CN113084290A - Laser soldering system and method - Google Patents
Laser soldering system and method Download PDFInfo
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- CN113084290A CN113084290A CN202110275654.5A CN202110275654A CN113084290A CN 113084290 A CN113084290 A CN 113084290A CN 202110275654 A CN202110275654 A CN 202110275654A CN 113084290 A CN113084290 A CN 113084290A
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- laser
- annular
- soldering
- light spot
- shaping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of laser welding, and provides a laser soldering system which comprises a laser generator, an annular welding disc and a shaping assembly for shaping laser emitted by the laser generator into an annular light spot, wherein the annular welding disc is provided with an operation area for covering the annular light spot for operation, and a plurality of soldering stations are distributed in the operation area of the annular welding disc. A laser soldering method is also provided. The annular bonding pad adopted by the invention is provided with a plurality of soldering stations, and the solder balls on N bonding pads on the annular product are soldered at one time, so that the production efficiency is improved by N times compared with a mode of soldering the solder balls on one bonding pad by laser each time. The temperature measuring device is used for detecting the temperature in the annular light spot, the detected temperature is fed back to the laser control unit, and the laser control unit controls the output power of the laser generator, so that the welding process is more stable, and the yield is improved.
Description
Technical Field
The invention relates to the technical field of laser welding, in particular to a laser soldering system and a laser soldering method.
Background
The soldering heat input of the electric soldering iron is large, high temperature easily causes the failure of devices inside the product, the electric soldering iron needs to be in contact with the bonding pad, and the product with interference around the bonding pad cannot be constructed. The laser welding has the advantages of small heat influence range, high processing efficiency, non-contact with a workpiece, easy realization of automation and the like, and is more and more widely applied to industries such as tin soldering and the like. In the soldering project, the traditional laser soldering welds one pad at a time, and the efficiency is low; the method of enlarging the size of the light spot and enabling the light spot to cover the whole annular bonding pad is adopted, so that the temperature of a non-bonding pad area (the center position of the light spot) is too high. The circular light spot can be generated by matching the conical prism with the focusing lens, but the conical prism is high in processing difficulty and high in cost. The annular light spot can be generated by using two or more prisms in a superposition combination, such as the following patent: an annular light spot device, application No.: 201320165279. X. However, the size of the annular light spot obtained by the structure cannot be adjusted, and the application range is small. The welding directly adopting the annular light spot can cause different absorbed laser energy due to the state difference of the material surface, the generated temperature is uncontrollable, the temperature is too high, the bonding pad can be burned, and the defects are generated.
Disclosure of Invention
The invention aims to provide a laser soldering system and a laser soldering method, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: the utility model provides a laser soldering system, includes laser generator, still includes annular pad and is used for with the shaping subassembly of laser shaping for annular facula that laser generator sent, the annular pad is last to have the confession annular facula covers the operation area of operation above that, annular pad a plurality of soldering stations have been laid in the operation area.
Further, the soldering stations are uniformly arranged along the annular direction of the working area.
Further, the shaping component comprises a collimating lens, a shaping lens, a reflecting element and a focusing lens which are sequentially arranged along the direction of the light path.
Further, the shaping lens is a diffractive optical element.
Further, the shaping component further comprises a light combining component mirror which is used for combining and coaxial light with different wavelengths, and the light combining component mirror is arranged on a light path between the reflecting element and the focusing mirror.
Further, the device also comprises a CCD camera used for visually positioning the welding position.
The laser device comprises a laser device control unit, a temperature measuring device and a laser device control unit, wherein the laser device control unit is used for controlling the output power of the laser generator, and the laser device control unit is used for controlling the output power of the laser generator.
The embodiment of the invention provides another technical scheme: a laser soldering method comprises the following steps:
s1, emitting laser by a laser generator and sending the laser to a shaping component;
s2, shaping the laser into an annular light spot after the shaping component receives the laser;
and S3, shooting the annular light spot onto an annular welding disc with a plurality of soldering stations, and enabling the annular light spot to cover each soldering station so as to realize multi-station simultaneous welding.
Further, a temperature measuring device is adopted to detect the temperature in the annular light spot, the detected temperature is fed back to a laser control unit, and the laser control unit controls the output power of the laser generator.
