit board
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Abstract
The invention discloses a method for preventing formation of wave-soldering bridge, comprising the steps: keeping a certain relative angle between a nozzle of wave-soldering and a railway of a wave-soldering tin furnace or between a molten tin bath and the railway and changing the flow direction of a solder spray flow sprayed by the nozzle so that the effective distance between every two soldering points on a soldered circuit board is increased; and enabling the soldered circuit board to be arranged on the railway in parallel to obtain the soldered circuit board without connection tin defect through the solder spray flow. The invention also discloses equipment for preventing formation of wave-soldering bridge, has the advantages of simpleness, reliability, lower cost, and the like and is particularly suitable for being used in a lead-free wave-soldering process so as to obtain a high-quality soldering circuit board without bridge defect.
Description
Technical field
The present invention relates to the wave-soldering technology, especially relate to a kind of formation method and apparatus that prevents wave-soldering bridge.
Background technology
Present most of board design has been taked the combined group packing technique of two-sided paster, and the SMT paster develops into the board design Developing Trend in Technology.But the perforation device still can occupy certain proportion on circuit board, because many devices are operated owing to reasons such as heat radiation, device material and reliability can't realize paster such as inductance coil, high power device, modular power source, connector etc.As the reliable interconnected method of such device, remain and take the wave-soldering welding.
The wave-soldering welding procedure is a maturation but comparatively complicated technology, relates to the knowledge of numerous areas such as materialogy, chemistry, control automatically, hydrodynamics.The wave-soldering welding procedure has similar 60 years history, and great change has all taken place for device structure, welding procedure, but exists welding to connect the tin defects phenomenon when welding always, and ratio accounts for more than 50% of weld defect.
Solving the wave-soldering bridge problem at present, many measures or method are arranged, is one of them such as hot blast cutter technology.Hot blast cutter technology is to utilize the nitrogen stream of heat to cut the solder joint that welding connects tin.
Summary of the invention
One of purpose of the present invention is to propose a kind of formation method that prevents wave-soldering bridge, company's tin defects of wave-soldering was eliminated before it forms, and method is simple and reliable, and cost is lower.
The object of the present invention is achieved like this: a kind of formation method that prevents wave-soldering bridge, comprise step: make between the track of the nozzle of wave-soldering and crest solder furnace or keep certain relative angle between molten tin bath and the track, change the flow direction of the welding materials flow of nozzle ejection, make the increase of the coverage between the solder joint on the soldered circuit board; Make soldered circuit board be set in parallel on its of described molten tin bath table plane and, obtain not having the soldered circuit board of company's tin defects by described welding materials flow.
Preferably, the angle ranging from 2 ° to 50 °.
More excellent, the angle ranging from 45 °.
In addition, described nozzle is preferably the Dan Pingbo nozzle.
Two of purpose of the present invention provides a kind of forming device that adopts the prevented wave-soldering bridge of described method design, realizes that company's tin defects of wave-soldering was eliminated before it forms.
The object of the present invention is achieved like this: a kind of forming device that prevents wave-soldering bridge comprises: the nozzle of ejection welding materials flow; Collect the molten tin bath of welding material; Be arranged at the track of going up the crest solder furnace on the table plane of this molten tin bath, soldered circuit board is set in parallel in this track; Keep certain relative angle between described nozzle and the track or between molten tin bath and the track.
Because the present invention makes between Dan Pingbo nozzle and tin stove track or molten tin bath and the track and keeps certain relative angle, thereby change the flow direction of wave-soldering materials flow, make the coverage between the solder joint become big, thereby effectively reduce the wave-soldering bridge problem.The present invention need not additionally to increase aid, only need to adjust between Dan Pingbo nozzle and tin stove track or molten tin bath and the track according to actual conditions to keep relative angle get final product, so the present invention has advantages such as realization is simple, reliable.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the structural representation of a specific embodiment of the present invention.
Fig. 3 is the structural representation of another specific embodiment of the present invention.
The specific embodiment
The present invention is further described below in conjunction with drawings and Examples.
Wave-soldering is to utilize the crest stream of scolder to realize the interconnected of assembly and circuit board.Therefore, the state of the art of crest is most important concerning welding process.In the initial period of welding, all welding all are immersed in the liquid scolder, and at this moment, solder joint all is in " connecting tin " state; Along with moving of solder joint, in the moment of separating with crest, scolder is in the moving state of semi-fluid, the scolder at solder joint place rapid " withdrawal " is to crest at this moment, " withdrawal " is many more to the scolder of crest, and the residue scolder on the solder joint is just few more, and the probability that forms tin is also just more little.In the forming process of solder joint, if just do not solidify scolder bounces back to solder joint under capillary effect before, will the company's of formation tin phenomenon.
