CN102554394A - Common temperature auxiliary welding structure applicable to selective wave soldering - Google Patents
Common temperature auxiliary welding structure applicable to selective wave soldering Download PDFInfo
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- CN102554394A CN102554394A CN2010106005532A CN201010600553A CN102554394A CN 102554394 A CN102554394 A CN 102554394A CN 2010106005532 A CN2010106005532 A CN 2010106005532A CN 201010600553 A CN201010600553 A CN 201010600553A CN 102554394 A CN102554394 A CN 102554394A
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Abstract
The invention discloses a common temperature auxiliary welding structure applicable to selective wave soldering, which comprises a welding spot, and an auxiliary welding pad is arranged near the welding spot. When the common temperature auxiliary welding structure is used for welding, the auxiliary welding pad and a welded pad simultaneously contact with tin waves and are simultaneously heated, a common temperature surface is formed, and heat loss of welding is effectively suppressed, so that welding temperature is ensured, the common temperature auxiliary welding structure has sufficient infiltration time when being used for welding, and 100% of filling effects are achieved.
Description
Technical field
The present invention relates to a kind of welding and use structure, be specifically related to a kind ofly be applicable to that the welding of selectivity wave-soldering uses structure.
Background technology
The selectivity wave-soldering is meant the solder (terne metal) with fusing; Become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow; Also can be through forming to the solder pot nitrogen injection; Make the printed board that components and parts are housed in advance through solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.
At present, the circuit on the wiring board commonly used uses copper, and the capacity of heat transmission of copper is only second to silver in metal.When carrying out the selectivity wave-soldering again, the heat of solder joint conducts very soon, makes product the time not have sufficient infiltrating time to reach 100% filling effect in welding.So just need take measures to avoid the heat of product when welding to conduct fast.
According to conduction principle, as shown in Figure 1, can know has following 2 factor to passes to want:
A. the speed of the big more conduction of sectional area of conduction is fast more, thus to reduce the conduction surface on the heat conduction path;
B. the big more conduction of velocity of the temperature difference is fast more, so want the temperature difference of diverse location in the wisp.
Can improve this manufacturing defect through the shape of the solder pad on traditional optimization wiring board to most of electronic products; But when on some electronic product, lasting big current work being arranged in order to prevent that the overheated large tracts of land of just can only carrying out from covering copper, manufacturing that exists in the current industry that Here it is and the conflicting place of designing requirement.
Summary of the invention
Technical problem to be solved by this invention provides a kind of auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering; Thermal loss when it can be contained in welding; Thereby the temperature when guaranteeing welding uses product sufficient infiltrating time to be arranged to reach 100% filling effect when welding.
In order to solve above technical problem, the invention provides a kind of auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering; Comprise solder joint, auxiliary solder pad is arranged near solder joint.
Beneficial effect of the present invention is: during welding auxiliary solder pad be soldered pad and contact with the tin ripple simultaneously to be heated simultaneously and so when welding, formed one and be total to warm face; Effectively contained the thermal loss when welding; Thereby the temperature when having guaranteed welding uses product sufficient infiltrating time to be arranged to reach 100% filling effect when welding.
Description of drawings
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is done further explain.
Fig. 1 is heat conducting sketch map;
Fig. 2 is the sketch map of the embodiment of the invention.
The specific embodiment
As shown in Figure 2, the auxiliary Welding Structure of common temperature of selectivity wave-soldering that is applicable to of the present invention is applied on the printed circuit board (PCB), and auxiliary solder pad 1 is arranged near solder joint 2.Said auxiliary solder pad 1 can be surrounded said solder joint for the auxiliary weld-ring of annular; Also can be for circle or circle or rectangle or square or the auxiliary pad 1 of other shapes that is symmetrically distributed, as long as surround solder joint 2.The pad that large tracts of land is covered copper is uniformly distributed with auxiliary pad or auxiliary weld-ring 1 on every side; This purpose is the also part or contact with the tin ripple simultaneously of auxiliary pad or auxiliary weld-ring around the tin ripple arrives when being soldered pad; So just in the isothermal level that forms a part on every side that is soldered a little; Thereby so just can effectively stop scattering and disappearing of heat guarantee the welding temperature of pad, use product sufficient infiltrating time to be arranged when welding to reach 100% filling effect.This technical scheme has solved this traditional manufacturing technology difficult problem from design point of view, and does not have the rising of quality risk and other manufacturing and material cost.