And further, welding the annular welding disc by adopting slowly rising and slowly falling temperature.
Compared with the prior art, the invention has the beneficial effects that:
1. the adopted annular bonding pad is provided with a plurality of soldering stations, the tin balls on N bonding pads on the annular product are welded at one time, and compared with a mode that the tin balls on one bonding pad are welded by laser at one time, the production efficiency is improved by N times.
2. The diffractive optical element is used as the shaping lens, and compared with the conical prism, the diffractive optical element has the advantages of miniaturization, high repeatability, low cost, high design freedom, high diffraction efficiency and the like.
3. The temperature measuring device can be used for detecting the temperature in the annular light spot in real time, feeding the temperature back to the laser control system, performing power control, ensuring that the temperature in the annular light spot is consistent with a set value, accurately controlling the temperature in the annular light spot and ensuring the yield.
4. The welding spot obtained by welding the annular welding disc by adopting the slowly-rising and slowly-falling temperature has good appearance and high yield which can reach 99.8%.
Drawings
Fig. 1 is a schematic diagram of a laser soldering system according to an embodiment of the present invention;
fig. 2 is a schematic view of an annular light spot of a laser soldering system according to an embodiment of the present invention;
fig. 3 is a schematic view of a linkage principle of a temperature measuring device and a laser control unit of a laser soldering system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an annular bonding pad of a laser soldering system according to an embodiment of the present invention;
fig. 5 is a set temperature curve of a laser soldering system according to an embodiment of the present invention;
fig. 6 is a laser power curve set by a laser soldering system according to an embodiment of the present invention;
in the reference symbols: 1-a laser generator; 2-a collimator; 3-shaping the lens; 4-a reflective element; 5-a CCD camera; 6-light-combining component mirror; 7-a focusing mirror; 8-annular light spot; 9-a temperature measuring device; 10-an annular pad; 11-soldering station.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 4, an embodiment of the invention provides a laser soldering system, which includes a laser generator 1, an annular pad 10 and a shaping component for shaping laser emitted from the laser generator 1 into an annular light spot 8, wherein the annular pad 10 has an operating area for covering the annular light spot 8 to operate, and a plurality of soldering stations 11 are distributed in the operating area of the annular pad 10. In this embodiment, the adopted annular bonding pad 10 has a plurality of soldering stations 11, and the solder balls on N bonding pads on the annular product are soldered at one time, so that the production efficiency is improved by N times compared with a mode of soldering the solder balls on one bonding pad by laser each time. Specifically, if the annular light spot 8 is adopted in the conventional laser soldering, the welding is performed one by one, and after the annular bonding pad 10 is adopted in the embodiment, the simultaneous processing of a plurality of stations can be realized, so that the welding efficiency of the annular light spot 8 is greatly improved. The laser generator 1 adopted is preferably a semiconductor laser with the wavelength of 915nm and the average power of 30W, the laser is very low in cost, the electro-optic conversion efficiency reaches 40%, the cooling mode is air cooling, and the device integration is facilitated due to the adoption of a U-box structure.
The following are specific examples:
as an optimized solution of the embodiment of the present invention, please refer to fig. 4, each soldering station 11 is uniformly arranged along the annular direction of the working area. In this embodiment, the soldering stations 11 are also arranged in a ring shape, so that the annular light spot 8 can cover each soldering station 11, and the welding work of a plurality of soldering stations can be completed at one time only by controlling the size of the annular light spot 8. For example, the annular bonding pad 10 is provided with seven soldering stations 11, and seven solder balls with the diameter of 0.50mm are arranged on the annular bonding pad. The laser of the annular light spot 8 heats seven solder balls on the bonding pad at one time, melts the solder balls, and then performs soldering processing on the bonding pad. Compared with the traditional circular light spot laser soldering mode: the seven solder balls on the bonding pad can be soldered only by seven times of laser action, the soldering of the whole annular bonding pad 10 can be completed within 14s after the laser action time is 2s every time, the solder balls on the bonding pad are processed by adopting the annular light spot 8, the time is only 2s, and the time is 1/7 of the time of the traditional processing mode, so that the production efficiency is greatly improved. Preferably, the soldering station 11 is coated with the soldering flux, then the solder balls are implanted, and the solder balls are heated by the laser, so that the bonding pads are soldered.
