CN104084661A - Nozzle of selective wave soldering equipment - Google Patents
Nozzle of selective wave soldering equipment Download PDFInfo
- Publication number
- CN104084661A CN104084661A CN201410330582.XA CN201410330582A CN104084661A CN 104084661 A CN104084661 A CN 104084661A CN 201410330582 A CN201410330582 A CN 201410330582A CN 104084661 A CN104084661 A CN 104084661A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- circular
- wave soldering
- dividing plate
- selective wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
The invention discloses a nozzle of selective wave soldering equipment. The nozzle comprises a nozzle body. A circular spraying opening of the nozzle body is provided with one or more partition plates for guiding and choking the flow of molten soldering flux. The partition plate is vertically arranged at the circular spraying opening of the nozzle body. According to the nozzle of the selective wave soldering equipment, the problem that poor excessive soldering and continuous welding are formed by excessive reservation of the soldering flux on soldering joints when an electrical element with a plurality of rows of stitches (with dense intervals) is welded can be avoided.
Description
Technical field
The present invention relates to welding equipment spare and accessory parts field, relate in particular to a kind of nozzle of selective wave soldering device.
Background technology
Wave-soldering refers to the solder (terne metal or SAC etc.) of fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, make to be equipped with in advance the printed board (being commonly called as circuit board) of components and parts by solder wave, realize machinery and the solder being electrically connected between components and parts welding end or pin and printed board pad.Wave soldering is widely used in circuit board assembling field, briefly explaining its general principle is exactly: more than scolder is heated to fusing point, use all kinds of liquid metal pumps that fusion welding is transported to high-order from welding tip ejection, thereby the part point that need to weld with circuit board position contact, and completes welding.
On this basis, there is again Selective Soldering technology in field of welding devices, is confined to a less region by welding region, and this just needs less nozzle to realize welding among a small circle.While selecting to weld due to use, the welding parameter of each solder joint can " be customized ", and this has also just achieved the accurate welding of zonule.Operative employee has enough technique to adjust space the welding parameter of each solder joint (quantity for spray of scaling powder, weld interval, welding crest height etc.) is adjusted to the best, and ratio of defects reduces thus, and welding quality significantly promotes.
But selective wave soldering device in actual applications, too much (being many tin phenomenon) of scolder that may cause the melting being sprayed by welding tip due to each side factor, the bad problem (i.e. two distances very closely but the part pin that should not connect is soldered to the company's of being referred to as weldering together) that even connects weldering, causes electric path abnormal (for example short circuit) in printed board, loses electric function or destroy other component.
Make a concrete analysis of the reason of many tin of nozzle, referring to Fig. 1, the conventional nozzle of at present selective wave soldering device, scolder sprays from upper end spout, its material of this nozzle can be tin sticky material (as iron), can be also not glue tin material (as stainless steel).Wherein, the mechanical analysis schematic diagram while being selective wave-soldering solder joint formation below: following Fig. 2, each power interacts, and finally forms solder joint (in Fig. 2, shadow part represents respectively the FI of scolder and the distribution of force of F4 of melting).Be that F1 (being the wetting power of part pin and board pads) and F2 (capillary force that part pin and via clearance produce) are upwards, can help scolder to rise to the top pad of whole through hole and circuit board; F3 (being the gravity of scolder), F4 (being the wetting power of nozzle) is downward, can make solder joint and unnecessary scolder depart from, and avoids many tin, connects the bad phenomenon such as weldering.But conventional nozzle is in the time of the electrical equipment of welding many rows stitch (closeer spacing), because (the pin of main closeer spacing causes multiple F1 and F2 stack, it has caused that (the capillary force increase that part pin and via clearance produce (it should be noted that for F1 (being the wetting power of part pin and board pads) and F2, be the generation of capillary force: on three phase boundary, meniscus causes----liquid level is bending to be produced), so upwards the change of making a concerted effort of effect is large; Concrete example is as the increase of the wetting power of F1 part pin and board pads, many rows stitch of closeer spacing will inevitably cause capillary increase, and then cause more solder adhesion and cause the wetting power of F1 part pin and board pads to become large at pad Shang ﹐), but the gravity of downward disengaging strength F3 scolder and the wetting power of F4 nozzle but do not change, will cause like this and upwards obviously be greater than with joint efforts downward force action and will easily occur that too much the staying of scolder forms many tin and connect the bad of weldering on solder joint, even reach 100% failure welding rate sometimes.
Summary of the invention
The object of the present invention is to provide a kind of nozzle of selective wave soldering device, to address the above problem.