When welding for employing selectivity wave-soldering (immersed solder), the pad that covers copper in the large tracts of land that is soldered face is uniformly distributed with auxiliary pad (4x ￠ 1, said auxiliary solder pad limit and solder joint back gauge >=1mm on every side.) or auxiliary weld-ring (ring width≤1, said auxiliary solder pad limit and solder joint back gauge>=1mm.) specifically as shown in Figure 2; Like this auxiliary weldering of when welding be soldered pad and contact with the tin ripple simultaneously to be heated simultaneously and so when welding, formed one and be total to warm face; Effectively contained the thermal loss when welding; Thereby the temperature when having guaranteed welding uses product sufficient infiltrating time to be arranged to reach 100% filling effect when welding.
It is interior because some ad-hoc location large tracts of land of product is covered the technical barrier that copper causes the failure welding of product in the unit interval that this technology has solved present industry, and the generation of the manufacturing defect when having avoided producing has also improved reliability of products and serviceability simultaneously.
The present invention is not limited to the embodiment that preceding text are discussed.More than the description of the specific embodiment is intended in order to describe and explain the technical scheme that the present invention relates to.Based on the conspicuous conversion of the present invention enlightenment or substitute and also should be considered to fall into protection scope of the present invention.The above specific embodiment is used for disclosing best implementation method of the present invention, so that those of ordinary skill in the art can use numerous embodiments of the present invention and multiple alternative reaches the object of the invention.
Claims (7)
1. a common temperature that is applicable to the selectivity wave-soldering is assisted Welding Structure; Comprise solder joint, it is characterized in that auxiliary solder pad is arranged near solder joint.
2. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 1 is characterized in that said auxiliary solder pad is an annular, surrounds said solder joint.
3. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 2 is characterized in that said auxiliary solder pad ring width≤1mm, said auxiliary solder pad limit and solder joint back gauge>=1mm.
4. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 1 is characterized in that said auxiliary solder pad is circle or rectangle or square.
5. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 1 is characterized in that said auxiliary solder pad is symmetrically distributed in around the solder joint.
6. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 1 is characterized in that said auxiliary solder pad is 4, is distributed in around the solder joint symmetrically.
7. the auxiliary Welding Structure of common temperature that is applicable to the selectivity wave-soldering as claimed in claim 6 is characterized in that said auxiliary solder pad diameter is 1mm, said auxiliary solder pad limit and solder joint back gauge >=1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106005532A CN102554394A (en) | 2010-12-22 | 2010-12-22 | Common temperature auxiliary welding structure applicable to selective wave soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106005532A CN102554394A (en) | 2010-12-22 | 2010-12-22 | Common temperature auxiliary welding structure applicable to selective wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102554394A true CN102554394A (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106005532A Pending CN102554394A (en) | 2010-12-22 | 2010-12-22 | Common temperature auxiliary welding structure applicable to selective wave soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102554394A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025130A (en) * | 2020-01-07 | 2020-04-17 | 电子科技大学 | SMT detection method for multilayer interconnected FPC |
| CN113084290A (en) * | 2021-03-15 | 2021-07-09 | 武汉华工激光工程有限责任公司 | Laser soldering system and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04291999A (en) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | Part cooling structure |
| JPH05326761A (en) * | 1992-05-15 | 1993-12-10 | Fujitsu Ltd | Mounting structure of thermal conduction spacer |
| US5730932A (en) * | 1996-03-06 | 1998-03-24 | International Business Machines Corporation | Lead-free, tin-based multi-component solder alloys |
| CN101072466A (en) * | 2006-05-08 | 2007-11-14 | 株式会社东海理化电机制作所 | Soldering structure of through hole |
| TW201044936A (en) * | 2009-06-05 | 2010-12-16 | Inventec Corp | Method for soldering electronic component and circuit board structure |
-
2010
- 2010-12-22 CN CN2010106005532A patent/CN102554394A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04291999A (en) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | Part cooling structure |
| JPH05326761A (en) * | 1992-05-15 | 1993-12-10 | Fujitsu Ltd | Mounting structure of thermal conduction spacer |
| US5730932A (en) * | 1996-03-06 | 1998-03-24 | International Business Machines Corporation | Lead-free, tin-based multi-component solder alloys |
| CN101072466A (en) * | 2006-05-08 | 2007-11-14 | 株式会社东海理化电机制作所 | Soldering structure of through hole |
| TW201044936A (en) * | 2009-06-05 | 2010-12-16 | Inventec Corp | Method for soldering electronic component and circuit board structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025130A (en) * | 2020-01-07 | 2020-04-17 | 电子科技大学 | SMT detection method for multilayer interconnected FPC |
| CN111025130B (en) * | 2020-01-07 | 2021-07-16 | 电子科技大学 | SMT detection method for multilayer interconnected FPC |
| CN113084290A (en) * | 2021-03-15 | 2021-07-09 | 武汉华工激光工程有限责任公司 | Laser soldering system and method |
| CN113084290B (en) * | 2021-03-15 | 2023-04-28 | 武汉华工激光工程有限责任公司 | Laser soldering system and method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |