CN203171153U - Novel environment-friendly lead-free low-temperature crest tin solder bar - Google Patents
Novel environment-friendly lead-free low-temperature crest tin solder bar Download PDFInfo
- Publication number
- CN203171153U CN203171153U CN 201320188896 CN201320188896U CN203171153U CN 203171153 U CN203171153 U CN 203171153U CN 201320188896 CN201320188896 CN 201320188896 CN 201320188896 U CN201320188896 U CN 201320188896U CN 203171153 U CN203171153 U CN 203171153U
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- tin solder
- novel environment
- free low
- friendly lead
- main body
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Abstract
The utility model provides a novel environment-friendly lead-free low-temperature crest tin solder bar which is mainly used in an assembling process of parts of micro-electronic sensors and the like low in heat resistance. The novel environment-friendly lead-free low-temperature crest tin solder bar comprises a cuboid-shaped main body. A rectangular groove and a groove are formed in at least one lateral side of the cuboid-shaped main body, at least one lateral side of the cuboid-shaped main body without the rectangular groove forms an opening, and the opening is arranged along the lateral side and penetrates the lateral side. Due to the fact that openings are arranged on two sides of the tin solder bar, internal stress of the tin solder bar is released, the tin solder bar is stable in a welding process, and spattering is not prone to occur. Therefore, the phenomenon that short circuit, connection welding and the like of welded products are prone to occur is avoided, and operation efficiency and product quality are improved.
Description
Technical field
The utility model relates to welding technology field, relates in particular to a kind of novel environment friendly lead-free low-temperature crest tin solder.
Background technology
Tin solder is the welding rod of soldering, and that tin solder is mainly used in is electric, the welding of electronics industry, tableware tin device processed, and high temperature resistant device is electric, the welding of electronics industry, printed wire, micro-scale technology, aircraft industry and coated metal.Common electric, electronics industry (television set, radio cassette player common antenna, quartz clock) aviation, micro-scale technology panel beating, lead pipe welding, the welding of cable, heat exchanger hardware, radiant body, jar processed etc.Bulb, cooler manufacturing, panel beating, lead pipe panel beating, boiler are used and other high temperature weld with the baking of bearing shell, pottery, thermal cutting, classification welding and other low-temperature welding.Existing tin solder, scaling powder and tin mix compacting and form, and stress is concentrated and splash phenomena occurs in welding process easily, causes the short-circuit conditions of solder joint and solder joint, influences welding quality.
Summary of the invention
In view of the above problems, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of novel environment friendly lead-free low-temperature crest tin solder, be mainly used in the low part assembling process of hear resistances such as microelectronic sensor, comprise the cuboid main body, include rectangular channel and groove at least one side of described cuboid main body, at least one side that described cuboid main body is not provided with rectangular channel forms opening, and described opening carries over this side setting and runs through this side.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, the angle of described opening is at 30 °-100 °.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, the length of described rectangular channel is greater than 1/2nd of described cuboid principal length.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, described groove is the circular groove that is positioned at described rectangular channel outside.Described circular groove comprises two circular grooves that are arranged at these rectangular channel both sides.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, the width of described rectangular channel is less than its width in the side of the cuboid main body at place.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, the length of the long-diagonal of described cuboid body cross-section is 15mm-35mm.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, described cuboid main body two ends have chamfering structure.
Preferable, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder, and wherein, the length of described cuboid main body is 300mm-800mm.
Compared to prior art, the utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder to go out the quantity of slag after fusing to lack than common scolding tin, and has good antioxygenic property, fusing back viscosity is low, good fluidity, the solderability height, be best suited for the wave soldering operation, simultaneously good wettability conductance thermal conductivity, Yi Shangxi, and owing to be provided with opening in the soldering tin bar both sides, the internal stress of this soldering tin bar obtains discharging, stable and be not prone to splash phenomena in welding process, thus avoided by the easy short circuit of weldering product, connect phenomenons such as weldering, improved operating efficiency and product quality.
Description of drawings
Fig. 1 is the schematic diagram of novel environment friendly lead-free low-temperature crest tin solder.
Fig. 2 is the schematic diagram of novel environment friendly lead-free low-temperature crest tin solder cross section.
The specific embodiment
Please refer to Fig. 1, be the schematic diagram of novel environment friendly lead-free low-temperature crest tin solder.Described novel environment friendly lead-free low-temperature crest tin solder 1 is mainly used in the low part assembling process of hear resistances such as microelectronic sensor, comprise cuboid main body 11, include rectangular channel 111 and groove at least one side of described cuboid main body 11, this groove can be the circular groove 112 that is arranged at these rectangular channel 111 both sides, the two relative side that described cuboid main body 11 is not provided with rectangular channel 111 forms opening 113, and described opening 113 carries over this side setting and runs through this side.Wherein, the angle of described opening is at 30 °-100 °.