Referring to fig. 1, as an optimized solution of the embodiment of the present invention, the shaping component includes a collimating lens, a shaping lens 3, a reflecting element 4, and a focusing lens 7, which are sequentially arranged along the light path direction. Preferably, the shaping lens 3 is a diffractive optical element. The shaping component further comprises a light combination component mirror 6 which is used for combining and coaxial light with different wavelengths, wherein the light combination component mirror 6 is arranged on a light path between the reflecting element 4 and the focusing mirror 7. In this embodiment, after the laser light comes out from the laser generator 1, the collimator 2 changes the light beam into parallel light, and then the shaping lens 3 performs polar shaping, where the shaping lens 3 is a Diffractive Optical Element (DOE), and compared with a conical prism, the Optical lens has the advantages of being small in size, high in repeatability, low in cost, high in design freedom, high in diffraction efficiency, and the like. Because the conical prism needs to form the glass material lens into a conical shape by adopting a machining method, the requirement on the machining precision of the size is high, the machining tolerance is generally required to be plus or minus 0.01-0.05mm, the requirement is difficult to meet by the existing machining technology, the machining cost is high, and the yield is low. The processing method of the plastic lens 3 is a step re-engraving method, and the processing flow comprises three steps: designing and manufacturing a mask, reproducing a pattern and etching. For the manufacture of the diffraction optical element, the phase characteristics are multi-order, and one-time manufacture can only present two gradient structures on a target material, so that the three-step process flow is required to be repeated for many times. The reflecting element 4 can reflect the laser, the light combining component mirror 6 can combine and coaxially combine the light with different wavelengths to form a coaxial light path, and the focusing mirror 7 focuses the laser to finally form an annular light spot 8. Preferably, the system further comprises a CCD camera 5 for visual positioning of the welding position.
Referring to fig. 1 as an optimized solution of the embodiment of the present invention, the system further includes a temperature measuring device 9 for detecting the temperature in the annular light spot 8, the temperature measuring device 9 feeds back the detected temperature to the laser control unit, and the laser control unit controls the output power of the laser generator 1. In this embodiment, the temperature measuring device 9 is preferably an infrared temperature measuring optical generator, which can detect the temperature in the annular light spot 8 in real time. The laser control unit is adopted here to cooperate with the laser control unit, specifically, as shown in fig. 3, the upper computer sets a welding temperature value, the single chip microcomputer obtains an instruction, the laser is opened to emit light, the welding disc is heated, the temperature rises, the temperature detector detects the temperature value in the annular light spot 8 in real time, the temperature value is fed back to the single chip microcomputer, the detected temperature value is compared with the set temperature value, the power of laser is controlled, the actual temperature in the annular light spot 8 is kept consistent with the set temperature value, and the stability control of the temperature in the annular light spot 8 is realized.
The embodiment of the invention provides a laser soldering method, which comprises the following steps: s1, emitting laser by using a laser generator 1 and sending the laser to a shaping component; s2, shaping the laser into an annular light spot 8 after the shaping component receives the laser; and S3, shooting the annular light spot 8 to an annular welding pad 10 with a plurality of soldering stations 11, and enabling the annular light spot 8 to cover each soldering station 11 so as to realize multi-station simultaneous welding. In this embodiment, the adopted annular bonding pad 10 has a plurality of soldering stations 11, and the solder balls on N bonding pads on the annular product are soldered at one time, so that the production efficiency is improved by N times compared with a mode of soldering the solder balls on one bonding pad by laser each time. Specifically, if the annular light spot 8 is adopted in the conventional laser soldering, the welding is performed one by one, and after the annular bonding pad 10 is adopted in the embodiment, the simultaneous processing of a plurality of stations can be realized, so that the welding efficiency of the annular light spot 8 is greatly improved. The laser generator 1 adopted is preferably a semiconductor laser with the wavelength of 915nm and the average power of 30W, the laser is very low in cost, the electro-optic conversion efficiency reaches 40%, the cooling mode is air cooling, and the device integration is facilitated due to the adoption of a U-box structure.