In order to achieve the above object, technical scheme of the present invention is achieved in that
A nozzle for selective wave soldering device, comprises nozzle body, and the circular nozzle of described nozzle body is provided with one or more for the scolder of melting being carried out to the dividing plate of water conservancy diversion and choked flow effect;
Described dividing plate is vertically arranged on the circular nozzle of described nozzle body.
Preferably, the circular nozzle of described nozzle body is provided with a described dividing plate; The center of circle that described dividing plate forms through circular spout place.
Preferably, the circular nozzle of described nozzle body is provided with three described dividing plates; One of them dividing plate is cylindrical form, and two other dividing plate is separately positioned between the dividing plate of cylindrical form and circular nozzle and is fixedly connected with.
Preferably, the circular nozzle of described nozzle body is provided with multiple described dividing plates; Multiple described baffle intervals are arranged on described circular nozzle.
Preferably, the circular nozzle of described nozzle body is provided with multiple described dividing plates; Multiple described dividing plates equal angles ground centered by the center of circle of described circular nozzle along the circumferential direction arranges at interval.
Preferably, the circular nozzle of described nozzle body is provided with two described dividing plates; Two described dividing plates are cross-shaped formation baffle assembly, and the center of the cross-shaped baffle assembly after formation overlaps with the center of circle that circular spout place forms.
Compared with prior art, the advantage of the embodiment of the present invention is:
The nozzle of a kind of selective wave soldering device provided by the invention, analyzes said structure principle known: in the time that the liquid solder of melting sprays from nozzle wish, the circular nozzle that first enters described nozzle body is provided with the region of one or more dividing plates; Main this dividing plate is owing to vertically directly standing at circular nozzle, and the scolder of melting is ingratiated with mobilely along vertical baffle surface like this, and vertically the dividing plate of setting can play water conservancy diversion and choked flow effect to a certain extent obviously; Aforementioned barriers can also combine and derive various shape in addition, the shapes such as such as yi word pattern, cross, rice font, three cyclotomy; For example: choked flow effect clearly can be played in cross baffle plate configuration center, so just, can increase to a certain extent scolder downward making a concerted effort in the time spraying (the main wetting power that passes through increase F4 nozzle is realized) of melting, simultaneously because drag effect has reduced mechanical function upwards; Therefore, the nozzle of the selective wave soldering device that the embodiment of the present invention provides can be avoided in the time welding the electrical equipment of many row's stitch (closeer spacing), occurs that too much the staying on solder joint of scolder forms many tin and connect the bad problem of welding.
Brief description of the drawings
Fig. 1 is the perspective view of nozzle of the prior art;
Fig. 2 is that nozzle solder joint in the time spraying scolder forms force analysis principle schematic;
The surface structure schematic diagram of the nozzle of the cross selective wave soldering device that Fig. 3 a provides for the embodiment of the present invention one;
Fig. 3 b is the top view of Fig. 3 a;
The surface structure schematic diagram of the nozzle of the selective wave soldering device being formed by three dividing plates that Fig. 4 a provides for the embodiment of the present invention one;
Fig. 4 b is the top view of Fig. 4 a;
The surface structure schematic diagram of the nozzle of three points of circular selective wave soldering devices that Fig. 5 a provides for the embodiment of the present invention one;
Fig. 5 b is the top view of Fig. 5 a;
The surface structure schematic diagram of the nozzle of the selective wave soldering device of the yi word pattern that Fig. 6 provides for the embodiment of the present invention one;
The surface structure schematic diagram of the nozzle of the selective wave soldering device of the rice font that Fig. 7 provides for the embodiment of the present invention one;
The surface structure schematic diagram of the nozzle of the selective wave soldering device being formed by two dividing plates that Fig. 8 provides for the embodiment of the present invention one.
Detailed description of the invention
Also by reference to the accompanying drawings the present invention is described in further detail below by specific embodiment.
Embodiment mono-
The embodiment of the present invention one provides a kind of nozzle of selective wave soldering device, comprises nozzle body, and the circular nozzle of described nozzle body is provided with one or more for the scolder of melting being carried out to the dividing plate of water conservancy diversion and choked flow effect;
Described dividing plate is vertically arranged on the circular nozzle of described nozzle body.
Referring to Fig. 6, the circular nozzle of described nozzle body 1 is provided with a described dividing plate 11; The center of circle that described dividing plate forms through circular spout place.