In conjunction with Fig. 1, Fig. 2 and shown in Figure 3.Hold the welding material 100 of promising liquid state in the molten tin bath 10; And nozzle 11 is arranged in the molten tin bath 10, and its end is with the welding material 100 ejection formation crests of liquid state; And, having between the track 30 of the tin stove of nozzle 11 and wave-soldering and keep certain angle (shown in Figure 3) between certain angle (shown in Figure 2) or molten tin bath 10 and the track 30, this angle is advisable with 2 ° to 50 °, is preferably 45 °.In addition, soldered circuit board 20 is arranged at the top of welding material 100, and the going up of welding material 100 that is parallel in the molten tin bath 10 shown the plane; As, soldered circuit board 20 is arranged on the track 30.
Keep certain angle owing to have between certain angle or molten tin bath 10 and the track 30 between nozzle 11 and the track 30, therefore, changed the flow direction of the welding materials flow of nozzle 11 ejections, make the increase of the coverage between the solder joint 21 on the soldered circuit board 20; When making soldered circuit board 20, obtain not having the soldered circuit board that connects tin defects by described welding materials flow.
Certainly, described nozzle 11 is preferably the Dan Pingbo nozzle.
Because the present invention makes between Dan Pingbo nozzle and the molten tin bath and keeps certain relative angle, thereby change the flow direction of wave-soldering materials flow, make the coverage between the solder joint become big, thereby effectively reduce the wave-soldering bridge problem.The present invention need not additionally to increase aid, only need get final product according to the relative angle that actual conditions are adjusted between Dan Pingbo nozzle and the molten tin bath, so the present invention has advantages such as realization is simple, reliable.
Claims (8)
1, a kind of formation method that prevents wave-soldering bridge is characterized in that, comprises step:
Make between the track of the nozzle of wave-soldering and crest solder furnace or keep certain relative angle between molten tin bath and the track, change the flow direction of the welding materials flow of nozzle ejection, make that the coverage between the solder joint increases on the soldered circuit board;
Make soldered circuit board be set in parallel in described track and by described welding materials flow, obtain not having the soldered circuit board that connects tin defects.
2, the formation method that prevents wave-soldering bridge according to claim 1 is characterized in that, the angle ranging from 2 ° to 50 °.
3, the formation method that prevents wave-soldering bridge according to claim 2 is characterized in that, the angle ranging from 45 °.
4, the formation method that prevents wave-soldering bridge according to claim 1 is characterized in that, described nozzle is the Dan Pingbo nozzle.
5, a kind of forming device that prevents wave-soldering bridge is characterized in that, comprising:
The nozzle of ejection welding materials flow;
Collect the molten tin bath of welding material;
Be arranged at the track of going up the crest solder furnace on the table plane of this molten tin bath, soldered circuit board is set in parallel in this track;
Keep certain relative angle between described nozzle and the track or between molten tin bath and the track.
6, the forming device that prevents wave-soldering bridge according to claim 5 is characterized in that, the angle ranging from 2 ° to 50 °.
7, the forming device that prevents wave-soldering bridge according to claim 6 is characterized in that, the angle ranging from 45 °.
8, the forming device that prevents wave-soldering bridge according to claim 5 is characterized in that, described nozzle is the Dan Pingbo nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100279832A CN101574748A (en) | 2008-05-09 | 2008-05-09 | Method and equipment for preventing formation of wave-soldering bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100279832A CN101574748A (en) | 2008-05-09 | 2008-05-09 | Method and equipment for preventing formation of wave-soldering bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101574748A true CN101574748A (en) | 2009-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100279832A Pending CN101574748A (en) | 2008-05-09 | 2008-05-09 | Method and equipment for preventing formation of wave-soldering bridge |
Country Status (1)
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| CN (1) | CN101574748A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704942A (en) * | 2014-11-27 | 2016-06-22 | 英业达科技有限公司 | Welding equipment |
| CN113172293A (en) * | 2021-04-28 | 2021-07-27 | 广东万新达电子科技有限公司 | Automatic welding and conveying equipment for circuit board |
-
2008
- 2008-05-09 CN CNA2008100279832A patent/CN101574748A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704942A (en) * | 2014-11-27 | 2016-06-22 | 英业达科技有限公司 | Welding equipment |
| CN113172293A (en) * | 2021-04-28 | 2021-07-27 | 广东万新达电子科技有限公司 | Automatic welding and conveying equipment for circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20091111 |