As an optimization scheme of the embodiment of the invention, the temperature measuring device 9 is adopted to detect the temperature in the annular light spot 8, the detected temperature is fed back to the laser control unit, and the laser control unit controls the output power of the laser generator 1. In this embodiment, the temperature measuring device 9 is preferably an infrared temperature measuring optical generator, which can detect the temperature in the annular light spot 8 in real time. The laser control unit is adopted here to cooperate with the laser control unit, specifically, as shown in fig. 3, the upper computer sets a welding temperature value, the single chip microcomputer obtains an instruction, the laser is opened to emit light, the welding disc is heated, the temperature rises, the temperature detector detects the temperature value in the annular light spot 8 in real time, the temperature value is fed back to the single chip microcomputer, the detected temperature value is compared with the set temperature value, the power of laser is controlled, the actual temperature in the annular light spot 8 is kept consistent with the set temperature value, and the stability control of the temperature in the annular light spot 8 is realized.
As an optimized scheme of the embodiment of the present invention, the annular bonding pad 10 is soldered by using a temperature that gradually rises and falls. In the embodiment, the tin balls on the annular bonding pad 10 are soldered by adopting slowly rising and slowly falling temperature, a set temperature curve is shown in fig. 5, the temperature in the annular light spot 8 is increased from 0W to 120 ℃ within 0-300ms of heating time, and the soldering flux is heated, so that the soldering flux flows on the bonding pad sufficiently, and the whole bonding pad is filled with the subsequent molten tin; within the heating time of 300-; the heating time is 400-; the temperature in the annular light spot 8 is reduced from 200 ℃ to 160 ℃ within the heating time of 1200 and 1210ms, so that the heat is reduced more stably; the heating time is 1210-. In addition, welding was performed by setting a laser power curve without using temperature control, as shown in fig. 6. In the traditional mode, because the temperature is not controlled, the laser energy absorption rate of the surface of some bonding pads is too high, the generated temperature value is too high, and the bonding pads are burnt; the yield is only 95.6%.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A laser soldering system, including laser generator, its characterized in that: the laser shaping device is characterized by further comprising an annular welding disc and a shaping assembly used for shaping laser emitted by the laser generator into an annular light spot, wherein the annular welding disc is provided with an operation area for covering the annular light spot on the annular welding disc for operation, and a plurality of tin soldering stations are distributed in the operation area of the annular welding disc.
2. A laser soldering system according to claim 1, wherein: all the soldering stations are uniformly arranged along the annular direction of the working area.
3. A laser soldering system according to claim 1, wherein: the shaping component comprises a collimating lens, a shaping lens, a reflecting element and a focusing lens which are sequentially arranged along the direction of a light path.
4. A laser soldering system according to claim 3, wherein: the shaping lens is a diffractive optical element.
5. A laser soldering system according to claim 3, wherein: the shaping component further comprises a light combining component mirror which is used for combining and coaxial light with different wavelengths, and the light combining component mirror is arranged on a light path between the reflecting element and the focusing mirror.
6. A laser soldering system according to claim 1, wherein: the device also comprises a CCD camera used for visually positioning the welding position.
7. A laser soldering system according to claim 1, wherein: the laser device comprises a laser control unit and is characterized by further comprising a temperature measuring device used for detecting the temperature in the annular light spot, the temperature measuring device feeds the measured temperature back to the laser control unit, and the laser control unit controls the output power of the laser generator.
8. A laser soldering method is characterized by comprising the following steps:
s1, emitting laser by a laser generator and sending the laser to a shaping component;
s2, shaping the laser into an annular light spot after the shaping component receives the laser;
and S3, shooting the annular light spot onto an annular welding disc with a plurality of soldering stations, and enabling the annular light spot to cover each soldering station so as to realize multi-station simultaneous welding.
9. A laser soldering method according to claim 8, wherein: and detecting the temperature in the annular light spot by using a temperature measuring device, feeding the detected temperature back to the laser control unit, and controlling the output power of the laser generator by using the laser control unit.
10. A laser soldering method according to claim 8, wherein: and welding the annular welding disc by adopting slowly rising and slowly falling temperature.
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| CN202110275654.5A CN113084290B (en) | 2021-03-15 | 2021-03-15 | Laser soldering system and method |
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| CN114932308A (en) * | 2022-04-11 | 2022-08-23 | 深圳市韵腾激光科技有限公司 | Dynamic Mini display unit repair system |
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| CN113084290B (en) | 2023-04-28 |
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