In present embodiment, the length that novel environment friendly lead-free low-temperature crest tin solder 1 is preferably the cuboid main body is the wave-soldering tin bar of 300mm-800mm, the wave-soldering tin bar can be divided into lead welding tin bar and Pb-free solder bar, and the novel environment friendly lead-free low-temperature crest tin solder 1 of present embodiment is not leaded, belong to the Pb-free solder bar, its composition further can be tin copper (Sn-0.7Cu), SAC (Sn-0.3Ag-0.5Cu) or SAC (Sn-3.0Ag-0.5Cu).Present embodiment is owing to the two relative side that is not provided with rectangular channel 111 in cuboid main body 11 forms opening 113, described opening 113 carries over this side setting and runs through this side, make the stress of novel environment friendly lead-free low-temperature crest tin solder 1 obtain herein discharging, it is more abundant to make novel environment friendly lead-free low-temperature crest tin solder 1 press in discharging in welding process, and opening angle is between 30 ° to 100 °, the release of pressing in more being conducive to, thereby in welding process, splash phenomena can not take place, thereby be short-circuited phenomenon etc. when preventing from pcb board welded, also prevent from scalding operating personnel.
Include above-mentioned rectangular channel 111 on one of them surface of novel environment friendly lead-free low-temperature crest tin solder 1 in the present embodiment, rectangular channel 111 is used for manufacturer or brand merchant's LOGO or title are imprinted on wherein, and this mode can neatly show LOGO or title regularly.The circular groove 112 that is arranged at these rectangular channel 111 both sides then plays the effect of a kind of location and sign.Further preferred, in the present embodiment, the length of described rectangular channel 111 makes the LOGO or the title that are arranged on this rectangular channel 111 to show significantly, thereby makes that the sign effect is more obvious greater than 1/2nd of described cuboid main body 11.
Simultaneously, the width of described rectangular channel 111 is less than the width on the surface of the described cuboid main body 11 at its place, and as shown in Figure 1, rectangular channel 111 is a low-lying place and is formed on the surface of cuboid main body 11.From Fig. 1, it can also be seen that; described circular groove 112 is near the end, two ends of described cuboid main body 11; the maximum gauge of the cross section of the described cuboid main body 11 of present embodiment is 15mm-35mm; and has chamfering structure at described cuboid main body two ends; this chamfering structure makes the end of tin solder become smoothly, thereby has protected both ends.Soldering tin bar 1 surface of present embodiment is uniform and smooth, fusing back good fluidity, wetability are splendid, the solder joint light, and oxidizing slag thing residue seldom takes place, and is applicable to various wave-solderings and the manual welding of high-quality requirement.
The utility model provides a kind of novel environment friendly lead-free low-temperature crest tin solder to go out the quantity of slag after fusing to lack than common scolding tin, and has good antioxygenic property, fusing back viscosity is low, good fluidity, the solderability height, be best suited for the wave soldering operation, simultaneously good wettability conductance thermal conductivity, Yi Shangxi, and owing to be provided with opening in the soldering tin bar both sides, the internal stress of this soldering tin bar obtains discharging, and is stable and be not prone to splash phenomena in welding process, thereby avoided by the easy short circuit of weldering product, connect phenomenons such as weldering, improved operating efficiency and product quality.
Claims (9)
1. novel environment friendly lead-free low-temperature crest tin solder, it is characterized in that, comprise the cuboid main body, include rectangular channel and groove at least one side of described cuboid main body, at least one side that described cuboid main body is not provided with rectangular channel forms opening, and described opening carries over this side setting and runs through this side.
2. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that, the angle of described opening is at 30 °-100 °.
3. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that the length of described rectangular channel is greater than 1/2nd of described cuboid principal length.
4. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that described groove is the circular groove that is positioned at described rectangular channel outside.
5. novel environment friendly lead-free low-temperature crest tin solder according to claim 4 is characterized in that described circular groove comprises two circular grooves that are arranged at these rectangular channel both sides.
6. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that, the width of described rectangular channel is less than its width in the side of the cuboid main body at place.
7. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that, the length of the long-diagonal of described cuboid body cross-section is 15mm-35mm.
8. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that, described cuboid main body two ends have chamfering structure.
9. novel environment friendly lead-free low-temperature crest tin solder according to claim 1 is characterized in that the length of described cuboid main body is 300mm-800mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320188896 CN203171153U (en) | 2013-04-16 | 2013-04-16 | Novel environment-friendly lead-free low-temperature crest tin solder bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320188896 CN203171153U (en) | 2013-04-16 | 2013-04-16 | Novel environment-friendly lead-free low-temperature crest tin solder bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203171153U true CN203171153U (en) | 2013-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320188896 Expired - Fee Related CN203171153U (en) | 2013-04-16 | 2013-04-16 | Novel environment-friendly lead-free low-temperature crest tin solder bar |
Country Status (1)
| Country | Link |
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| CN (1) | CN203171153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157920A (en) * | 2013-04-16 | 2013-06-19 | 昆山市圣翰锡业有限公司 | Novel environment-friendly lead-free low temperature wave tin solder bar |
-
2013
- 2013-04-16 CN CN 201320188896 patent/CN203171153U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157920A (en) * | 2013-04-16 | 2013-06-19 | 昆山市圣翰锡业有限公司 | Novel environment-friendly lead-free low temperature wave tin solder bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20190416 |