Referring to Fig. 4 a, Fig. 4 b, the circular nozzle of described nozzle body 1 is provided with three described dividing plates 11; One of them dividing plate is cylindrical form, and two other dividing plate is separately positioned between the dividing plate of cylindrical form and circular nozzle and is fixedly connected with.
Referring to Fig. 8, the circular nozzle of described nozzle body 1 is provided with multiple dividing plates 11 (being multiple comprising more than two and two); Multiple described dividing plates 11 are disposed on described circular nozzle.It should be noted that, the technical characterictic of above-mentioned summary has comprised partition shape illustrated in Figure 8; Certainly also comprise its derivative shape; For example: can be also 3, above the circular nozzle that 4 are disposed on nozzle body.
The circular nozzle of described nozzle body 1 is provided with multiple described dividing plates 11; Multiple described dividing plates equal angles ground centered by the center of circle of described circular nozzle along the circumferential direction arranges at interval.It should be noted that, the technical characterictic of above-mentioned summary has comprised Fig. 3 a, Fig. 3 b and Fig. 5 a, Fig. 5 b and partition shape illustrated in Figure 7; Certainly also comprise other derivative shapes, this embodiment of the present invention be will not enumerate.
Referring to Fig. 3 a, the circular nozzle of described nozzle body 1 is provided with two described dividing plates 11; Two described dividing plates are cross-shaped formation baffle assembly, and the center of the cross-shaped baffle assembly after formation overlaps with the center of circle that circular spout place forms.
It should be noted that, in the time that the scolder of melting sprays from nozzle wish, the circular nozzle that first enters described nozzle body is provided with the region of one or more dividing plates (being choked flow region); Main this dividing plate is owing to vertically directly standing at circular nozzle, and the scolder of melting is ingratiated with mobilely along vertical baffle surface like this, and vertically the dividing plate of setting can play water conservancy diversion and choked flow effect to a certain extent obviously;
Therefore, the nozzle of the selective wave soldering device that the embodiment of the present invention provides can be avoided in the time welding the electrical equipment of many row's stitch (closeer spacing), occurs that too much the staying on solder joint of scolder forms many tin and connect the bad problem of welding.
The specific works principle of the nozzle of the selective the wave soldering device below embodiment of the present invention being provided is done explanation:
As described in Figure, nozzle, has increased by one or multiple dividing plate at nozzle, can be the cross as figure, can be also a word, three cyclotomy, rice font, any figure such as concentric circles (waiting derivative shape), its object is to increase F4 strength downward while welding.In the time of weld separation, scolding tin unnecessary between the scolding tin of shower nozzle ejection and soldered part can be participated in grabbing by dividing plate or baffle assembly, the surface area large (moistened surface power causes that the scolder of melting declines) of the assembly forming due to multiple dividing plates, be easy in this process, obtain unnecessary scolding tin, thereby avoid many tin and connect the generation of welding bad phenomenon.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (6)
1. a nozzle for selective wave soldering device, is characterized in that,
Comprise nozzle body, the circular nozzle of described nozzle body is provided with one or more for the scolder of melting being carried out to the dividing plate of water conservancy diversion and choked flow effect;
Described dividing plate is vertically arranged on the circular nozzle of described nozzle body.
2. the nozzle of selective wave soldering device as claimed in claim 1, is characterized in that,
The circular nozzle of described nozzle body is provided with a described dividing plate; The center of circle that described dividing plate forms through circular spout place.
3. the nozzle of selective wave soldering device as claimed in claim 1, is characterized in that,
The circular nozzle of described nozzle body is provided with three described dividing plates; One of them dividing plate is cylindrical form, and two other dividing plate is separately positioned between the dividing plate of cylindrical form and circular nozzle and is fixedly connected with.
4. the nozzle of selective wave soldering device as claimed in claim 1, is characterized in that,
The circular nozzle of described nozzle body is provided with multiple described dividing plates;
Multiple described baffle intervals are arranged on described circular nozzle.
5. the nozzle of selective wave soldering device as claimed in claim 1, is characterized in that,
The circular nozzle of described nozzle body is provided with multiple described dividing plates; Multiple described dividing plates equal angles ground centered by the center of circle of described circular nozzle along the circumferential direction arranges at interval.
6. the nozzle of selective wave soldering device as claimed in claim 5, is characterized in that,
The circular nozzle of described nozzle body is provided with two described dividing plates; Two described dividing plates are cross-shaped formation baffle assembly, and the center of the cross-shaped baffle assembly after formation overlaps with the center of circle that circular spout place forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330582.XA CN104084661A (en) | 2014-07-11 | 2014-07-11 | Nozzle of selective wave soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330582.XA CN104084661A (en) | 2014-07-11 | 2014-07-11 | Nozzle of selective wave soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104084661A true CN104084661A (en) | 2014-10-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410330582.XA Pending CN104084661A (en) | 2014-07-11 | 2014-07-11 | Nozzle of selective wave soldering equipment |
Country Status (1)
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| CN (1) | CN104084661A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107175382A (en) * | 2016-03-09 | 2017-09-19 | 联创汽车电子有限公司 | The spray nozzle plate of selective wave-soldering nozzle arrangements and its composition |
| DE102018105388A1 (en) * | 2018-03-08 | 2019-09-12 | Ersa Gmbh | Soldering nozzle and soldering machine |
| US20220347780A1 (en) * | 2019-08-30 | 2022-11-03 | Seho Vermögensverwaltungs Gmbh & Co. Kg | Soldering nozzle and method for the production thereof |
| DE202023100340U1 (en) | 2023-01-24 | 2024-04-25 | Ersa Gmbh | Soldering nozzle, use of a soldering nozzle and soldering device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4221478A1 (en) * | 1992-06-30 | 1994-01-05 | Siemens Ag | Soldering nozzle for wave soldering of flat circuitry components - has central opening for producing wave with ring groove for holding solder bath |
| JP2003158369A (en) * | 2001-11-22 | 2003-05-30 | Senju Metal Ind Co Ltd | Soldering method for printed board and jet soldering bath |
| JP2005021965A (en) * | 2003-07-02 | 2005-01-27 | Tamura Seisakusho Co Ltd | Jet type soldering device |
| JP2010274286A (en) * | 2009-05-27 | 2010-12-09 | Ngk Spark Plug Co Ltd | Nozzle for solder and jet soldering device |
| CN102548700A (en) * | 2009-09-24 | 2012-07-04 | 千住金属工业株式会社 | Nozzle for heating device, heating device, and nozzle for cooling device |
| CN204195006U (en) * | 2014-07-11 | 2015-03-11 | 库尔特机电设备（上海）有限公司 | A kind of nozzle of selective wave soldering device |
-
2014
- 2014-07-11 CN CN201410330582.XA patent/CN104084661A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4221478A1 (en) * | 1992-06-30 | 1994-01-05 | Siemens Ag | Soldering nozzle for wave soldering of flat circuitry components - has central opening for producing wave with ring groove for holding solder bath |
| JP2003158369A (en) * | 2001-11-22 | 2003-05-30 | Senju Metal Ind Co Ltd | Soldering method for printed board and jet soldering bath |
| JP2005021965A (en) * | 2003-07-02 | 2005-01-27 | Tamura Seisakusho Co Ltd | Jet type soldering device |
| JP2010274286A (en) * | 2009-05-27 | 2010-12-09 | Ngk Spark Plug Co Ltd | Nozzle for solder and jet soldering device |
| CN102548700A (en) * | 2009-09-24 | 2012-07-04 | 千住金属工业株式会社 | Nozzle for heating device, heating device, and nozzle for cooling device |
| CN204195006U (en) * | 2014-07-11 | 2015-03-11 | 库尔特机电设备（上海）有限公司 | A kind of nozzle of selective wave soldering device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107175382A (en) * | 2016-03-09 | 2017-09-19 | 联创汽车电子有限公司 | The spray nozzle plate of selective wave-soldering nozzle arrangements and its composition |
| CN107175382B (en) * | 2016-03-09 | 2020-04-10 | 联创汽车电子有限公司 | Selective wave-soldering nozzle structure and nozzle disc composed of same |
| DE102018105388A1 (en) * | 2018-03-08 | 2019-09-12 | Ersa Gmbh | Soldering nozzle and soldering machine |
| WO2019170535A1 (en) | 2018-03-08 | 2019-09-12 | Ersa Gmbh | Soldering nozzle and soldering installation |
| CN112154039A (en) * | 2018-03-08 | 2020-12-29 | 尔萨有限公司 | Welding nozzle and welding device |
| US11458558B2 (en) | 2018-03-08 | 2022-10-04 | Ersa Gmbh | Soldering nozzle and soldering installation |
| US20220347780A1 (en) * | 2019-08-30 | 2022-11-03 | Seho Vermögensverwaltungs Gmbh & Co. Kg | Soldering nozzle and method for the production thereof |
| DE202023100340U1 (en) | 2023-01-24 | 2024-04-25 | Ersa Gmbh | Soldering nozzle, use of a soldering nozzle and soldering device |
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| C06 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141008 |